JP4451371B2 - 窒化物半導体レーザ素子 - Google Patents
窒化物半導体レーザ素子 Download PDFInfo
- Publication number
- JP4451371B2 JP4451371B2 JP2005298361A JP2005298361A JP4451371B2 JP 4451371 B2 JP4451371 B2 JP 4451371B2 JP 2005298361 A JP2005298361 A JP 2005298361A JP 2005298361 A JP2005298361 A JP 2005298361A JP 4451371 B2 JP4451371 B2 JP 4451371B2
- Authority
- JP
- Japan
- Prior art keywords
- nitride semiconductor
- face
- layer
- adhesion layer
- semiconductor laser
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
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Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
- H01S5/00—Semiconductor lasers
- H01S5/02—Structural details or components not essential to laser action
- H01S5/028—Coatings ; Treatment of the laser facets, e.g. etching, passivation layers or reflecting layers
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B82—NANOTECHNOLOGY
- B82Y—SPECIFIC USES OR APPLICATIONS OF NANOSTRUCTURES; MEASUREMENT OR ANALYSIS OF NANOSTRUCTURES; MANUFACTURE OR TREATMENT OF NANOSTRUCTURES
- B82Y20/00—Nanooptics, e.g. quantum optics or photonic crystals
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
- H01S5/00—Semiconductor lasers
- H01S5/0014—Measuring characteristics or properties thereof
- H01S5/0021—Degradation or life time measurements
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
- H01S5/00—Semiconductor lasers
- H01S5/02—Structural details or components not essential to laser action
- H01S5/028—Coatings ; Treatment of the laser facets, e.g. etching, passivation layers or reflecting layers
- H01S5/0281—Coatings made of semiconductor materials
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
- H01S5/00—Semiconductor lasers
- H01S5/02—Structural details or components not essential to laser action
- H01S5/028—Coatings ; Treatment of the laser facets, e.g. etching, passivation layers or reflecting layers
- H01S5/0282—Passivation layers or treatments
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
- H01S5/00—Semiconductor lasers
- H01S5/20—Structure or shape of the semiconductor body to guide the optical wave ; Confining structures perpendicular to the optical axis, e.g. index or gain guiding, stripe geometry, broad area lasers, gain tailoring, transverse or lateral reflectors, special cladding structures, MQW barrier reflection layers
- H01S5/22—Structure or shape of the semiconductor body to guide the optical wave ; Confining structures perpendicular to the optical axis, e.g. index or gain guiding, stripe geometry, broad area lasers, gain tailoring, transverse or lateral reflectors, special cladding structures, MQW barrier reflection layers having a ridge or stripe structure
- H01S5/223—Buried stripe structure
- H01S5/2231—Buried stripe structure with inner confining structure only between the active layer and the upper electrode
