JP4027465B2 - アクティブマトリクス型表示装置およびその製造方法 - Google Patents
アクティブマトリクス型表示装置およびその製造方法 Download PDFInfo
- Publication number
- JP4027465B2 JP4027465B2 JP19177597A JP19177597A JP4027465B2 JP 4027465 B2 JP4027465 B2 JP 4027465B2 JP 19177597 A JP19177597 A JP 19177597A JP 19177597 A JP19177597 A JP 19177597A JP 4027465 B2 JP4027465 B2 JP 4027465B2
- Authority
- JP
- Japan
- Prior art keywords
- film
- active element
- display device
- photoelectric conversion
- active
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
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Classifications
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- G—PHYSICS
- G02—OPTICS
- G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
- G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
- G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour
- G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour based on liquid crystals, e.g. single liquid crystal display cells
- G02F1/133—Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
- G02F1/1333—Constructional arrangements; Manufacturing methods
- G02F1/1345—Conductors connecting electrodes to cell terminals
- G02F1/13454—Drivers integrated on the active matrix substrate
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
- H10D86/00—Integrated devices formed in or on insulating or conducting substrates, e.g. formed in silicon-on-insulator [SOI] substrates or on stainless steel or glass substrates
- H10D86/40—Integrated devices formed in or on insulating or conducting substrates, e.g. formed in silicon-on-insulator [SOI] substrates or on stainless steel or glass substrates characterised by multiple TFTs
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
- H10D86/00—Integrated devices formed in or on insulating or conducting substrates, e.g. formed in silicon-on-insulator [SOI] substrates or on stainless steel or glass substrates
- H10D86/40—Integrated devices formed in or on insulating or conducting substrates, e.g. formed in silicon-on-insulator [SOI] substrates or on stainless steel or glass substrates characterised by multiple TFTs
- H10D86/60—Integrated devices formed in or on insulating or conducting substrates, e.g. formed in silicon-on-insulator [SOI] substrates or on stainless steel or glass substrates characterised by multiple TFTs wherein the TFTs are in active matrices
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10F—INORGANIC SEMICONDUCTOR DEVICES SENSITIVE TO INFRARED RADIATION, LIGHT, ELECTROMAGNETIC RADIATION OF SHORTER WAVELENGTH OR CORPUSCULAR RADIATION
- H10F19/00—Integrated devices, or assemblies of multiple devices, comprising at least one photovoltaic cell covered by group H10F10/00, e.g. photovoltaic modules
- H10F19/50—Integrated devices comprising at least one photovoltaic cell and other types of semiconductor or solid-state components
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10F—INORGANIC SEMICONDUCTOR DEVICES SENSITIVE TO INFRARED RADIATION, LIGHT, ELECTROMAGNETIC RADIATION OF SHORTER WAVELENGTH OR CORPUSCULAR RADIATION
- H10F39/00—Integrated devices, or assemblies of multiple devices, comprising at least one element covered by group H10F30/00, e.g. radiation detectors comprising photodiode arrays
