JP3759108B2 - 接着性が増大した低欠陥密度のｂｅｏｌ相互接続用低誘電率レベル間誘電体被膜を製造する方法 - Google Patents

接着性が増大した低欠陥密度のｂｅｏｌ相互接続用低誘電率レベル間誘電体被膜を製造する方法 Download PDF

Info

Publication number
JP3759108B2
JP3759108B2 JP2002568408A JP2002568408A JP3759108B2 JP 3759108 B2 JP3759108 B2 JP 3759108B2 JP 2002568408 A JP2002568408 A JP 2002568408A JP 2002568408 A JP2002568408 A JP 2002568408A JP 3759108 B2 JP3759108 B2 JP 3759108B2
Authority
JP
Japan
Prior art keywords
substrate
coupling agent
silane coupling
coating
applying
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
JP2002568408A
Other languages
English (en)
Japanese (ja)
Other versions
JP2004532514A (ja
Inventor
エッカート、アンドルー、ロバート
ヘイ、ジョン、シー
ヘドリック、ジェフリー、カーティス
リー、カン−ウック
リニガー、エリック、ゲールハード
シモニー、エヴァ、エリカ
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
International Business Machines Corp
Original Assignee
International Business Machines Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by International Business Machines Corp filed Critical International Business Machines Corp
Publication of JP2004532514A publication Critical patent/JP2004532514A/ja
Application granted granted Critical
Publication of JP3759108B2 publication Critical patent/JP3759108B2/ja
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Images

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P14/00—Formation of materials, e.g. in the shape of layers or pillars
    • H10P14/60—Formation of materials, e.g. in the shape of layers or pillars of insulating materials
    • H10P14/63—Formation of materials, e.g. in the shape of layers or pillars of insulating materials characterised by the formation processes
    • H10P14/6326—Deposition processes
    • H10P14/6342—Liquid deposition, e.g. spin-coating, sol-gel techniques or spray coating
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P14/00—Formation of materials, e.g. in the shape of layers or pillars
    • H10P14/60—Formation of materials, e.g. in the shape of layers or pillars of insulating materials
    • H10P14/63—Formation of materials, e.g. in the shape of layers or pillars of insulating materials characterised by the formation processes
    • H10P14/6326—Deposition processes
    • H10P14/6328—Deposition from the gas or vapour phase
    • H10P14/6334—Deposition from the gas or vapour phase using decomposition or reaction of gaseous or vapour phase compounds, i.e. chemical vapour deposition
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P14/00—Formation of materials, e.g. in the shape of layers or pillars
    • H10P14/60—Formation of materials, e.g. in the shape of layers or pillars of insulating materials
    • H10P14/66—Formation of materials, e.g. in the shape of layers or pillars of insulating materials characterised by the type of materials
    • H10P14/668—Formation of materials, e.g. in the shape of layers or pillars of insulating materials characterised by the type of materials the materials being characterised by the deposition precursor materials
    • H10P14/6681—Formation of materials, e.g. in the shape of layers or pillars of insulating materials characterised by the type of materials the materials being characterised by the deposition precursor materials the precursor containing a compound comprising Si
    • H10P14/6682—Formation of materials, e.g. in the shape of layers or pillars of insulating materials characterised by the type of materials the materials being characterised by the deposition precursor materials the precursor containing a compound comprising Si the compound being a silane, e.g. disilane, methylsilane or chlorosilane
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W20/00—Interconnections in chips, wafers or substrates
    • H10W20/01—Manufacture or treatment
    • H10W20/071—Manufacture or treatment of dielectric parts thereof
    • H10W20/074—Manufacture or treatment of dielectric parts thereof of dielectric parts comprising thin functional dielectric layers, e.g. dielectric etch-stop, barrier, capping or liner layers
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P14/00—Formation of materials, e.g. in the shape of layers or pillars
    • H10P14/60—Formation of materials, e.g. in the shape of layers or pillars of insulating materials
    • H10P14/66—Formation of materials, e.g. in the shape of layers or pillars of insulating materials characterised by the type of materials
    • H10P14/668—Formation of materials, e.g. in the shape of layers or pillars of insulating materials characterised by the type of materials the materials being characterised by the deposition precursor materials
    • H10P14/6681—Formation of materials, e.g. in the shape of layers or pillars of insulating materials characterised by the type of materials the materials being characterised by the deposition precursor materials the precursor containing a compound comprising Si
    • H10P14/6684—Formation of materials, e.g. in the shape of layers or pillars of insulating materials characterised by the type of materials the materials being characterised by the deposition precursor materials the precursor containing a compound comprising Si the compound comprising silicon and oxygen
    • H10P14/6686—Formation of materials, e.g. in the shape of layers or pillars of insulating materials characterised by the type of materials the materials being characterised by the deposition precursor materials the precursor containing a compound comprising Si the compound comprising silicon and oxygen the compound being a molecule comprising at least one silicon-oxygen bond and the compound having hydrogen or an organic group attached to the silicon or oxygen, e.g. a siloxane
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P14/00—Formation of materials, e.g. in the shape of layers or pillars
    • H10P14/60—Formation of materials, e.g. in the shape of layers or pillars of insulating materials
    • H10P14/69—Inorganic materials
    • H10P14/692—Inorganic materials composed of oxides, glassy oxides or oxide-based glasses
    • H10P14/6921—Inorganic materials composed of oxides, glassy oxides or oxide-based glasses containing silicon
    • H10P14/6922—Inorganic materials composed of oxides, glassy oxides or oxide-based glasses containing silicon the material containing Si, O and at least one of H, N, C, F or other non-metal elements, e.g. SiOC, SiOC:H or SiONC

