JP2023078199A - 搬送システム、露光装置、及び搬送方法 - Google Patents
搬送システム、露光装置、及び搬送方法 Download PDFInfo
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- 238000000034 method Methods 0.000 title claims description 29
- 238000005259 measurement Methods 0.000 claims abstract description 89
- 238000001514 detection method Methods 0.000 abstract description 64
- 235000012431 wafers Nutrition 0.000 description 381
- 239000007788 liquid Substances 0.000 description 42
- 230000003287 optical effect Effects 0.000 description 36
- 238000005286 illumination Methods 0.000 description 30
- 238000012546 transfer Methods 0.000 description 24
- 238000010586 diagram Methods 0.000 description 18
- 230000002093 peripheral effect Effects 0.000 description 15
- 230000032258 transport Effects 0.000 description 15
- 238000007654 immersion Methods 0.000 description 14
- 238000012545 processing Methods 0.000 description 13
- 238000003384 imaging method Methods 0.000 description 10
- 238000004519 manufacturing process Methods 0.000 description 10
- 238000011084 recovery Methods 0.000 description 10
- 239000012530 fluid Substances 0.000 description 9
- 238000006073 displacement reaction Methods 0.000 description 8
- 239000000463 material Substances 0.000 description 7
- 239000005871 repellent Substances 0.000 description 7
- 239000011521 glass Substances 0.000 description 5
- 239000004065 semiconductor Substances 0.000 description 5
- 239000010408 film Substances 0.000 description 4
- 230000001678 irradiating effect Effects 0.000 description 4
- 230000008569 process Effects 0.000 description 4
- 230000004043 responsiveness Effects 0.000 description 4
- 239000000758 substrate Substances 0.000 description 4
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 4
- 239000000919 ceramic Substances 0.000 description 3
- 238000005530 etching Methods 0.000 description 3
- 239000004973 liquid crystal related substance Substances 0.000 description 3
- 238000001459 lithography Methods 0.000 description 3
- 230000009467 reduction Effects 0.000 description 3
- 229910052691 Erbium Inorganic materials 0.000 description 2
- 230000004075 alteration Effects 0.000 description 2
- 238000005452 bending Methods 0.000 description 2
- 230000007423 decrease Effects 0.000 description 2
- 238000003708 edge detection Methods 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 238000010894 electron beam technology Methods 0.000 description 2
- UYAHIZSMUZPPFV-UHFFFAOYSA-N erbium Chemical compound [Er] UYAHIZSMUZPPFV-UHFFFAOYSA-N 0.000 description 2
- 239000000835 fiber Substances 0.000 description 2
- 230000006870 function Effects 0.000 description 2
- 239000011159 matrix material Substances 0.000 description 2
- 238000012986 modification Methods 0.000 description 2
- 230000004048 modification Effects 0.000 description 2
- 239000002245 particle Substances 0.000 description 2
- 239000004925 Acrylic resin Substances 0.000 description 1
- 229920000178 Acrylic resin Polymers 0.000 description 1
- 229910018072 Al 2 O 3 Inorganic materials 0.000 description 1
- 238000000018 DNA microarray Methods 0.000 description 1
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 1
- 239000004809 Teflon Substances 0.000 description 1
- 229920006362 Teflon® Polymers 0.000 description 1
- 229910052769 Ytterbium Inorganic materials 0.000 description 1
- 239000006094 Zerodur Substances 0.000 description 1
- 230000001133 acceleration Effects 0.000 description 1
- 230000002411 adverse Effects 0.000 description 1
- 230000003749 cleanliness Effects 0.000 description 1
- 239000000470 constituent Substances 0.000 description 1
- 238000012937 correction Methods 0.000 description 1
- 239000013078 crystal Substances 0.000 description 1
- 238000002716 delivery method Methods 0.000 description 1
- 238000013461 design Methods 0.000 description 1
- 239000000428 dust Substances 0.000 description 1
- 238000002474 experimental method Methods 0.000 description 1
- 238000007667 floating Methods 0.000 description 1
- 230000004907 flux Effects 0.000 description 1
- 238000007689 inspection Methods 0.000 description 1
