JP2540652B2 - 半導体装置 - Google Patents

半導体装置

Info

Publication number
JP2540652B2
JP2540652B2 JP2141684A JP14168490A JP2540652B2 JP 2540652 B2 JP2540652 B2 JP 2540652B2 JP 2141684 A JP2141684 A JP 2141684A JP 14168490 A JP14168490 A JP 14168490A JP 2540652 B2 JP2540652 B2 JP 2540652B2
Authority
JP
Japan
Prior art keywords
semiconductor chip
semiconductor device
lead
metal
plating layer
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
JP2141684A
Other languages
English (en)
Japanese (ja)
Other versions
JPH0437149A (ja
Inventor
隆夫 藤津
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Toshiba Corp
Original Assignee
Tokyo Shibaura Electric Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Tokyo Shibaura Electric Co Ltd filed Critical Tokyo Shibaura Electric Co Ltd
Priority to JP2141684A priority Critical patent/JP2540652B2/ja
Priority to KR1019910009041A priority patent/KR970000972B1/ko
Priority to DE69132685T priority patent/DE69132685T2/de
Priority to EP00103351A priority patent/EP1020903B1/en
Priority to DE69133497T priority patent/DE69133497T2/de
Priority to EP91108886A priority patent/EP0459493B1/en
Publication of JPH0437149A publication Critical patent/JPH0437149A/ja
Priority to US08/344,605 priority patent/US5654584A/en
Priority to US08/461,448 priority patent/US5556810A/en
Application granted granted Critical
Publication of JP2540652B2 publication Critical patent/JP2540652B2/ja
Priority to KR96058153A priority patent/KR970005718B1/ko
Priority to KR1019960058151A priority patent/KR970005716B1/ko
Priority to KR1019960058150A priority patent/KR970005715B1/ko
Priority to KR1019960058149A priority patent/KR970005714B1/ko
Priority to KR1019960058152A priority patent/KR970005717B1/ko
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Classifications

    • H10W72/00—
    • H10W76/12—
    • H10W70/435—
    • H10W70/465—
    • H10W70/479—
    • H10W72/019—
    • H10W70/682—
    • H10W70/685—
    • H10W72/073—
    • H10W72/07331—
    • H10W72/075—
    • H10W72/07554—
    • H10W72/29—
    • H10W72/354—
    • H10W72/547—
    • H10W72/5522—
    • H10W72/5524—
    • H10W72/59—
    • H10W72/923—
    • H10W72/952—
    • H10W90/754—
    • H10W99/00—

Landscapes

  • Wire Bonding (AREA)
  • Lead Frames For Integrated Circuits (AREA)
JP2141684A 1990-06-01 1990-06-01 半導体装置 Expired - Fee Related JP2540652B2 (ja)

Priority Applications (13)

Application Number Priority Date Filing Date Title
JP2141684A JP2540652B2 (ja) 1990-06-01 1990-06-01 半導体装置
KR1019910009041A KR970000972B1 (ko) 1990-06-01 1991-05-31 반도체 장치 및 그 제조 방법
DE69132685T DE69132685T2 (de) 1990-06-01 1991-05-31 Halbleiteranordnung bestehend aus einem TAB-Band und deren Herstellungsverfahren
EP00103351A EP1020903B1 (en) 1990-06-01 1991-05-31 A semiconductor device using a lead frame and its manufacturing method
DE69133497T DE69133497T2 (de) 1990-06-01 1991-05-31 Leiterrahmen für eine Halbleiteranordnung und dessen Herstellungsverfahren
EP91108886A EP0459493B1 (en) 1990-06-01 1991-05-31 A semiconductor device comprising a TAB tape and its manufacturing method
US08/344,605 US5654584A (en) 1990-06-01 1994-11-18 Semiconductor device having tape automated bonding leads
US08/461,448 US5556810A (en) 1990-06-01 1995-06-05 Method for manufacturing a semiconductor device wherein a semiconductor chip is connected to a lead frame by metal plating
KR96058153A KR970005718B1 (en) 1990-06-01 1996-11-27 A semiconductor device and its menufacture method
KR1019960058151A KR970005716B1 (ko) 1990-06-01 1996-11-27 반도체 장치 및 그 제조 방법
KR1019960058150A KR970005715B1 (ko) 1990-06-01 1996-11-27 반도체 장치 및 그 제조 방법
KR1019960058149A KR970005714B1 (ko) 1990-06-01 1996-11-27 반도체 장치 및 그 제조 방법
KR1019960058152A KR970005717B1 (ko) 1990-06-01 1996-11-27 반도체 장치 및 그 제조 방법

