M317676 八、新型說明： 【新型所屬之技術領域】 本創作是有關於一種連接器結構改良，尤指一種含散 熱器之連接器結構改良。 【先前技術】 - 按，根據半導體製程的摩爾定律，越來越多的電子零 件，隨著科技進步的發展，有越做越小的趨勢’取而代之 • 的是在零件縮小後，消耗的功率在轉換訊號中所產生的廢 熱，該等廢熱與電子零件的使用壽命息息相關，一般而 言，溫度越高，電子元件的使用壽命也就越短；因此，在 要求電子元件的傳輸處理速度之前，如何搭配完善的散熱 裝置進行散熱就變得格外重要了，不然很容易造成元件無 法長時間運作、或是整組系統的不穩定。 請參閱第1圖習知技術，係為中華民國專利字號第 • M279910號『卡用連接器』，如圖所示，藉由散熱裝置與卡 ' 的連接，可以達到散熱的目的，該連接器1包含：一散熱 裝置2、用於接觸插入至一連接器部3之卡C之一面；及 一彈性裝置4、用於驅動散熱裝置2朝向前述卡C之一面。 又，一擠壓桿5具有一凸輪部6，其具有的特色在於··卡 C插入時，散熱裝置2就從卡C之一面退開而作用之第一 凸輪面7 ;當卡C排出時，散熱裝置2就從卡C之一面退 開而作用於第二凸輪面8，此機制是配合PCMCIA卡，當插 M317676 入PCMCIA卡時，散熱裝置2 品 沉θ千貼於该PCMCIA卡的表 ’…上述之裝置，卻因為該凸輪部6只有單邊，且 財常常會導致賴裝置2與贿Μ卡的表 =生摩擦’長久使用下來，很容易對卡本身造成損傷， 為一不良之設計’制層面也無法有效進行拓展。 有鐘於此’本創作係提出—種含散熱器之連結器結構 改良’以解決存在於習知技術巾之該些缺失。 【新型内容】 ^創作之主要目的係在提供—種含散熱器之連接器 、、，°構改良’其顧過下壓機構的導柱活動結合於具有高度 差的斜導槽，使PCMCIA卡插入到底後，才將散熱片下麼 貼=至PCMCIA卡的表面上，避免pCMCIA卡插拔時與散熱 片摩擦損傷卡片，進一步有效保護該pCMCIA卡。 為達上述之目的，本創作係揭露一種含散熱器之連接 器結構改良，包含一框架，於框架兩侧設置有一對導臂， 且在導臂上相對設置有斜導槽，該斜導槽内分別具有一上 限位區與一下限位區；一下壓機構，透過導臂固定於框架 上’且下壓機構的兩側臂上分別設置有導柱，容置於斜導 槽内，當下壓機構向前移動時，導柱就限位於上限位區， 當下壓機構向後移動時，導柱便限位在下限位區；以及一 散熱片，固定設置於下壓機構上，透過散熱片上的導熱介 材與卡片連接，當卡片推至底部時，才會帶動下壓機構上 M317676 的散熱片與卡片的表面接合， 片傳導出去’並可同時避免卡 卡片本身。 :卡片產生的熱量透過散熱 片插入過程中的摩擦傷害到 的圖式詳加說明，當更 、特點及其所達成之功 以下猎由具體實施例配合所附 容易暸解本創作之目的、技術内容 效。 【實施方式】 '、、、㈣查貞方便簡_解本 特 與優點及其_叙功效 -朴徵内各 附圖，詳細說明如下：更為㈣、將本創作配合 =閱第2嶋本創作含散熱器之連接 =嶋樣含咖，諸構立體分= ”弟®料本創作斜導槽之放大圖，本㈣係包括— 框架1卜下壓機構12、—散熱片14以及-導熱介材· u。 如圖所不，本創作實施例之框架1〇係為一 pcMCIA卡連接 态，在框架10後端，設置有一排電性接腳101，可以與卡 片進行電性連接，又於該框架1 Q兩側設置有一對導臂 102 ’且在導臂1〇2上設置有斜導槽1〇3，該斜導槽103 内分別具有一上限位區103a與一下限位區l〇3b，在框架 10的内側更設置有滑執104,方便卡片插入，又在滑執104 的後端設置有彈性元件106，利用該彈性元件106對該下 壓機構12進行固定歸位的動作，最後在框架10四周設置 M317676 複數個螺絲105，使該框架10可以穩定設置在電路基板。 又，一下壓機構12，透過導臂102活動結合於該框架 10上，且一散熱片14，固定設置於該下壓機構12上，散熱 片14上可以設置有縱向或橫向之散熱鰭片141 ’該下壓機 構12的兩側臂121上分別設置有導柱122，可容置於該斜導 - 槽103内，並於下壓機構12後端相對設置有帶動塊123，該 ^ 帶動塊123設置於框架10後端内侧之彈性元件106前面。 籲一導熱介材11，設於散熱片14底部，其係為一緩衝材 質，如石墨、導熱矽膠片或玻璃纖維基材，其主要作用是 將卡片上的熱傳導至散熱片14上散逸，因為散熱片14與卡 片均屬硬性材質，使用導熱介質11一方面可加強散熱片14 與卡片的密合度，另一方面可使散熱片14與卡片連接時不 容易產生摩擦。 晴配合參閱弟4A、4B圖，如圖所示，當卡片16處於尚 • 未推入到底的階段時，框架10後端具有一對彈性元件 ， 1〇6,可以頂於帶動塊123上，使該下壓機構12上的導柱122 限位於該上限位區103a，令散熱片14下方的導熱介材u 與卡片16可產生一落差距離L，方便卡片16插入。當卡片 16透過滑軌104插入接近底部時，於框架1〇内接觸到帶動 塊123 ’進而帶動下壓機構12以其導柱⑵沿著斜導槽ι〇3 逐漸向後並向下移動，最後使導熱介材u與卡片16上表面 接觸’如第5A、5B圖所示，將卡片產生的熱量透過散熱片 M317676 14傳導出去。當卡片16取出時，藉由彈性元件1〇6使下壓 機構12與散熱片η逐漸往前並往上移動回復至上限位區 103a而離開卡片16。在卡片16移動的過程中，散熱片14 及其底部的導熱介材11不會與卡片16接觸摩擦，而可避免 卡片受損。 再請參閱第6圖係為本創作外加退卡機構之立體分解 圖、第7A圖係為本創作外加退卡機構卡片推入前之實施例 仰視圖、第7B圖係為本創作外加退卡機構卡片推入前之實 施例側視圖、第7C圖係為第7A圖之實施例剖視圖。如圖所 不，係為本創作的另一實施例，本創作更進一步包含有一 退卡機構18，該退卡機構18設置於框架1〇的底部，該退卡 機構18包含有一底框181，在該底框181上利用一支軸182 連接帶動一連動片183、一連捍184，並於該連桿184連接 一擠壓連桿185，且在連動片183後方設置有一對止擋部 186，該止擋部186係設於帶動塊123的後方或前方。當卡 片16插入且未推擠下壓機構12的帶動塊123時，下壓機構 12的導柱122係位於斜導槽1〇3的上限位區1〇如，使散熱片 14及其T方的導熱介材11與卡#16表©產生-距離L，不 與卡片16接觸摩擦。再參閱細〜8C圖，當卡片16繼續推 入時’藉由推髮帶動塊123而帶動下壓機構12以其導柱122 /口著斜導槽103逐漸向下並向後移動至下限位區⑽匕，最 後田卡片16與電性接㈣1連接時，導熱介材11即與卡片 M317676 16接觸密合，令卡片16得以散熱。 當卡片16取出時，將擠壓連桿185向後推，透過連桿 184施力於連動片183與止擋部186向前，進而將卡片“退 出框架10，且該彈性元件106得以回復，並將下壓機構12 推回，下壓機構12即隨著卡片16取出而逐漸向上並向前移 ' 動回復固定至斜導槽103的上限位區103a。且在無卡狀熊 時，框架10後端的彈性元件1〇6可以頂於帶動塊123上，使 Φ 下壓機構12上的導柱122限位於該上限位區i〇3a，產生一 落差距離，方便卡片16插人。藉此，在卡片插人與取出的 過程中可避免與散熱片摩擦而造成卡片受損。 本創作除了可應用於PCMCIA卡連接器之外，亦可應於 其他的卡連接器，如CF記憶卡連接器。 。、 綜上所述，本創作在突破先前之技術結構下，確實已 達到所欲增進之功效，且也非熟悉該項技#者所^思 ^ ’顯已符合創作專利之ΐ請要件，爰依法提出專财 請’懇請貴局核准本件創作專利中請案，以勵創作，至 感德便。 以上所述之實施例僅係為說明本創作之技術思相及 特點，其目的在使熟習此項技藝之人士能夠瞭解本創作之 内容並據以實施，當不能以之限定本創作之專利範圍，即 大凡依本創作所揭示之精神所作之均等變化或修傅，仍應 涵蓋在本創作之專利範圍内。 〜 M317676 【圖式簡單說明】 第1圖係為習知技術圖。 ，2圖係為本創作含散熱器之連接n結構立體圖。 ，3圖係為本創作含散熱器之連接ϋ結構立體分解圖。 =3Α圖係為本創作斜導槽之放大圖。 第4Α圖係為本創作卡片推入前之 實施例侧視圖。 :4Β圖係為第4Α圖之實施例剖視圖。 第5Α圖係為本創作卡片推入後之實施例侧視圖。 ㈣圖係為第5Α圖之實施例剖視圖。 ^ 6圖係為本創作外加退卡機構之立體分解圖。 第7Α圖係為本創作外加退卡機構卡片推人前之實施例仰 視圖。 第圖係為本創作外加退卡機構卡片推入前之實施例側 視圖。 :7。圖係為第7Α圖之實施例剖視圖。 第圖係為本創作外加退卡機構卡片推入後之實施你 視圖。 弟8Β圖 視圖 係為本創作外加退卡機構卡片推入後之實施例侧 第8Α圖之實施例剖視圖。 說明】 第8C圖係為 【主要元件符號 (習知技術部份） M317676M317676 VIII. New description: [New technical field] This creation is about the improvement of a connector structure, especially the structure of a connector with a heat sink. [Prior Art] - According to Moore's Law of Semiconductor Process, more and more electronic parts, with the development of science and technology, have become smaller and smaller. 'The replacement is that after the parts are reduced, the power consumed is The waste heat generated in the conversion signal is closely related to the service life of the electronic components. Generally, the higher the temperature, the shorter the service life of the electronic components; therefore, before the transmission processing speed of the electronic components is required, how It is especially important to use a complete heat sink for heat dissipation. Otherwise, it is easy to cause the components to not operate for a long time or the instability of the entire system. Please refer to the prior art of Figure 1, which is the "Cable Connector" of the Republic of China Patent No. M279910. As shown in the figure, the heat sink can be connected to the card to achieve the purpose of heat dissipation. 1 includes: a heat sink 2 for contacting one side of the card C inserted into a connector portion 3; and a resilient means 4 for driving the heat sink 2 toward one side of the card C. Further, a pressing rod 5 has a cam portion 6 which is characterized in that, when the card C is inserted, the heat dissipating device 2 is retracted from one side of the card C to act on the first cam surface 7; when the card C is ejected The heat sink 2 is retracted from one side of the card C to act on the second cam surface 8. This mechanism is matched with the PCMCIA card. When the M317676 is inserted into the PCMCIA card, the heat sink 2 is affixed to the table of the PCMCIA card. '...The above device, but because the cam portion 6 has only one side, and the money often causes the device 2 and the bribe card to be used for long-term use, it is easy to damage the card itself, which is a bad The design level cannot be effectively expanded. There is a clock here. This creation proposes a structural improvement of the connector with a heat sink to solve the lack of such a conventional technical towel. [New content] ^The main purpose of the creation is to provide a connector with a heat sink, and the structure of the column is improved. The guide column activity of the lower pressing mechanism is combined with the inclined guide groove with the height difference to make the PCMCIA card. After inserting the bottom, the heat sink is attached to the surface of the PCMCIA card to avoid damage to the card when the pCMCIA card is inserted and removed, and the pCMCIA card is further effectively protected. In order to achieve the above purpose, the present invention discloses a structural improvement of a connector including a heat sink, comprising a frame, a pair of guide arms are disposed on both sides of the frame, and inclined guide grooves are oppositely disposed on the guide arm, the inclined guide groove There is an upper limit zone and a lower limit zone respectively; the lower pressing mechanism is fixed on the frame through the guide arm', and the guide legs are respectively arranged on the arms on both sides of the pressing