JP4005270B2 - 半導体装置の製造方法 - Google Patents
半導体装置の製造方法 Download PDFInfo
- Publication number
- JP4005270B2 JP4005270B2 JP17471499A JP17471499A JP4005270B2 JP 4005270 B2 JP4005270 B2 JP 4005270B2 JP 17471499 A JP17471499 A JP 17471499A JP 17471499 A JP17471499 A JP 17471499A JP 4005270 B2 JP4005270 B2 JP 4005270B2
- Authority
- JP
- Japan
- Prior art keywords
- film
- semiconductor device
- manufacturing
- capacitor
- forming
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
- 239000004065 semiconductor Substances 0.000 title claims description 55
- 238000004519 manufacturing process Methods 0.000 title claims description 32
- 239000003990 capacitor Substances 0.000 claims description 41
- 238000000034 method Methods 0.000 claims description 39
- 239000000463 material Substances 0.000 claims description 37
- BASFCYQUMIYNBI-UHFFFAOYSA-N platinum Chemical compound [Pt] BASFCYQUMIYNBI-UHFFFAOYSA-N 0.000 claims description 36
- 230000008569 process Effects 0.000 claims description 33
- 239000000758 substrate Substances 0.000 claims description 19
- 229910052697 platinum Inorganic materials 0.000 claims description 18
- 238000010438 heat treatment Methods 0.000 claims description 16
- 238000009792 diffusion process Methods 0.000 claims description 13
- 238000005530 etching Methods 0.000 claims description 12
- 229910052741 iridium Inorganic materials 0.000 claims description 12
- 229910052703 rhodium Inorganic materials 0.000 claims description 12
- 229910052707 ruthenium Inorganic materials 0.000 claims description 12
- 230000004888 barrier function Effects 0.000 claims description 11
- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical compound [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 claims description 10
- 239000001301 oxygen Substances 0.000 claims description 10
- 229910052760 oxygen Inorganic materials 0.000 claims description 10
- 239000012298 atmosphere Substances 0.000 claims description 8
- 238000002955 isolation Methods 0.000 claims description 5
- 229910052719 titanium Inorganic materials 0.000 claims description 5
- 229910052726 zirconium Inorganic materials 0.000 claims description 4
- 238000006243 chemical reaction Methods 0.000 claims description 3
- 230000002265 prevention Effects 0.000 claims description 3
- KJTLSVCANCCWHF-UHFFFAOYSA-N Ruthenium Chemical compound [Ru] KJTLSVCANCCWHF-UHFFFAOYSA-N 0.000 claims 4
- GWEVSGVZZGPLCZ-UHFFFAOYSA-N Titan oxide Chemical compound O=[Ti]=O GWEVSGVZZGPLCZ-UHFFFAOYSA-N 0.000 claims 4
- RTAQQCXQSZGOHL-UHFFFAOYSA-N Titanium Chemical compound [Ti] RTAQQCXQSZGOHL-UHFFFAOYSA-N 0.000 claims 4
- HTXDPTMKBJXEOW-UHFFFAOYSA-N dioxoiridium Chemical compound O=[Ir]=O HTXDPTMKBJXEOW-UHFFFAOYSA-N 0.000 claims 4
- GKOZUEZYRPOHIO-UHFFFAOYSA-N iridium atom Chemical compound [Ir] GKOZUEZYRPOHIO-UHFFFAOYSA-N 0.000 claims 4
- JKQOBWVOAYFWKG-UHFFFAOYSA-N molybdenum trioxide Chemical compound O=[Mo](=O)=O JKQOBWVOAYFWKG-UHFFFAOYSA-N 0.000 claims 4
- 239000010948 rhodium Substances 0.000 claims 4
- MHOVAHRLVXNVSD-UHFFFAOYSA-N rhodium atom Chemical compound [Rh] MHOVAHRLVXNVSD-UHFFFAOYSA-N 0.000 claims 4
- WOCIAKWEIIZHES-UHFFFAOYSA-N ruthenium(iv) oxide Chemical compound O=[Ru]=O WOCIAKWEIIZHES-UHFFFAOYSA-N 0.000 claims 4
- 239000010936 titanium Substances 0.000 claims 4
- NRTOMJZYCJJWKI-UHFFFAOYSA-N Titanium nitride Chemical compound [Ti]#N NRTOMJZYCJJWKI-UHFFFAOYSA-N 0.000 claims 3
- QCWXUUIWCKQGHC-UHFFFAOYSA-N Zirconium Chemical compound [Zr] QCWXUUIWCKQGHC-UHFFFAOYSA-N 0.000 claims 3