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2141684A JP2540652B2 (ja) 1990-06-01 1990-06-01 半導体装置

Related Child Applications (2)

Application Number Title Priority Date Filing Date
JP8011933A Division JP2777345B2 (ja) 1996-01-26 1996-01-26 半導体装置
JP8011934A Division JP2736247B2 (ja) 1996-01-26 1996-01-26 半導体装置の製造方法

Publications (2)

Publication Number Publication Date
JPH0437149A JPH0437149A (ja) 1992-02-07
JP2540652B2 true JP2540652B2 (ja) 1996-10-09

Family

ID=15297809

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2141684A Expired - Fee Related JP2540652B2 (ja) 1990-06-01 1990-06-01 半導体装置

Country Status (5)

Country Link
US (1) US5654584A (enExample)
EP (2) EP0459493B1 (enExample)
JP (1) JP2540652B2 (enExample)
KR (1) KR970000972B1 (enExample)
DE (2) DE69133497T2 (enExample)

Families Citing this family (168)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5249728A (en) * 1993-03-10 1993-10-05 Atmel Corporation Bumpless bonding process having multilayer metallization
JPH0799213A (ja) * 1993-06-09 1995-04-11 At & T Corp 集積回路チップ
JP2833996B2 (ja) * 1994-05-25 1998-12-09 日本電気株式会社 フレキシブルフィルム及びこれを有する半導体装置
JP3226752B2 (ja) * 1995-04-12 2001-11-05 株式会社東芝 半導体装置の製造方法
KR0157905B1 (ko) * 1995-10-19 1998-12-01 문정환 반도체 장치
KR100186333B1 (ko) * 1996-06-20 1999-03-20 문정환 칩 사이즈 반도체 패키지 및 그 제조방법
SG75841A1 (en) 1998-05-02 2000-10-24 Eriston Invest Pte Ltd Flip chip assembly with via interconnection
US6406939B1 (en) 1998-05-02 2002-06-18 Charles W. C. Lin Flip chip assembly with via interconnection
US6143981A (en) 1998-06-24 2000-11-07 Amkor Technology, Inc. Plastic integrated circuit package and method and leadframe for making the package
US7332375B1 (en) 1998-06-24 2008-02-19 Amkor Technology, Inc. Method of making an integrated circuit package
US7005326B1 (en) 1998-06-24 2006-02-28 Amkor Technology, Inc. Method of making an integrated circuit package
US7030474B1 (en) 1998-06-24 2006-04-18 Amkor Technology, Inc. Plastic integrated circuit package and method and leadframe for making the package
US7071541B1 (en) 1998-06-24 2006-07-04 Amkor Technology, Inc. Plastic integrated circuit package and method and leadframe for making the package
US7112474B1 (en) 1998-06-24 2006-09-26 Amkor Technology, Inc. Method of making an integrated circuit package
US6893900B1 (en) 1998-06-24 2005-05-17 Amkor Technology, Inc. Method of making an integrated circuit package
US6448633B1 (en) 1998-11-20 2002-09-10 Amkor Technology, Inc. Semiconductor package and method of making using leadframe having lead locks to secure leads to encapsulant
TW522536B (en) 1998-12-17 2003-03-01 Wen-Chiang Lin Bumpless flip chip assembly with strips-in-via and plating
SG82591A1 (en) 1998-12-17 2001-08-21 Eriston Technologies Pte Ltd Bumpless flip chip assembly with solder via
SG82590A1 (en) 1998-12-17 2001-08-21 Eriston Technologies Pte Ltd Bumpless flip chip assembly with strips and via-fill
KR100403142B1 (ko) 1999-10-15 2003-10-30 앰코 테크놀로지 코리아 주식회사 반도체패키지
KR100379089B1 (ko) * 1999-10-15 2003-04-08 앰코 테크놀로지 코리아 주식회사 리드프레임 및 이를 이용한 반도체패키지
KR20010037247A (ko) 1999-10-15 2001-05-07 마이클 디. 오브라이언 반도체패키지
US6580159B1 (en) 1999-11-05 2003-06-17 Amkor Technology, Inc. Integrated circuit device packages and substrates for making the packages
US6847103B1 (en) 1999-11-09 2005-01-25 Amkor Technology, Inc. Semiconductor package with exposed die pad and body-locking leadframe
US6639308B1 (en) 1999-12-16 2003-10-28 Amkor Technology, Inc. Near chip size semiconductor package
KR100421774B1 (ko) 1999-12-16 2004-03-10 앰코 테크놀로지 코리아 주식회사 반도체패키지 및 그 제조 방법
KR100583494B1 (ko) 2000-03-25 2006-05-24 앰코 테크놀로지 코리아 주식회사 반도체패키지
US7042068B2 (en) 2000-04-27 2006-05-09 Amkor Technology, Inc. Leadframe and semiconductor package made using the leadframe
US6402970B1 (en) 2000-08-22 2002-06-11 Charles W. C. Lin Method of making a support circuit for a semiconductor chip assembly
US6350633B1 (en) 2000-08-22 2002-02-26 Charles W. C. Lin Semiconductor chip assembly with simultaneously electroplated contact terminal and connection joint
US6562709B1 (en) 2000-08-22 2003-05-13 Charles W. C. Lin Semiconductor chip assembly with simultaneously electroplated contact terminal and connection joint
US6562657B1 (en) 2000-08-22 2003-05-13 Charles W. C. Lin Semiconductor chip assembly with simultaneously electrolessly plated contact terminal and connection joint
