JP2010079404A - Electronic apparatus - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide an electronic apparatus with an electric connector that facilitates connection of a blade to a server frame, whose heat transfer resistance in a thermal connector is small, and whose electric contact resistance is small. <P>SOLUTION: The electronic apparatus includes: the blade on which a heating element is loaded; a server frame electrically connected by insertion of the blades; and a cooling device for absorbing the heat of the heating element, and for releasing the heat to the outside of the server frame. In the apparatus, the cooling device includes: a first cooling means fixed to the blade; a second cooling means fixed to the server frame; and a thermal connector for thermally connecting the first cooling means to the second cooling means. The first cooling means includes a first heat absorbing part and a first heat releasing part, and the second cooling means includes a second heat absorbing part and a second heat releasing part. The thermal connector includes a flexible member configured to expand/contract while being interlocked with the insertion/extraction of the blade into/from the server frame, and configured to thermally connect the first heat releasing part and the second heat absorbing part. <P>COPYRIGHT: (C)2010,JPO&INPIT

Description

  The present invention relates to an electronic device.

  In recent years, blade servers, for which demand is rapidly increasing, are required to further improve information processing capability and save space. Here, the blade server is a server computer having a form in which a plurality of servers that can be inserted and removed, called blades, are mounted in a housing.

  The information processing capability has improved dramatically year by year as the performance of a single CPU has increased. In addition, by increasing the number of CPUs mounted on one blade, information processing capability per blade is improved. Further, by reducing the thickness of the blades, the number of blades that can be mounted per rack is increased. The heat generation density of the blade server has increased dramatically due to the increase in the amount of heat generated with the high performance of the CPU and the thinning of the blade.

  Therefore, in order to prevent heat from being accumulated in the blade server, it is desired to improve the cooling efficiency of the blade server.

  On the other hand, blade servers achieve high reliability through redundant design and maintenance during operation.

  Redundant design means that the blade server configuration is designed so that more devices with the same function are installed than necessary and other devices with the same function can be covered even if there is a failed device. .

  Further, the maintenance during operation is to prevent the server operation efficiency from being lowered by not performing the maintenance work when the device in the blade server fails without turning off the power of the blade server. To realize maintenance during operation, it is necessary that each unit such as a blade, a power supply unit, and a fan unit be detachable from the rack while being energized during operation of the blade server. This is called hot-swapping and is a feature of the blade server. Therefore, the cooling device mounted on the blade needs to be detachable.

  Here, a typical configuration of a blade server will be described. In the blade server, several chassis are mounted in a rack. A plurality of blades, power supply units, fan units, management modules, and communication modules are mounted on the chassis. Each of the blade, the fan unit, and the communication module is connected to the management module via a backplane. The blade is mounted with electronic components such as a CPU, a memory, a chip set, and a hard disk.

  Currently, the mainstream cooling method for blade servers is to cool each electronic component by flowing air into the blades using a fan unit mounted on the chassis. Among electronic components, a CPU having a large calorific value is attached with a heat sink made of a material having high thermal conductivity such as copper or aluminum. The heat sink attached to the CPU has become larger year by year as the amount of heat generated by the CPU has increased, and higher performance has been achieved such as the incorporation of a heat pipe.

  However, in a dramatic increase in the amount of heat generated by the CPU and the thinning of the blade, it is becoming the limit to attach a heat sink to the CPU and cool the air in the blade.

  Therefore, a cooling system that transports heat generated by the CPU to the outside of the blade and dissipates heat using a liquid circulation heat transport device or a phase change heat transport device is conceivable. According to this cooling system, since a large-sized radiator or chiller can be applied as a heat radiating means outside the blade, it is possible to cope with a high heat generation amount of the CPU.

  On the other hand, in this cooling system, realization of hot-swapping is a problem. As a solution, there is a method of connecting a heat transport device in the blade and a heat transport device outside the blade by using a coupler. However, in this method, there is a risk of liquid leakage because the refrigerant liquid moves back and forth between the heat transport device in the blade and the heat transport device outside the blade via the coupler.

  In order to prevent liquid leakage, it is desirable that the heat transport device inside and outside the blade is completely closed. In that case, a thermal connector for connecting the heat transport device in the blade and the heat transport device outside the blade in a state where the thermal resistance is low is required. In addition, a large current flows in the electrical connector, and it is desired to reduce the voltage drop in the electrical connector.

  The following are known techniques relating to thermal connectors and electrical connectors.