- KZYDBKYFEURFNC-UHFFFAOYSA-N dioxorhodium Chemical compound O=[Rh]=O KZYDBKYFEURFNC-UHFFFAOYSA-N 0.000 claims 2
- 239000004408 titanium dioxide Substances 0.000 claims 2
- -1 ITO Chemical compound 0.000 claims 1
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 claims 1
- 229910052782 aluminium Inorganic materials 0.000 claims 1
- 230000002708 enhancing effect Effects 0.000 claims 1
- 239000010410 layer Substances 0.000 description 27
- 229910052751 metal Inorganic materials 0.000 description 13
- 239000002184 metal Substances 0.000 description 13
- 230000010287 polarization Effects 0.000 description 13
- 238000010586 diagram Methods 0.000 description 10
- 230000007547 defect Effects 0.000 description 7
- 229910010413 TiO 2 Inorganic materials 0.000 description 6
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 description 6
- 230000006866 deterioration Effects 0.000 description 5
- 229920002120 photoresistant polymer Polymers 0.000 description 5
- 230000015572 biosynthetic process Effects 0.000 description 3
- 230000015556 catabolic process Effects 0.000 description 3
- 238000002425 crystallisation Methods 0.000 description 3
- 230000008025 crystallization Effects 0.000 description 3
- 238000006731 degradation reaction Methods 0.000 description 3
- 230000008859 change Effects 0.000 description 2
- 238000001755 magnetron sputter deposition Methods 0.000 description 2
- 238000002161 passivation Methods 0.000 description 2
- 238000001020 plasma etching Methods 0.000 description 2
- 239000000126 substance Substances 0.000 description 2
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 1
- BOTDANWDWHJENH-UHFFFAOYSA-N Tetraethyl orthosilicate Chemical compound CCO[Si](OCC)(OCC)OCC BOTDANWDWHJENH-UHFFFAOYSA-N 0.000 description 1
- 230000003213 activating effect Effects 0.000 description 1
- 230000002411 adverse Effects 0.000 description 1
- 238000006555 catalytic reaction Methods 0.000 description 1
- 230000007812 deficiency Effects 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 229910052738 indium Inorganic materials 0.000 description 1
- 239000011229 interlayer Substances 0.000 description 1
- 239000012528 membrane Substances 0.000 description 1
- 239000012299 nitrogen atmosphere Substances 0.000 description 1
- 230000002093 peripheral effect Effects 0.000 description 1
- 230000001737 promoting effect Effects 0.000 description 1
- 230000001603 reducing effect Effects 0.000 description 1
- 238000006722 reduction reaction Methods 0.000 description 1
- 229910052710 silicon Inorganic materials 0.000 description 1
- 239000010703 silicon Substances 0.000 description 1
- 238000003980 solgel method Methods 0.000 description 1
Images
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L28/00—Passive two-terminal components without a potential-jump or surface barrier for integrated circuits; Details thereof; Multistep manufacturing processes therefor
- H01L28/40—Capacitors
- H01L28/55—Capacitors with a dielectric comprising a perovskite structure material
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L29/00—Semiconductor devices specially adapted for rectifying, amplifying, oscillating or switching and having potential barriers; Capacitors or resistors having potential barriers, e.g. a PN-junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof ; Multistep manufacturing processes therefor
