JP3920256B2 - カード用コネクタ - Google Patents
カード用コネクタ Download PDFInfo
- Publication number
- JP3920256B2 JP3920256B2 JP2003344832A JP2003344832A JP3920256B2 JP 3920256 B2 JP3920256 B2 JP 3920256B2 JP 2003344832 A JP2003344832 A JP 2003344832A JP 2003344832 A JP2003344832 A JP 2003344832A JP 3920256 B2 JP3920256 B2 JP 3920256B2
- Authority
- JP
- Japan
- Prior art keywords
- card
- cam
- eject
- predetermined position
- shaft
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
Images
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
- H01R13/00—Details of coupling devices of the kinds covered by groups H01R12/70 or H01R24/00 - H01R33/00
- H01R13/62—Means for facilitating engagement or disengagement of coupling parts or for holding them in engagement
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K5/00—Casings, cabinets or drawers for electric apparatus
- H05K5/02—Details
- H05K5/0256—Details of interchangeable modules or receptacles therefor, e.g. cartridge mechanisms
- H05K5/026—Details of interchangeable modules or receptacles therefor, e.g. cartridge mechanisms having standardized interfaces
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/40—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs
- H01L23/4093—Snap-on arrangements, e.g. clips
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K5/00—Casings, cabinets or drawers for electric apparatus
- H05K5/02—Details
- H05K5/0256—Details of interchangeable modules or receptacles therefor, e.g. cartridge mechanisms
- H05K5/0286—Receptacles therefor, e.g. card slots, module sockets, card groundings
- H05K5/0295—Receptacles therefor, e.g. card slots, module sockets, card groundings having ejection mechanisms
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Physics & Mathematics (AREA)
- Coupling Device And Connection With Printed Circuit (AREA)
- Cooling Or The Like Of Electrical Apparatus (AREA)
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
- Connector Housings Or Holding Contact Members (AREA)
- Mounting Of Printed Circuit Boards And The Like (AREA)
- Casings For Electric Apparatus (AREA)
- Details Of Connecting Devices For Male And Female Coupling (AREA)
Description
12 カード
13 ベースプレートの上面
14 カードガイド
15 コネクタ要素
16 ケーブル
17 取付耳
18 貫通孔
21 アーム
22 第1のシャフト
23 ヒートシンク
24 第2のシャフト
25 スプリング
26 第1の貫通孔
27 第2の貫通孔
28 貫通孔
31 イジェクトバー
32 レバー
33 カム面
34 突起
35 支点
36 第1の端部
37 第2の端部
41 カム溝
42 ピン
Claims (5)
- 所定位置に挿入されたカードに接続するカード用コネクタにおいて、前記カードの挿脱を案内するカードガイド、前記カードガイドを固定したベースプレート、前記カードを離脱させるためのイジェクト機構、前記カードの放熱を促進するための放熱部材、前記放熱部材を前記カードに対し可動であるように保持した保持部材、及び前記イジェクト機構と前記保持部材との間に作用するカム機構を有し、前記イジェクト機構は、前記カードガイドに沿ってスライド可能なイジェクトバーと、前記イジェクトバーに応動し前記カードに離脱力を伝達するレバーとを有し、前記保持部材は、前記ベースプレートに回動可能に結合されたアームと、前記アームの回動端に保持されたシャフトとを有し、前記放熱部材は前記シャフトに回動可能に保持されており、前記カードが前記所定位置に挿入されているときには前記放熱部材が前記カードに当接し、前記イジェクト機構が前記カードを前記所定位置から離脱させる際には、前記カム機構の作用により、前記保持部材が前記放熱部材を前記カードから離間させた後に前記カードの離脱が行われることを特徴とするカード用コネクタ。
- 前記放熱部材を前記カードに向けて付勢した付勢手段をさらに含む、請求項1に記載のカード用コネクタ。
- 前記カム機構は、前記イジェクト機構及び前記保持部材の一方に備えたカム面と、他方に備えられ、前記イジェクト機構の動作に応じて前記カム面に係合するカムフォロワーとを有する、請求項1又は2に記載のカード用コネクタ。
- 前記カム機構は、前記イジェクト機構及び前記保持部材の一方に備えたカム溝と、他方に備えられ、前記イジェクト機構の動作に応じて前記カム溝に沿って移動するカムフォロワーとを有する、請求項1又は2に記載のカード用コネクタ。
- 前記所定位置に挿入されたカードに接続されるコネクタ要素をさらに含む、請求項3又は4に記載のカード用コネクタ。
Priority Applications (4)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2003344832A JP3920256B2 (ja) | 2003-10-02 | 2003-10-02 | カード用コネクタ |
CNB2004100797299A CN100459319C (zh) | 2003-10-02 | 2004-09-17 | 具有散热部件但不会阻碍卡片插入和移除的卡片连接器 |
