JP3759108B2 - 接着性が増大した低欠陥密度のbeol相互接続用低誘電率レベル間誘電体被膜を製造する方法 - Google Patents
接着性が増大した低欠陥密度のbeol相互接続用低誘電率レベル間誘電体被膜を製造する方法 Download PDFInfo
- Publication number
- JP3759108B2 JP3759108B2 JP2002568408A JP2002568408A JP3759108B2 JP 3759108 B2 JP3759108 B2 JP 3759108B2 JP 2002568408 A JP2002568408 A JP 2002568408A JP 2002568408 A JP2002568408 A JP 2002568408A JP 3759108 B2 JP3759108 B2 JP 3759108B2
- Authority
- JP
- Japan
- Prior art keywords
- substrate
- coupling agent
- silane coupling
- coating
- applying
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
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Classifications
-
- H10P14/6342—
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- H10P14/6334—
-
- H10P14/6682—
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- H10W20/074—
-
- H10P14/6686—
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- H10P14/6922—
Landscapes
- Formation Of Insulating Films (AREA)
- Internal Circuitry In Semiconductor Integrated Circuit Devices (AREA)
- Application Of Or Painting With Fluid Materials (AREA)
- Laminated Bodies (AREA)
- Production Of Multi-Layered Print Wiring Board (AREA)
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US09/789,422 US6455443B1 (en) | 2001-02-21 | 2001-02-21 | Method of fabricating low-dielectric constant interlevel dielectric films for BEOL interconnects with enhanced adhesion and low-defect density |
| PCT/US2002/004879 WO2002069381A2 (en) | 2001-02-21 | 2002-02-19 | Method of fabricating low-dielectric constant interlevel dielectric films for beol interconnects with enhanced adhesion and low-defect density |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JP2004532514A JP2004532514A (ja) | 2004-10-21 |
| JP3759108B2 true JP3759108B2 (ja) | 2006-03-22 |
Family
ID=25147596
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2002568408A Expired - Fee Related JP3759108B2 (ja) | 2001-02-21 | 2002-02-19 | 接着性が増大した低欠陥密度のbeol相互接続用低誘電率レベル間誘電体被膜を製造する方法 |
Country Status (12)
| Country | Link |
|---|---|
| US (1) | US6455443B1 (enExample) |
| EP (1) | EP1390972B1 (enExample) |
| JP (1) | JP3759108B2 (enExample) |
| KR (1) | KR100516534B1 (enExample) |
| CN (1) | CN1251312C (enExample) |
| AT (1) | ATE333144T1 (enExample) |
| DE (1) | DE60213086T2 (enExample) |
| ES (1) | ES2262797T3 (enExample) |
| IL (1) | IL157506A (enExample) |
| IN (1) | IN2003DE01322A (enExample) |
| TW (1) | TW561551B (enExample) |
| WO (1) | WO2002069381A2 (enExample) |
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| US6685983B2 (en) * | 2001-03-14 | 2004-02-03 | International Business Machines Corporation | Defect-free dielectric coatings and preparation thereof using polymeric nitrogenous porogens |
| US6716771B2 (en) * | 2002-04-09 | 2004-04-06 | Intel Corporation | Method for post-CMP conversion of a hydrophobic surface of a low-k dielectric layer to a hydrophilic surface |
| WO2004053205A2 (en) * | 2002-07-22 | 2004-06-24 | Massachusetts Institute Of Technolgoy | Porous material formation by chemical vapor deposition onto colloidal crystal templates |