  Patent Document 1 discloses an electronic apparatus in which a block 720 on which a plurality of modules 721 incorporating electronic components are mounted is inserted into a grid-like chassis 710 as shown in FIG. In this electronic device, the heat radiating plate 730 of the block 720 is formed of a thin material, and the heat radiating plate 730 is expanded by the movement of the piston 735 due to the insertion and removal of the block 720, whereby the heat radiating plate 730 and the chassis wall surface 711 are formed. It is closely attached to improve heat dissipation efficiency.

  In Patent Document 2, even when the refrigerant is not circulated and no pressure is applied to the refrigerant, the cross section of the cooling plate is wider than the mounting gap with no internal pressure added in order to bring the cooling plate and the module into close contact with each other. A technique is disclosed in which the cooling plate and the module are brought into close contact with each other by the elasticity of the cooling plate by making the width shape.

  Patent Document 3 discloses a technique in which a deformable portion is directly designed on a heat sink attached to a heat generating device, and when the heat sink is screwed to a base, the deformed portion of the heat sink absorbs pressure exerted on the heat generating component. .

  Patent Document 4 discloses an electrical connector having a structure in which a base is sandwiched between two balloons.

JP 2007-250752 A JP 2003-110071 A JP 2004-362535 A JP-A-4-230976

  Patent Document 1 describes an electronic apparatus in which a block 720 in which a plurality of modules 721 incorporating electronic components are mounted as described above is inserted into a grid-like chassis 710. The heat dissipation plate 730 of the block 720 is made of a thin-walled material. This is a technique for improving the heat radiation efficiency by forming the heat sink 730 and the chassis wall surface 711 by inflating the heat sink 730 by moving the piston 735 by inserting and removing the block 720.

  In this Patent Document 1, a means (not shown) for inflating the heat dissipation plate 730 by screwing a plug after inserting the block 720 into the chassis 710 and a piston 735 when inserting the block 720 into the chassis 710 are inserted. Means are disclosed. However, in the former means, an operation of screwing the plug after the insertion of the block 720 is required, and the operation is complicated. In the latter method, in order to insert the block 720 while expanding the heat radiating plate 730, if the heat radiating plate 730 is expanded with a sufficient pressure, a large frictional force acts between the heat radiating plate 730 and the chassis wall surface 711. Insertion of the block 720 becomes difficult.

  Patent Document 2 discloses that the cross section of the cooling plate is wider than the mounting gap with no internal pressure added in order to bring the cooling plate and the module into close contact with each other even when no pressure is applied to the refrigerant when the refrigerant is not circulated. A technique for bringing the cooling plate and the module into close contact with each other by the elasticity of the cooling plate is disclosed. However, a specific method for inserting and removing the module is not mentioned, and a method by which the module can be easily inserted and removed is necessary.

  Patent Document 3 discloses a technique in which a deformable portion is designed directly on a heat sink attached to a heat generating device, and when the heat sink is screwed to the base, the pressure exerted on the heat generating component is absorbed by the deformable portion of the heat sink. . However, this technique needs to be screwed for thermal connection, and it is considered difficult to use for a blade server that requires hot insertion / removal with a simple operation.

  Patent Document 4 discloses an electrical connector having a structure in which a base is sandwiched between two balloons. However, Patent Document 4 does not mention a method for connecting the electrical connector with a simple operation, and requires a method for connecting the electrical connector with a single operation.

  An object of the present invention is to provide an electronic apparatus including an electrical connector that is easy to connect a blade to a server frame, has a small heat transfer resistance in a thermal connector, and has a small electrical contact resistance.

  An electronic apparatus according to the present invention includes a blade on which a heating element is mounted, a server frame that is electrically connected by inserting the blade, and a cooling device that absorbs heat from the heating element and dissipates the heat to the outside of the server frame. In the electronic apparatus, the cooling device includes a first cooling means fixed to the blade, a second cooling means fixed to the server frame, and the first cooling means and the second cooling means. A thermal connector for thermally connecting to the cooling means, wherein the first cooling means includes a first heat absorbing portion and a first heat radiating portion, and the second cooling means is a second A thermal absorption part and a second heat radiation part, wherein the thermal connector has a flexible member that expands and contracts in conjunction with insertion and removal of the blade from the server frame, and the first heat radiation part and the first heat radiation part Heat the second endotherm Characterized by being connectable to.

  ADVANTAGE OF THE INVENTION According to this invention, the electronic device provided with the electrical connector with which the connection of the braid | blade to a server frame is easy, heat transfer resistance in a thermal connector is small, and electrical contact resistance is small can be provided.

  Further, according to the present invention, from the alignment of the first heat radiating portion and the second heat absorbing portion to the pressure contact can be completed by one operation when the blade is mounted on the casing.

