JP7267111B2 - 位置決め機構及び位置決め方法 - Google Patents
位置決め機構及び位置決め方法 Download PDFInfo
- Publication number
- JP7267111B2 JP7267111B2 JP2019103182A JP2019103182A JP7267111B2 JP 7267111 B2 JP7267111 B2 JP 7267111B2 JP 2019103182 A JP2019103182 A JP 2019103182A JP 2019103182 A JP2019103182 A JP 2019103182A JP 7267111 B2 JP7267111 B2 JP 7267111B2
- Authority
- JP
- Japan
- Prior art keywords
- shell
- mounting table
- positioning
- probe card
- wafer
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
Images
Classifications
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
- G01R31/28—Testing of electronic circuits, e.g. by signal tracer
- G01R31/2851—Testing of integrated circuits [IC]
- G01R31/2893—Handling, conveying or loading, e.g. belts, boats, vacuum fingers
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
- H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
- H01L21/68742—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support characterised by a lifting arrangement, e.g. lift pins
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
- G01R31/28—Testing of electronic circuits, e.g. by signal tracer
- G01R31/2851—Testing of integrated circuits [IC]
- G01R31/2855—Environmental, reliability or burn-in testing
- G01R31/286—External aspects, e.g. related to chambers, contacting devices or handlers
- G01R31/2865—Holding devices, e.g. chucks; Handlers or transport devices
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
- G01R31/28—Testing of electronic circuits, e.g. by signal tracer
- G01R31/2851—Testing of integrated circuits [IC]
- G01R31/2886—Features relating to contacting the IC under test, e.g. probe heads; chucks
- G01R31/2887—Features relating to contacting the IC under test, e.g. probe heads; chucks involving moving the probe head or the IC under test; docking stations
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
- G01R1/02—General constructional details
- G01R1/04—Housings; Supporting members; Arrangements of terminals
- G01R1/0408—Test fixtures or contact fields; Connectors or connecting adaptors; Test clips; Test sockets
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
- G01R1/02—General constructional details
- G01R1/04—Housings; Supporting members; Arrangements of terminals
- G01R1/0408—Test fixtures or contact fields; Connectors or connecting adaptors; Test clips; Test sockets
- G01R1/0491—Test fixtures or contact fields; Connectors or connecting adaptors; Test clips; Test sockets for testing integrated circuits on wafers, e.g. wafer-level test cartridge
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
- G01R31/28—Testing of electronic circuits, e.g. by signal tracer
- G01R31/2851—Testing of integrated circuits [IC]
- G01R31/2855—Environmental, reliability or burn-in testing
- G01R31/286—External aspects, e.g. related to chambers, contacting devices or handlers
- G01R31/2865—Holding devices, e.g. chucks; Handlers or transport devices
- G01R31/2867—Handlers or transport devices, e.g. loaders, carriers, trays
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
- G01R31/28—Testing of electronic circuits, e.g. by signal tracer
- G01R31/2851—Testing of integrated circuits [IC]
- G01R31/2886—Features relating to contacting the IC under test, e.g. probe heads; chucks
- G01R31/2891—Features relating to contacting the IC under test, e.g. probe heads; chucks related to sensing or controlling of force, position, temperature
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/68—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for positioning, orientation or alignment
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/6838—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping with gripping and holding devices using a vacuum; Bernoulli devices
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
- H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
- H01L21/68785—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support characterised by the mechanical construction of the susceptor, stage or support
Landscapes
- Engineering & Computer Science (AREA)
- General Physics & Mathematics (AREA)
- Physics & Mathematics (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Computer Hardware Design (AREA)