| US6974762B2 (en) * | 2002-08-01 | 2005-12-13 | Intel Corporation | Adhesion of carbon doped oxides by silanization |
| JP2004274020A (ja) * | 2002-09-24 | 2004-09-30 | Rohm & Haas Electronic Materials Llc | 電子デバイス製造 |
| US7005390B2 (en) * | 2002-10-09 | 2006-02-28 | Intel Corporation | Replenishment of surface carbon and surface passivation of low-k porous silicon-based dielectric materials |
| US20040137243A1 (en) * | 2002-10-21 | 2004-07-15 | Massachusetts Institute Of Technology | Chemical vapor deposition of organosilicate thin films |
| US7248062B1 (en) | 2002-11-04 | 2007-07-24 | Kla-Tencor Technologies Corp. | Contactless charge measurement of product wafers and control of corona generation and deposition |
| KR20040051097A (ko) * | 2002-12-11 | 2004-06-18 | 패럴린코리아(주) | 패럴린(parylene) 고분자 코팅의 접착력을 증진시키는전처리 방법 및 이를 응용한 장치 |
| CN100334695C (zh) * | 2003-01-02 | 2007-08-29 | 上海华虹(集团)有限公司 | 一种含硅低介电常数材料炉子固化工艺 |
| TW200421483A (en) * | 2003-03-17 | 2004-10-16 | Semiconductor Leading Edge Tec | Semiconductor device and method of manufacturing the same |
| US7164197B2 (en) * | 2003-06-19 | 2007-01-16 | 3M Innovative Properties Company | Dielectric composite material |
| US6825561B1 (en) | 2003-06-19 | 2004-11-30 | International Business Machines Corporation | Structure and method for eliminating time dependent dielectric breakdown failure of low-k material |
| JP4106438B2 (ja) * | 2003-06-20 | 2008-06-25 | 独立行政法人産業技術総合研究所 | 多層微細配線インターポーザおよびその製造方法 |
| US6992003B2 (en) * | 2003-09-11 | 2006-01-31 | Freescale Semiconductor, Inc. | Integration of ultra low K dielectric in a semiconductor fabrication process |
| US7056840B2 (en) * | 2003-09-30 | 2006-06-06 | International Business Machines Corp. | Direct photo-patterning of nanoporous organosilicates, and method of use |
| US6903004B1 (en) | 2003-12-16 | 2005-06-07 | Freescale Semiconductor, Inc. | Method of making a semiconductor device having a low K dielectric |
| US6962871B2 (en) * | 2004-03-31 | 2005-11-08 | Dielectric Systems, Inc. | Composite polymer dielectric film |
| US7094661B2 (en) * | 2004-03-31 | 2006-08-22 | Dielectric Systems, Inc. | Single and dual damascene techniques utilizing composite polymer dielectric film |
| US7309395B2 (en) * | 2004-03-31 | 2007-12-18 | Dielectric Systems, Inc. | System for forming composite polymer dielectric film |
| US20060046044A1 (en) * | 2004-08-24 | 2006-03-02 | Lee Chung J | Porous composite polymer dielectric film |
| CN101151688B (zh) * | 2004-12-07 | 2013-01-16 | 富多电子公司 | 微型变压器、多层印刷电路及其制造方法 |
| US20060128163A1 (en) * | 2004-12-14 | 2006-06-15 | International Business Machines Corporation | Surface treatment of post-rie-damaged p-osg and other damaged materials |
| US7446055B2 (en) * | 2005-03-17 | 2008-11-04 | Air Products And Chemicals, Inc. | Aerosol misted deposition of low dielectric organosilicate films |
| US20060275547A1 (en) * | 2005-06-01 | 2006-12-07 | Lee Chung J | Vapor Phase Deposition System and Method |