Landscapes

  • Formation Of Insulating Films (AREA)
  • Internal Circuitry In Semiconductor Integrated Circuit Devices (AREA)
  • Application Of Or Painting With Fluid Materials (AREA)
  • Laminated Bodies (AREA)
  • Production Of Multi-Layered Print Wiring Board (AREA)
JP2002568408A 2001-02-21 2002-02-19 接着性が増大した低欠陥密度のｂｅｏｌ相互接続用低誘電率レベル間誘電体被膜を製造する方法 Expired - Fee Related JP3759108B2 (ja)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US09/789,422 US6455443B1 (en) 2001-02-21 2001-02-21 Method of fabricating low-dielectric constant interlevel dielectric films for BEOL interconnects with enhanced adhesion and low-defect density
PCT/US2002/004879 WO2002069381A2 (en) 2001-02-21 2002-02-19 Method of fabricating low-dielectric constant interlevel dielectric films for beol interconnects with enhanced adhesion and low-defect density

Publications (2)

Publication Number Publication Date
JP2004532514A JP2004532514A (ja) 2004-10-21
JP3759108B2 true JP3759108B2 (ja) 2006-03-22

Family

ID=25147596

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2002568408A Expired - Fee Related JP3759108B2 (ja) 2001-02-21 2002-02-19 接着性が増大した低欠陥密度のｂｅｏｌ相互接続用低誘電率レベル間誘電体被膜を製造する方法

Country Status (12)

Country Link
US (1) US6455443B1 (enExample)
EP (1) EP1390972B1 (enExample)
JP (1) JP3759108B2 (enExample)
KR (1) KR100516534B1 (enExample)
CN (1) CN1251312C (enExample)
AT (1) ATE333144T1 (enExample)
DE (1) DE60213086T2 (enExample)
ES (1) ES2262797T3 (enExample)
IL (1) IL157506A (enExample)
IN (1) IN2003DE01322A (enExample)
TW (1) TW561551B (enExample)
WO (1) WO2002069381A2 (enExample)