US6551861B1 (en) 2000-08-22 2003-04-22 Charles W. C. Lin Method of making a semiconductor chip assembly by joining the chip to a support circuit with an adhesive
US6660626B1 (en) 2000-08-22 2003-12-09 Charles W. C. Lin Semiconductor chip assembly with simultaneously electrolessly plated contact terminal and connection joint
US6403460B1 (en) 2000-08-22 2002-06-11 Charles W. C. Lin Method of making a semiconductor chip assembly
US6436734B1 (en) 2000-08-22 2002-08-20 Charles W. C. Lin Method of making a support circuit for a semiconductor chip assembly
US6511865B1 (en) 2000-09-20 2003-01-28 Charles W. C. Lin Method for forming a ball bond connection joint on a conductive trace and conductive pad in a semiconductor chip assembly
US6350632B1 (en) 2000-09-20 2002-02-26 Charles W. C. Lin Semiconductor chip assembly with ball bond connection joint
US6350386B1 (en) 2000-09-20 2002-02-26 Charles W. C. Lin Method of making a support circuit with a tapered through-hole for a semiconductor chip assembly
US6448108B1 (en) 2000-10-02 2002-09-10 Charles W. C. Lin Method of making a semiconductor chip assembly with a conductive trace subtractively formed before and after chip attachment
US6544813B1 (en) 2000-10-02 2003-04-08 Charles W. C. Lin Method of making a semiconductor chip assembly with a conductive trace subtractively formed before and after chip attachment
US6872591B1 (en) 2000-10-13 2005-03-29 Bridge Semiconductor Corporation Method of making a semiconductor chip assembly with a conductive trace and a substrate
US6949408B1 (en) 2000-10-13 2005-09-27 Bridge Semiconductor Corporation Method of connecting a conductive trace and an insulative base to a semiconductor chip using multiple etch steps
US6699780B1 (en) 2000-10-13 2004-03-02 Bridge Semiconductor Corporation Method of connecting a conductive trace to a semiconductor chip using plasma undercut etching
US6440835B1 (en) 2000-10-13 2002-08-27 Charles W. C. Lin Method of connecting a conductive trace to a semiconductor chip
US6576539B1 (en) 2000-10-13 2003-06-10 Charles W.C. Lin Semiconductor chip assembly with interlocked conductive trace
US7009297B1 (en) 2000-10-13 2006-03-07 Bridge Semiconductor Corporation Semiconductor chip assembly with embedded metal particle
US7414319B2 (en) * 2000-10-13 2008-08-19 Bridge Semiconductor Corporation Semiconductor chip assembly with metal containment wall and solder terminal
US7075186B1 (en) 2000-10-13 2006-07-11 Bridge Semiconductor Corporation Semiconductor chip assembly with interlocked contact terminal
US6492252B1 (en) 2000-10-13 2002-12-10 Bridge Semiconductor Corporation Method of connecting a bumped conductive trace to a semiconductor chip
US7190080B1 (en) 2000-10-13 2007-03-13 Bridge Semiconductor Corporation Semiconductor chip assembly with embedded metal pillar
US7071089B1 (en) 2000-10-13 2006-07-04 Bridge Semiconductor Corporation Method of making a semiconductor chip assembly with a carved bumped terminal
US6537851B1 (en) 2000-10-13 2003-03-25 Bridge Semiconductor Corporation Method of connecting a bumped compliant conductive trace to a semiconductor chip
US6876072B1 (en) 2000-10-13 2005-04-05 Bridge Semiconductor Corporation Semiconductor chip assembly with chip in substrate cavity
US7132741B1 (en) 2000-10-13 2006-11-07 Bridge Semiconductor Corporation Semiconductor chip assembly with carved bumped terminal
US7129575B1 (en) 2000-10-13 2006-10-31 Bridge Semiconductor Corporation Semiconductor chip assembly with bumped metal pillar
US6576493B1 (en) 2000-10-13 2003-06-10 Bridge Semiconductor Corporation Method of connecting a conductive trace and an insulative base to a semiconductor chip using multiple etch steps
US7262082B1 (en) 2000-10-13 2007-08-28 Bridge Semiconductor Corporation Method of making a three-dimensional stacked semiconductor package with a metal pillar and a conductive interconnect in an encapsulant aperture
US7094676B1 (en) 2000-10-13 2006-08-22 Bridge Semiconductor Corporation Semiconductor chip assembly with embedded metal pillar
US7129113B1 (en) 2000-10-13 2006-10-31 Bridge Semiconductor Corporation Method of making a three-dimensional stacked semiconductor package with a metal pillar in an encapsulant aperture
US6548393B1 (en) 2000-10-13 2003-04-15 Charles W. C. Lin Semiconductor chip assembly with hardened connection joint