- H10F39/011—Manufacture or treatment of image sensors covered by group H10F39/12
- H10F39/016—Manufacture or treatment of image sensors covered by group H10F39/12 of thin-film-based image sensors
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10F—INORGANIC SEMICONDUCTOR DEVICES SENSITIVE TO INFRARED RADIATION, LIGHT, ELECTROMAGNETIC RADIATION OF SHORTER WAVELENGTH OR CORPUSCULAR RADIATION
- H10F39/00—Integrated devices, or assemblies of multiple devices, comprising at least one element covered by group H10F30/00, e.g. radiation detectors comprising photodiode arrays
- H10F39/011—Manufacture or treatment of image sensors covered by group H10F39/12
- H10F39/026—Wafer-level processing
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10F—INORGANIC SEMICONDUCTOR DEVICES SENSITIVE TO INFRARED RADIATION, LIGHT, ELECTROMAGNETIC RADIATION OF SHORTER WAVELENGTH OR CORPUSCULAR RADIATION
- H10F39/00—Integrated devices, or assemblies of multiple devices, comprising at least one element covered by group H10F30/00, e.g. radiation detectors comprising photodiode arrays
- H10F39/10—Integrated devices
- H10F39/12—Image sensors
- H10F39/191—Photoconductor image sensors
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10F—INORGANIC SEMICONDUCTOR DEVICES SENSITIVE TO INFRARED RADIATION, LIGHT, ELECTROMAGNETIC RADIATION OF SHORTER WAVELENGTH OR CORPUSCULAR RADIATION
- H10F39/00—Integrated devices, or assemblies of multiple devices, comprising at least one element covered by group H10F30/00, e.g. radiation detectors comprising photodiode arrays
- H10F39/80—Constructional details of image sensors
- H10F39/811—Interconnections
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10F—INORGANIC SEMICONDUCTOR DEVICES SENSITIVE TO INFRARED RADIATION, LIGHT, ELECTROMAGNETIC RADIATION OF SHORTER WAVELENGTH OR CORPUSCULAR RADIATION
- H10F77/00—Constructional details of devices covered by this subclass
- H10F77/30—Coatings
- H10F77/306—Coatings for devices having potential barriers
- H10F77/331—Coatings for devices having potential barriers for filtering or shielding light, e.g. multicolour filters for photodetectors
- H10F77/334—Coatings for devices having potential barriers for filtering or shielding light, e.g. multicolour filters for photodetectors for shielding light, e.g. light blocking layers or cold shields for infrared detectors
-
- G—PHYSICS
- G02—OPTICS
- G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
- G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
- G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour
- G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour based on liquid crystals, e.g. single liquid crystal display cells
- G02F1/133—Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
- G02F1/13306—Circuit arrangements or driving methods for the control of single liquid crystal cells
- G02F1/13312—Circuits comprising photodetectors for purposes other than feedback
-
- G—PHYSICS
- G02—OPTICS
- G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
- G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
