AU2002236492A1 - Self teaching robot - Google Patents

Self teaching robot

Info

Publication number
AU2002236492A1
AU2002236492A1 AU2002236492A AU3649202A AU2002236492A1 AU 2002236492 A1 AU2002236492 A1 AU 2002236492A1 AU 2002236492 A AU2002236492 A AU 2002236492A AU 3649202 A AU3649202 A AU 3649202A AU 2002236492 A1 AU2002236492 A1 AU 2002236492A1
Authority
AU
Australia
Prior art keywords
teaching robot
self teaching
self
robot
teaching
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Abandoned
Application number
AU2002236492A
Other languages
English (en)
Inventor
Graham L. Hine
Roger G. Hine
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Asyst Technologies Inc
Original Assignee
ASYST TECHNOLOGIES
Asyst Technologies Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by ASYST TECHNOLOGIES, Asyst Technologies Inc filed Critical ASYST TECHNOLOGIES
Publication of AU2002236492A1 publication Critical patent/AU2002236492A1/en
Abandoned legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67242—Apparatus for monitoring, sorting or marking
    • H01L21/67259—Position monitoring, e.g. misposition detection or presence detection
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/68—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for positioning, orientation or alignment
    • H01L21/681—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for positioning, orientation or alignment using optical controlling means
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
    • H01L21/68707—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a robot blade, or gripped by a gripper for conveyance

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Robotics (AREA)
  • Manipulator (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
AU2002236492A 2000-12-04 2001-11-28 Self teaching robot Abandoned AU2002236492A1 (en)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US09/729,463 2000-12-04
US09/729,463 US6591160B2 (en) 2000-12-04 2000-12-04 Self teaching robot
PCT/US2001/044393 WO2002047115A2 (en) 2000-12-04 2001-11-28 Self teaching robot

Publications (1)

Publication Number Publication Date
AU2002236492A1 true AU2002236492A1 (en) 2002-06-18

Family

ID=24931146

Family Applications (1)

Application Number Title Priority Date Filing Date
AU2002236492A Abandoned AU2002236492A1 (en) 2000-12-04 2001-11-28 Self teaching robot

Country Status (5)

Country Link
US (1) US6591160B2 (enExample)
JP (1) JP4163950B2 (enExample)
AU (1) AU2002236492A1 (enExample)
TW (1) TW508289B (enExample)
WO (1) WO2002047115A2 (enExample)