US7319265B1 (en) 2000-10-13 2008-01-15 Bridge Semiconductor Corporation Semiconductor chip assembly with precision-formed metal pillar
US6740576B1 (en) 2000-10-13 2004-05-25 Bridge Semiconductor Corporation Method of making a contact terminal with a plated metal peripheral sidewall portion for a semiconductor chip assembly
US6908788B1 (en) 2000-10-13 2005-06-21 Bridge Semiconductor Corporation Method of connecting a conductive trace to a semiconductor chip using a metal base
US6673710B1 (en) 2000-10-13 2004-01-06 Bridge Semiconductor Corporation Method of connecting a conductive trace and an insulative base to a semiconductor chip
US6984576B1 (en) 2000-10-13 2006-01-10 Bridge Semiconductor Corporation Method of connecting an additively and subtractively formed conductive trace and an insulative base to a semiconductor chip
US7264991B1 (en) 2000-10-13 2007-09-04 Bridge Semiconductor Corporation Method of connecting a conductive trace to a semiconductor chip using conductive adhesive
US6667229B1 (en) 2000-10-13 2003-12-23 Bridge Semiconductor Corporation Method of connecting a bumped compliant conductive trace and an insulative base to a semiconductor chip
US6444489B1 (en) 2000-12-15 2002-09-03 Charles W. C. Lin Semiconductor chip assembly with bumped molded substrate
KR20020058209A (ko) 2000-12-29 2002-07-12 마이클 디. 오브라이언 반도체패키지
US6653170B1 (en) 2001-02-06 2003-11-25 Charles W. C. Lin Semiconductor chip assembly with elongated wire ball bonded to chip and electrolessly plated to support circuit
US6967395B1 (en) 2001-03-20 2005-11-22 Amkor Technology, Inc. Mounting for a package containing a chip
KR100369393B1 (ko) 2001-03-27 2003-02-05 앰코 테크놀로지 코리아 주식회사 리드프레임 및 이를 이용한 반도체패키지와 그 제조 방법
KR100393448B1 (ko) 2001-03-27 2003-08-02 앰코 테크놀로지 코리아 주식회사 반도체 패키지 및 그 제조 방법
US7045883B1 (en) 2001-04-04 2006-05-16 Amkor Technology, Inc. Thermally enhanced chip scale lead on chip semiconductor package and method of making same
US6597059B1 (en) 2001-04-04 2003-07-22 Amkor Technology, Inc. Thermally enhanced chip scale lead on chip semiconductor package
US7064009B1 (en) 2001-04-04 2006-06-20 Amkor Technology, Inc. Thermally enhanced chip scale lead on chip semiconductor package and method of making same
US7485952B1 (en) 2001-09-19 2009-02-03 Amkor Technology, Inc. Drop resistant bumpers for fully molded memory cards
US6900527B1 (en) 2001-09-19 2005-05-31 Amkor Technology, Inc. Lead-frame method and assembly for interconnecting circuits within a circuit module
US6630726B1 (en) 2001-11-07 2003-10-07 Amkor Technology, Inc. Power semiconductor package with strap
US6608366B1 (en) 2002-04-15 2003-08-19 Harry J. Fogelson Lead frame with plated end leads
US6818973B1 (en) 2002-09-09 2004-11-16 Amkor Technology, Inc. Exposed lead QFP package fabricated through the use of a partial saw process
US7361533B1 (en) 2002-11-08 2008-04-22 Amkor Technology, Inc. Stacked embedded leadframe
US7190062B1 (en) 2004-06-15 2007-03-13 Amkor Technology, Inc. Embedded leadframe semiconductor package
US6905914B1 (en) 2002-11-08 2005-06-14 Amkor Technology, Inc. Wafer level package and fabrication method
US7723210B2 (en) 2002-11-08 2010-05-25 Amkor Technology, Inc. Direct-write wafer level chip scale package
US6847099B1 (en) 2003-02-05 2005-01-25 Amkor Technology Inc. Offset etched corner leads for semiconductor package
US7001799B1 (en) 2003-03-13 2006-02-21 Amkor Technology, Inc. Method of making a leadframe for semiconductor devices
US6794740B1 (en) 2003-03-13 2004-09-21 Amkor Technology, Inc. Leadframe package for semiconductor devices
US6879034B1 (en) 2003-05-01 2005-04-12 Amkor Technology, Inc. Semiconductor package including low temperature co-fired ceramic substrate
US7008825B1 (en) 2003-05-27 2006-03-07 Amkor Technology, Inc. Leadframe strip having enhanced testability
US6897550B1 (en) 2003-06-11 2005-05-24 Amkor Technology, Inc. Fully-molded leadframe stand-off feature
US7245007B1 (en) 2003-09-18 2007-07-17 Amkor Technology, Inc. Exposed lead interposer leadframe package
US6921967B2 (en) 2003-09-24 2005-07-26 Amkor Technology, Inc. Reinforced die pad support structure
US7138707B1 (en) 2003-10-21 2006-11-21 Amkor Technology, Inc. Semiconductor package including leads and conductive posts for providing increased functionality
US7144517B1 (en) 2003-11-07 2006-12-05 Amkor Technology, Inc. Manufacturing method for leadframe and for semiconductor package using the leadframe