- G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour
- G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour based on liquid crystals, e.g. single liquid crystal display cells
- G02F1/133—Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
- G02F1/13306—Circuit arrangements or driving methods for the control of single liquid crystal cells
- G02F1/13324—Circuits comprising solar cells
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10F—INORGANIC SEMICONDUCTOR DEVICES SENSITIVE TO INFRARED RADIATION, LIGHT, ELECTROMAGNETIC RADIATION OF SHORTER WAVELENGTH OR CORPUSCULAR RADIATION
- H10F39/00—Integrated devices, or assemblies of multiple devices, comprising at least one element covered by group H10F30/00, e.g. radiation detectors comprising photodiode arrays
- H10F39/10—Integrated devices
- H10F39/12—Image sensors
- H10F39/198—Contact-type image sensors [CIS]
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02E—REDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGY GENERATION, TRANSMISSION OR DISTRIBUTION
- Y02E10/00—Energy generation through renewable energy sources
- Y02E10/50—Photovoltaic [PV] energy
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- Physics & Mathematics (AREA)
- Nonlinear Science (AREA)
- Mathematical Physics (AREA)
- Chemical & Material Sciences (AREA)
- Crystallography & Structural Chemistry (AREA)
- General Physics & Mathematics (AREA)
- Optics & Photonics (AREA)
- Thin Film Transistor (AREA)
- Solid State Image Pick-Up Elements (AREA)
- Liquid Crystal (AREA)
Priority Applications (10)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP19177597A JP4027465B2 (ja) | 1997-07-01 | 1997-07-01 | アクティブマトリクス型表示装置およびその製造方法 |
| TW087110257A TW444265B (en) | 1997-07-01 | 1998-06-25 | Active matrix display device and method of manufacturing the same |
| US09/104,979 US6087648A (en) | 1997-07-01 | 1998-06-26 | Active matrix display device and method of manufacturing the same |
| KR1019980026345A KR100530678B1 (ko) | 1997-07-01 | 1998-07-01 | 활성매트릭스 디스플레이장치와 그 제조방법 |
| US09/590,130 US6274861B1 (en) | 1997-07-01 | 2000-06-09 | Active matrix display device having a common substrate and method of manufacturing the same |
| US09/908,794 US6399933B2 (en) | 1997-07-01 | 2001-07-20 | Active matrix display device and method of manufacturing the same |
| US10/139,236 US6784411B2 (en) | 1997-07-01 | 2002-05-07 | Display device with a pixel matrix and a sensor over same substrate |
| US10/861,365 US7235814B2 (en) | 1997-07-01 | 2004-06-07 | Active matrix display device and method of manufacturing the same |
| KR1020050061314A KR100541787B1 (ko) | 1997-07-01 | 2005-07-07 | 활성 매트릭스 디스플레이 장치와 그 제조 방법 |
| US11/812,528 US7510917B2 (en) | 1997-07-01 | 2007-06-19 | Active matrix display device and method of manufacturing the same |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP19177597A JP4027465B2 (ja) | 1997-07-01 | 1997-07-01 | アクティブマトリクス型表示装置およびその製造方法 |
Related Child Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2004218591A Division JP4163156B2 (ja) | 2004-07-27 | 2004-07-27 | 表示装置 |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| JPH1124105A JPH1124105A (ja) | 1999-01-29 |