| US20060275616A1 (en) * | 2005-06-03 | 2006-12-07 | Clough Robert S | Silane-based coupling agent |
| WO2007022538A2 (en) * | 2005-08-19 | 2007-02-22 | Kla-Tencor Technologies Corporation | Test pads for measuring properties of a wafer |
| JP2009505412A (ja) * | 2005-08-19 | 2009-02-05 | エイブイエックス リミテッド | ポリマーベースの固体コンデンサおよびその製造方法 |
| GB0517952D0 (en) * | 2005-09-02 | 2005-10-12 | Avx Ltd | Method of forming anode bodies for solid state capacitors |
| JP4616154B2 (ja) * | 2005-11-14 | 2011-01-19 | 富士通株式会社 | 半導体装置の製造方法 |
| US7851138B2 (en) * | 2007-07-19 | 2010-12-14 | Hitachi Global Storage Technologies, Netherlands, B.V. | Patterning a surface comprising silicon and carbon |
| US7760487B2 (en) * | 2007-10-22 | 2010-07-20 | Avx Corporation | Doped ceramic powder for use in forming capacitor anodes |
| US7760488B2 (en) * | 2008-01-22 | 2010-07-20 | Avx Corporation | Sintered anode pellet treated with a surfactant for use in an electrolytic capacitor |
| US7768773B2 (en) * | 2008-01-22 | 2010-08-03 | Avx Corporation | Sintered anode pellet etched with an organic acid for use in an electrolytic capacitor |
| US7852615B2 (en) * | 2008-01-22 | 2010-12-14 | Avx Corporation | Electrolytic capacitor anode treated with an organometallic compound |
| KR20110014996A (ko) * | 2008-05-08 | 2011-02-14 | 바스프 에스이 | 탄화규소 층을 포함하는 층상 구조물, 이의 제조 방법 및 용도 |
| US8203827B2 (en) * | 2009-02-20 | 2012-06-19 | Avx Corporation | Anode for a solid electrolytic capacitor containing a non-metallic surface treatment |
| CN102487057B (zh) * | 2010-12-03 | 2014-03-12 | 中芯国际集成电路制造(北京)有限公司 | 金属前介质层及其制造方法 |
| TWI445626B (zh) * | 2011-03-18 | 2014-07-21 | 長興化學工業股份有限公司 | 製造軟性元件的方法 |
| CN103367107B (zh) * | 2012-04-09 | 2016-04-20 | 中芯国际集成电路制造(上海)有限公司 | 改善表面结合力的方法 |
| CN103874325B (zh) * | 2012-12-11 | 2017-04-12 | 财团法人工业技术研究院 | 层叠结构、其制造方法及发光装置 |
| DE112014001822T5 (de) * | 2013-04-04 | 2015-12-24 | Fuji Electric Co., Ltd. | Verfahren zum Fertigen einer Halbleitervorrichtung |
| US9159556B2 (en) | 2013-09-09 | 2015-10-13 | GlobalFoundries, Inc. | Alleviation of the corrosion pitting of chip pads |
| US9806132B2 (en) * | 2013-11-22 | 2017-10-31 | General Electric Company | Organic X-ray detector with barrier layer |
| CN105418926B (zh) * | 2014-09-12 | 2018-07-13 | 中国科学院上海高等研究院 | 一种含氟萘乙基硅树脂及其制备方法和应用 |
| JP6540361B2 (ja) | 2015-08-18 | 2019-07-10 | 富士通株式会社 | 半導体装置及びその製造方法 |
| US9799593B1 (en) * | 2016-04-01 | 2017-10-24 | Intel Corporation | Semiconductor package substrate having an interfacial layer |
| US10468243B2 (en) * | 2017-11-22 | 2019-11-05 | Taiwan Semiconductor Manufacturing Co., Ltd. | Method of manufacturing semiconductor device and method of cleaning substrate |
| CN110965045A (zh) * | 2018-09-29 | 2020-04-07 | 南京理工大学 | 一种利用Parylene微纳米薄膜对薄壁聚能切割索进行防护的方法 |
| US11500290B2 (en) * | 2018-11-13 | 2022-11-15 | International Business Machines Corporation | Adhesion promoters |
| CN110606970A (zh) * | 2019-09-30 | 2019-12-24 | 福州大学 | 一种提升涂层与塑料粘结力的塑料表面预处理方法 |
| JP7408010B2 (ja) * | 2021-03-10 | 2024-01-04 | 三菱電機株式会社 | 異種材料接合体の製造方法、および異種材料接合体 |