US10/946,182 US6942506B2 (en) | 2003-10-02 | 2004-09-21 | Card connector having a heat radiation member without inhibiting insertion and removal of a card |
KR1020040077915A KR100649811B1 (ko) | 2003-10-02 | 2004-09-30 | 카드의 삽입 및 이탈을 저해하지 않는 방열 부재를 구비한카드 커넥터 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2003344832A JP3920256B2 (ja) | 2003-10-02 | 2003-10-02 | カード用コネクタ |
Publications (2)
Publication Number | Publication Date |
---|---|
JP2005116564A JP2005116564A (ja) | 2005-04-28 |
JP3920256B2 true JP3920256B2 (ja) | 2007-05-30 |
Family
ID=34386329
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2003344832A Expired - Fee Related JP3920256B2 (ja) | 2003-10-02 | 2003-10-02 | カード用コネクタ |
Country Status (4)
Country | Link |
---|---|
US (1) | US6942506B2 (ja) |
JP (1) | JP3920256B2 (ja) |
KR (1) | KR100649811B1 (ja) |
CN (1) | CN100459319C (ja) |
Families Citing this family (43)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US7133285B2 (en) * | 2004-01-23 | 2006-11-07 | Yamaichi Electronics U.S.A., Inc. | Electronics connector with heat sink |
JP3946707B2 (ja) * | 2004-03-29 | 2007-07-18 | タイコエレクトロニクスアンプ株式会社 | カード用コネクタ |
TWI256874B (en) * | 2004-05-10 | 2006-06-11 | Asustek Comp Inc | Heat sink assembly with rotatable fins |
KR100699259B1 (ko) * | 2005-03-08 | 2007-03-27 | 삼성전자주식회사 | 디스플레이 장치 |
TWM278117U (en) * | 2005-05-12 | 2005-10-11 | Tyco Electronics Amp Kk | Card connector |
KR100653063B1 (ko) * | 2005-06-08 | 2006-12-01 | 삼성전자주식회사 | 카드식 전자부품용 방열부재 및 이를 포함한디스플레이장치 |
KR100731365B1 (ko) * | 2005-11-02 | 2007-06-21 | 엘지전자 주식회사 | Pod 카드의 냉각 구조 |
KR101233291B1 (ko) * | 2006-05-29 | 2013-02-15 | 오탁스 컴퍼니 리미티드 | 카드 슬롯장치 및 이를 구비하는 전자기기 |
KR20080029510A (ko) * | 2006-09-29 | 2008-04-03 | 삼성전자주식회사 | 방송수신장치용 사용자인증카드 접속장치 및 이를 갖춘방송수신장치 |
JP2008152418A (ja) * | 2006-12-15 | 2008-07-03 | Otax Co Ltd | カードスロット及びこれを備えた電子機器 |
TWI318812B (en) * | 2007-02-06 | 2009-12-21 | Asustek Comp Inc | A sim card retainer |
US8172619B2 (en) * | 2007-05-04 | 2012-05-08 | Thomson Licensing | Smart card heat sink |
DE202007006626U1 (de) * | 2007-05-09 | 2007-10-04 | Hamburg Industries Co., Ltd., Shen Keng | Verbindungseinrichtung |
US7667972B2 (en) * | 2007-05-11 | 2010-02-23 | Chant Sincere Co., Ltd. | Connector with a heat sink |
US7946336B2 (en) * | 2008-02-21 | 2011-05-24 | Inventec Corporation | Heat sink structure |
US7852633B2 (en) * | 2008-07-24 | 2010-12-14 | Yamaichi Electronics Co., Ltd. | Connector for connection to a module board |
US7733652B2 (en) * | 2008-09-17 | 2010-06-08 | Tyco Electronics Corporation | Heat sink assembly for a pluggable module |
JP2011181731A (ja) * | 2010-03-02 | 2011-09-15 | Molex Inc | カード状部品用ソケットを備えた電子機器 |
JP5655658B2 (ja) * | 2011-03-23 | 2015-01-21 | ソニー株式会社 | 半導体記録メディア記録及び/又は再生装置 |
JP5673349B2 (ja) * | 2011-05-25 | 2015-02-18 | 富士通株式会社 | プラガブルモジュール |
US8644017B2 (en) | 2011-05-26 | 2014-02-04 | Lsi Corporation | Storage device carriers for adapting a storage device of a first size to a slot for a storage device of a second size |
US20130070422A1 (en) * | 2011-09-15 | 2013-03-21 | Lsi Corporation | Enclosure-integrated handle features for mounting storage devices |
US9052483B2 (en) * | 2011-09-27 | 2015-06-09 | Finisar Corporation | Communication module assembly with heat sink and methods of manufacture |
JP2013118770A (ja) * | 2011-12-02 | 2013-06-13 | Toshiba Corp | 電気車制御装置 |
TWI441590B (zh) * | 2011-12-15 | 2014-06-11 | Inventec Corp | 電子模組 |
TW201417414A (zh) * | 2012-10-16 | 2014-05-01 | Hon Hai Prec Ind Co Ltd | 電連接器組合及其壓接裝置 |