| JPH1124105A5 JPH1124105A5 (enExample) | 2005-05-26 |
| JP4027465B2 true JP4027465B2 (ja) | 2007-12-26 |
Family
ID=16280335
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP19177597A Expired - Lifetime JP4027465B2 (ja) | 1997-07-01 | 1997-07-01 | アクティブマトリクス型表示装置およびその製造方法 |
Country Status (4)
| Country | Link |
|---|---|
| US (6) | US6087648A (enExample) |
| JP (1) | JP4027465B2 (enExample) |
| KR (2) | KR100530678B1 (enExample) |
| TW (1) | TW444265B (enExample) |
Families Citing this family (100)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US7872728B1 (en) | 1996-10-22 | 2011-01-18 | Seiko Epson Corporation | Liquid crystal panel substrate, liquid crystal panel, and electronic device and projection display device using the same |
| US20010043175A1 (en) * | 1996-10-22 | 2001-11-22 | Masahiro Yasukawa | Liquid crystal panel substrate, liquid crystal panel, and electronic equipment and projection type display device both using the same |
| JP4187819B2 (ja) * | 1997-03-14 | 2008-11-26 | シャープ株式会社 | 薄膜装置の製造方法 |
| JP4027465B2 (ja) * | 1997-07-01 | 2007-12-26 | 株式会社半導体エネルギー研究所 | アクティブマトリクス型表示装置およびその製造方法 |
| JP3838393B2 (ja) * | 1997-09-02 | 2006-10-25 | 株式会社半導体エネルギー研究所 | イメージセンサを内蔵した表示装置 |
| JP4271268B2 (ja) | 1997-09-20 | 2009-06-03 | 株式会社半導体エネルギー研究所 | イメージセンサおよびイメージセンサ一体型アクティブマトリクス型表示装置 |
| JP4044187B2 (ja) * | 1997-10-20 | 2008-02-06 | 株式会社半導体エネルギー研究所 | アクティブマトリクス型表示装置およびその作製方法 |
| JPH11307756A (ja) * | 1998-02-20 | 1999-11-05 | Canon Inc | 光電変換装置および放射線読取装置 |
| JPH11326954A (ja) * | 1998-05-15 | 1999-11-26 | Semiconductor Energy Lab Co Ltd | 半導体装置 |
| US6773953B1 (en) * | 1998-12-23 | 2004-08-10 | Intel Corporation | Camera sensor identifier via etched flaw |
| KR100303774B1 (ko) * | 1998-12-30 | 2001-11-15 | 박종섭 | 개선된 광감도를 갖는 씨모스이미지센서 제조방법 |
| JP4731655B2 (ja) * | 1999-02-12 | 2011-07-27 | 株式会社半導体エネルギー研究所 | 半導体装置の作製方法 |
| US6506635B1 (en) * | 1999-02-12 | 2003-01-14 | Semiconductor Energy Laboratory Co., Ltd. | Semiconductor device, and method of forming the same |
| US6180426B1 (en) | 1999-03-01 | 2001-01-30 | Mou-Shiung Lin | High performance sub-system design and assembly |
| JP4641586B2 (ja) * | 1999-03-12 | 2011-03-02 | 株式会社半導体エネルギー研究所 | 半導体装置の作製方法 |
| KR100348996B1 (ko) * | 1999-04-12 | 2002-08-17 | 엘지.필립스 엘시디 주식회사 | 액정표시장치의 제조방법 |
| US6507010B1 (en) * | 1999-05-11 | 2003-01-14 | Semiconductor Energy Laboratory Co., Ltd. | Contact area sensor |
| US7061062B2 (en) * | 1999-07-01 | 2006-06-13 | Gateway Inc. | Integrated circuit with unified input device, microprocessor and display systems |
| US7242449B1 (en) * | 1999-07-23 | 2007-07-10 | Semiconductor Energy Laboratory Co., Ltd. | Semiconductor device and integral image recognition/display apparatus |
| KR100631011B1 (ko) * | 1999-08-12 | 2006-10-04 | 엘지.필립스 엘시디 주식회사 | 박막트랜지스터 제조방법 |
| US6587086B1 (en) | 1999-10-26 | 2003-07-01 | Semiconductor Energy Laboratory Co., Ltd. | Electro-optical device |
| US6614054B1 (en) * | 2000-11-27 | 2003-09-02 | Lg.Philips Lcd Co., Ltd. | Polysilicon thin film transistor used in a liquid crystal display and the fabricating method |
