JP3596388B2 - 半導体装置 - Google Patents

半導体装置 Download PDF

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Publication number
JP3596388B2
JP3596388B2 JP33312499A JP33312499A JP3596388B2 JP 3596388 B2 JP3596388 B2 JP 3596388B2 JP 33312499 A JP33312499 A JP 33312499A JP 33312499 A JP33312499 A JP 33312499A JP 3596388 B2 JP3596388 B2 JP 3596388B2
Authority
JP
Japan
Prior art keywords
semiconductor chip
members
heat radiating
pair
heat
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
JP33312499A
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English (en)
Japanese (ja)
Other versions
JP2001156219A (ja
JP2001156219A5 (https=
Inventor
豊 福田
好美 中瀬
和仁 野村
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Denso Corp
Original Assignee
Denso Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Denso Corp filed Critical Denso Corp
Priority to JP33312499A priority Critical patent/JP3596388B2/ja
Priority to US09/717,227 priority patent/US6703707B1/en
Priority to FR0015130A priority patent/FR2801423B1/fr
Priority to DE10066441A priority patent/DE10066441B4/de
Priority to DE10066442A priority patent/DE10066442B4/de
Priority to DE10066445A priority patent/DE10066445B4/de
Priority to DE10066443A priority patent/DE10066443B8/de
Priority to DE10058446A priority patent/DE10058446B8/de
Priority to DE10066446A priority patent/DE10066446B4/de
Publication of JP2001156219A publication Critical patent/JP2001156219A/ja
Priority to US10/321,365 priority patent/US6693350B2/en
Priority to US10/699,838 priority patent/US6798062B2/en
Priority to US10/699,746 priority patent/US6998707B2/en
Priority to US10/699,954 priority patent/US6967404B2/en
Priority to US10/699,828 priority patent/US6992383B2/en
Priority to US10/699,785 priority patent/US6891265B2/en
Priority to US10/699,744 priority patent/US20040089940A1/en
Priority to US10/699,837 priority patent/US6960825B2/en
Priority to US10/699,784 priority patent/US20040089941A1/en
Application granted granted Critical
Publication of JP3596388B2 publication Critical patent/JP3596388B2/ja
Publication of JP2001156219A5 publication Critical patent/JP2001156219A5/ja
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

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    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/60—Strap connectors, e.g. thick copper clips for grounding of power devices
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/073—Connecting or disconnecting of die-attach connectors
    • H10W72/07331—Connecting techniques
    • H10W72/07336—Soldering or alloying
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/076—Connecting or disconnecting of strap connectors
    • H10W72/07631—Techniques
    • H10W72/07636—Soldering or alloying
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/551—Materials of bond wires
    • H10W72/552—Materials of bond wires comprising metals or metalloids, e.g. silver
    • H10W72/5522—Materials of bond wires comprising metals or metalloids, e.g. silver comprising gold [Au]
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/551—Materials of bond wires
    • H10W72/552—Materials of bond wires comprising metals or metalloids, e.g. silver
    • H10W72/5524—Materials of bond wires comprising metals or metalloids, e.g. silver comprising aluminium [Al]
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/60—Strap connectors, e.g. thick copper clips for grounding of power devices
    • H10W72/651—Materials of strap connectors
    • H10W72/652—Materials of strap connectors comprising metals or metalloids, e.g. silver
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/60—Strap connectors, e.g. thick copper clips for grounding of power devices
    • H10W72/651—Materials of strap connectors
    • H10W72/655—Materials of strap connectors of outermost layers of multilayered strap connectors, e.g. material of a coating
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/851—Dispositions of multiple connectors or interconnections
    • H10W72/853—On the same surface
    • H10W72/871—Bond wires and strap connectors
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/851—Dispositions of multiple connectors or interconnections
    • H10W72/874—On different surfaces
    • H10W72/884—Die-attach connectors and bond wires
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/731—Package configurations characterised by the relative positions of pads or connectors relative to package parts of die-attach connectors
    • H10W90/736—Package configurations characterised by the relative positions of pads or connectors relative to package parts of die-attach connectors between a chip and a stacked lead frame, conducting package substrate or heat sink
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/751—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires
    • H10W90/756—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires between a chip and a stacked lead frame, conducting package substrate or heat sink
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/761—Package configurations characterised by the relative positions of pads or connectors relative to package parts of strap connectors
    • H10W90/763—Package configurations characterised by the relative positions of pads or connectors relative to package parts of strap connectors between laterally-adjacent chips

Landscapes

  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
JP33312499A 1999-11-24 1999-11-24 半導体装置 Expired - Lifetime JP3596388B2 (ja)

Priority Applications (18)