mechanism, and are accommodated in the inclined guide groove, when pressed down When the mechanism moves forward, the guide post is limited to the upper limit zone. When the pressing mechanism moves backward, the guide post is limited to the lower limit zone; and a heat sink is fixedly disposed on the pressing mechanism to transmit heat through the heat sink. The medium is connected to the card. When the card is pushed to the bottom, the heat sink of the M317676 on the pressing mechanism is engaged with the surface of the card, and the film is conducted out and the card itself can be avoided at the same time. The heat generated by the card is explained in detail through the friction damage in the process of inserting the heat sink. When the features, characteristics and achievements are as follows, it is easy to understand the purpose and technical content of the creation. effect. [Embodiment] ',,, (4) 贞 贞 贞 _ _ 本 本 本 本 本 本 本 本 本 本 本 本 本 本 本 - - 朴 朴 朴 朴 朴 朴 朴 朴 朴 朴 朴 朴 朴 朴 朴 朴 朴 朴 朴 朴 朴 朴 朴Connection with radiator = 嶋 含 含 , 诸 诸 诸 = = ” ” ” ” ” ” ” ” ” ” ” ” ” ” ” ” ” ” ” ” ” ” ” ” ” ” ” ” ” ” ” ” ” ” ” ” ” ” ” ” ” Material u. As shown in the figure, the frame 1 of the present embodiment is a pcMCIA card connection state. At the rear end of the frame 10, a row of electrical pins 101 are provided, which can be electrically connected with the card, and A pair of guide arms 102' are disposed on both sides of the frame 1Q, and oblique guide grooves 1〇3 are disposed on the guide arms 1〇2, and the inclined guide grooves 103 respectively have an upper limit region 103a and a lower limit region l〇 3b, a sliding handle 104 is further disposed on the inner side of the frame 10 to facilitate card insertion, and an elastic member 106 is disposed at the rear end of the sliding handle 104, and the pressing mechanism 12 is fixed and returned by the elastic member 106. Finally, M317676 multiple screws 105 are arranged around the frame 10, so that the frame 10 can be stably set in electricity. Further, the pressing mechanism 12 is movably coupled to the frame 10 through the guiding arm 102, and a heat sink 14 is fixedly disposed on the pressing mechanism 12. The heat sink 14 may be provided with longitudinal or lateral heat radiating fins. The guide rails 122 are disposed on the two sides of the lower arm 121 of the lower pressing mechanism 12, and are disposed in the oblique guide groove 103, and the driving block 123 is oppositely disposed at the rear end of the pressing mechanism 12. The driving block 123 is disposed in front of the elastic member 106 on the inner side of the rear end of the frame 10. A heat conducting medium 11 is disposed at the bottom of the heat sink 14, which is a buffer material such as graphite, thermal conductive film or glass fiber substrate. The main function is to dissipate the heat on the card to the heat sink 14 because the heat sink 14 and the card are both rigid materials. The heat conductive medium 11 can enhance the adhesion between the heat sink 14 and the card, and on the other hand, the heat sink can be used. 14 When the card is connected, it is not easy to generate friction. For the matching with the brothers 4A and 4B, as shown in the figure, when the card 16 is in the stage of not being pushed to the end, the rear end of the frame 10 has a pair of elastic members, 1〇 6, can be driven by On the block 123, the guide post 122 on the pressing mechanism 12 is limited to the upper limit position 103a, so that the heat conducting material