| TW525216B (en) | 2000-12-11 | 2003-03-21 | Semiconductor Energy Lab | Semiconductor device, and manufacturing method thereof |
| US6747290B2 (en) | 2000-12-12 | 2004-06-08 | Semiconductor Energy Laboratory Co., Ltd. | Information device |
| SG111923A1 (en) | 2000-12-21 | 2005-06-29 | Semiconductor Energy Lab | Light emitting device and method of manufacturing the same |
| DE10100884A1 (de) * | 2001-01-11 | 2002-07-25 | Bosch Gmbh Robert | Vorrichtung zur Sensierung eines Magnetfeldes, Magnetfeldmesser und Strommesser |
| TWI313507B (en) | 2002-10-25 | 2009-08-11 | Megica Corporatio | Method for assembling chips |
| US7351605B2 (en) * | 2001-04-09 | 2008-04-01 | Semiconductor Energy Laboratory Co., Ltd. | Method of manufacturing a semiconductor device |
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| US20030191693A1 (en) * | 2002-04-08 | 2003-10-09 | Itamar Aphek | System and method for conducting an advertising business |
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| TW544882B (en) | 2001-12-31 | 2003-08-01 | Megic Corp | Chip package structure and process thereof |
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| TW584950B (en) * | 2001-12-31 | 2004-04-21 | Megic Corp | Chip packaging structure and process thereof |
| US6673698B1 (en) | 2002-01-19 | 2004-01-06 | Megic Corporation | Thin film semiconductor package utilizing a glass substrate with composite polymer/metal interconnect layers |
| JP4456806B2 (ja) * | 2002-03-19 | 2010-04-28 | セイコーエプソン株式会社 | 液晶表示装置、電気光学装置とその製造方法、電子機器 |
| KR100560347B1 (ko) * | 2002-03-29 | 2006-03-14 | 테스텍 주식회사 | 지문인식장치의 tft 지문입력기 제조방법 |
| US7609360B2 (en) * | 2002-06-17 | 2009-10-27 | Fujifilm Corporation | Image display device |
| JP4401066B2 (ja) * | 2002-11-19 | 2010-01-20 | 三洋電機株式会社 | 半導体集積装置及びその製造方法 |
| TWI350404B (en) * | 2002-12-13 | 2011-10-11 | Semiconductor Energy Lab | Light emitting device |
| AU2003289448A1 (en) * | 2003-01-08 | 2004-08-23 | Semiconductor Energy Laboratory Co., Ltd. | Semiconductor device and its fabricating method |
| GB2398916A (en) * | 2003-02-28 | 2004-09-01 | Sharp Kk | Display and sensor apparatus |
| US7307940B2 (en) | 2003-06-30 | 2007-12-11 | Semiconductor Energy Laboratory Co., Ltd. | Optical pick-up device |
| CN101483180B (zh) * | 2003-07-14 | 2011-11-16 | 株式会社半导体能源研究所 | 液晶显示器件 |
| JP2005043672A (ja) | 2003-07-22 | 2005-02-17 | Toshiba Matsushita Display Technology Co Ltd | アレイ基板およびその製造方法 |
| TW591698B (en) * | 2003-08-18 | 2004-06-11 | Au Optronics Corp | Thin film transistor array substrate and photolithography process and mask design thereof |
| KR100669270B1 (ko) * | 2003-08-25 | 2007-01-16 | 도시바 마쯔시따 디스플레이 테크놀로지 컴퍼니, 리미티드 | 표시 장치 및 광전 변환 소자 |
| CN100339940C (zh) * | 2003-08-28 | 2007-09-26 | 友达光电股份有限公司 | 薄膜电晶体阵列基板及其微影制造方法与光罩设计结构 |
| US7253391B2 (en) | 2003-09-19 | 2007-08-07 | Semiconductor Energy Laboratory Co., Ltd. | Optical sensor device and electronic apparatus |
| CN100477240C (zh) * | 2003-10-06 | 2009-04-08 | 株式会社半导体能源研究所 | 半导体器件以及制造该器件的方法 |
| JP4616559B2 (ja) * | 2004-01-15 | 2011-01-19 | 大日本印刷株式会社 | 表示装置及び表示システム |
| US7145359B2 (en) * | 2004-06-28 | 2006-12-05 | Silicon Laboratories Inc. | Multiple signal format output buffer |