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
- H01S5/00—Semiconductor lasers
- H01S5/30—Structure or shape of the active region; Materials used for the active region
- H01S5/34—Structure or shape of the active region; Materials used for the active region comprising quantum well or superlattice structures, e.g. single quantum well [SQW] lasers, multiple quantum well [MQW] lasers or graded index separate confinement heterostructure [GRINSCH] lasers
- H01S5/343—Structure or shape of the active region; Materials used for the active region comprising quantum well or superlattice structures, e.g. single quantum well [SQW] lasers, multiple quantum well [MQW] lasers or graded index separate confinement heterostructure [GRINSCH] lasers in AIIIBV compounds, e.g. AlGaAs-laser, InP-based laser
- H01S5/34333—Structure or shape of the active region; Materials used for the active region comprising quantum well or superlattice structures, e.g. single quantum well [SQW] lasers, multiple quantum well [MQW] lasers or graded index separate confinement heterostructure [GRINSCH] lasers in AIIIBV compounds, e.g. AlGaAs-laser, InP-based laser with a well layer based on Ga(In)N or Ga(In)P, e.g. blue laser
Landscapes
- Physics & Mathematics (AREA)
- Engineering & Computer Science (AREA)
- Nanotechnology (AREA)
- Optics & Photonics (AREA)
- Chemical & Material Sciences (AREA)
- Crystallography & Structural Chemistry (AREA)
- Biophysics (AREA)
- Life Sciences & Earth Sciences (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Electromagnetism (AREA)
- Semiconductor Lasers (AREA)
- Physical Vapour Deposition (AREA)
Priority Applications (6)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2005298361A JP4451371B2 (ja) | 2004-12-20 | 2005-10-13 | 窒化物半導体レーザ素子 |
| CN 200510136195 CN1805230B (zh) | 2004-12-20 | 2005-12-20 | 氮化物半导体发光元件及其制造方法 |
| CN201110082164.XA CN102170090B (zh) | 2004-12-20 | 2005-12-20 | 氮化物半导体发光元件 |
| US11/311,138 US7701994B2 (en) | 2004-12-20 | 2005-12-20 | Nitride semiconductor light-emitting device and method for fabrication thereof |
| US12/659,149 US7820542B2 (en) | 2004-12-20 | 2010-02-26 | Nitride semiconductor light-emitting device and method for fabrication thereof |
| US12/923,334 US8129732B2 (en) | 2004-12-20 | 2010-09-15 | Nitride semiconductor light-emitting device and method for fabrication thereof |
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2004367005 | 2004-12-20 | ||
| JP2005298361A JP4451371B2 (ja) | 2004-12-20 | 2005-10-13 | 窒化物半導体レーザ素子 |
Related Child Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2009143037A Division JP2009206526A (ja) | 2004-12-20 | 2009-06-16 | 窒化物半導体発光素子の製造方法 |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| JP2006203162A JP2006203162A (ja) | 2006-08-03 |
