TW508289B - Self teaching robot - Google Patents
Self teaching robot Download PDFInfo
- Publication number
- TW508289B TW508289B TW090129815A TW90129815A TW508289B TW 508289 B TW508289 B TW 508289B TW 090129815 A TW090129815 A TW 090129815A TW 90129815 A TW90129815 A TW 90129815A TW 508289 B TW508289 B TW 508289B
- Authority
- TW
- Taiwan
- Prior art keywords
- workpiece
- sensor
- target
- transfer mechanism
- robot
- Prior art date
Links
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Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67242—Apparatus for monitoring, sorting or marking
- H01L21/67259—Position monitoring, e.g. misposition detection or presence detection
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/68—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for positioning, orientation or alignment
- H01L21/681—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for positioning, orientation or alignment using optical controlling means
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
- H01L21/68707—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a robot blade, or gripped by a gripper for conveyance
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Robotics (AREA)
- Manipulator (AREA)
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US09/729,463 US6591160B2 (en) | 2000-12-04 | 2000-12-04 | Self teaching robot |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| TW508289B true TW508289B (en) | 2002-11-01 |
Family
ID=24931146
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| TW090129815A TW508289B (en) | 2000-12-04 | 2001-12-03 | Self teaching robot |
Country Status (5)
| Country | Link |
|---|---|
| US (1) | US6591160B2 (enExample) |
| JP (1) | JP4163950B2 (enExample) |
| AU (1) | AU2002236492A1 (enExample) |
| TW (1) | TW508289B (enExample) |
| WO (1) | WO2002047115A2 (enExample) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| TWI447544B (zh) * | 2007-09-04 | 2014-08-01 | Musashi Engineering Inc | A memory medium, a device, and a computer program that has a program that creates a mobile program |
| TWI801456B (zh) * | 2017-12-12 | 2023-05-11 | 日商東京威力科創股份有限公司 | 搬送裝置之教導方法及基板處理系統 |
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| US6887026B1 (en) * | 2000-12-22 | 2005-05-03 | Infineon Technologie Sc300 Gmbh & Co. Kg | Semiconductor product container and system for handling a semiconductor product container |
| KR100383260B1 (ko) * | 2001-03-08 | 2003-05-09 | 삼성전자주식회사 | 레티클 위치감지장치기능을 갖는 포크 암을 구비한 레이클이송장치 |
| JP3694808B2 (ja) * | 2001-04-13 | 2005-09-14 | 株式会社安川電機 | ウェハ搬送用ロボットの教示方法および教示用プレート |
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| JP3832292B2 (ja) * | 2001-08-31 | 2006-10-11 | 株式会社ダイフク | 荷保管設備 |
| CN100431806C (zh) * | 2001-09-07 | 2008-11-12 | 株式会社安川电机 | 晶片位置教示方法和教示用夹具 |
| US20030053892A1 (en) * | 2001-09-17 | 2003-03-20 | Taiwan Semiconductor Manufacturing Co., Ltd. | Loadport equipped with automatic height adjustment means and method for operating |
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-
2001
- 2001-11-28 WO PCT/US2001/044393 patent/WO2002047115A2/en not_active Ceased
- 2001-11-28 AU AU2002236492A patent/AU2002236492A1/en not_active Abandoned
- 2001-11-28 JP JP2002548748A patent/JP4163950B2/ja not_active Expired - Fee Related
- 2001-12-03 TW TW090129815A patent/TW508289B/zh not_active IP Right Cessation
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| TWI447544B (zh) * | 2007-09-04 | 2014-08-01 | Musashi Engineering Inc | A memory medium, a device, and a computer program that has a program that creates a mobile program |
| TWI801456B (zh) * | 2017-12-12 | 2023-05-11 | 日商東京威力科創股份有限公司 | 搬送裝置之教導方法及基板處理系統 |
Also Published As
| Publication number | Publication date |
|---|---|
| WO2002047115A3 (en) | 2003-05-15 |
| US20020068992A1 (en) | 2002-06-06 |
| JP2004536443A (ja) | 2004-12-02 |
| AU2002236492A1 (en) | 2002-06-18 |
| JP4163950B2 (ja) | 2008-10-08 |
| US6591160B2 (en) | 2003-07-08 |
| WO2002047115A2 (en) | 2002-06-13 |
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