| US7342256B2 (en) * | 2004-07-16 | 2008-03-11 | Semiconductor Energy Laboratory Co., Ltd. | Display device mounted with read function and electric appliance |
| JP4817636B2 (ja) | 2004-10-04 | 2011-11-16 | 株式会社半導体エネルギー研究所 | 半導体装置およびその作製方法 |
| US8378963B2 (en) * | 2004-12-09 | 2013-02-19 | Sony Ericsson Mobile Communications Ab | Photosensors for displays and related devices |
| WO2006118028A1 (ja) * | 2005-04-28 | 2006-11-09 | Sharp Kabushiki Kaisha | 液晶表示装置 |
| TWI269420B (en) | 2005-05-03 | 2006-12-21 | Megica Corp | Stacked chip package and process thereof |
| US7722691B2 (en) * | 2005-09-30 | 2010-05-25 | Saint-Gobain Abrasives, Inc. | Abrasive tools having a permeable structure |
| US20070268209A1 (en) * | 2006-05-16 | 2007-11-22 | Kenneth Wargon | Imaging Panels Including Arrays Of Audio And Video Input And Output Elements |
| TWI539423B (zh) * | 2006-05-31 | 2016-06-21 | 半導體能源研究所股份有限公司 | 顯示裝置、顯示裝置的驅動方法、以及電子設備 |
| KR100912188B1 (ko) | 2006-06-30 | 2009-08-14 | 엘지디스플레이 주식회사 | 액정표시장치 및 이의 제조 방법 |
| KR100878379B1 (ko) * | 2006-07-12 | 2009-01-13 | 엡슨 이미징 디바이스 가부시키가이샤 | 액정 표시 장치 |
| KR101174015B1 (ko) | 2006-09-14 | 2012-08-16 | 엘지전자 주식회사 | 평판 표시장치 및 그 제조 방법 |
| KR101309174B1 (ko) * | 2006-11-15 | 2013-09-23 | 삼성디스플레이 주식회사 | 표시 장치와 그 제조 방법 |
| KR101340444B1 (ko) * | 2006-12-23 | 2013-12-11 | 엘지디스플레이 주식회사 | 액정표시장치 및 제조방법 |
| KR101441346B1 (ko) * | 2007-04-27 | 2014-09-18 | 가부시키가이샤 한도오따이 에네루기 켄큐쇼 | 반도체 장치 및 그 제작 방법 |
| JP5298461B2 (ja) * | 2007-05-29 | 2013-09-25 | セイコーエプソン株式会社 | 液晶装置及び電子機器 |
| US20090027566A1 (en) * | 2007-07-27 | 2009-01-29 | Kenneth Wargon | Flexible sheet audio-video device |
| TWI353063B (en) * | 2007-07-27 | 2011-11-21 | Au Optronics Corp | Photo detector and method for fabricating the same |
| US8148236B2 (en) * | 2007-11-30 | 2012-04-03 | Semiconductor Energy Laboratory Co., Ltd. | Display device and method for manufacturing thereof |
| JP5292066B2 (ja) | 2007-12-05 | 2013-09-18 | 株式会社半導体エネルギー研究所 | 表示装置 |
| US8125558B2 (en) * | 2007-12-14 | 2012-02-28 | Texas Instruments Incorporated | Integrated image capture and projection system |
| JP5572307B2 (ja) * | 2007-12-28 | 2014-08-13 | 株式会社半導体エネルギー研究所 | 光電変換装置の製造方法 |
| TWI398707B (zh) * | 2008-05-16 | 2013-06-11 | Au Optronics Corp | 光感測單元及具有此光感測單元之畫素結構與液晶顯示面板 |
| CN101285975B (zh) * | 2008-06-06 | 2010-06-23 | 友达光电股份有限公司 | 光感测单元及具此光感测单元的像素结构与液晶显示面板 |
| TW201003850A (en) * | 2008-07-10 | 2010-01-16 | Au Optronics Corp | Semiconductor device, display apparatus, electro-optical apparatus, and method for fabricating thereof |
| TWI372277B (en) * | 2008-09-04 | 2012-09-11 | Au Optronics Corp | Display module |
| US8114720B2 (en) | 2008-12-25 | 2012-02-14 | Semiconductor Energy Laboratory Co., Ltd. | Semiconductor device and manufacturing method thereof |
| RU2487422C1 (ru) * | 2009-09-07 | 2013-07-10 | Шарп Кабусики Кайся | Схема пикселя и устройство отображения |
| US8373825B2 (en) * | 2009-11-30 | 2013-02-12 | Sharp Kabushiki Kaisha | Display device |
| JP5219162B2 (ja) * | 2009-12-29 | 2013-06-26 | シャープ株式会社 | 光電変換装置 |
| US8384690B2 (en) * | 2010-05-14 | 2013-02-26 | International Business Machines Corp. | Interface device with integrated solar cell(S) for power collection |