US7211879B1 (en) 2003-11-12 2007-05-01 Amkor Technology, Inc. Semiconductor package with chamfered corners and method of manufacturing the same
US7993983B1 (en) 2003-11-17 2011-08-09 Bridge Semiconductor Corporation Method of making a semiconductor chip assembly with chip and encapsulant grinding
US7425759B1 (en) 2003-11-20 2008-09-16 Bridge Semiconductor Corporation Semiconductor chip assembly with bumped terminal and filler
US7538415B1 (en) 2003-11-20 2009-05-26 Bridge Semiconductor Corporation Semiconductor chip assembly with bumped terminal, filler and insulative base
US7057268B1 (en) 2004-01-27 2006-06-06 Amkor Technology, Inc. Cavity case with clip/plug for use on multi-media card
US7091594B1 (en) 2004-01-28 2006-08-15 Amkor Technology, Inc. Leadframe type semiconductor package having reduced inductance and its manufacturing method
US7202554B1 (en) 2004-08-19 2007-04-10 Amkor Technology, Inc. Semiconductor package and its manufacturing method
US7761814B2 (en) 2004-09-13 2010-07-20 Microsoft Corporation Flick gesture
US7217991B1 (en) 2004-10-22 2007-05-15 Amkor Technology, Inc. Fan-in leadframe semiconductor package
US7750483B1 (en) 2004-11-10 2010-07-06 Bridge Semiconductor Corporation Semiconductor chip assembly with welded metal pillar and enlarged plated contact terminal
US7446419B1 (en) 2004-11-10 2008-11-04 Bridge Semiconductor Corporation Semiconductor chip assembly with welded metal pillar of stacked metal balls
US7268421B1 (en) 2004-11-10 2007-09-11 Bridge Semiconductor Corporation Semiconductor chip assembly with welded metal pillar that includes enlarged ball bond
US7507603B1 (en) 2005-12-02 2009-03-24 Amkor Technology, Inc. Etch singulated semiconductor package
US7572681B1 (en) 2005-12-08 2009-08-11 Amkor Technology, Inc. Embedded electronic component package
US7902660B1 (en) 2006-05-24 2011-03-08 Amkor Technology, Inc. Substrate for semiconductor device and manufacturing method thereof
US7968998B1 (en) 2006-06-21 2011-06-28 Amkor Technology, Inc. Side leaded, bottom exposed pad and bottom exposed lead fusion quad flat semiconductor package
JP2008078561A (ja) * 2006-09-25 2008-04-03 Toshiba Corp 半導体装置及びその製造方法
US7811863B1 (en) 2006-10-26 2010-10-12 Bridge Semiconductor Corporation Method of making a semiconductor chip assembly with metal pillar and encapsulant grinding and heat sink attachment
US7494843B1 (en) 2006-12-26 2009-02-24 Bridge Semiconductor Corporation Method of making a semiconductor chip assembly with thermal conductor and encapsulant grinding
US7687893B2 (en) 2006-12-27 2010-03-30 Amkor Technology, Inc. Semiconductor package having leadframe with exposed anchor pads
US7829990B1 (en) 2007-01-18 2010-11-09 Amkor Technology, Inc. Stackable semiconductor package including laminate interposer
US7982297B1 (en) 2007-03-06 2011-07-19 Amkor Technology, Inc. Stackable semiconductor package having partially exposed semiconductor die and method of fabricating the same
US7977774B2 (en) 2007-07-10 2011-07-12 Amkor Technology, Inc. Fusion quad flat semiconductor package
US7687899B1 (en) 2007-08-07 2010-03-30 Amkor Technology, Inc. Dual laminate package structure with embedded elements
US7777351B1 (en) 2007-10-01 2010-08-17 Amkor Technology, Inc. Thin stacked interposer package
US8089159B1 (en) 2007-10-03 2012-01-03 Amkor Technology, Inc. Semiconductor package with increased I/O density and method of making the same
US7847386B1 (en) 2007-11-05 2010-12-07 Amkor Technology, Inc. Reduced size stacked semiconductor package and method of making the same
US7956453B1 (en) 2008-01-16 2011-06-07 Amkor Technology, Inc. Semiconductor package with patterning layer and method of making same
US7723852B1 (en) 2008-01-21 2010-05-25 Amkor Technology, Inc. Stacked semiconductor package and method of making same
US8067821B1 (en) 2008-04-10 2011-11-29 Amkor Technology, Inc. Flat semiconductor package with half package molding
US7768135B1 (en) 2008-04-17 2010-08-03 Amkor Technology, Inc. Semiconductor package with fast power-up cycle and method of making same
US7808084B1 (en) 2008-05-06 2010-10-05 Amkor Technology, Inc. Semiconductor package with half-etched locking features
US8125064B1 (en) 2008-07-28 2012-02-28 Amkor Technology, Inc. Increased I/O semiconductor package and method of making same