| JP2006203162A5 JP2006203162A5 (enExample) | 2009-02-05 |
| JP4451371B2 true JP4451371B2 (ja) | 2010-04-14 |
Family
ID=36595689
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2005298361A Expired - Lifetime JP4451371B2 (ja) | 2004-12-20 | 2005-10-13 | 窒化物半導体レーザ素子 |
Country Status (3)
| Country | Link |
|---|---|
| US (3) | US7701994B2 (enExample) |
| JP (1) | JP4451371B2 (enExample) |
| CN (1) | CN102170090B (enExample) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2007103814A (ja) * | 2005-10-07 | 2007-04-19 | Sharp Corp | 窒化物半導体発光素子およびその製造方法 |
| JP2012044230A (ja) * | 2011-11-30 | 2012-03-01 | Sharp Corp | 窒化物半導体発光素子 |
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| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP4451371B2 (ja) * | 2004-12-20 | 2010-04-14 | シャープ株式会社 | 窒化物半導体レーザ素子 |
| JP5285835B2 (ja) * | 2005-07-13 | 2013-09-11 | 株式会社東芝 | 半導体素子およびその製造方法 |
| JP5191650B2 (ja) * | 2005-12-16 | 2013-05-08 | シャープ株式会社 | 窒化物半導体発光素子および窒化物半導体発光素子の製造方法 |
| KR100853241B1 (ko) * | 2005-12-16 | 2008-08-20 | 샤프 가부시키가이샤 | 질화물 반도체 발광소자 및 질화물 반도체 레이저 소자의제조방법 |
| JP2007201412A (ja) * | 2005-12-27 | 2007-08-09 | Sanyo Electric Co Ltd | 半導体レーザ装置およびその製造方法 |
| JP5004597B2 (ja) * | 2006-03-06 | 2012-08-22 | シャープ株式会社 | 窒化物半導体発光素子および窒化物半導体発光素子の製造方法 |
| JP5430826B2 (ja) * | 2006-03-08 | 2014-03-05 | シャープ株式会社 | 窒化物半導体レーザ素子 |
| JP4444304B2 (ja) * | 2006-04-24 | 2010-03-31 | シャープ株式会社 | 窒化物半導体発光素子および窒化物半導体発光素子の製造方法 |
| GB2439973A (en) * | 2006-07-13 | 2008-01-16 | Sharp Kk | Modifying the optical properties of a nitride optoelectronic device |
| JP2008060472A (ja) * | 2006-09-01 | 2008-03-13 | Sumitomo Electric Ind Ltd | 半導体レーザ及びその製造方法 |
| JP4799339B2 (ja) * | 2006-09-22 | 2011-10-26 | シャープ株式会社 | 窒化物半導体発光素子 |
| JP5011942B2 (ja) * | 2006-10-17 | 2012-08-29 | ソニー株式会社 | 半導体レーザの製造方法 |
| JP5042609B2 (ja) * | 2006-12-08 | 2012-10-03 | シャープ株式会社 | 窒化物系半導体素子 |
| JP4978454B2 (ja) * | 2006-12-28 | 2012-07-18 | 日亜化学工業株式会社 | 窒化物半導体レーザ素子 |
| JP2008227002A (ja) * | 2007-03-09 | 2008-09-25 | Nichia Chem Ind Ltd | 窒化物半導体レーザ素子 |
| JP2008218523A (ja) * | 2007-02-28 | 2008-09-18 | Nichia Chem Ind Ltd | 窒化物半導体レーザ素子及びその製造方法 |
| JP2008205171A (ja) * | 2007-02-20 | 2008-09-04 | Nichia Chem Ind Ltd | 窒化物半導体レーザ素子 |
| JP5670009B2 (ja) * | 2007-02-26 | 2015-02-18 | 日亜化学工業株式会社 | 窒化物半導体レーザ素子 |
| JP5681338B2 (ja) * | 2007-02-28 | 2015-03-04 | 日亜化学工業株式会社 | 窒化物半導体レーザ素子 |
| JP5162926B2 (ja) * | 2007-03-07 | 2013-03-13 | 三菱電機株式会社 | 半導体レーザ装置の製造方法 |
| JP4946524B2 (ja) * | 2007-03-08 | 2012-06-06 | 三菱電機株式会社 | 半導体レーザ装置 |
| JP2008235790A (ja) * | 2007-03-23 | 2008-10-02 | Mitsubishi Electric Corp | 半導体光素子の製造方法 |
| JP5004642B2 (ja) * | 2007-04-19 | 2012-08-22 | 三洋電機株式会社 | 半導体レーザ装置 |
| JP4986714B2 (ja) * | 2007-05-30 | 2012-07-25 | 三洋電機株式会社 | 窒化物系半導体レーザ素子およびその製造方法 |
| JP5572919B2 (ja) * | 2007-06-07 | 2014-08-20 | 日亜化学工業株式会社 | 窒化物半導体レーザ素子 |