  A blade server is a blade (sword-shaped unit) on which devices such as a CPU (Central Processing Unit), memory, and hard disk, which are heating elements, are mounted in a rack equipped with a power supply unit, fan unit, management module, etc. It is.

  The inventor has a heat pipe (also referred to as a thermal connector) and an electric connector between a heat pipe that takes heat of the CPU out of the blade and a heat radiating device that discharges the heat taken out of the heat pipe to the outside of the rack. Various studies have been made on connections. As a result, an electronic device having the following configuration was obtained.

  In the present invention, a blade on which a heating element is mounted, a server frame that allows electrical connection by insertion of the blade, and heat in the heat-receiving element are received by the heat-absorbing portion, and an internal liquid (refrigerant) evaporates, In an electronic device including a cooling device that circulates in the piping (using the phase change of the refrigerant) by condensing the refrigerant vaporized in the heat radiating portion, the heat radiating portion of the cooling device is extended in the insertion / extraction direction of the blade. A first heat dissipating part and a second heat dissipating part attached to the server frame, and the blade is connected to the thermal connection between the first heat dissipating part and the second heat dissipating part. It has a configuration using a flexible member that expands and contracts (expands and contracts) in conjunction with insertion / extraction (insertion / extraction). Here, the blade can be freely inserted and removed. This is said to be freely insertable. Inserting the blade means that the blade is inserted into the server frame to be electrically connected, and removing the blade means that the blade is pulled out from the server frame to disconnect the electrical connection.

  In the electronic device of the present invention, the flexible member includes a cylinder, and a piston to be inserted into the cylinder is attached to the server frame. By inserting the blade, the piston causes the fluid in the cylinder to flow. It has the structure pushed into the inside of a flexible member.

  In the electronic device according to the present invention, the flexible member is attached to a case, and the flexible member is expanded by inserting the first heat radiating portion into the case. The heat dissipating member is pressure-bonded (also referred to as pressure contact).

  Moreover, the electronic device of this invention has the structure which interposed the heat conduction member between the said 1st thermal radiation part in the said case, and the said flexible member.

  Moreover, the electronic device of the present invention has a configuration in which an elastic body for holding a gap in which the first heat radiating portion is to be inserted into the case is provided in the case.

  Embodiments will be described below with reference to the drawings.

  FIG. 1 is a conceptual perspective view of a rack mount type electronic device on which a blade server or the like according to an embodiment of the present invention is mounted. Note that FIG. 1 is a perspective view of a part of the electronic device for easy understanding.

  In FIG. 1, a rack mount cabinet 101 includes a housing 103 and a lid 105, and includes a plurality of shapes formed in a shape based on a specific standard such as an IEC (International Electric Commission) standard / EIA (The Electrical Industries Association) standard. A shelf 107 is provided. Since the blade servers 109 having individual functions can be selected and mounted on the plurality of shelves 107 in a free arrangement, the system configuration has both flexibility and expandability.

  FIG. 2 is a schematic perspective view illustrating the configuration of a blade server showing an embodiment according to the present invention.

  In FIG. 2, the blade server 109 includes a plurality of CPU blades 200 having a CPU 201 mounted in a server frame 113, a backplane 115 connecting the plurality of CPU blades 200, and a power module, not shown in FIG. A switch module, management module, etc. are installed.

  The CPU blade 200 may be inserted 91 / extracted 93 in the directions indicated by the arrows, respectively, for the server frame 113 for maintenance or the like during operation of the blade server 109. A feature of the blade server 109 is that any of the CPU blades 200 mounted on the blade server 109 can be attached / detached (hot-swap) even when the blade server 109 is in operation.

  Corresponding to the situation in which the number of individual blade servers 109 mounted on the rack mount cabinet 101 of FIG. 1 is increased due to higher performance and higher functionality of electronic devices, the shelves in the rack mount cabinet 101 on which the blade servers 109 are mounted. In order to increase the quantity 107, it is desired to reduce the size of each blade server 109 mounted on the rack mount cabinet 101 and to save the space for the cooling device.

  On the other hand, the amount of heat generated by semiconductor devices such as the CPU 201 mounted on an electronic device has increased with higher performance. In addition, the amount of heat generated varies greatly depending on the work content, and an efficient cooling method is required.

  A cooling device 111 for dealing with the blade server 109 having such characteristics will be described with reference to the schematic diagram of FIG.

  FIG. 3 is a schematic sectional view of the blade server in the present embodiment.

  In FIG. 3, the cooling device 111 includes a first cooling unit 300, a second cooling unit 400, and a thermal connector 500 that thermally connects the first cooling unit 300 and the second cooling unit 400. It has become.