US8184453B1 (en) 2008-07-31 2012-05-22 Amkor Technology, Inc. Increased capacity semiconductor package
US7847392B1 (en) 2008-09-30 2010-12-07 Amkor Technology, Inc. Semiconductor device including leadframe with increased I/O
US7989933B1 (en) 2008-10-06 2011-08-02 Amkor Technology, Inc. Increased I/O leadframe and semiconductor device including same
US8008758B1 (en) 2008-10-27 2011-08-30 Amkor Technology, Inc. Semiconductor device with increased I/O leadframe
US8089145B1 (en) 2008-11-17 2012-01-03 Amkor Technology, Inc. Semiconductor device including increased capacity leadframe
US8072050B1 (en) 2008-11-18 2011-12-06 Amkor Technology, Inc. Semiconductor device with increased I/O leadframe including passive device
US7875963B1 (en) 2008-11-21 2011-01-25 Amkor Technology, Inc. Semiconductor device including leadframe having power bars and increased I/O
US7982298B1 (en) 2008-12-03 2011-07-19 Amkor Technology, Inc. Package in package semiconductor device
US8680656B1 (en) 2009-01-05 2014-03-25 Amkor Technology, Inc. Leadframe structure for concentrated photovoltaic receiver package
US20170117214A1 (en) 2009-01-05 2017-04-27 Amkor Technology, Inc. Semiconductor device with through-mold via
US8058715B1 (en) 2009-01-09 2011-11-15 Amkor Technology, Inc. Package in package device for RF transceiver module
US8026589B1 (en) 2009-02-23 2011-09-27 Amkor Technology, Inc. Reduced profile stackable semiconductor package
US7960818B1 (en) 2009-03-04 2011-06-14 Amkor Technology, Inc. Conformal shield on punch QFN semiconductor package
US8575742B1 (en) 2009-04-06 2013-11-05 Amkor Technology, Inc. Semiconductor device with increased I/O leadframe including power bars
US8796561B1 (en) 2009-10-05 2014-08-05 Amkor Technology, Inc. Fan out build up substrate stackable package and method
US8937381B1 (en) 2009-12-03 2015-01-20 Amkor Technology, Inc. Thin stackable package and method
US9691734B1 (en) 2009-12-07 2017-06-27 Amkor Technology, Inc. Method of forming a plurality of electronic component packages
US8324511B1 (en) 2010-04-06 2012-12-04 Amkor Technology, Inc. Through via nub reveal method and structure
US8294276B1 (en) 2010-05-27 2012-10-23 Amkor Technology, Inc. Semiconductor device and fabricating method thereof
US8440554B1 (en) 2010-08-02 2013-05-14 Amkor Technology, Inc. Through via connected backside embedded circuit features structure and method
US8487445B1 (en) 2010-10-05 2013-07-16 Amkor Technology, Inc. Semiconductor device having through electrodes protruding from dielectric layer
US8791501B1 (en) 2010-12-03 2014-07-29 Amkor Technology, Inc. Integrated passive device structure and method
US8674485B1 (en) 2010-12-08 2014-03-18 Amkor Technology, Inc. Semiconductor device including leadframe with downsets
US8390130B1 (en) 2011-01-06 2013-03-05 Amkor Technology, Inc. Through via recessed reveal structure and method
TWI557183B (zh) 2015-12-16 2016-11-11 財團法人工業技術研究院 矽氧烷組成物、以及包含其之光電裝置
US8648450B1 (en) 2011-01-27 2014-02-11 Amkor Technology, Inc. Semiconductor device including leadframe with a combination of leads and lands
US8866278B1 (en) 2011-10-10 2014-10-21 Amkor Technology, Inc. Semiconductor device with increased I/O configuration
US8552548B1 (en) 2011-11-29 2013-10-08 Amkor Technology, Inc. Conductive pad on protruding through electrode semiconductor device
US9704725B1 (en) 2012-03-06 2017-07-11 Amkor Technology, Inc. Semiconductor device with leadframe configured to facilitate reduced burr formation
US9048298B1 (en) 2012-03-29 2015-06-02 Amkor Technology, Inc. Backside warpage control structure and fabrication method
US9129943B1 (en) 2012-03-29 2015-09-08 Amkor Technology, Inc. Embedded component package and fabrication method
JP2013138511A (ja) * 2013-03-27 2013-07-11 Taiyo Yuden Co Ltd 弾性波装置
KR101486790B1 (ko) 2013-05-02 2015-01-28 앰코 테크놀로지 코리아 주식회사 강성보강부를 갖는 마이크로 리드프레임
US20150075849A1 (en) * 2013-09-17 2015-03-19 Jia Lin Yap Semiconductor device and lead frame with interposer
KR101563911B1 (ko) 2013-10-24 2015-10-28 앰코 테크놀로지 코리아 주식회사 반도체 패키지
US9673122B2 (en) 2014-05-02 2017-06-06 Amkor Technology, Inc. Micro lead frame structure having reinforcing portions and method
CN108054108B (zh) * 2017-12-19 2019-10-25 哈尔滨工业大学 一种基于快速局域电沉积的引线键合方法
CN107946201B (zh) * 2017-12-19 2020-03-31 哈尔滨工业大学 一种基于局域电沉积的引线键合焊点结构的制备方法
KR102646637B1 (ko) * 2022-12-07 2024-03-12 주식회사바텍 엑스선 소스용 전압변환장치