u under the heat sink 14 and the card 16 can generate a drop distance L to facilitate the insertion of the card 16. When the slide rail 104 is inserted into the bottom portion, the driving block 123' is contacted in the frame 1〇, and the lower pressing mechanism 12 is driven to gradually move backward and downward along the inclined guide groove ι〇3, and finally heat conduction. The medium u is in contact with the upper surface of the card 16 as shown in Figs. 5A and 5B, and the heat generated by the card is conducted through the heat sink M317676 14. When the card 16 is taken out, the pressing mechanism 12 is caused by the elastic member 1〇6. The heat sink η is gradually moved forward and upward to return to the upper limit zone 103a to leave the card 16. During the movement of the card 16, the heat sink 14 and the heat conducting medium 11 at the bottom thereof do not rub against the card 16, and the card can be prevented from being damaged. Please refer to Fig. 6 for the three-dimensional exploded view of the creation plus the card-returning mechanism, and the seventh drawing is the bottom view of the embodiment of the creation plus the card-removing mechanism before the card is pushed in, and the 7th picture is the creation plus the withdrawal card. A side view of the embodiment before the mechanism card is pushed in, and a 7C is a cross-sectional view of the embodiment of Fig. 7A. As another embodiment of the present invention, the present invention further includes a card ejecting mechanism 18 disposed at the bottom of the frame 1 , and the ejecting mechanism 18 includes a bottom frame 181 . A connecting rod 183 and a connecting rod 184 are connected to the bottom frame 181 by a shaft 182, and a connecting rod 185 is connected to the connecting rod 184, and a pair of stopping portions 186 are disposed behind the linking piece 183. The stop portion 186 is disposed at the rear or the front of the driving block 123. When the card 16 is inserted and the pushing block 123 of the pressing mechanism 12 is not pushed, the guiding post 122 of the pressing mechanism 12 is located at the upper limit position 1 of the inclined guiding groove 1〇3, for example, the heat sink 14 and its T side are The heat conducting medium 11 and the card #16 are generated - the distance L, and are not in contact with the card 16 to rub. Referring to the thin ~ 8C figure, when the card 16 continues to be pushed in, the push-down mechanism 12 is driven to push the lower pressing mechanism 12 to gradually move downward and backward to the lower limit position by the guide post 122 / the oblique guide groove 103 (10) When the last field card 16 is connected to the electrical connection (four) 1, the heat conductive medium 11 is in close contact with the card M317676 16 to allow the card 16 to dissipate heat. When the card 16 is taken out, the pressing link 185 is pushed backward, and the connecting piece 184 is biased forward by the connecting rod 184 to move forward, thereby pushing the card out of the frame 10, and the elastic member 106 is restored, and The pressing mechanism 12 is pushed back, and the pressing mechanism 12 is gradually moved upward and forward as the card 16 is removed, and is fixed to the upper limit region 103a of the oblique guide groove 103. When there is no card bear, the frame 10 The elastic element 1〇6 of the rear end can be placed on the driving block 123, so that the guiding column 122 on the Φ pressing mechanism 12 is limited to the upper limit