  The first cooling means 300 includes a first heat absorbing part 301, a pipe 302 and a first heat radiating part 303. The second cooling unit 400 includes a second heat absorption unit 401, a pipe 405, and a second heat radiation unit 403.

  In the first cooling means 300, the first heat absorbing portion 301 and the CPU 201 are connected in a state of being smaller than a predetermined thermal resistance, and the heat generated by the CPU 201 is transferred behind the CPU blade 200 (of the rack mount cabinet 101 in FIG. 1). It is transported in the right direction of FIG.

  The first cooling means 300 is mounted in the CPU blade 200, and is attached to and detached from the CPU blade 200. In a state where the CPU blade 200 is mounted on the server frame 113, the first heat radiating unit 303 is disposed on the back side of the back plane 115.

  A refrigerant liquid is sealed inside the first cooling means 300, and heat is efficiently transported using a phase change (evaporation / condensation) of the refrigerant liquid. Or the refrigerant | coolant liquid enclosed in the 1st cooling means 300 is circulated, and heat is conveyed efficiently. Here, the phase change refers to evaporation / condensation of the refrigerant liquid accompanied by endotherm and heat generation.

  The second cooling unit 400 absorbs heat from the first cooling unit 300 via the thermal connector 500 and finally radiates heat outside the server frame 113. The second heat absorption unit 401 is mounted in the server frame 113 and is connected via the first heat dissipation unit 303 and the thermal connector 500 in a state where the thermal resistance is smaller than a predetermined value derived from the design specifications. .

  A refrigerant liquid is sealed inside the second cooling unit 400, and the refrigerant liquid is circulated through the pipe 402, thereby transporting heat from the second heat absorbing unit 401 to the second heat radiating unit 403. Or the 2nd cooling means 400 may convey heat using the phase change of the refrigerant | coolant liquid enclosed inside.

  The second heat radiating unit 403 is a radiator that performs heat exchange with air, and is installed in the back of the server frame 113. Alternatively, although not shown, the second heat radiating portion 403 may radiate heat to the heat absorbing portion of the third cooling means that radiates heat outside the server frame 113. Moreover, although not shown in figure, the 2nd thermal radiation part 403 may be installed outside the server frame 113, and may radiate heat with a radiator or a chiller unit.

  Although the first cooling means 300 and the second cooling means 400 each contain a refrigerant liquid, there is no risk of liquid leakage or the like because each is a closed system.

  In the present embodiment, the thermal connector 500 connects the first heat radiating portion 303 and the second heat absorbing portion 401 in a state where the thermal resistance is smaller than a predetermined value derived from the design specifications, and the first heat radiating portion. 303 is configured to be detachable from the second heat absorbing portion 401.

  In the present embodiment, the thermal connector 500 is disposed on the back side of the back plane 115, but is not necessarily limited thereto, and the thermal connector 500 may be disposed on the front side of the back plane 115. .

  Next, the detailed structure of the thermal connector 500 in the present embodiment will be described with reference to FIGS.

  FIG. 4 is a perspective view showing a state in which the thermal connector is assembled.

  FIG. 5 is a perspective view showing a state in which the thermal connector is disassembled.

  4 and 5, in the case 503, the second heat absorbing portion 401 and the first heat radiating portion 303 are brought into pressure contact with each other via a heat conductive sheet 305 (also referred to as a heat conductive member), so that Connected well. The heat conductive sheet 305 is affixed to the first heat radiating portion 303. The second heat absorbing part 401, the balloon 531, and the cylinder 533 are fixed to the case 503. The balloon 531 communicates with the cylinder 533, and a piston 535 is inserted into the cylinder 533. A liquid 543 (shown in FIG. 6) is sealed in the balloon 531 and the cylinder 533. The liquid 543 (shown in FIG. 6) is, for example, oil. The liquid 543 is held inside the balloon 531 and the cylinder 533 and can flow between the balloon 531 and the cylinder 533.

  The balloon 531 has, for example, a structure in which a thin metal plate is overlapped and a side portion is welded, and includes a tube 532 for communicating with the cylinder 533. A leaf spring 407 (also referred to as an elastic body) is attached to the second heat absorbing portion 401 along the insertion / extraction direction of the CPU blade 200, and a certain gap is provided between the second heat absorbing portion 401 and the case 503. To maintain. The balloon 531 may be called a flexible member.

  Piston 535 slides relative to cylinder 533. At this time, in order to prevent leakage and vaporization of the liquid 543 (shown in FIG. 6) inside the cylinder 533, a sealing mechanism such as an O-ring 541 (shown in FIGS. 7 and 8) is provided between the cylinder 533 and the piston 535. It is desirable. The piston 535 is attached to the rail support member 591 via a spring 537. When inserting / removing the CPU blade 200 into / from the server frame 113, the case 503 does not move forward from the backplane 115, and the piston 535 does not come out of the cylinder 533.