Families Citing this family (88)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6244121B1 (en) * 1998-03-06 2001-06-12 Applied Materials, Inc. Sensor device for non-intrusive diagnosis of a semiconductor processing system
SE9900123L (sv) * 1999-01-15 2000-07-16 Abb Ab Metod för robot
US6887026B1 (en) * 2000-12-22 2005-05-03 Infineon Technologie Sc300 Gmbh & Co. Kg Semiconductor product container and system for handling a semiconductor product container
KR100383260B1 (ko) * 2001-03-08 2003-05-09 삼성전자주식회사 레티클 위치감지장치기능을 갖는 포크 암을 구비한 레이클이송장치
JP3694808B2 (ja) * 2001-04-13 2005-09-14 株式会社安川電機 ウェハ搬送用ロボットの教示方法および教示用プレート
US6678583B2 (en) * 2001-08-06 2004-01-13 Seminet, Inc. Robotic storage buffer system for substrate carrier pods
JP3832292B2 (ja) * 2001-08-31 2006-10-11 株式会社ダイフク 荷保管設備
CN100431806C (zh) * 2001-09-07 2008-11-12 株式会社安川电机 晶片位置教示方法和教示用夹具
US20030053892A1 (en) * 2001-09-17 2003-03-20 Taiwan Semiconductor Manufacturing Co., Ltd. Loadport equipped with automatic height adjustment means and method for operating
US7289230B2 (en) 2002-02-06 2007-10-30 Cyberoptics Semiconductors, Inc. Wireless substrate-like sensor
US7233841B2 (en) * 2002-04-19 2007-06-19 Applied Materials, Inc. Vision system
US7085622B2 (en) 2002-04-19 2006-08-01 Applied Material, Inc. Vision system
US6825485B1 (en) * 2002-05-08 2004-11-30 Storage Technology Corporation System and method for aligning a robot device in a data storage library
US7039499B1 (en) * 2002-08-02 2006-05-02 Seminet Inc. Robotic storage buffer system for substrate carrier pods
US6795786B2 (en) * 2002-12-31 2004-09-21 Intel Corporation Robotic sensor calibration system
US7397539B2 (en) * 2003-03-31 2008-07-08 Asml Netherlands, B.V. Transfer apparatus for transferring an object, lithographic apparatus employing such a transfer apparatus, and method of use thereof
SG125948A1 (en) * 2003-03-31 2006-10-30 Asml Netherlands Bv Supporting structure for use in a lithographic apparatus
KR101015778B1 (ko) * 2003-06-03 2011-02-22 도쿄엘렉트론가부시키가이샤 기판 처리장치 및 기판 수수 위치의 조정 방법
JP4137711B2 (ja) * 2003-06-16 2008-08-20 東京エレクトロン株式会社 基板処理装置及び基板搬送手段の位置合わせ方法
US6934606B1 (en) * 2003-06-20 2005-08-23 Novellus Systems, Inc. Automatic calibration of a wafer-handling robot
US7458763B2 (en) * 2003-11-10 2008-12-02 Blueshift Technologies, Inc. Mid-entry load lock for semiconductor handling system
US10086511B2 (en) 2003-11-10 2018-10-02 Brooks Automation, Inc. Semiconductor manufacturing systems
US20070269297A1 (en) 2003-11-10 2007-11-22 Meulen Peter V D Semiconductor wafer handling and transport
US20050111956A1 (en) * 2003-11-10 2005-05-26 Blueshift Technologies, Inc. Methods and systems for reducing the effect of vibration in a vacuum-based semiconductor handling system
KR100577582B1 (ko) * 2004-06-09 2006-05-08 삼성전자주식회사 반도체 포토 스피너 설비 및 이를 이용한 웨이퍼 티칭불량방지방법
JP4775584B2 (ja) * 2004-06-25 2011-09-21 株式会社安川電機 ポジショナおよび複合カールコード
US20060047363A1 (en) * 2004-08-31 2006-03-02 Farrelly Philip J Machine vision system for lab workcells
US8000837B2 (en) 2004-10-05 2011-08-16 J&L Group International, Llc Programmable load forming system, components thereof, and methods of use
TWI447061B (zh) * 2005-07-11 2014-08-01 Brooks Automation Inc 備有自動化對準功能的基板移送裝置