Application Number Priority Date Filing Date Title
JP33312499A JP3596388B2 (ja) 1999-11-24 1999-11-24 半導体装置
US09/717,227 US6703707B1 (en) 1999-11-24 2000-11-22 Semiconductor device having radiation structure
FR0015130A FR2801423B1 (fr) 1999-11-24 2000-11-23 Dispositif semi-conducteur a structure rayonnante, procede de fabrication d'un dispositif semi-conducteur et procede de fabrication d'un instrument electronique
DE10066441A DE10066441B4 (de) 1999-11-24 2000-11-24 Halbleitervorrichtung mit Abstrahlungsbauteilen
DE10066442A DE10066442B4 (de) 1999-11-24 2000-11-24 Halbleitervorrichtung mit Abstrahlungs-Struktur
DE10066445A DE10066445B4 (de) 1999-11-24 2000-11-24 Halbleitervorrichtung mit Abstrahlungs-Struktur
DE10066443A DE10066443B8 (de) 1999-11-24 2000-11-24 Halbleitervorrichtung mit Abstrahlungsbauteilen
DE10058446A DE10058446B8 (de) 1999-11-24 2000-11-24 Halbleitervorrichtung mit Abstrahlungsbauteilen
DE10066446A DE10066446B4 (de) 1999-11-24 2000-11-24 Verfahren zur Herstellung eines elektronischen Bauteils mit zwei Abstrahlungsbauteilen
US10/321,365 US6693350B2 (en) 1999-11-24 2002-12-18 Semiconductor device having radiation structure and method for manufacturing semiconductor device having radiation structure
US10/699,838 US6798062B2 (en) 1999-11-24 2003-11-04 Semiconductor device having radiation structure
US10/699,746 US6998707B2 (en) 1999-11-24 2003-11-04 Semiconductor device having radiation structure
US10/699,954 US6967404B2 (en) 1999-11-24 2003-11-04 Semiconductor device having radiation structure
US10/699,828 US6992383B2 (en) 1999-11-24 2003-11-04 Semiconductor device having radiation structure
US10/699,785 US6891265B2 (en) 1999-11-24 2003-11-04 Semiconductor device having radiation structure
US10/699,744 US20040089940A1 (en) 1999-11-24 2003-11-04 Semiconductor device having radiation structure
US10/699,837 US6960825B2 (en) 1999-11-24 2003-11-04 Semiconductor device having radiation structure
US10/699,784 US20040089941A1 (en) 1999-11-24 2003-11-04 Semiconductor device having radiation structure

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP33312499A JP3596388B2 (ja) 1999-11-24 1999-11-24 半導体装置

Publications (3)

Publication Number Publication Date
JP2001156219A JP2001156219A (ja) 2001-06-08
JP3596388B2 true JP3596388B2 (ja) 2004-12-02
JP2001156219A5 JP2001156219A5 (https=) 2005-04-07

Family

ID=18262570

Family Applications (1)

Application Number Title Priority Date Filing Date
JP33312499A Expired - Lifetime JP3596388B2 (ja) 1999-11-24 1999-11-24 半導体装置

Country Status (1)

Country Link
JP (1) JP3596388B2 (https=)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE102006032490B4 (de) * 2005-07-22 2014-07-03 Denso Corporation Halbleitervorrichtung