  In this embodiment, the cylinder 533 is fixed to the case 503 and the piston 535 is attached to the rail support member 591, but on the contrary, the piston 535 is fixed to the case 503 and the cylinder 533 is fixed to the rail support member 591. You may attach to.

  The case 503 is attached so as to move along the rail 501 in the insertion direction 91 of the CPU blade 200 by a predetermined length. The rail 501 is fixed to the server frame 113 (shown in FIG. 2). A spring 505 is attached to a portion of the pipe 405 between the case 503 and the rail support member 591, and when the CPU blade 200 (shown in FIG. 2) is not inserted, the case 503 is mounted on the rail 501. Located on the foremost side of.

  Further, the operation of the thermal connector 500 will be described with reference to FIGS.

  6 and 7 are cross-sectional views in the middle of inserting the CPU blade into the server frame. FIG. 8 is a cross-sectional view when the CPU blade is completely inserted into the server frame. 6 and 7 are cross-sectional views in the middle of removing the CPU blade 200 from the server frame 113.

  6 to 8, first, the process of inserting the CPU blade 200 will be described.

  When the CPU blade 200 is inserted into the server frame 113, first, the first heat radiating portion 303 is inserted into the case 503 located on the foremost side of the movable range on the rail 501. At this time, since there is a gap 507 due to the action of the leaf spring 407, the first heat radiating portion 303 is easily inserted into the case 503 without rubbing against the second heat absorbing portion 401. When the front end portion of the first heat radiating portion 303 hits the back wall of the case 503, the positions of the first heat radiating portion 303 and the second heat absorbing portion 401 in the insertion direction 91 coincide with each other.

  When the CPU blade 200 is further inserted (continuously pushed), the first heat radiating portion 303 moves in the insertion direction 91 together with the case 503. At this time, the cylinder 533 fixed to the case 503 also moves in the insertion direction 91.

  When the cylinder 533 moves in the insertion direction 91, the piston 535 attached to the rail support member 591 via the spring 537 is inserted into the cylinder 533 and the fluid in the cylinder 533 flows into the balloon 531. The balloon 531 is inflated and presses the second heat absorbing portion 401 against the first heat radiating portion 303. At this time, it is desirable that the heat conductive sheet 305 affixed to the first heat radiating portion 303 is provided with a grid-like slit. This is because air remains between the first heat radiation part 303 and the heat conduction sheet 305 and between the second heat absorption part 401 and the heat conduction sheet 305 so that the heat conduction sheet 305 does not adhere to the heat conduction part 305. This is to prevent resistance.

  When the CPU blade 200 is completely inserted into the server frame 113, the CPU blade 200 is fixed to the server frame 113 by a stopper 203 (shown in FIG. 3). A predetermined pressure is applied to the liquid 543 in the balloon 531 by the action of the spring 537, so that the second heat absorbing portion 401 and the first heat radiating portion 303 are always pressed with a predetermined pressure.

  Next, the process of removing the CPU blade 200 will be described.

  When the stopper 203 (shown in FIG. 3) is removed and the CPU blade 200 is moved in the removal direction 93, the case 503 is moved along the rail 501 in the removal direction 93, and the volume between the piston 535 and the cylinder 533 increases. . For this reason, the liquid 543 in the balloon 531 moves into the cylinder 533. As a result, the force that has pressed the second heat absorbing portion 401 and the first heat radiating portion 303 is removed.

  The leaf spring 407 creates a gap between the second heat absorbing portion 401 and the first heat radiating portion 303, and the first heat radiating portion 303 can be easily extracted from the case 503. The case 503 returns to the frontmost position on the rail 501 by the action of the spring 505.

  Thereby, insertion and removal can be performed repeatedly.

  Another embodiment relating to the thermal connector in the electronic apparatus of the present invention will be described with reference to FIG. In this embodiment, the cooling device having the configuration including the first cooling means 300, the second cooling means 400, and the thermal connector 500 is the same as that of the first embodiment of the present invention, but the plate 553 is displaced in the pressing direction 95. There is a difference in that the first heat radiating portion 303 and the second heat absorbing portion 401 are brought into pressure contact with each other.

  FIG. 9 is a cross-sectional view taken along line AA of FIG. 3 of the thermal connector 500 in the present embodiment.