Families Citing this family (53)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6685983B2 (en) * 2001-03-14 2004-02-03 International Business Machines Corporation Defect-free dielectric coatings and preparation thereof using polymeric nitrogenous porogens
US6716771B2 (en) * 2002-04-09 2004-04-06 Intel Corporation Method for post-CMP conversion of a hydrophobic surface of a low-k dielectric layer to a hydrophilic surface
WO2004053205A2 (en) * 2002-07-22 2004-06-24 Massachusetts Institute Of Technolgoy Porous material formation by chemical vapor deposition onto colloidal crystal templates
US6974762B2 (en) * 2002-08-01 2005-12-13 Intel Corporation Adhesion of carbon doped oxides by silanization
JP2004274020A (ja) * 2002-09-24 2004-09-30 Rohm & Haas Electronic Materials Llc 電子デバイス製造
US7005390B2 (en) * 2002-10-09 2006-02-28 Intel Corporation Replenishment of surface carbon and surface passivation of low-k porous silicon-based dielectric materials
US20040137243A1 (en) * 2002-10-21 2004-07-15 Massachusetts Institute Of Technology Chemical vapor deposition of organosilicate thin films
US7248062B1 (en) 2002-11-04 2007-07-24 Kla-Tencor Technologies Corp. Contactless charge measurement of product wafers and control of corona generation and deposition
KR20040051097A (ko) * 2002-12-11 2004-06-18 패럴린코리아(주) 패럴린(parylene) 고분자 코팅의 접착력을 증진시키는전처리 방법 및 이를 응용한 장치
CN100334695C (zh) * 2003-01-02 2007-08-29 上海华虹（集团）有限公司 一种含硅低介电常数材料炉子固化工艺
TW200421483A (en) * 2003-03-17 2004-10-16 Semiconductor Leading Edge Tec Semiconductor device and method of manufacturing the same
US7164197B2 (en) * 2003-06-19 2007-01-16 3M Innovative Properties Company Dielectric composite material
US6825561B1 (en) 2003-06-19 2004-11-30 International Business Machines Corporation Structure and method for eliminating time dependent dielectric breakdown failure of low-k material
JP4106438B2 (ja) * 2003-06-20 2008-06-25 独立行政法人産業技術総合研究所 多層微細配線インターポーザおよびその製造方法
US6992003B2 (en) * 2003-09-11 2006-01-31 Freescale Semiconductor, Inc. Integration of ultra low K dielectric in a semiconductor fabrication process
US7056840B2 (en) * 2003-09-30 2006-06-06 International Business Machines Corp. Direct photo-patterning of nanoporous organosilicates, and method of use
US6903004B1 (en) 2003-12-16 2005-06-07 Freescale Semiconductor, Inc. Method of making a semiconductor device having a low K dielectric
US6962871B2 (en) * 2004-03-31 2005-11-08 Dielectric Systems, Inc. Composite polymer dielectric film
US7309395B2 (en) * 2004-03-31 2007-12-18 Dielectric Systems, Inc. System for forming composite polymer dielectric film
US7094661B2 (en) * 2004-03-31 2006-08-22 Dielectric Systems, Inc. Single and dual damascene techniques utilizing composite polymer dielectric film
US20060046044A1 (en) * 2004-08-24 2006-03-02 Lee Chung J Porous composite polymer dielectric film
RU2007120247A (ru) * 2004-12-07 2009-01-20 Малти-Файнлайн Электроникс, Инк. (Us) Миниатюрные схемы, индуктивные элементы и способы их производства
US20060128163A1 (en) * 2004-12-14 2006-06-15 International Business Machines Corporation Surface treatment of post-rie-damaged p-osg and other damaged materials
US7446055B2 (en) * 2005-03-17 2008-11-04 Air Products And Chemicals, Inc. Aerosol misted deposition of low dielectric organosilicate films
US20060275547A1 (en) * 2005-06-01 2006-12-07 Lee Chung J Vapor Phase Deposition System and Method
US20060275616A1 (en) * 2005-06-03 2006-12-07 Clough Robert S Silane-based coupling agent
WO2007020464A1 (en) * 2005-08-19 2007-02-22 Avx Limited Solid state capacitors and method of manufacturing them
US7893703B2 (en) * 2005-08-19 2011-02-22 Kla-Tencor Technologies Corp. Systems and methods for controlling deposition of a charge on a wafer for measurement of one or more electrical properties of the wafer
GB0517952D0 (en) * 2005-09-02 2005-10-12 Avx Ltd Method of forming anode bodies for solid state capacitors
JP4616154B2 (ja) * 2005-11-14 2011-01-19 富士通株式会社 半導体装置の製造方法
US7851138B2 (en) * 2007-07-19 2010-12-14 Hitachi Global Storage Technologies, Netherlands, B.V. Patterning a surface comprising silicon and carbon
US7760487B2 (en) * 2007-10-22 2010-07-20 Avx Corporation Doped ceramic powder for use in forming capacitor anodes
US7768773B2 (en) * 2008-01-22 2010-08-03 Avx Corporation Sintered anode pellet etched with an organic acid for use in an electrolytic capacitor
US7852615B2 (en) * 2008-01-22 2010-12-14 Avx Corporation Electrolytic capacitor anode treated with an organometallic compound
US7760488B2 (en) * 2008-01-22 2010-07-20 Avx Corporation Sintered anode pellet treated with a surfactant for use in an electrolytic capacitor
CN102318044A (zh) * 2008-05-08 2012-01-11 巴斯夫欧洲公司 包含碳化硅层的层型结构、其制备方法及其用途
US8203827B2 (en) * 2009-02-20 2012-06-19 Avx Corporation Anode for a solid electrolytic capacitor containing a non-metallic surface treatment
CN102487057B (zh) * 2010-12-03 2014-03-12 中芯国际集成电路制造(北京)有限公司 金属前介质层及其制造方法
TWI445626B (zh) * 2011-03-18 2014-07-21 長興化學工業股份有限公司 製造軟性元件的方法
CN103367107B (zh) * 2012-04-09 2016-04-20 中芯国际集成电路制造(上海)有限公司 改善表面结合力的方法
US20140162054A1 (en) * 2012-12-11 2014-06-12 Industrial Technology Research Institute Interposer layer for enhancing adhesive attraction of poly(p-xylylene) film to substrate
WO2014163188A1 (ja) * 2013-04-04 2014-10-09 富士電機株式会社 半導体デバイスの製造方法
US9159556B2 (en) 2013-09-09 2015-10-13 GlobalFoundries, Inc. Alleviation of the corrosion pitting of chip pads
US9806132B2 (en) * 2013-11-22 2017-10-31 General Electric Company Organic X-ray detector with barrier layer
CN105418926B (zh) * 2014-09-12 2018-07-13 中国科学院上海高等研究院 一种含氟萘乙基硅树脂及其制备方法和应用
JP6540361B2 (ja) 2015-08-18 2019-07-10 富士通株式会社 半導体装置及びその製造方法
US9799593B1 (en) * 2016-04-01 2017-10-24 Intel Corporation Semiconductor package substrate having an interfacial layer
US10468243B2 (en) * 2017-11-22 2019-11-05 Taiwan Semiconductor Manufacturing Co., Ltd. Method of manufacturing semiconductor device and method of cleaning substrate
CN110965045A (zh) * 2018-09-29 2020-04-07 南京理工大学 一种利用Parylene微纳米薄膜对薄壁聚能切割索进行防护的方法
US11500290B2 (en) * 2018-11-13 2022-11-15 International Business Machines Corporation Adhesion promoters
CN110606970A (zh) * 2019-09-30 2019-12-24 福州大学 一种提升涂层与塑料粘结力的塑料表面预处理方法
DE112021007236T5 (de) * 2021-03-10 2024-01-04 Mitsubishi Electric Corporation Verfahren zum herstellen eines verbundkörpers aus verschiedenen materialien, sowie verbundkörper aus verschiedenen materialien
CN118719508B (zh) * 2024-09-02 2024-12-27 上海派拉纶生物技术股份有限公司 一种含复配偶联剂的Parylene涂层及其制备方法和应用