US7933685B1 (en) * 2006-01-10 2011-04-26 National Semiconductor Corporation System and method for calibrating a wafer handling robot and a wafer cassette
US20070271638A1 (en) * 2006-05-03 2007-11-22 Data I/O Corporation Auto-teaching system
WO2008051544A1 (en) * 2006-10-23 2008-05-02 Cyberoptics Semiconductor, Inc. Improved calibration of a substrate handling robot
US8260461B2 (en) * 2007-08-30 2012-09-04 Applied Materials, Inc. Method and system for robot calibrations with a camera
US8224607B2 (en) * 2007-08-30 2012-07-17 Applied Materials, Inc. Method and apparatus for robot calibrations with a calibrating device
US8588958B2 (en) * 2007-09-04 2013-11-19 Musashi Engineering, Inc. Moving program making-out program and device
JP4863985B2 (ja) * 2007-12-20 2012-01-25 大日本スクリーン製造株式会社 基板処理装置
US9269529B2 (en) * 2007-12-27 2016-02-23 Lam Research Corporation Systems and methods for dynamic alignment beam calibration
CN101911276B (zh) * 2007-12-27 2012-04-25 朗姆研究公司 使用至少一个光源校准末端执行器对准的系统和方法
SG195592A1 (en) * 2007-12-27 2013-12-30 Lam Res Corp Arrangements and methods for determining positions and offsets in plasma processing system
US8751047B2 (en) * 2007-12-27 2014-06-10 Lam Research Corporation Systems and methods for calibrating end effector alignment in a plasma processing system
US7921690B2 (en) * 2008-01-10 2011-04-12 Parata Systems, Llc System and method for calibrating an automated materials handling system
NL1036673A1 (nl) * 2008-04-09 2009-10-12 Asml Holding Nv Robot Position Calibration Tool (RPCT).
US8242730B2 (en) * 2008-06-10 2012-08-14 Nichols Michael J Automated robot teach tool and method of use
CN101625528B (zh) * 2008-07-08 2010-09-29 中芯国际集成电路制造(上海)有限公司 掩模版夹具
US8886354B2 (en) * 2009-01-11 2014-11-11 Applied Materials, Inc. Methods, systems and apparatus for rapid exchange of work material
DE102009016811A1 (de) * 2009-04-09 2010-10-14 Aes Motomation Gmbh Verfahren zur automatischen Vermessung und zum Einlernen von Lagepositionen von Objekten innerhalb eines Substratprozessiersystems mittels Sensorträger und zugehöriger Sensorträger
KR101445911B1 (ko) * 2009-04-13 2014-09-29 히라따기꼬오 가부시키가이샤 기판캐리어 측정 지그, 충돌방지 지그 및 그것을 이용한 충돌방지 방법
US8676537B2 (en) * 2009-08-07 2014-03-18 Taiwan Semiconductor Manufacturing Company, Ltd. Portable wireless sensor
US8459922B2 (en) * 2009-11-13 2013-06-11 Brooks Automation, Inc. Manipulator auto-teach and position correction system
KR101064084B1 (ko) 2010-03-25 2011-09-08 엘지이노텍 주식회사 발광소자 패키지 및 그 제조방법
CN101907577B (zh) * 2010-07-13 2012-01-04 友达光电股份有限公司 卡匣校正系统及其方法
JP5849403B2 (ja) * 2011-02-15 2016-01-27 セイコーエプソン株式会社 ロボットコントローラー、ロボット、及び、ロボットシステム
US9233377B2 (en) 2011-04-13 2016-01-12 Siemens Healthcare Diagnostics Inc. Method, system, and apparatus for aligning the angle of a polar coordinate system device to the axis of an end-effector
US20170028557A1 (en) 2015-07-28 2017-02-02 Comprehensive Engineering Solutions, Inc. Robotic navigation system and method
DE102012200220A1 (de) * 2011-06-20 2012-12-20 Semilev Gmbh Verfahren zum Kalibrieren eines aktiv magnetgelagerten Roboters
US8646404B2 (en) * 2011-09-26 2014-02-11 Todd E. Hendricks, SR. Modular system with platformed robot, booth, and fluid delivery system for tire spraying