  In this embodiment, the first heat radiating portion 303 and the second heat absorbing portion 401 are pressed against each other by being sandwiched between the case 551 and the plate 553. The case 551 can move in the insertion direction 91 along the case rail 555 that is rigidly connected to the server frame 113.

  When the CPU blade 200 is not inserted, the case 551 is positioned on the most front side on the case rail by the action of the spring 559. The plate 553 can move in the insertion direction 91 along the plate rail 557 that is rigidly connected to the server frame 113. The plate 553 is attached to the case 551 in the pressing direction 95 with a degree of freedom. The case rail 555 and the plate rail 557 are not parallel to each other, and the distance between the rails is reduced toward the back side.

  Due to the above-described structure, when the case 551 moves in the insertion direction, the plate 553 also moves in the insertion direction and is displaced in the pressing direction 95 at the same time. Due to this displacement, the plate 553 presses the first heat radiating portion 303 and the second heat absorbing portion 401.

  It is desirable that a heat conductive sheet 305 is attached to the surface where the first heat radiating portion 303 is in contact with the second heat absorbing portion 401 in order to reduce the thermal resistance. The heat conductive sheet 305 may be provided with grid-like slits. The second heat absorbing portion 401 is preferably in contact with the plate 553 through the balloon 561. A liquid is sealed in the balloon 561.

  First, the process of inserting the CPU blade 200 will be described.

  When the CPU blade 200 is inserted, first, the first heat radiating portion 303 is inserted into the case 551 located on the most front side of the movable range on the case rail 555. At this time, due to the action of a leaf spring (not shown), the first heat radiating portion 303 can be easily inserted into the case 551 without rubbing against the second heat absorbing portion 401 because there is a gap 507.

  When the front end portion of the first heat radiating portion 303 hits the back wall 552 of the case 551, the positions of the first heat radiating portion 303 and the second heat absorbing portion 401 in the insertion direction coincide with each other.

  Further, when the CPU blade 200 is inserted, the first heat radiating portion 303 moves integrally with the case 551 in the insertion direction. When the case 551 moves in the insertion direction, the plate 553 similarly moves along the plate rail 557 in the insertion direction. Along with this, the plate 553 also moves in the pressing direction 95 and presses the second heat absorbing portion 401 against the first heat radiating portion 303. When the CPU blade 200 is completely inserted into the server frame 113, the CPU blade 200 is fixed to the server frame 113 by the stopper 203 in FIG.

  Next, the process of removing the CPU blade 200 will be described.

  When the stopper 203 shown in FIG. 3 is removed and the CPU blade 200 is moved in the removal direction, the case 551, the plate 553, the first heat radiation part 303, and the second heat absorption part 401 move together in the removal direction 93. . When the plate 553 moves in the removal direction 93, it moves along the plate rail 557, and therefore moves in the direction opposite to the pressing direction 95.

  Therefore, the force that the plate 553 pressed the first heat radiating portion 303 and the second heat absorbing portion 401 is removed, and the action of the plate spring described above causes the first heat radiating portion 303 and the second heat absorbing portion 401 to be connected. There is a gap in When the case 551 returns to the forefront side of the case rail 555 and the CPU blade 200 is further moved in the removal direction 93, the first heat radiating portion 303 comes out of the case 551. At this time, since there is a gap between the first heat radiating portion 303 and the second heat absorbing portion 401, the first heat radiating portion 303 can be easily removed. Thereby, insertion and removal can be performed repeatedly.

  Another embodiment relating to the thermal connector in the electronic apparatus of the present invention will be described with reference to FIGS. In the present embodiment, the cooling device having a configuration including the first cooling means 300, the second cooling means 400, and the thermal connector 500 is the same as that of the first embodiment of the present invention, but the plate 573 is replaced by the leaf spring 575. And the first heat dissipating part 303 and the second heat absorbing part 401 are brought into pressure contact with each other.

  FIG. 10 is a cross-sectional view taken along line BB of FIG. 3 when the first heat radiating portion 303 and the second heat absorbing portion 401 of the thermal connector 500 in this embodiment are in pressure contact with each other. FIG. 11 is a cross-sectional view taken along line AA of FIG. 3 when the first heat radiating portion 303 and the second heat absorbing portion 401 of the thermal connector 500 in this embodiment are in pressure contact with each other.

  In the present embodiment, the first heat radiating portion 303 and the second heat absorbing portion 401 are brought into pressure contact by being sandwiched between a case 571 and a plate 573 pressed by a leaf spring 575. It is desirable that a heat conductive sheet 305 is attached to the surface where the first heat radiating portion 303 is in contact with the second heat absorbing portion 401 in order to reduce the thermal resistance. The heat conductive sheet 305 may be provided with grid-like slits. The second heat absorbing portion 401 is preferably in contact with the plate 573 through the balloon 581. A liquid 582 is sealed in the balloon 581.