Family Cites Families (29)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS53103659U (enExample) * 1977-01-25 1978-08-21
US4176443A (en) * 1977-03-08 1979-12-04 Sgs-Ates Componenti Elettronici S.P.A. Method of connecting semiconductor structure to external circuits
JPS5524479A (en) * 1978-08-09 1980-02-21 Nec Corp Semiconductor
JPS5750056A (en) * 1980-09-09 1982-03-24 Toshiba Corp Information processor having branch trace function
JPS57143848A (en) * 1981-02-27 1982-09-06 Nec Corp Semiconductor device
US4496965A (en) * 1981-05-18 1985-01-29 Texas Instruments Incorporated Stacked interdigitated lead frame assembly
JPS6092636A (ja) * 1983-10-27 1985-05-24 Toshiba Corp 半導体装置の製造方法
JPS60115247A (ja) * 1983-11-28 1985-06-21 Fujitsu Ltd 半導体装置
JPS61208245A (ja) * 1985-03-13 1986-09-16 Kyushu Hitachi Maxell Ltd 半導体装置のリ−ドフレ−ム製造方法
JPS62108534A (ja) * 1985-11-06 1987-05-19 Nec Corp 半導体装置
US4977441A (en) * 1985-12-25 1990-12-11 Hitachi, Ltd. Semiconductor device and tape carrier
JPH0682705B2 (ja) * 1986-03-10 1994-10-19 株式会社東芝 半導体装置の実装方法
JPS62296431A (ja) * 1986-06-17 1987-12-23 Alps Electric Co Ltd フリツプチツプの接続方法
JPS6373644A (ja) * 1986-09-17 1988-04-04 Fujitsu Ltd 半導体装置の製造方法
US4885630A (en) * 1986-10-27 1989-12-05 Electric Power Research Institute High power multi-layer semiconductive switching device having multiple parallel contacts with improved forward voltage drop
US4839713A (en) * 1987-02-20 1989-06-13 Mitsubishi Denki Kabushiki Kaisha Package structure for semiconductor device
JP2623578B2 (ja) * 1987-07-14 1997-06-25 日本電気株式会社 半導体集積回路装置
JPS6473734A (en) * 1987-09-16 1989-03-20 Nec Corp Tape carrier
JPH01207938A (ja) * 1988-02-15 1989-08-21 Nec Corp 半導体装置
JPH01276750A (ja) * 1988-04-28 1989-11-07 Matsushita Electric Ind Co Ltd 半導体装置
JPH0233929A (ja) * 1988-07-23 1990-02-05 Nec Corp 半導体装置
JPH0266953A (ja) * 1988-08-31 1990-03-07 Nec Corp 半導体素子の実装構造およびその製造方法
US5016082A (en) * 1988-09-16 1991-05-14 Delco Electronics Corporation Integrated circuit interconnect design
JPH0287538A (ja) * 1988-09-26 1990-03-28 Hitachi Ltd テープキャリアモジュール
JPH02119252A (ja) * 1988-10-28 1990-05-07 Nec Corp 混成集積回路装置
JP2651608B2 (ja) * 1988-10-28 1997-09-10 イビデン株式会社 電子部品搭載用基板
US4922322A (en) * 1989-02-09 1990-05-01 National Semiconductor Corporation Bump structure for reflow bonding of IC devices
JPH02208957A (ja) * 1989-02-09 1990-08-20 Toshiba Corp 電子機器用封着材料
US4948645A (en) * 1989-08-01 1990-08-14 Rogers Corporation Tape automated bonding and method of making the same