| JP5127644B2 (ja) * | 2007-09-28 | 2013-01-23 | 三洋電機株式会社 | 窒化物系半導体レーザ素子 |
| JP5127642B2 (ja) * | 2007-09-28 | 2013-01-23 | 三洋電機株式会社 | 窒化物系半導体レーザ素子 |
| JP4598040B2 (ja) * | 2007-10-04 | 2010-12-15 | シャープ株式会社 | 窒化物半導体レーザ素子 |
| DE102008012859B4 (de) * | 2007-12-21 | 2023-10-05 | OSRAM Opto Semiconductors Gesellschaft mit beschränkter Haftung | Laserlichtquelle mit einer Filterstruktur |
| JP2009170801A (ja) * | 2008-01-18 | 2009-07-30 | Mitsubishi Electric Corp | 半導体レーザ |
| JP2009176812A (ja) * | 2008-01-22 | 2009-08-06 | Mitsubishi Electric Corp | 半導体レーザ |
| KR101461673B1 (ko) * | 2008-02-11 | 2014-11-13 | 엘지전자 주식회사 | 반도체 레이저 다이오드 패키지 시스템 및 그 방법 |
| JP5183516B2 (ja) * | 2008-02-15 | 2013-04-17 | 三洋電機株式会社 | 半導体レーザ素子 |
| JP5443356B2 (ja) | 2008-07-10 | 2014-03-19 | 株式会社東芝 | 半導体レーザ装置 |
| JP5193718B2 (ja) * | 2008-07-18 | 2013-05-08 | パナソニック株式会社 | 窒化物半導体レーザ装置 |
| JP2010135516A (ja) * | 2008-12-03 | 2010-06-17 | Panasonic Corp | 窒化物半導体発光装置 |
| JP5383313B2 (ja) | 2009-05-20 | 2014-01-08 | パナソニック株式会社 | 窒化物半導体発光装置 |
| JP4621791B2 (ja) | 2009-06-11 | 2011-01-26 | シャープ株式会社 | 窒化物半導体レーザ素子 |
| JP5707772B2 (ja) | 2010-08-06 | 2015-04-30 | 日亜化学工業株式会社 | 窒化物半導体レーザ素子及びその製造方法 |
| JP2012109499A (ja) | 2010-11-19 | 2012-06-07 | Sony Corp | 半導体レーザ素子およびその製造方法 |
| CN102545046B (zh) * | 2012-01-17 | 2013-05-01 | 东南大学 | 回音壁模微腔激光二极管的制备方法 |
| CN102545060B (zh) * | 2012-01-17 | 2013-03-20 | 东南大学 | 一种微激光二极管阵列的制备方法 |
| JP5491679B1 (ja) * | 2012-06-29 | 2014-05-14 | パナソニック株式会社 | 窒化物半導体発光素子 |
Family Cites Families (29)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US4317086A (en) * | 1979-09-13 | 1982-02-23 | Xerox Corporation | Passivation and reflector structure for electroluminescent devices |
| JPH0834337B2 (ja) * | 1990-04-02 | 1996-03-29 | シャープ株式会社 | 半導体レーザ素子の製造方法 |
| JPH07162086A (ja) * | 1993-12-10 | 1995-06-23 | Mitsubishi Electric Corp | 半導体レーザの製造方法 |
| US5689123A (en) * | 1994-04-07 | 1997-11-18 | Sdl, Inc. | III-V aresenide-nitride semiconductor materials and devices |
| JPH07335981A (ja) * | 1994-06-07 | 1995-12-22 | Mitsubishi Electric Corp | 半導体発光素子,レーザアンプ,及び増幅機能を有する波長可変フィルタ |
| JPH08316582A (ja) * | 1995-05-19 | 1996-11-29 | Nec Corp | 半導体レーザ |
| JPH09162496A (ja) | 1995-12-12 | 1997-06-20 | Nippon Telegr & Teleph Corp <Ntt> | 半導体レーザ及びその製造方法 |
| JP3774503B2 (ja) | 1996-04-17 | 2006-05-17 | 日本オプネクスト株式会社 | 半導体レーザ素子およびその製造方法 |
| US6387721B1 (en) * | 1998-09-25 | 2002-05-14 | Mitsubishi Chemical Corporation | Semiconductor light-emitting device and manufacturing method for the same |
| JP2001160627A (ja) * | 1999-11-30 | 2001-06-12 | Toyoda Gosei Co Ltd | Iii族窒化物系化合物半導体発光素子 |
| US6693935B2 (en) * | 2000-06-20 | 2004-02-17 | Sony Corporation | Semiconductor laser |
| JP4033644B2 (ja) | 2000-07-18 | 2008-01-16 | 日亜化学工業株式会社 | 窒化ガリウム系発光素子 |