| TWI460611B (zh) * | 2010-06-07 | 2014-11-11 | Au Optronics Corp | 觸控鍵盤 |
| JP5530839B2 (ja) * | 2010-07-09 | 2014-06-25 | パナソニック株式会社 | 固体撮像装置 |
| KR101743268B1 (ko) * | 2010-12-06 | 2017-06-05 | 삼성디스플레이 주식회사 | 광 센서 및 이를 갖는 표시장치 |
| KR101882709B1 (ko) * | 2011-07-12 | 2018-07-27 | 엘지전자 주식회사 | 이동 단말기 |
| TWI461989B (zh) * | 2011-08-25 | 2014-11-21 | Au Optronics Corp | 觸控元件 |
| JP2013161810A (ja) | 2012-02-01 | 2013-08-19 | Japan Display West Co Ltd | 撮像装置およびその製造方法ならびに撮像表示システム |
| TWI477874B (zh) * | 2012-03-28 | 2015-03-21 | E Ink Holdings Inc | 顯示裝置及其製作方法 |
| JP6190228B2 (ja) * | 2013-09-24 | 2017-08-30 | 株式会社東芝 | 半導体装置及び撮像装置 |
| CN105336752B (zh) * | 2014-06-23 | 2018-08-21 | 上海箩箕技术有限公司 | 面阵传感器装置及其形成方法 |
| JP2016009777A (ja) * | 2014-06-25 | 2016-01-18 | ソニー株式会社 | 固体撮像素子およびその製造方法、並びに電子機器 |
| CN105095872B (zh) * | 2015-07-29 | 2018-10-02 | 京东方科技集团股份有限公司 | 一种基板及其制备方法、指纹识别传感器、指纹识别装置 |
| CN105573549B (zh) * | 2015-12-08 | 2018-12-25 | 上海天马微电子有限公司 | 阵列基板、触控屏和触控显示装置及其制作方法 |
| CN105741748B (zh) * | 2016-03-04 | 2019-05-14 | 京东方科技集团股份有限公司 | 一种显示面板、显示设备及制作方法 |
| CN109901333B (zh) * | 2019-02-26 | 2021-11-30 | 江西合力泰科技有限公司 | 一种基于太阳能液晶显示屏的手机太阳能充电方法 |
| CN110120432B (zh) * | 2019-05-23 | 2021-03-16 | 京东方科技集团股份有限公司 | 光电转换结构和显示面板 |
| CN113064307B (zh) * | 2021-03-19 | 2022-02-22 | 深圳市华星光电半导体显示技术有限公司 | 阵列基板及制作方法、显示面板 |
| TWI781720B (zh) * | 2021-08-10 | 2022-10-21 | 友達光電股份有限公司 | 光偵測裝置 |
| WO2023205141A1 (en) * | 2022-04-20 | 2023-10-26 | Smith & Nephew, Inc. | Bone repair compositions comprising polythiourethane and uses thereof |
Family Cites Families (40)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5688111A (en) | 1979-12-19 | 1981-07-17 | Citizen Watch Co Ltd | Liquid crystal display device with solar battery |
| US5650637A (en) * | 1982-04-30 | 1997-07-22 | Seiko Epson Corporation | Active matrix assembly |
| JPS6064467A (ja) | 1983-09-20 | 1985-04-13 | Seiko Epson Corp | 固体イメ−ジセンサ |
| US4862237A (en) * | 1983-01-10 | 1989-08-29 | Seiko Epson Corporation | Solid state image sensor |
| JPH03135524A (ja) * | 1983-09-20 | 1991-06-10 | Seiko Epson Corp | 固体イメージセンサ |
| JPS60210869A (ja) | 1984-06-29 | 1985-10-23 | Hitachi Ltd | 固体撮像素子 |
| JPS633454A (ja) | 1986-06-24 | 1988-01-08 | Seiko Epson Corp | 固体撮像装置及びその製造方法 |
| US4876597A (en) * | 1987-09-04 | 1989-10-24 | Adt Security Systems, Inc. | Video observation systems |
| JP2617798B2 (ja) * | 1989-09-22 | 1997-06-04 | 三菱電機株式会社 | 積層型半導体装置およびその製造方法 |
| JPH0423470A (ja) * | 1990-05-18 | 1992-01-27 | Fuji Xerox Co Ltd | イメージセンサ |
| JPH04109776A (ja) | 1990-08-30 | 1992-04-10 | Olympus Optical Co Ltd | 固体撮像装置 |
| JP2765635B2 (ja) * | 1991-01-11 | 1998-06-18 | キヤノン株式会社 | 光電変換装置 |
| US5567956A (en) * | 1991-03-27 | 1996-10-22 | Canon Kabushiki Kaisha | Information processing apparatus including a photoelectric conversion element having a semiconductor layer with a varying energy band gap width |
| US5589847A (en) * | 1991-09-23 | 1996-12-31 | Xerox Corporation | Switched capacitor analog circuits using polysilicon thin film technology |
| KR960005160B1 (ko) | 1992-01-31 | 1996-04-22 | 주식회사유공 | 소비자용 살균 조성물 |
