JP4163950B2 - セルフティーチングロボット - Google Patents

セルフティーチングロボット Download PDF

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Publication number
JP4163950B2
JP4163950B2 JP2002548748A JP2002548748A JP4163950B2 JP 4163950 B2 JP4163950 B2 JP 4163950B2 JP 2002548748 A JP2002548748 A JP 2002548748A JP 2002548748 A JP2002548748 A JP 2002548748A JP 4163950 B2 JP4163950 B2 JP 4163950B2
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JP
Japan
Prior art keywords
robot
target
sensor
end effector
workpiece
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Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
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JP2002548748A
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English (en)
Japanese (ja)
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JP2004536443A5 (enExample
JP2004536443A (ja
Inventor
ロジャー ジー ハイン
グラハム エル ハイン
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Asyst Technologies Inc
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Asyst Technologies Inc
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Publication of JP2004536443A publication Critical patent/JP2004536443A/ja
Publication of JP2004536443A5 publication Critical patent/JP2004536443A5/ja
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Publication of JP4163950B2 publication Critical patent/JP4163950B2/ja
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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67242—Apparatus for monitoring, sorting or marking
    • H01L21/67259—Position monitoring, e.g. misposition detection or presence detection
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/68—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for positioning, orientation or alignment
    • H01L21/681—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for positioning, orientation or alignment using optical controlling means
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
    • H01L21/68707—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a robot blade, or gripped by a gripper for conveyance

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  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Robotics (AREA)
  • Manipulator (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
JP2002548748A 2000-12-04 2001-11-28 セルフティーチングロボット Expired - Fee Related JP4163950B2 (ja)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US09/729,463 US6591160B2 (en) 2000-12-04 2000-12-04 Self teaching robot
PCT/US2001/044393 WO2002047115A2 (en) 2000-12-04 2001-11-28 Self teaching robot

Publications (3)

Publication Number Publication Date
JP2004536443A JP2004536443A (ja) 2004-12-02
JP2004536443A5 JP2004536443A5 (enExample) 2005-12-22
JP4163950B2 true JP4163950B2 (ja) 2008-10-08

Family

ID=24931146

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2002548748A Expired - Fee Related JP4163950B2 (ja) 2000-12-04 2001-11-28 セルフティーチングロボット

Country Status (5)

Country Link
US (1) US6591160B2 (enExample)
JP (1) JP4163950B2 (enExample)
AU (1) AU2002236492A1 (enExample)
TW (1) TW508289B (enExample)
WO (1) WO2002047115A2 (enExample)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US8309983B2 (en) 2010-03-25 2012-11-13 Lg Innotek Co., Ltd. Light emitting device package and lighting system having the same
JP2014165439A (ja) * 2013-02-27 2014-09-08 Tokyo Electron Ltd 基板搬送装置、基板受渡位置確認方法及び基板処理システム

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JP3694808B2 (ja) * 2001-04-13 2005-09-14 株式会社安川電機 ウェハ搬送用ロボットの教示方法および教示用プレート
US6678583B2 (en) * 2001-08-06 2004-01-13 Seminet, Inc. Robotic storage buffer system for substrate carrier pods
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US20030053892A1 (en) * 2001-09-17 2003-03-20 Taiwan Semiconductor Manufacturing Co., Ltd. Loadport equipped with automatic height adjustment means and method for operating
US7289230B2 (en) 2002-02-06 2007-10-30 Cyberoptics Semiconductors, Inc. Wireless substrate-like sensor
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US6795786B2 (en) * 2002-12-31 2004-09-21 Intel Corporation Robotic sensor calibration system
US7397539B2 (en) * 2003-03-31 2008-07-08 Asml Netherlands, B.V. Transfer apparatus for transferring an object, lithographic apparatus employing such a transfer apparatus, and method of use thereof
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KR101015778B1 (ko) * 2003-06-03 2011-02-22 도쿄엘렉트론가부시키가이샤 기판 처리장치 및 기판 수수 위치의 조정 방법
JP4137711B2 (ja) * 2003-06-16 2008-08-20 東京エレクトロン株式会社 基板処理装置及び基板搬送手段の位置合わせ方法
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US8309983B2 (en) 2010-03-25 2012-11-13 Lg Innotek Co., Ltd. Light emitting device package and lighting system having the same
JP2014165439A (ja) * 2013-02-27 2014-09-08 Tokyo Electron Ltd 基板搬送装置、基板受渡位置確認方法及び基板処理システム

Also Published As

Publication number Publication date
WO2002047115A3 (en) 2003-05-15
US20020068992A1 (en) 2002-06-06
JP2004536443A (ja) 2004-12-02
TW508289B (en) 2002-11-01
AU2002236492A1 (en) 2002-06-18
US6591160B2 (en) 2003-07-08
WO2002047115A2 (en) 2002-06-13

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