- H01L29/66—Types of semiconductor device ; Multistep manufacturing processes therefor
- H01L29/68—Types of semiconductor device ; Multistep manufacturing processes therefor controllable by only the electric current supplied, or only the electric potential applied, to an electrode which does not carry the current to be rectified, amplified or switched
- H01L29/76—Unipolar devices, e.g. field effect transistors
- H01L29/772—Field effect transistors
- H01L29/78—Field effect transistors with field effect produced by an insulated gate
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10B—ELECTRONIC MEMORY DEVICES
- H10B53/00—Ferroelectric RAM [FeRAM] devices comprising ferroelectric memory capacitors
Landscapes
- Engineering & Computer Science (AREA)
- Power Engineering (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Computer Hardware Design (AREA)
- Chemical & Material Sciences (AREA)
- Materials Engineering (AREA)
- Physics & Mathematics (AREA)
- Ceramic Engineering (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Semiconductor Memories (AREA)
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
KR1019980023272A KR100279297B1 (ko) | 1998-06-20 | 1998-06-20 | 반도체 장치 및 그의 제조 방법 |
KR199823272 | 1998-06-20 |
Related Child Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2007174271A Division JP2007294995A (ja) | 1998-06-20 | 2007-07-02 | 半導体装置 |
Publications (2)
Publication Number | Publication Date |
---|---|
JP2000031404A JP2000031404A (ja) | 2000-01-28 |
JP4005270B2 true JP4005270B2 (ja) | 2007-11-07 |
Family
ID=19540170
Family Applications (2)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP17471499A Expired - Fee Related JP4005270B2 (ja) | 1998-06-20 | 1999-06-21 | 半導体装置の製造方法 |
JP2007174271A Pending JP2007294995A (ja) | 1998-06-20 | 2007-07-02 | 半導体装置 |
Family Applications After (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2007174271A Pending JP2007294995A (ja) | 1998-06-20 | 2007-07-02 | 半導体装置 |
Country Status (8)
Country | Link |
---|---|
US (2) | US6172386B1 (zh) |
JP (2) | JP4005270B2 (zh) |
KR (1) | KR100279297B1 (zh) |
CN (1) | CN100539013C (zh) |
DE (1) | DE19926711B4 (zh) |
FR (1) | FR2780199B1 (zh) |
GB (1) | GB2338595B (zh) |
TW (1) | TW418523B (zh) |
Families Citing this family (34)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US6429120B1 (en) | 2000-01-18 | 2002-08-06 | Micron Technology, Inc. | Methods and apparatus for making integrated-circuit wiring from copper, silver, gold, and other metals |
KR100279297B1 (ko) * | 1998-06-20 | 2001-02-01 | 윤종용 | 반도체 장치 및 그의 제조 방법 |
KR100292819B1 (ko) * | 1998-07-07 | 2001-09-17 | 윤종용 | 커패시터및그의제조방법 |
US6586790B2 (en) * | 1998-07-24 | 2003-07-01 | Kabushiki Kaisha Toshiba | Semiconductor device and method for manufacturing the same |
US6174735B1 (en) * | 1998-10-23 | 2001-01-16 | Ramtron International Corporation | Method of manufacturing ferroelectric memory device useful for preventing hydrogen line degradation |
JP3475100B2 (ja) * | 1998-11-26 | 2003-12-08 | シャープ株式会社 | 半導体装置の製造方法 |
US6440850B1 (en) * | 1999-08-27 | 2002-08-27 | Micron Technology, Inc. | Structure for an electrical contact to a thin film in a semiconductor structure and method for making the same |
JP3276351B2 (ja) * | 1999-12-13 | 2002-04-22 | 松下電器産業株式会社 | 半導体装置の製造方法 |
US7262130B1 (en) * | 2000-01-18 | 2007-08-28 | Micron Technology, Inc. | Methods for making integrated-circuit wiring from copper, silver, gold, and other metals |