Also Published As

Publication number Publication date
KR920001701A (ko) 1992-01-30
JPH0437149A (ja) 1992-02-07
US5654584A (en) 1997-08-05
DE69133497D1 (de) 2006-01-19
DE69132685T2 (de) 2002-06-13
EP1020903B1 (en) 2005-12-14
DE69132685D1 (de) 2001-09-20
EP1020903A1 (en) 2000-07-19
KR970000972B1 (ko) 1997-01-21
DE69133497T2 (de) 2006-08-24
EP0459493B1 (en) 2001-08-16
EP0459493A2 (en) 1991-12-04
EP0459493A3 (enExample) 1994-02-23

Similar Documents

Publication Publication Date Title
JP2540652B2 (ja) 半導体装置
US5556810A (en) Method for manufacturing a semiconductor device wherein a semiconductor chip is connected to a lead frame by metal plating
US6650013B2 (en) Method of manufacturing wire bonded microelectronic device assemblies
US6541848B2 (en) Semiconductor device including stud bumps as external connection terminals
US6864166B1 (en) Method of manufacturing wire bonded microelectronic device assemblies
JP2002164437A (ja) ボンディングおよび電流配分を分散したパワー集積回路および方法
JP2004343030A (ja) 配線回路基板とその製造方法とその配線回路基板を備えた回路モジュール
JPH05109813A (ja) 半導体装置
US20250157898A1 (en) Flip chip quad flat no leads (qfn) package
JP2777345B2 (ja) 半導体装置
JP2005183868A (ja) 半導体装置およびその実装構造
KR970005715B1 (ko) 반도체 장치 및 그 제조 방법
JP2736247B2 (ja) 半導体装置の製造方法
JP2974840B2 (ja) 半導体素子の実装方法
JP2721580B2 (ja) 半導体装置の製造方法
JP3889311B2 (ja) プリント配線板
JP2652222B2 (ja) 電子部品搭載用基板
JP2918087B2 (ja) 半導体チップ搭載用多層配線基板
JP2000243874A (ja) 半導体装置
JP3951869B2 (ja) 実装基板およびその製造方法、並びに電子回路装置およびその製造方法
JP3053935B2 (ja) 半導体装置及びその製造方法
JPH0786281A (ja) 半導体装置および半導体装置の製造方法
JPS62199022A (ja) 半導体装置の実装具
JP4575928B2 (ja) 半導体装置
JP4520478B2 (ja) 半導体装置

Legal Events

Date Code Title Description
LAPS Cancellation because of no payment of annual fees