position i〇3a, thereby generating a drop distance, thereby facilitating the insertion of the card 16. In the process of inserting and removing the card, the card can be prevented from being damaged by friction with the heat sink. In addition to being applicable to the PCMCIA card connector, this creation can also be applied to other card connectors, such as a CF memory card connector. In summary, this creation has achieved the desired effect of improving the technology under the previous technical structure, and it is also not familiar with the technology #^^^^ has already met the requirements of the creation of patents. , 提出Propose special funds according to law, please ask your office to approve this article. The patent application is for the purpose of creating a creative and sensible. The above-mentioned examples are only for explaining the technical thinking and characteristics of the creation, and the purpose is to enable those skilled in the art to understand the content of the creation. And according to the implementation, when it is not possible to limit the scope of the patent of this creation, that is, the equal change or revision of the spirit according to the spirit of this creation should still be covered in the scope of this creation patent. ~ M317676 [Simple diagram Explanation: Fig. 1 is a conventional technical diagram. 2 is a perspective view of the connection n structure with a heat sink. 3 is a three-dimensional exploded view of the connection structure with a heat sink. This is an enlarged view of the oblique guide groove. The fourth drawing is a side view of the embodiment before the creation of the creative card. The 4Β is a cross-sectional view of the embodiment of the fourth drawing. The fifth drawing is the pushing of the creative card. (4) The figure is a cross-sectional view of the embodiment of the fifth drawing. ^ 6 is a three-dimensional exploded view of the creation plus the card ejecting mechanism. The seventh drawing is the creation of the card with the card ejecting agency. Embodiment bottom view The figure is a side view of the embodiment of the present invention plus the card issuing mechanism of the card ejecting mechanism. : 7. The figure is a cross-sectional view of the embodiment of the seventh drawing. The figure is the drawing of the card of the present application plus the card ejecting mechanism. The implementation of your view. The Β8Β view is a cross-sectional view of the embodiment of the eighth side of the embodiment on the side of the creation plus the card ejecting mechanism. Explanation] Figure 8C is the main component symbol (known part of the technology) M317676
連接器1 散熱裝置2 連接器部3 彈性裝置4 擠壓桿5 " 凸輪部6 ' 第一凸輪面7 ⑩第二凸輪面8 卡C (本創作部份） 框架10 電性接腳101 導臂102 斜導槽103 ©上限位區103a ' 下限位區103b 滑軌104 螺絲105 彈性元件106 導熱介材11 下壓機構12 侧臂121 12 M317676 導柱122 帶動塊123 散熱片14 散熱鳍片141 卡片16 — 退卡機構18 〜 底框181 _支軸182 連動片183 連桿184 擠壓連桿18 5 止擔部18 6Connector 1 Heat sink 2 Connector part 3 Elastic device 4 Extruder rod 5 " Cam portion 6 'First cam surface 7 10 Second cam surface 8 Card C (this creation part) Frame 10 Electrical pin 101 Guide Arm 102 oblique guide 103 © upper limit zone 103a ' lower limit zone 103b slide rail 104 screw 105 elastic element 106 thermal conductive material 11 press down mechanism 12 side arm 121 12 M317676 guide post 122 drive block 123 heat sink 14 heat sink fin 141 Card 16 - Retracting mechanism 18 ~ Bottom frame 181 _ Support shaft 182 Linking piece 183 Connecting rod 184 Squeeze connecting rod 18 5 Stop portion 18 6