Family Cites Families (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
FR2193864B1 (enExample) * 1972-07-31 1974-12-27 Rhone Poulenc Sa
JPH0791509B2 (ja) * 1985-12-17 1995-10-04 住友化学工業株式会社 半導体用絶縁膜形成塗布液
US4950583A (en) * 1986-09-17 1990-08-21 Brewer Science Inc. Adhesion promoting product and process for treating an integrated circuit substrate therewith
US4732858A (en) * 1986-09-17 1988-03-22 Brewer Science, Inc. Adhesion promoting product and process for treating an integrated circuit substrate
DE69502709T2 (de) * 1994-10-18 1998-12-24 Philips Electronics N.V., Eindhoven Verfahren und herstellung einer dünnen silizium-oxid-schicht
US5760480A (en) * 1995-09-20 1998-06-02 Advanced Micro Devics, Inc. Low RC interconnection
JPH09143420A (ja) * 1995-09-21 1997-06-03 Asahi Glass Co Ltd 低誘電率樹脂組成物
US6071830A (en) * 1996-04-17 2000-06-06 Sony Corporation Method of forming insulating film
US5989998A (en) * 1996-08-29 1999-11-23 Matsushita Electric Industrial Co., Ltd. Method of forming interlayer insulating film

Also Published As

Publication number Publication date
CN1550036A (zh) 2004-11-24
TW561551B (en) 2003-11-11
US6455443B1 (en) 2002-09-24
KR100516534B1 (ko) 2005-09-22
WO2002069381A2 (en) 2002-09-06
DE60213086D1 (de) 2006-08-24
EP1390972A2 (en) 2004-02-25
KR20030071841A (ko) 2003-09-06
IN2003DE01322A (enExample) 2005-05-27
IL157506A (en) 2007-06-03
DE60213086T2 (de) 2006-12-28
US20020160600A1 (en) 2002-10-31
WO2002069381A3 (en) 2003-12-18
EP1390972B1 (en) 2006-07-12
ES2262797T3 (es) 2006-12-01
IL157506A0 (en) 2004-03-28
ATE333144T1 (de) 2006-08-15
CN1251312C (zh) 2006-04-12
JP2004532514A (ja) 2004-10-21