US20130173039A1 (en) * 2012-01-04 2013-07-04 Seagate Technology Llc Methods and devices for determining a teaching point location using pressure measurements
US20130269615A1 (en) * 2012-04-16 2013-10-17 Asm Ip Holding B.V. Vertical wafer boat
JP6114060B2 (ja) * 2013-02-27 2017-04-12 東京エレクトロン株式会社 基板搬送装置、基板受渡位置確認方法及び基板処理システム
SG2013025770A (en) 2013-04-05 2014-11-27 Sigenic Pte Ltd Apparatus and method for detecting position drift in a machine operation using a robot arm
US10203683B2 (en) 2013-07-16 2019-02-12 Seagate Technology Llc Coordinating end effector and vision controls
US10780586B2 (en) 2013-08-09 2020-09-22 Nidec Sankyo Corporation Horizontal articulated robot with bevel gears
JP6374156B2 (ja) * 2013-08-09 2018-08-15 日本電産サンキョー株式会社 水平多関節ロボットおよび水平多関節ロボットの製造方法
JP6309220B2 (ja) * 2013-08-12 2018-04-11 株式会社ダイヘン 搬送システム
US9666465B2 (en) * 2013-12-12 2017-05-30 Seagate Technology Llc Positioning apparatus
US9658316B2 (en) * 2013-12-30 2017-05-23 Taiwan Semiconductor Manufacturing Co., Ltd. Device and method for positioning and calibrating a wafer transportation apparatus
CN107112266B (zh) 2014-11-10 2020-12-08 布鲁克斯自动化公司 工具自动教导方法和设备
US10730180B2 (en) * 2015-05-29 2020-08-04 Abb Schweiz Ag User interface for a teleoperated robot
US20170028549A1 (en) * 2015-07-28 2017-02-02 Comprehensive Engineering Solutions, Inc. Robotic navigation system and method
US9966290B2 (en) 2015-07-30 2018-05-08 Lam Research Corporation System and method for wafer alignment and centering with CCD camera and robot
JP6444940B2 (ja) * 2016-05-17 2018-12-26 ファナック株式会社 被加工物保持システム
JP6741538B2 (ja) * 2016-09-28 2020-08-19 川崎重工業株式会社 ロボット、ロボットの制御装置、及び、ロボットの位置教示方法
JP6685213B2 (ja) * 2016-09-29 2020-04-22 株式会社Ｓｃｒｅｅｎホールディングス 基板整列装置、基板処理装置、基板配列装置、基板整列方法、基板処理方法および基板配列方法
TWI617995B (zh) * 2016-11-04 2018-03-11 廣明光電股份有限公司 機器人視覺定位的驗證方法
DE102018100003B4 (de) * 2017-08-08 2020-03-12 Taiwan Semiconductor Manufacturing Co., Ltd. Methodologie zum automatischen Anlernen eines EFEM-Roboters
US10861723B2 (en) * 2017-08-08 2020-12-08 Taiwan Semiconductor Manufacturing Co., Ltd. EFEM robot auto teaching methodology
US10020216B1 (en) * 2017-09-08 2018-07-10 Kawasaki Jukogyo Kabushiki Kaisha Robot diagnosing method
JP7187147B2 (ja) * 2017-12-12 2022-12-12 東京エレクトロン株式会社 搬送装置のティーチング方法及び基板処理システム
JP7049909B2 (ja) * 2018-05-11 2022-04-07 川崎重工業株式会社 基板搬送ロボット及び基板保持ハンドの光軸ずれ検出方法
CN110931377B (zh) 2018-09-20 2023-11-03 台湾积体电路制造股份有限公司 反射率测量系统与方法
US11756840B2 (en) * 2018-09-20 2023-09-12 Taiwan Semiconductor Manufacturing Co., Ltd. Reflectance measurement system and method thereof
WO2020163657A1 (en) 2019-02-08 2020-08-13 Yaskawa America, Inc. Through-beam auto teaching
CN113557434B (zh) 2019-03-07 2025-10-17 简·探针公司 加工仪器中用于运输和保持消耗品的系统和方法
US11524410B2 (en) * 2020-06-12 2022-12-13 Hexagon Metrology, Inc. Robotic alignment method for workpiece measuring systems
US11676845B2 (en) 2020-06-30 2023-06-13 Brooks Automation Us, Llc Automated teach apparatus for robotic systems and method therefor
US12121229B2 (en) * 2021-02-05 2024-10-22 Shenzhen Institutes Of Advanced Technology Chinese Academy Of Sciences Soft-bodied apparatus and method for opening eyelid
JP2025514965A (ja) 2022-05-04 2025-05-13 エフ． ホフマン－ラ ロシュ アーゲー スライド撮像設備
JP2024118194A (ja) 2023-02-20 2024-08-30 株式会社安川電機 ロボットシステム、キャリブレーションツール、及びキャリブレーション方法