US8911244B2 (en) * | 2012-12-13 | 2014-12-16 | International Business Machines Corporation | Receptacle with heat management for electronic and optical systems |
KR101460898B1 (ko) * | 2013-06-11 | 2014-11-14 | 현대오트론 주식회사 | 경사 구조물을 이용한 차량의 전자 제어 장치 및 그 제조 방법 |
US9329643B2 (en) | 2013-06-17 | 2016-05-03 | Michael R. Tobias | Apparatus for holding a semiconductor module |
CN110662388A (zh) * | 2015-01-11 | 2020-01-07 | 莫列斯有限公司 | 模块壳体及连接器端口 |
JP6549327B2 (ja) | 2016-01-11 | 2019-07-24 | モレックス エルエルシー | ルーティングアセンブリ及びそれを使用するシステム |
CN108475870B (zh) | 2016-01-19 | 2019-10-18 | 莫列斯有限公司 | 集成路由组件以及采用集成路由组件的系统 |
US9893474B1 (en) * | 2016-10-12 | 2018-02-13 | International Business Machines Corporation | Active cable heat sink |
US10212852B1 (en) * | 2017-02-28 | 2019-02-19 | Juniper Networks, Inc | Apparatus, system, and method for improved thermal contact between heatsinks and field-replaceable electronic modules |
CN107087377B (zh) * | 2017-04-28 | 2019-04-26 | 华为技术有限公司 | 散热装置、散热器、电子设备及散热控制的方法 |
CN107591655B (zh) * | 2017-07-28 | 2021-06-18 | 富士康(昆山)电脑接插件有限公司 | 卡缘连接器及其组件 |
TWI651037B (zh) * | 2018-04-25 | 2019-02-11 | 和碩聯合科技股份有限公司 | 機殼組件及電子裝置 |
JP7196470B2 (ja) * | 2018-08-30 | 2022-12-27 | 日本電気株式会社 | 電子機器の放熱構造 |
CN112970104B (zh) * | 2018-11-09 | 2023-11-14 | 索斯科有限公司 | 散热器紧固件 |
US10925186B2 (en) * | 2019-05-15 | 2021-02-16 | Hewlett Packard Enterprise Development Lp | Vertical lift heat transfer device for pluggable modules |
US11624880B2 (en) * | 2019-10-08 | 2023-04-11 | Infinera Corporation | Communication module engagement |
TWI704862B (zh) * | 2020-02-20 | 2020-09-11 | 四零四科技股份有限公司 | 將可抽換模組所產生之熱量傳導至機殼模組之散熱結構以及具有前述散熱結構之電子裝置 |
EP4135493A1 (en) * | 2021-08-12 | 2023-02-15 | Nokia Solutions and Networks Oy | Apparatus comprising a heat sink for a pluggable module |
Family Cites Families (9)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH03188589A (ja) * | 1989-12-18 | 1991-08-16 | Matsushita Graphic Commun Syst Inc | Icカードとカード挿入装置 |
JP3157099B2 (ja) * | 1995-12-20 | 2001-04-16 | 株式会社ピーエフユー | Pcカードの冷却構造 |
US5865639A (en) * | 1996-06-25 | 1999-02-02 | Texas Instruments Incorporated | Burn-in test socket apparatus |
JP3813281B2 (ja) * | 1997-01-14 | 2006-08-23 | 富士通株式会社 | Icカードスロットを有する電子装置 |
TW387620U (en) * | 1998-11-24 | 2000-04-11 | Hon Hai Prec Ind Co Ltd | Double-deck electronic card connector |
US6201697B1 (en) * | 1999-02-16 | 2001-03-13 | Chip Coolers, Inc. | Heat sink assembly with cam lock |
JP2001266081A (ja) | 2000-12-11 | 2001-09-28 | Pfu Ltd | Pcカードの冷却構造 |
JP2003059602A (ja) * | 2001-08-08 | 2003-02-28 | Yamaichi Electronics Co Ltd | 半導体装置用ソケット |
AU2003223221A1 (en) * | 2002-03-06 | 2003-09-22 | Tyco Electronics Corporation | Pluggable electronic module and receptacle with heat sink |
-
2003
- 2003-10-02 JP JP2003344832A patent/JP3920256B2/ja not_active Expired - Fee Related
-
2004
- 2004-09-17 CN CNB2004100797299A patent/CN100459319C/zh not_active Expired - Fee Related
- 2004-09-21 US US10/946,182 patent/US6942506B2/en not_active Expired - Fee Related
- 2004-09-30 KR KR1020040077915A patent/KR100649811B1/ko not_active IP Right Cessation
Also Published As
Publication number | Publication date |
---|---|
KR100649811B1 (ko) | 2006-11-28 |
KR20050033013A (ko) | 2005-04-08 |
CN1604398A (zh) | 2005-04-06 |
JP2005116564A (ja) | 2005-04-28 |
US6942506B2 (en) | 2005-09-13 |
CN100459319C (zh) | 2009-02-04 |
US20050074995A1 (en) | 2005-04-07 |
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