Similar Documents

Publication Publication Date Title
JP3759108B2 (ja) 接着性が増大した低欠陥密度のｂｅｏｌ相互接続用低誘電率レベル間誘電体被膜を製造する方法
CN1839468B (zh) 使用甲硅烷基化剂修复低k介电材料的损伤
US7709371B2 (en) Repairing damage to low-k dielectric materials using silylating agents
CN1742363B (zh) 受损电介质材料和电介质膜的修复和恢复
US8475666B2 (en) Method for making toughening agent materials
CN101048857B (zh) 用作金属间电介质的低k和超低k有机硅酸盐膜的疏水性的恢复
JPWO1995024639A1 (ja) 絶縁膜形成用シロキサン類の評価方法、絶縁膜形成用塗布液およびその製造方法ならびに半導体装置用絶縁膜の形成方法およびこれを適用する半導体装置の製造方法
TW200303057A (en) Integration scheme for advanced BEOL metallization including low-k cap layer and method thereof
CN101647106B (zh) 表面疏水化膜、表面疏水化膜形成材料、布线层、半导体装置及其制造方法
JP2008210970A (ja) 絶縁膜材料、多層配線及びその製造方法、並びに、半導体装置の製造方法
JP2009206457A (ja) 絶縁膜
JP2000021872A (ja) 低誘電率樹脂組成物、低誘電率絶縁膜形成方法および半導体装置の製造方法
KR101064336B1 (ko) 실릴화제를 이용한 저-ｋ 유전물질로의 손상 보수
JP2006351877A (ja) 積層体の製造方法、半導体デバイスおよび半導体デバイスの製造方法
Krishtab et al. Low-k materials engineering for 10 nm technology node and beyond
JPWO1995018190A1 (ja) 半導体装置の絶縁膜および絶縁膜形成用塗布液ならびに絶縁膜の製造方法
JP2008085063A (ja) エッチングストッパー膜形成用組成物、該組成物を用いた膜及び電子デバイス
JP2004304177A (ja) 半導体装置および半導体装置の製造方法
JP2005175394A (ja) ダマシン法を用いた配線の形成方法及び該配線形成に用いるシリカ系被膜形成用塗布液

Legal Events

Date Code Title Description
A977 Report on retrieval

Free format text: JAPANESE INTERMEDIATE CODE: A971007

Effective date: 20050520

A131 Notification of reasons for refusal

Free format text: JAPANESE INTERMEDIATE CODE: A131

Effective date: 20050531

A521 Request for written amendment filed

Free format text: JAPANESE INTERMEDIATE CODE: A523

Effective date: 20050811

A02 Decision of refusal

Free format text: JAPANESE INTERMEDIATE CODE: A02

Effective date: 20050907

A521 Request for written amendment filed

Free format text: JAPANESE INTERMEDIATE CODE: A523

Effective date: 20051025

A911 Transfer to examiner for re-examination before appeal (zenchi)

Free format text: JAPANESE INTERMEDIATE CODE: A911

Effective date: 20051031

A131 Notification of reasons for refusal

Free format text: JAPANESE INTERMEDIATE CODE: A131

Effective date: 20051122

A521 Request for written amendment filed

Free format text: JAPANESE INTERMEDIATE CODE: A523

Effective date: 20051125

TRDD Decision of grant or rejection written
A01 Written decision to grant a patent or to grant a registration (utility model)

Free format text: JAPANESE INTERMEDIATE CODE: A01

Effective date: 20051220

A61 First payment of annual fees (during grant procedure)

Free format text: JAPANESE INTERMEDIATE CODE: A61

Effective date: 20051227

R150 Certificate of patent or registration of utility model

Free format text: JAPANESE INTERMEDIATE CODE: R150

FPAY Renewal fee payment (event date is renewal date of database)

Free format text: PAYMENT UNTIL: 20090113

Year of fee payment: 3

FPAY Renewal fee payment (event date is renewal date of database)

Free format text: PAYMENT UNTIL: 20100113

Year of fee payment: 4

FPAY Renewal fee payment (event date is renewal date of database)

Free format text: PAYMENT UNTIL: 20100113

Year of fee payment: 4

FPAY Renewal fee payment (event date is renewal date of database)

Free format text: PAYMENT UNTIL: 20110113

Year of fee payment: 5

FPAY Renewal fee payment (event date is renewal date of database)

Free format text: PAYMENT UNTIL: 20120113

Year of fee payment: 6

FPAY Renewal fee payment (event date is renewal date of database)

Free format text: PAYMENT UNTIL: 20130113

Year of fee payment: 7

FPAY Renewal fee payment (event date is renewal date of database)

Free format text: PAYMENT UNTIL: 20140113

Year of fee payment: 8

R250 Receipt of annual fees

Free format text: JAPANESE INTERMEDIATE CODE: R250

R250 Receipt of annual fees

Free format text: JAPANESE INTERMEDIATE CODE: R250

LAPS Cancellation because of no payment of annual fees