Family Cites Families (28)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6016673B2 (ja) * 1978-12-25 1985-04-26 川崎重工業株式会社 サ−ボ系における被検体認識装置
US6163946A (en) * 1981-05-11 2000-12-26 Great Lakes Intellectual Property Vision target based assembly
JPS6132113A (ja) 1984-07-23 1986-02-14 Seiko Instr & Electronics Ltd ロボツト制御方式
US5579444A (en) 1987-08-28 1996-11-26 Axiom Bildverarbeitungssysteme Gmbh Adaptive vision-based controller
JP2512099B2 (ja) 1988-08-24 1996-07-03 松下電器産業株式会社 ロボットの動作教示方法および制御装置
US4945493A (en) 1988-09-26 1990-07-31 Ford Motor Company Method and system for correcting a robot path
US5297238A (en) 1991-08-30 1994-03-22 Cimetrix Incorporated Robot end-effector terminal control frame (TCF) calibration method and device
US5737441A (en) * 1991-12-12 1998-04-07 Nikon Corporation Aligning method and apparatus
JPH0615589A (ja) 1992-07-03 1994-01-25 Daihen Corp 産業用ロボット制御装置
WO1994023647A1 (en) 1993-04-22 1994-10-27 Pixsys, Inc. System for locating relative positions of objects
US6225012B1 (en) 1994-02-22 2001-05-01 Nikon Corporation Method for positioning substrate
US5802201A (en) * 1996-02-09 1998-09-01 The Trustees Of Columbia University In The City Of New York Robot system with vision apparatus and transparent grippers
JP3211655B2 (ja) * 1996-03-19 2001-09-25 トヨタ自動車株式会社 成形方法および成形装置
US6318951B1 (en) * 1999-07-09 2001-11-20 Semitool, Inc. Robots for microelectronic workpiece handling
CN1244018C (zh) * 1996-11-28 2006-03-01 株式会社尼康 曝光方法和曝光装置
US5988971A (en) * 1997-07-09 1999-11-23 Ade Optical Systems Corporation Wafer transfer robot
US6522386B1 (en) * 1997-07-24 2003-02-18 Nikon Corporation Exposure apparatus having projection optical system with aberration correction element
JPH1154407A (ja) 1997-08-05 1999-02-26 Nikon Corp 位置合わせ方法
US6157873A (en) 1998-04-09 2000-12-05 Motoman, Inc. Robot programming system and method
US6425865B1 (en) 1998-06-12 2002-07-30 The University Of British Columbia Robotically assisted medical ultrasound
US6447668B1 (en) * 1998-07-09 2002-09-10 Acm Research, Inc. Methods and apparatus for end-point detection
IL125337A0 (en) * 1998-07-14 1999-03-12 Nova Measuring Instr Ltd Method and apparatus for lithography monitoring and process control
US6490369B1 (en) * 1999-07-06 2002-12-03 Fanuc Robotics North America Method of viewing and identifying a part for a robot manipulator
US6460369B2 (en) * 1999-11-03 2002-10-08 Applied Materials, Inc. Consecutive deposition system
TWI223734B (en) * 1999-12-21 2004-11-11 Asml Netherlands Bv Crash prevention in positioning apparatus for use in lithographic projection apparatus
KR100621100B1 (ko) * 2000-02-11 2006-09-07 삼성전자주식회사 용접로봇 교시위치 보정방법 및 용접로봇시스템
US6516244B1 (en) * 2000-08-25 2003-02-04 Wafermasters, Inc. Wafer alignment system and method
US6466841B2 (en) * 2001-02-14 2002-10-15 Xerox Corporation Apparatus and method for determining a reference position for an industrial robot

Also Published As

Publication number Publication date
WO2002047115A3 (en) 2003-05-15
US20020068992A1 (en) 2002-06-06
JP2004536443A (ja) 2004-12-02
TW508289B (en) 2002-11-01
JP4163950B2 (ja) 2008-10-08
US6591160B2 (en) 2003-07-08
WO2002047115A2 (en) 2002-06-13

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