  Next, a method for inserting / removing the thermal connector 500 of this embodiment will be described.

  12 is a cross-sectional view taken along the line BB in FIG. 3 when the thermal connector 500 is removed in the present embodiment. FIG. 13 is a cross-sectional view taken along line AA of FIG. 3 when the thermal connector 500 is removed in the present embodiment.

  When removing the CPU blade 200, first, the lever 583 is pulled. Then, the rod 577 connected to the lever 583 moves in the removal direction 93, the projection provided on the rod 577 and the projection provided on the plate 573 come into contact, and the plate 573 moves in the direction opposite to the pressing direction 95. Furthermore, a gap 507 is generated between the second heat absorbing portion 401 and the first heat radiating portion 303 by the action of the leaf spring 579. Thereby, the CPU blade 200 can be easily removed.

  Another embodiment of the electronic device of the present invention will be described with reference to FIGS.

  The present embodiment relates to an electrical connector that reduces a voltage drop that occurs when a large current flows.

  FIG. 14 is a cross-sectional view of the electrical connector at the time of insertion showing an embodiment according to the present invention. FIG. 15 is a cross-sectional view of the electrical connector when the insertion according to the embodiment of the present invention is completed.

  The electrical connector can be inserted / removed (inserted / removed) at the same time as the thermal connector is inserted / removed.

  The terminal 811 is attached to the CPU blade 200 shown in FIG. An insulator 813 is attached to the terminal 811 in order to prevent a short circuit. The terminal 831 is attached to the backplane 115 shown in FIG. An insulator 833 is attached to the terminal 831 to prevent a short circuit.

  This figure shows a state in which the CPU blade 200 shown in FIG. 3 is inserted into the server frame 113 shown in FIG. At this time, the terminal 811 is inserted into the case 851. A balloon 853 is installed in the case 851. Balloon 853 communicates with cylinder 855. A liquid 857 is contained in the cylinder 855. The liquid 857 is, for example, oil. A piston 859 is inserted into the cylinder 855, and the liquid 857 flows from the inside of the cylinder 855 into the balloon 853 when the piston 859 is put in and out. That is, when the piston 859 enters the cylinder 855, the balloon 853 expands. Conversely, when the piston 859 exits the cylinder 855, the balloon 853 contracts. The piston 859 is fixed to the case 851, and the piston 859 can be taken in and out of the cylinder 855 by the movement of the case 851. The piston 859 does not come out of the cylinder 855 completely. Note that the balloon 853 may be called a flexible member.

  When the terminal 811 is inserted into the case 851, since the balloon 853 is not inflated, there is a gap 861 between the terminal 811 and the terminal 831. For this reason, the terminal 811 can be easily inserted between the terminal 831 and the balloon 853 in the case.

  When the terminal 811 is completely inserted into the case 851, the case 851 moves, and the piston 859 pressurizes the liquid 857 in the cylinder 855 to inflate the balloon 853. As the balloon 853 is inflated, the terminal 811 is pressed against the terminal 831. At this time, the inside of the cylinder 855 is kept at an appropriate pressure by the spring 865 so that an excessive pressure is not applied to the balloon 853 by the liquid 857.

  When the terminal 811 is removed, first, the terminal 811 moves together with the case 851. At this time, the balloon 853 is deflated, and a gap 861 is formed again between the terminals 811 and 831. The case 851 is moved to a predetermined position by the spring 863. Since there is a gap 861 between the terminal 811 and the terminal 831, the terminal 811 can be easily removed from the case 851.

  As described above, according to the present invention, the first heat radiating portion and the second heat absorbing portion can be pressed with a contact surface pressure sufficient to connect with a thermal resistance smaller than a predetermined value, And from the position alignment of said 1st heat radiating part and said 2nd heat absorption part to press contact can be completed by one operation | movement at the time of mounting | wearing with the said braid | blade to the said housing | casing.

  Further, according to the present invention, the contact resistance between the two terminals described above (between the terminal 811 and the terminal 831) is reduced, and the deterioration of the contact resistance is suppressed, so that the voltage drop when a large current is passed. In addition, the above-described two terminals can be pressed against each other by one operation of mounting the blade on the casing.

  Furthermore, according to the present invention, it is possible to provide an electronic device that is equipped with a high-performance CPU that consumes a large amount of power and generates a large amount of heat, and that can be easily maintained.