| CN118719508B (zh) * | 2024-09-02 | 2024-12-27 | 上海派拉纶生物技术股份有限公司 | 一种含复配偶联剂的Parylene涂层及其制备方法和应用 |
Family Cites Families (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| FR2193864B1 (enExample) * | 1972-07-31 | 1974-12-27 | Rhone Poulenc Sa | |
| JPH0791509B2 (ja) * | 1985-12-17 | 1995-10-04 | 住友化学工業株式会社 | 半導体用絶縁膜形成塗布液 |
| US4950583A (en) * | 1986-09-17 | 1990-08-21 | Brewer Science Inc. | Adhesion promoting product and process for treating an integrated circuit substrate therewith |
| US4732858A (en) * | 1986-09-17 | 1988-03-22 | Brewer Science, Inc. | Adhesion promoting product and process for treating an integrated circuit substrate |
| DE69502709T2 (de) * | 1994-10-18 | 1998-12-24 | Philips Electronics N.V., Eindhoven | Verfahren und herstellung einer dünnen silizium-oxid-schicht |
| US5760480A (en) * | 1995-09-20 | 1998-06-02 | Advanced Micro Devics, Inc. | Low RC interconnection |
| JPH09143420A (ja) * | 1995-09-21 | 1997-06-03 | Asahi Glass Co Ltd | 低誘電率樹脂組成物 |
| US6071830A (en) * | 1996-04-17 | 2000-06-06 | Sony Corporation | Method of forming insulating film |
| US5989998A (en) * | 1996-08-29 | 1999-11-23 | Matsushita Electric Industrial Co., Ltd. | Method of forming interlayer insulating film |
-
2001
- 2001-02-21 US US09/789,422 patent/US6455443B1/en not_active Expired - Fee Related
-
2002
- 2002-02-19 ES ES02721047T patent/ES2262797T3/es not_active Expired - Lifetime
- 2002-02-19 WO PCT/US2002/004879 patent/WO2002069381A2/en not_active Ceased
- 2002-02-19 DE DE60213086T patent/DE60213086T2/de not_active Expired - Lifetime
- 2002-02-19 KR KR20037009637A patent/KR100516534B1/ko not_active Expired - Fee Related
- 2002-02-19 AT AT02721047T patent/ATE333144T1/de not_active IP Right Cessation
- 2002-02-19 JP JP2002568408A patent/JP3759108B2/ja not_active Expired - Fee Related
- 2002-02-19 CN CNB028063457A patent/CN1251312C/zh not_active Expired - Fee Related
- 2002-02-19 EP EP02721047A patent/EP1390972B1/en not_active Expired - Lifetime
- 2002-02-21 TW TW091103031A patent/TW561551B/zh not_active IP Right Cessation
-
2003
- 2003-08-19 IN IN1322DE2003 patent/IN2003DE01322A/en unknown
- 2003-08-21 IL IL157506A patent/IL157506A/en not_active IP Right Cessation
Also Published As
| Publication number | Publication date |
|---|---|
| CN1550036A (zh) | 2004-11-24 |
| JP2004532514A (ja) | 2004-10-21 |
| IN2003DE01322A (enExample) | 2005-05-27 |
| CN1251312C (zh) | 2006-04-12 |
| EP1390972A2 (en) | 2004-02-25 |
| IL157506A0 (en) | 2004-03-28 |
| WO2002069381A3 (en) | 2003-12-18 |
| ATE333144T1 (de) | 2006-08-15 |
| DE60213086T2 (de) | 2006-12-28 |
| TW561551B (en) | 2003-11-11 |
| ES2262797T3 (es) | 2006-12-01 |
| KR20030071841A (ko) | 2003-09-06 |
| IL157506A (en) | 2007-06-03 |
| US6455443B1 (en) | 2002-09-24 |
| EP1390972B1 (en) | 2006-07-12 |
| US20020160600A1 (en) | 2002-10-31 |
| KR100516534B1 (ko) | 2005-09-22 |
| DE60213086D1 (de) | 2006-08-24 |
| WO2002069381A2 (en) | 2002-09-06 |
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