| JP2002076522A (ja) * | 2000-09-01 | 2002-03-15 | Nec Corp | 窒化物半導体レーザ |
| JP4315583B2 (ja) * | 2000-09-19 | 2009-08-19 | パイオニア株式会社 | Iii族窒化物系半導体レーザ素子 |
| JP4251529B2 (ja) * | 2001-02-14 | 2009-04-08 | シャープ株式会社 | 窒化物半導体レーザ素子およびそれを用いた光学式情報再生装置 |
| JP4977931B2 (ja) | 2001-03-06 | 2012-07-18 | ソニー株式会社 | GaN系半導体レーザの製造方法 |
| JP2003069148A (ja) * | 2001-08-27 | 2003-03-07 | Fuji Photo Film Co Ltd | 半導体レーザ素子 |
| US6379985B1 (en) * | 2001-08-01 | 2002-04-30 | Xerox Corporation | Methods for cleaving facets in III-V nitrides grown on c-face sapphire substrates |
| JP2003060298A (ja) | 2001-08-08 | 2003-02-28 | Nichia Chem Ind Ltd | 半導体発光素子の製造方法と半導体発光素子 |
| US6734111B2 (en) * | 2001-08-09 | 2004-05-11 | Comlase Ab | Method to GaAs based lasers and a GaAs based laser |
| WO2003043150A1 (en) * | 2001-10-26 | 2003-05-22 | Ammono Sp.Zo.O. | Light emitting element structure using nitride bulk single crystal layer |
| JP3749498B2 (ja) * | 2002-03-26 | 2006-03-01 | スタンレー電気株式会社 | 結晶成長用基板およびZnO系化合物半導体デバイス |
| JP2004335559A (ja) | 2003-04-30 | 2004-11-25 | Nichia Chem Ind Ltd | Iii族窒化物基板を用いる半導体素子 |
| JP2005101536A (ja) | 2003-08-28 | 2005-04-14 | Nichia Chem Ind Ltd | 窒化物半導体レーザ素子 |
| EP2937897A3 (en) * | 2003-09-15 | 2016-03-23 | Nuvotronics LLC | Device package and methods for the fabrication and testing thereof |
| JP2005127383A (ja) | 2003-10-22 | 2005-05-19 | Nok Corp | 磁性流体シールユニット |
| JP2005175111A (ja) | 2003-12-10 | 2005-06-30 | Hitachi Ltd | 半導体レーザ及びその製造方法 |
| JP4451371B2 (ja) * | 2004-12-20 | 2010-04-14 | シャープ株式会社 | 窒化物半導体レーザ素子 |
| JP4444304B2 (ja) * | 2006-04-24 | 2010-03-31 | シャープ株式会社 | 窒化物半導体発光素子および窒化物半導体発光素子の製造方法 |
-
2005
- 2005-10-13 JP JP2005298361A patent/JP4451371B2/ja not_active Expired - Lifetime
- 2005-12-20 US US11/311,138 patent/US7701994B2/en active Active
- 2005-12-20 CN CN201110082164.XA patent/CN102170090B/zh not_active Expired - Lifetime
-
2010
- 2010-02-26 US US12/659,149 patent/US7820542B2/en not_active Expired - Lifetime
- 2010-09-15 US US12/923,334 patent/US8129732B2/en not_active Expired - Lifetime
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2007103814A (ja) * | 2005-10-07 | 2007-04-19 | Sharp Corp | 窒化物半導体発光素子およびその製造方法 |
| JP2012044230A (ja) * | 2011-11-30 | 2012-03-01 | Sharp Corp | 窒化物半導体発光素子 |
Also Published As
| Publication number | Publication date |
|---|---|
| CN102170090A (zh) | 2011-08-31 |
| JP2006203162A (ja) | 2006-08-03 |
| CN102170090B (zh) | 2013-04-03 |
| US20100159626A1 (en) | 2010-06-24 |
| US20110007770A1 (en) | 2011-01-13 |
| US8129732B2 (en) | 2012-03-06 |
| US7701994B2 (en) | 2010-04-20 |
| US7820542B2 (en) | 2010-10-26 |
| US20060133442A1 (en) | 2006-06-22 |
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| JP2007081017A (ja) | モノリシック型半導体レーザ | |
| JP2007081016A (ja) | 半導体レーザ |
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