US6376370B1 (en) * | 2000-01-18 | 2002-04-23 | Micron Technology, Inc. | Process for providing seed layers for using aluminum, copper, gold and silver metallurgy process for providing seed layers for using aluminum, copper, gold and silver metallurgy |
US6420262B1 (en) * | 2000-01-18 | 2002-07-16 | Micron Technology, Inc. | Structures and methods to enhance copper metallization |
US6651658B1 (en) * | 2000-08-03 | 2003-11-25 | Sequal Technologies, Inc. | Portable oxygen concentration system and method of using the same |
KR100382719B1 (ko) * | 2000-08-25 | 2003-05-09 | 삼성전자주식회사 | 강유전체 커패시터를 포함하는 반도체 장치 및 그 제조방법 |
US6887716B2 (en) * | 2000-12-20 | 2005-05-03 | Fujitsu Limited | Process for producing high quality PZT films for ferroelectric memory integrated circuits |
JP2004523924A (ja) * | 2001-03-21 | 2004-08-05 | コーニンクレッカ フィリップス エレクトロニクス エヌ ヴィ | 電子デバイス |
DE10114406A1 (de) * | 2001-03-23 | 2002-10-02 | Infineon Technologies Ag | Verfahren zur Herstellung ferroelektrischer Speicherzellen |
JP2003059905A (ja) * | 2001-07-31 | 2003-02-28 | Applied Materials Inc | エッチング方法、キャパシタの製造方法、および半導体装置 |
JP2003204043A (ja) * | 2001-10-24 | 2003-07-18 | Fujitsu Ltd | 半導体装置及びその製造方法 |
JP2003152165A (ja) | 2001-11-15 | 2003-05-23 | Fujitsu Ltd | 半導体装置およびその製造方法 |
JP4641702B2 (ja) * | 2002-11-20 | 2011-03-02 | ソニー株式会社 | 強誘電体型不揮発性半導体メモリ及びその製造方法 |
US20040153611A1 (en) * | 2003-02-04 | 2004-08-05 | Sujat Jamil | Methods and apparatus for detecting an address conflict |
US7287126B2 (en) * | 2003-07-30 | 2007-10-23 | Intel Corporation | Methods and apparatus for maintaining cache coherency |
US7220665B2 (en) * | 2003-08-05 | 2007-05-22 | Micron Technology, Inc. | H2 plasma treatment |
JP4308691B2 (ja) * | 2004-03-19 | 2009-08-05 | 富士通マイクロエレクトロニクス株式会社 | 半導体基板および半導体基板の製造方法 |
CN100463182C (zh) * | 2004-10-19 | 2009-02-18 | 精工爱普生株式会社 | 铁电体存储器及其制造方法 |
JP4257537B2 (ja) * | 2005-06-02 | 2009-04-22 | セイコーエプソン株式会社 | 強誘電体層の製造方法、電子機器の製造方法、強誘電体メモリ装置の製造方法、圧電素子の製造方法、およびインクジェット式記録ヘッドの製造方法 |
JP2007073909A (ja) * | 2005-09-09 | 2007-03-22 | Oki Electric Ind Co Ltd | 半導体メモリの製造方法 |
US7772014B2 (en) * | 2007-08-28 | 2010-08-10 | Texas Instruments Incorporated | Semiconductor device having reduced single bit fails and a method of manufacture thereof |
US9092582B2 (en) | 2010-07-09 | 2015-07-28 | Cypress Semiconductor Corporation | Low power, low pin count interface for an RFID transponder |
US9846664B2 (en) | 2010-07-09 | 2017-12-19 | Cypress Semiconductor Corporation | RFID interface and interrupt |
US8723654B2 (en) | 2010-07-09 | 2014-05-13 | Cypress Semiconductor Corporation | Interrupt generation and acknowledgment for RFID |
JP2013120825A (ja) | 2011-12-07 | 2013-06-17 | Elpida Memory Inc | 半導体装置及びその製造方法 |
US11621269B2 (en) * | 2019-03-11 | 2023-04-04 | Globalfoundries U.S. Inc. | Multi-level ferroelectric memory cell |
CN113400696B (zh) * | 2021-06-26 | 2022-02-22 | 宜宾学院 | 大口径高压纤维增强柔性复合管连接方法 |
Family Cites Families (21)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR100266046B1 (ko) * | 1990-09-28 | 2000-09-15 | 야스카와 히데아키 | 반도체장치 |
JPH04158570A (ja) * | 1990-10-22 | 1992-06-01 | Seiko Epson Corp | 半導体装置の構造及びその製造方法 |
EP0516031A1 (en) * | 1991-05-29 | 1992-12-02 | Ramtron International Corporation | Stacked ferroelectric memory cell and method |
US5206788A (en) * | 1991-12-12 | 1993-04-27 | Ramtron Corporation | Series ferroelectric capacitor structure for monolithic integrated circuits and method |