1 is a conceptual perspective view of a rack mount type electronic device in which a blade server or the like according to an embodiment of the present invention is mounted. It is a schematic structure perspective view of the blade server which shows the Example by this invention. It is a schematic sectional drawing of the cooling device of CPU which shows the Example by this invention. It is a perspective view which shows the thermal connector of Example 1 by this invention. It is a disassembled perspective view which shows the thermal connector of Example 1 by this invention. It is sectional drawing of a thermal connector periphery in the insertion process initial stage of CPU blade of Example 1 by this invention. It is sectional drawing of the thermal connector periphery in the middle of the insertion process of CPU blade of Example 1 by this invention. It is sectional drawing of the thermal connector periphery at the time of completion of insertion of CPU blade of Example 1 by this invention. It is sectional drawing of the thermal connector periphery in the insertion process of CPU blade of Example 2 by this invention. FIG. 6 is a sectional view taken along line BB of FIG. 3 when the insertion of the CPU blade of Example 3 according to the present invention is completed. FIG. 6 is a cross-sectional view taken along line AA of FIG. 3 when the insertion of the CPU blade of Example 3 according to the present invention is completed. FIG. 6 is a cross-sectional view taken along the line BB in FIG. 3 in the process of removing the CPU blade according to the third embodiment of the present invention. FIG. 6 is a cross-sectional view taken along the line AA of FIG. 3 in the process of removing the CPU blade according to the third embodiment of the present invention. It is sectional drawing in the insertion process of the electrical connector of Example 4 by this invention. It is sectional drawing at the time of completion of insertion of the electrical connector of Example 4 by this invention. It is sectional drawing of the electronic device in patent document 1. FIG.

Explanation of symbols

  91: Insertion direction, 93: Removal direction, 95: Pressing direction, 101: Rack mount cabinet, 103: Housing, 105: Lid, 107: Shelf, 109: Blade server, 111: Cooling device, 113: Server frame, 115: Backplane, 200: CPU blade, 201: CPU, 203, 539: Stopper, 300: First cooling means, 301: First heat absorbing part, 303: First heat radiating part, 305: Thermal conductive sheet, 400: second cooling means, 401: second heat absorbing portion, 403: second heat radiating portion, 405: piping, 407, 563, 575, 579: leaf spring, 500: thermal connector, 501: rail, 503, 551, 571, 851: Case, 552: Back wall, 505, 537, 559, 863, 865: Spring, 507, 861: Clearance, 531, 5 1,581,853: Balloon, 532: Tube, 533, 855: Cylinder, 535, 735, 859: Piston, 541: O-ring, 543, 582, 857: Liquid, 553, 573: Plate, 555: Rail for case 557: plate rail, 777: rod, 583: lever, 710: chassis, 711: chassis wall surface, 720: block, 721: module, 730: heat sink, 731: refrigerant, 733: piping, 811, 831: terminal , 813, 833: insulators.

Claims (6)

  In an electronic apparatus comprising: a blade on which a heating element is mounted; a server frame that is electrically connected by inserting the blade; and a cooling device that absorbs heat from the heating element and dissipates the heat to the outside of the server frame. The cooling device thermally connects the first cooling means fixed to the blade, the second cooling means fixed to the server frame, and the first cooling means and the second cooling means. Including a thermal connector for connection, wherein the first cooling means includes a first heat absorbing portion and a first heat radiating portion, and the second cooling means includes a second heat absorbing portion and a second heat radiating portion. The thermal connector includes a flexible member that expands and contracts in conjunction with the insertion / extraction of the blade to / from the server frame, and heats the first heat dissipating part and the second heat absorbing part. Can be connected Electronic apparatus characterized.   The electronic device according to claim 1, wherein the first cooling unit and / or the second cooling unit is configured to use a phase change of a refrigerant.   The electronic device according to claim 1, wherein the flexible member communicates with a cylinder, a piston inserted into the cylinder is fixed to the server frame, and the flexible member and the piston are inserted into the server frame as the blade is inserted into the server frame. An electronic apparatus characterized in that a fluid that is held inside the cylinder and that can flow between the flexible member and the cylinder is pushed into the flexible member.   2. The electronic device according to claim 1, wherein the flexible member is attached to a case of the thermal connector, and the flexible member expands with the insertion of the first heat radiating portion into the case. An electronic apparatus, wherein the heat radiating portion and the second heat radiating portion are in pressure contact.   5. The electronic device according to claim 1, wherein a heat conducting member is interposed between the first heat radiating portion and the second heat absorbing portion in the case. Electronics.   6. The electronic device according to claim 1, wherein an elastic body is provided inside the case for holding a gap for inserting the first heat radiating portion inside the case. 7. Electronic equipment characterized by

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