- 238000010884 ion-beam technique Methods 0.000 description 1
- 238000005339 levitation Methods 0.000 description 1
- 239000000696 magnetic material Substances 0.000 description 1
- 230000000873 masking effect Effects 0.000 description 1
- 238000000691 measurement method Methods 0.000 description 1
- QSHDDOUJBYECFT-UHFFFAOYSA-N mercury Chemical compound [Hg] QSHDDOUJBYECFT-UHFFFAOYSA-N 0.000 description 1
- 229910052753 mercury Inorganic materials 0.000 description 1
- 238000012858 packaging process Methods 0.000 description 1
- -1 polytetrafluoroethylene Polymers 0.000 description 1
- 229920001343 polytetrafluoroethylene Polymers 0.000 description 1
- 239000004810 polytetrafluoroethylene Substances 0.000 description 1
- 238000003672 processing method Methods 0.000 description 1
- 230000000630 rising effect Effects 0.000 description 1
- 229910052710 silicon Inorganic materials 0.000 description 1
- 239000010703 silicon Substances 0.000 description 1
- 239000002210 silicon-based material Substances 0.000 description 1
- 229920002050 silicone resin Polymers 0.000 description 1
- 239000007787 solid Substances 0.000 description 1
- 238000001179 sorption measurement Methods 0.000 description 1
- 239000010409 thin film Substances 0.000 description 1
- NAWDYIZEMPQZHO-UHFFFAOYSA-N ytterbium Chemical compound [Yb] NAWDYIZEMPQZHO-UHFFFAOYSA-N 0.000 description 1
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B25—HAND TOOLS; PORTABLE POWER-DRIVEN TOOLS; MANIPULATORS
- B25J—MANIPULATORS; CHAMBERS PROVIDED WITH MANIPULATION DEVICES
- B25J11/00—Manipulators not otherwise provided for
- B25J11/0095—Manipulators transporting wafers
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B25—HAND TOOLS; PORTABLE POWER-DRIVEN TOOLS; MANIPULATORS
- B25J—MANIPULATORS; CHAMBERS PROVIDED WITH MANIPULATION DEVICES
- B25J15/00—Gripping heads and other end effectors
- B25J15/06—Gripping heads and other end effectors with vacuum or magnetic holding means
- B25J15/0616—Gripping heads and other end effectors with vacuum or magnetic holding means with vacuum
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- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
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- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/70—Microphotolithographic exposure; Apparatus therefor
- G03F7/70691—Handling of masks or workpieces
- G03F7/70716—Stages
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- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
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- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/70—Microphotolithographic exposure; Apparatus therefor
- G03F7/70691—Handling of masks or workpieces
- G03F7/70733—Handling masks and workpieces, e.g. exchange of workpiece or mask, transport of workpiece or mask
- G03F7/7075—Handling workpieces outside exposure position, e.g. SMIF box
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
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- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/70—Microphotolithographic exposure; Apparatus therefor
- G03F7/70691—Handling of masks or workpieces
- G03F7/70783—Handling stress or warp of chucks, masks or workpieces, e.g. to compensate for imaging errors or considerations related to warpage of masks or workpieces due to their own weight
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67242—Apparatus for monitoring, sorting or marking
- H01L21/67259—Position monitoring, e.g. misposition detection or presence detection
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67242—Apparatus for monitoring, sorting or marking
- H01L21/67288—Monitoring of warpage, curvature, damage, defects or the like
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/68—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for positioning, orientation or alignment
- H01L21/681—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for positioning, orientation or alignment using optical controlling means