US5468684A (en) * | 1991-12-13 | 1995-11-21 | Symetrix Corporation | Integrated circuit with layered superlattice material and method of fabricating same |
US5723171A (en) * | 1992-10-23 | 1998-03-03 | Symetrix Corporation | Integrated circuit electrode structure and process for fabricating same |
JP3299837B2 (ja) * | 1993-07-22 | 2002-07-08 | シャープ株式会社 | 半導体記憶装置 |
JPH07111318A (ja) * | 1993-10-12 | 1995-04-25 | Olympus Optical Co Ltd | 強誘電体メモリ |
US5965942A (en) * | 1994-09-28 | 1999-10-12 | Sharp Kabushiki Kaisha | Semiconductor memory device with amorphous diffusion barrier between capacitor and plug |
JPH08191133A (ja) * | 1994-11-10 | 1996-07-23 | Sony Corp | 半導体素子のキャパシタ構造及びその作製方法 |
US5977577A (en) * | 1994-11-15 | 1999-11-02 | Radiant Technologies, Inc | Ferroelectric based memory devices utilizing low curie point ferroelectrics and encapsulation |
CN1075243C (zh) * | 1994-12-28 | 2001-11-21 | 松下电器产业株式会社 | 集成电路用电容元件及其制造方法 |
US5739049A (en) * | 1995-08-21 | 1998-04-14 | Hyundai Electronics Industries Co., Ltd. | Method for fabricating semiconductor device having a capacitor and a method of forming metal wiring on a semiconductor substrate |
JPH09102587A (ja) * | 1995-10-05 | 1997-04-15 | Olympus Optical Co Ltd | 強誘電体薄膜素子 |
KR100200704B1 (ko) * | 1996-06-07 | 1999-06-15 | 윤종용 | 강유전체 메모리 장치 및 그 제조 방법 |
KR100197566B1 (ko) * | 1996-06-29 | 1999-06-15 | 윤종용 | 강유전체 메모리 장치 |
JPH1022463A (ja) * | 1996-07-02 | 1998-01-23 | Sony Corp | 積層構造及びその製造方法、キャパシタ構造並びに不揮発性メモリ |
EP0837504A3 (en) * | 1996-08-20 | 1999-01-07 | Ramtron International Corporation | Partially or completely encapsulated ferroelectric device |
US5990513A (en) * | 1996-10-08 | 1999-11-23 | Ramtron International Corporation | Yield enhancement technique for integrated circuit processing to reduce effects of undesired dielectric moisture retention and subsequent hydrogen out-diffusion |
KR100268453B1 (ko) * | 1998-03-30 | 2000-11-01 | 윤종용 | 반도체 장치 및 그것의 제조 방법 |
KR100279297B1 (ko) * | 1998-06-20 | 2001-02-01 | 윤종용 | 반도체 장치 및 그의 제조 방법 |
-
1998
- 1998-06-20 KR KR1019980023272A patent/KR100279297B1/ko not_active IP Right Cessation
-
1999
- 1999-04-23 GB GB9909488A patent/GB2338595B/en not_active Expired - Fee Related
- 1999-04-23 TW TW088106497A patent/TW418523B/zh not_active IP Right Cessation
- 1999-06-10 FR FR9907317A patent/FR2780199B1/fr not_active Expired - Fee Related
- 1999-06-11 DE DE19926711A patent/DE19926711B4/de not_active Expired - Fee Related
- 1999-06-18 US US09/335,699 patent/US6172386B1/en not_active Expired - Fee Related
- 1999-06-18 CN CNB991090896A patent/CN100539013C/zh not_active Expired - Fee Related
- 1999-06-21 JP JP17471499A patent/JP4005270B2/ja not_active Expired - Fee Related
-
2000
- 2000-10-30 US US09/698,262 patent/US6515323B1/en not_active Expired - Fee Related
-
2007
- 2007-07-02 JP JP2007174271A patent/JP2007294995A/ja active Pending
Also Published As
Publication number | Publication date |
---|---|
KR20000002485A (ko) | 2000-01-15 |
JP2000031404A (ja) | 2000-01-28 |
CN100539013C (zh) | 2009-09-09 |
FR2780199A1 (fr) | 1999-12-24 |
JP2007294995A (ja) | 2007-11-08 |
TW418523B (en) | 2001-01-11 |
US6515323B1 (en) | 2003-02-04 |
CN1239828A (zh) | 1999-12-29 |
DE19926711A1 (de) | 1999-12-23 |
US6172386B1 (en) | 2001-01-09 |
GB9909488D0 (en) | 1999-06-23 |
KR100279297B1 (ko) | 2001-02-01 |
GB2338595A (en) | 1999-12-22 |
GB2338595B (en) | 2000-08-23 |
FR2780199B1 (fr) | 2005-04-15 |
DE19926711B4 (de) | 2006-08-24 |
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