Families Citing this family (48)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3719506B2 (ja) * 2001-12-19 2005-11-24 株式会社デンソー 半導体装置及びその製造方法
KR100415821B1 (ko) * 2001-06-29 2004-01-24 삼성전자주식회사 히트 싱크를 구비한 전력반도체 모듈
JP2008078679A (ja) * 2001-07-26 2008-04-03 Denso Corp 半導体装置
JP3580293B2 (ja) * 2002-03-26 2004-10-20 株式会社デンソー 半導体装置の製造方法
JP4376798B2 (ja) * 2001-07-26 2009-12-02 株式会社デンソー 半導体装置
JP2003110064A (ja) * 2001-07-26 2003-04-11 Denso Corp 半導体装置
JP3807354B2 (ja) * 2001-08-06 2006-08-09 株式会社デンソー 半導体装置
JP2003243611A (ja) * 2002-02-21 2003-08-29 Mitsubishi Electric Corp 半導体モジュール及び半導体装置
JP2003264265A (ja) * 2002-03-08 2003-09-19 Mitsubishi Electric Corp 電力用半導体装置
JP3847676B2 (ja) * 2002-07-15 2006-11-22 三菱電機株式会社 パワー半導体装置
US6777800B2 (en) * 2002-09-30 2004-08-17 Fairchild Semiconductor Corporation Semiconductor die package including drain clip
JP3759131B2 (ja) 2003-07-31 2006-03-22 Ｎｅｃエレクトロニクス株式会社 リードレスパッケージ型半導体装置とその製造方法
JP4207710B2 (ja) * 2003-08-08 2009-01-14 株式会社デンソー 半導体装置
JP2005116963A (ja) * 2003-10-10 2005-04-28 Denso Corp 半導体装置
JP2005136332A (ja) * 2003-10-31 2005-05-26 Toyota Motor Corp 半導体装置
JP3978424B2 (ja) * 2003-12-10 2007-09-19 トヨタ自動車株式会社 半導体モジュール、半導体装置および負荷駆動装置
JP4254527B2 (ja) * 2003-12-24 2009-04-15 株式会社デンソー 半導体装置
JP2005203548A (ja) * 2004-01-15 2005-07-28 Honda Motor Co Ltd 半導体装置のモジュール構造
JP4302607B2 (ja) * 2004-01-30 2009-07-29 株式会社デンソー 半導体装置
JP2005243685A (ja) * 2004-02-24 2005-09-08 Renesas Technology Corp 半導体装置
JP4158738B2 (ja) 2004-04-20 2008-10-01 株式会社デンソー 半導体モジュール実装構造、カード状半導体モジュール及びカード状半導体モジュール密着用受熱部材
JP2006066464A (ja) * 2004-08-24 2006-03-09 Toyota Industries Corp 半導体装置
JP4449724B2 (ja) * 2004-12-08 2010-04-14 株式会社デンソー 半導体モジュール
JP4353935B2 (ja) * 2005-11-07 2009-10-28 Ｎｅｃエレクトロニクス株式会社 リードレスパッケージ型半導体装置
JP4882394B2 (ja) * 2006-01-30 2012-02-22 富士電機株式会社 半導体装置
US7619302B2 (en) * 2006-05-23 2009-11-17 International Rectifier Corporation Highly efficient both-side-cooled discrete power package, especially basic element for innovative power modules
JP5232367B2 (ja) * 2006-07-12 2013-07-10 ルネサスエレクトロニクス株式会社 半導体装置
JP4946959B2 (ja) * 2008-04-09 2012-06-06 株式会社デンソー 半導体装置の製造方法
JP2009302579A (ja) * 2009-09-28 2009-12-24 Fuji Electric Device Technology Co Ltd 半導体装置およびその製造方法
JP5414644B2 (ja) 2010-09-29 2014-02-12 三菱電機株式会社 半導体装置
JP5427745B2 (ja) * 2010-09-30 2014-02-26 日立オートモティブシステムズ株式会社 パワー半導体モジュール及びその製造方法
JP2012175070A (ja) * 2011-02-24 2012-09-10 Panasonic Corp 半導体パッケージ
US8637981B2 (en) * 2011-03-30 2014-01-28 International Rectifier Corporation Dual compartment semiconductor package with temperature sensor
JP2013021254A (ja) * 2011-07-14 2013-01-31 Mitsubishi Electric Corp 半導体装置および半導体装置の製造方法
ITMI20120711A1 (it) 2012-04-27 2013-10-28 St Microelectronics Srl Dispositivo di potenza
ITMI20120712A1 (it) * 2012-04-27 2013-10-28 St Microelectronics Srl Dispositivo elettronico a montaggio passante con doppio dissipatore di calore
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JP5845142B2 (ja) * 2012-06-06 2016-01-20 日本電信電話株式会社 郵便物回収システム
WO2014054212A1 (ja) * 2012-10-01 2014-04-10 富士電機株式会社 半導体装置とその製造方法
JP6226365B2 (ja) * 2013-09-05 2017-11-08 株式会社東芝 半導体装置
JP6925279B2 (ja) * 2015-04-13 2021-08-25 アーベーベー・シュバイツ・アーゲーＡＢＢ Ｓｃｈｗｅｉｚ ＡＧ パワーエレクトロニクスモジュール
JP6822000B2 (ja) 2016-08-05 2021-01-27 株式会社デンソー 半導体装置
JP6874467B2 (ja) * 2017-03-29 2021-05-19 株式会社デンソー 半導体装置とその製造方法
JP6997552B2 (ja) * 2017-07-28 2022-01-17 日立Astemo株式会社 電力変換装置及び電力変換装置の製造方法
JP7159609B2 (ja) * 2018-05-15 2022-10-25 株式会社デンソー 半導体装置
US20230215778A1 (en) * 2020-08-03 2023-07-06 Mitsubishi Electric Corporation Semiconductor device module and method for manufacturing same
JP7579224B2 (ja) * 2021-09-13 2024-11-07 株式会社東芝 半導体装置
JP2024130953A (ja) * 2023-03-15 2024-09-30 株式会社東芝 半導体装置およびその製造方法

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE102006032490B4 (de) * 2005-07-22 2014-07-03 Denso Corporation Halbleitervorrichtung
DE102006062989B3 (de) 2005-07-22 2018-04-05 Denso Corporation Halbleitervorrichtung mit Halbleiterbaugruppen, die jeweils ein Halbleiterelement und ein Umschließungselement aufweisen

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