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/6838—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping with gripping and holding devices using a vacuum; Bernoulli devices
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
- H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
- H01L21/68742—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support characterised by a lifting arrangement, e.g. lift pins
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- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
- H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
- H01L21/68778—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support characterised by supporting substrates others than wafers, e.g. chips
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- Condensed Matter Physics & Semiconductors (AREA)
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Abstract
Description
面内で2次元移動するウエハステージWST及び計測ステージMSTを含むステージ装置50と、不図示の搬出ユニット及び後述するウエハ支持部材125とともにウエハWを搬送する搬送システム120(図6参照)を構成する搬入ユニット121と、これらの制御系等とを備えている。ここで、ベース盤12は、床面上に防振装置(図示省略)によってほぼ水平に(XY平面に平行に)支持されている。ベース盤12は、平板状の外形を有する部材から成る。また、ベース盤12の内部には、平面モータ(後述)の固定子を構成する、XY二次元方向を行方向、列方向としてマトリックス状に配置された複数のコイル17を含むコイルユニットが、収容されている。なお、図1において、露光ステーションには、ウエハステージWSTが位置しており、ウエハステージWST(より詳細には後述するウエハテーブルWTB)上にウエハWが保持されている。また、露光ステーションの近傍に計測ステージMSTが位置している。
上に液浸領域を保持しておき、計測ステージとの交換でウエハステージWSTが投影ユニットPUの直下に配置されるとき、計測ステージMST上の液浸領域がウエハステージWST上に移動される。
Claims (18)
- 物体を物体載置部が設けられた物体載置部材に搬送する搬送システムであって、
前記物体との間に気体流を形成して前記物体に対する吸引力を発生させる吸引部材と、
前記吸引部材により非接触で保持された前記物体の一部と接触する接触部材と、
を備え、
前記接触部材は、前記物体載置部に対して上下方向に相対移動可能な支持部材が、前記物体を支持したとき、前記物体の一部との接触が解除される搬送システム。 - 前記接触部材は、前記物体の下面に対向する第1位置と前記物体の下面に対向しない第2位置との間で移動可能である
請求項1に記載の搬送システム。 - 前記接触部材は、前記上下方向に移動可能である
請求項1又は2に記載の搬送システム。 - 一軸方向に延びる軸部と、
前記軸部を介して、前記接触部材を前記一軸回りに回転駆動する回転駆動装置と、
を更に備える
請求項1~3のいずれか一項に記載の搬送システム。 - 前記回転駆動装置は、前記接触部材を前記一軸回りに回転駆動することにより、前記接触部材を、前記物体の下面に対向する第1位置と前記物体の下面に対向しない第2位置との間で移動する
請求項4に記載の搬送システム。 - 前記物体は板状であって、
前記軸部は、前記吸引部材により非接触で保持された状態にある前記物体の厚さ方向に沿って延びている
請求項4または5に記載の搬送システム。 - 前記接触部材に設けられた第1反射部と、
前記上下方向と交差する所定平面内での前記物体の位置に関する情報を計測する計測系と
を更に備え、
前記接触部材が前記物体の下面に対向する第1位置にあるとき、前記計測系の計測光が前記第1反射部によって反射される
請求項1~6のいずれか一項に記載の搬送システム。 - 前記物体載置部材には、前記接触部材が前記物体の下面に対向しない第2位置にあるとき、前記上下方向と交差する所定平面内での前記物体の位置に関する情報を計測する計測系の計測光を反射する第2反射部が設けられている
請求項1~7のいずれか一項に記載の搬送システム。 - 前記第2反射部は、前記物体が前記物体載置部に載置されているときに、前記計測系の計測光を反射する
請求項8に記載の搬送システム。 - 前記吸引部材により非接触で保持されている前記物体の形状に関する情報を求める計測装置と、
前記吸引部材と前記物体載置部とを前記上下方向に相対移動させる駆動装置と、
前記計測装置で求められた前記情報を用いて、前記物体が所定の形状で前記物体載置部に載置されるように前記吸引部材と前記駆動装置との少なくとも一方を制御する制御装置と、
を更に備える請求項1~9のいずれか一項に記載の搬送システム。 - 前記制御装置は、前記計測装置で求められた前記情報を用いて、前記吸引部材の前記上下方向の移動と前記支持部材の前記上下方向の移動との少なくとも一方を制御する
請求項10に記載の搬送システム。 - 前記支持部材は前記物体載置部に対して前記上下方向に相対移動することにより前記物体を前記物体載置部に載置可能である
請求項1~11のいずれか一項に記載の搬送システム。 - 前記接触部材は、前記物体の下面に接触可能である
請求項1~12のいずれか一項に記載の搬送システム。 - 前記接触部材は、前記支持部材が前記物体に下面に接触した後、前記物体の一部との接触が解除される
請求項1~13のいずれか一項に記載の搬送システム。 - 板状の物体上にパターンを形成する露光装置であって、
請求項1~14のいずれか一項に記載の搬送システムと、
前記搬送システムにより前記物体載置部材に搬送された前記板状の物体をエネルギビームで露光して、前記パターンを形成するパターン生成装置と、を備える露光装置。 - 物体を物体載置部が設けられた物体載置部材に搬送する搬送方法であって、
前記物体との間に気体流を形成して前記物体に対する吸引力を生じさせ、前記物体を非接触で保持することと、
非接触で保持された前記物体の一部に接触部材を接触させることと、
前記物体載置部に対して上下方向に相対移動可能な支持部材で前記物体を下方から支持させることと、
前記物体が前記支持部材で支持されたとき、前記物体の一部と前記接触部材との接触を解除する搬送方法。 - 前記物体が前記支持部材で支持されたとき、前記接触部材を前記物体の一部から離間させ、前記物体の一部に対向する第1位置から前記物体の一部に対向しない第2位置に移動させる
請求項16に記載の搬送方法。 - 非接触で保持されている前記物体の形状に関する情報を求め、
前記物体に関する情報を用いて、前記物体が所定の形状で前記物体載置部に載置されるように、前記物体の形状を調整する
請求項16または17に記載の搬送方法。
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Application Number | Priority Date | Filing Date | Title |
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US201261731892P | 2012-11-30 | 2012-11-30 | |
US61/731,892 | 2012-11-30 | ||
JP2018107671A JP6607286B2 (ja) | 2012-11-30 | 2018-06-05 | 搬送システム、露光装置、搬送方法、露光方法及びデバイス製造方法 |
JP2019189302A JP6981458B2 (ja) | 2012-11-30 | 2019-10-16 | 搬送システム、露光装置、搬送方法、露光方法及びデバイス製造方法 |
JP2021186320A JP7243797B2 (ja) | 2012-11-30 | 2021-11-16 | 搬送システム、露光装置、及び搬送方法 |
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US (6) | US9821469B2 (ja) |
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JP (5) | JP6358564B2 (ja) |
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