| GB9202693D0 (en) * | 1992-02-08 | 1992-03-25 | Philips Electronics Uk Ltd | A method of manufacturing a large area active matrix array |
| JP2791620B2 (ja) | 1992-03-09 | 1998-08-27 | 株式会社半導体エネルギー研究所 | 電子装置 |
| GB9209734D0 (en) * | 1992-05-06 | 1992-06-17 | Philips Electronics Uk Ltd | An image sensor |
| JP3282216B2 (ja) | 1992-07-03 | 2002-05-13 | カシオ計算機株式会社 | 入出力デバイスおよび入出力装置 |
| JP3347423B2 (ja) | 1993-08-31 | 2002-11-20 | キヤノン株式会社 | 液晶表示装置 |
| DE69330709T2 (de) | 1992-12-28 | 2002-07-11 | Canon K.K., Tokio/Tokyo | Blickrichtungsdetektor und Kamera mit diesem Detektor |
| JP3155846B2 (ja) | 1992-12-28 | 2001-04-16 | キヤノン株式会社 | 液晶表示装置、該表示装置を有するビューファインダー及び該ビューファインダーを有する電子カメラ |
| KR950002087B1 (ko) | 1992-12-29 | 1995-03-10 | 현대전자산업주식회사 | 피포(fifo)기능을 수행하는 레지스터 회로 |
| JP2791635B2 (ja) * | 1993-12-24 | 1998-08-27 | 株式会社半導体エネルギー研究所 | 半導体装置およびその作製方法 |
| US6413805B1 (en) * | 1993-03-12 | 2002-07-02 | Semiconductor Energy Laboratory Co., Ltd. | Semiconductor device forming method |
| GB9311129D0 (en) * | 1993-05-28 | 1993-07-14 | Philips Electronics Uk Ltd | Electronic devices with-film circuit elements forming a sampling circuit |
| KR960001193B1 (ko) * | 1993-06-19 | 1996-01-19 | 엘지전자주식회사 | 일체형 입출력 소자 |
| JPH0786570A (ja) * | 1993-06-29 | 1995-03-31 | Victor Co Of Japan Ltd | 半導体装置 |
| JPH0926603A (ja) | 1995-05-08 | 1997-01-28 | Semiconductor Energy Lab Co Ltd | 表示装置 |
| JPH0943627A (ja) | 1995-05-19 | 1997-02-14 | Sharp Corp | 液晶表示装置およびその製造方法 |
| US6069674A (en) * | 1995-05-19 | 2000-05-30 | Sharp Kabushiki Kaisha | Liquid crystal display apparatus |
| JPH0982981A (ja) | 1995-09-19 | 1997-03-28 | Sony Corp | 薄膜半導体装置の製造方法 |
| KR970022424A (ko) * | 1995-10-12 | 1997-05-28 | 김광호 | 콘택 이미지 센서가 내장된 액정 표시 장치 |
| US5831699A (en) * | 1996-04-29 | 1998-11-03 | Motorola, Inc. | Display with inactive portions and active portions, and having drivers in the inactive portions |
| US6005648A (en) | 1996-06-25 | 1999-12-21 | Semiconductor Energy Laboratory Co., Ltd. | Display device |
| JP4027465B2 (ja) * | 1997-07-01 | 2007-12-26 | 株式会社半導体エネルギー研究所 | アクティブマトリクス型表示装置およびその製造方法 |
| JP4044187B2 (ja) | 1997-10-20 | 2008-02-06 | 株式会社半導体エネルギー研究所 | アクティブマトリクス型表示装置およびその作製方法 |
| US6277679B1 (en) * | 1998-11-25 | 2001-08-21 | Semiconductor Energy Laboratory Co., Ltd. | Method of manufacturing thin film transistor |
| JP3463627B2 (ja) * | 1999-09-30 | 2003-11-05 | 富士電機株式会社 | 飲料カップ供給装置 |
| KR100952087B1 (ko) | 2003-02-20 | 2010-04-13 | 램 리써치 코포레이션 | 패터닝된 기판의 메가소닉 세정을 위한 방법 및 장치 |
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| US6274861B1 (en) | 2001-08-14 |
| US7510917B2 (en) | 2009-03-31 |
| US6784411B2 (en) | 2004-08-31 |
| US20020125410A1 (en) | 2002-09-12 |
| KR100541787B1 (ko) | 2006-01-11 |
| US6087648A (en) | 2000-07-11 |
| US6399933B2 (en) | 2002-06-04 |
| US20070249084A1 (en) | 2007-10-25 |
| KR100530678B1 (ko) | 2006-03-22 |
| US7235814B2 (en) | 2007-06-26 |
| US20020011553A1 (en) | 2002-01-31 |
| US20040217357A1 (en) | 2004-11-04 |
| TW444265B (en) | 2001-07-01 |
| KR19990013496A (ko) | 1999-02-25 |
| JPH1124105A (ja) | 1999-01-29 |
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