- Manufacturing & Machinery (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Power Engineering (AREA)
- General Engineering & Computer Science (AREA)
- Environmental & Geological Engineering (AREA)
- Testing Or Measuring Of Semiconductors Or The Like (AREA)
- Testing Of Individual Semiconductor Devices (AREA)
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
Description
図3~図5を参照して、シェル10の載置台13とホルダ14との水平方向の位置ずれを防止する機構(以下「位置ずれ防止機構」という。)について説明する。図3及び図4は、それぞれ位置ずれ防止機構を説明するための断面図及び上面図である。図5は、図3の一部を拡大して示す図である。
図6を参照して、シェル10の内部を外部に比べて低圧にして、シェル10の内部のリークを防止する機構(以下「リーク防止機構」という。)の一例について説明する。図6は、シェル10におけるリーク防止機構の一例を示す図である。
図9及び図10を参照して、シェル10を形成する際にウエハ11とプローブカード12との位置決めを行う機構(以下「位置決め機構」という。)について説明する。
図11を参照して、シェル10を搬送する際にウエハ11の温度を調整する機構(以下、「第1の温度調整機構」という。)として機能するカセットユニット220について説明する。図11は、第1の温度調整機構を説明するための図である。
図14を参照して、オーバドライブ量を調整する機構(以下「オーバドライブ量調整機構」)の一例について説明する。図14は、オーバドライブ量調整機構の一例を示す図である。
図16及び図17を参照して、検査装置110のメンテナンス時期の判断を支援(アシスト)する機能(以下「メンテナンス支援機能」という。)について説明する。以下に説明するメンテナンス支援機能は、例えば検査装置110のコントローラ116によって実行される。ただし、該メンテナンス支援機能は、例えば検査システム1の管理装置300によって実行されてもよい。図16は、メンテナンス支援機能の一例を示すフローチャートである。
12 プローブカード
12b プローブ
13 載置台
14 ホルダ
15 プレート
215a アライナ
215p 昇降ピン
Claims (7)
- 基板を載置する載置台と、
前記載置台を下方から保持する保持部と、
前記載置台を前記保持部に対して昇降させる昇降ピンと、
前記保持部を下方から支持し、前記昇降ピンに対する前記保持部の相対位置を変化させるアライナと、
を有し、
前記保持部及び前記アライナには、前記昇降ピンが貫通可能な貫通穴が設けられている、
位置決め機構。 - 前記保持部に対して予め定められた位置に設けられ、前記基板に形成された複数のデバイスの電極と電気的に接触可能な接触部を含む配線部材を有する、
請求項1に記載の位置決め機構。 - 前記配線部材は、前記複数のデバイスの電極に接触させるプローブを有するプローブカードである、
請求項2に記載の位置決め機構。 - 前記保持部に対して前記配線部材の位置を常に一定に保持する第2の保持部を有する、
請求項2又は3に記載の位置決め機構。 - 前記載置台は、真空チャックである、
請求項1乃至4のいずれか一項に記載の位置決め機構。 - 基板が載置された載置台を保持部に対して位置決めする位置決め方法であって、
前記保持部の上に前記基板が載置された前記載置台を載置するステップと、
前記保持部の上に載置された前記載置台をアライナにより下方から支持するステップと、
前記保持部から前記載置台を上方に離間させるステップと、
前記保持部から前記載置台を上方に離間させた状態で前記アライナを水平方向に移動させて前記保持部に対する前記載置台の相対位置を変化させるステップと、
を有する、
位置決め方法。 - 前記相対位置を変化させるステップの後に実行され、前記載置台を下方に移動させて前記保持部の上に載置するステップと、
前記保持部に対して予め定められた位置に、前記基板に形成された複数のデバイスの電極と電気的に接触可能な接触部を含む配線部材を配置するステップと、
を有する、
請求項6に記載の位置決め方法。
Priority Applications (4)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2019103182A JP7267111B2 (ja) | 2019-05-31 | 2019-05-31 | 位置決め機構及び位置決め方法 |
US15/930,601 US11131708B2 (en) | 2019-05-31 | 2020-05-13 | Aligning mechanism and aligning method |
KR1020200059802A KR102422861B1 (ko) | 2019-05-31 | 2020-05-19 | 위치 결정 기구 및 위치 결정 방법 |
CN202010434554.8A CN112018023B (zh) | 2019-05-31 | 2020-05-21 | 定位装置和定位方法 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2019103182A JP7267111B2 (ja) | 2019-05-31 | 2019-05-31 | 位置決め機構及び位置決め方法 |
Publications (2)
Publication Number | Publication Date |
---|---|
JP2020198354A JP2020198354A (ja) | 2020-12-10 |
JP7267111B2 true JP7267111B2 (ja) | 2023-05-01 |
Family
ID=73506598
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2019103182A Active JP7267111B2 (ja) | 2019-05-31 | 2019-05-31 | 位置決め機構及び位置決め方法 |
Country Status (4)
Country | Link |
---|---|
US (1) | US11131708B2 (ja) |
JP (1) | JP7267111B2 (ja) |
KR (1) | KR102422861B1 (ja) |
CN (1) | CN112018023B (ja) |
Families Citing this family (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR102243839B1 (ko) * | 2018-07-13 | 2021-04-22 | 도쿄엘렉트론가부시키가이샤 | 중간 접속 부재, 및 검사 장치 |
TWI745197B (zh) * | 2020-12-18 | 2021-11-01 | 鴻勁精密股份有限公司 | 定位機構、作業機、測試機及測試設備 |
CN112986801B (zh) * | 2021-03-09 | 2021-10-08 | 深圳市东方宇之光科技股份有限公司 | 一种飞针测试机用飞针座快速固定机构 |
JP7456065B2 (ja) | 2021-03-23 | 2024-03-26 | キオクシア株式会社 | ストレージシステム |
JP2024005061A (ja) * | 2022-06-29 | 2024-01-17 | 東京エレクトロン株式会社 | 検査方法 |
Citations (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2018206948A (ja) | 2017-06-05 | 2018-12-27 | 東京エレクトロン株式会社 | 検査装置、検査システム、および位置合わせ方法 |
Family Cites Families (20)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR100522975B1 (ko) * | 2004-04-17 | 2005-10-19 | (주)지오니스 | 자동정렬수단이 구비된 반도체 웨이퍼 분석용 프로버 시스템 |
WO2007088927A1 (ja) * | 2006-02-01 | 2007-08-09 | Olympus Corporation | 基板交換装置及び基板処理装置並びに基板検査装置 |
JP2008103544A (ja) * | 2006-10-19 | 2008-05-01 | Yaskawa Electric Corp | アライナー装置 |
JP4783762B2 (ja) * | 2007-08-31 | 2011-09-28 | 東京エレクトロン株式会社 | 基板載置台および基板処理装置 |
JP4729056B2 (ja) * | 2008-02-01 | 2011-07-20 | 東京エレクトロン株式会社 | 真空プローブ装置のための検査ステージ |
JP5322822B2 (ja) * | 2009-07-27 | 2013-10-23 | 株式会社日本マイクロニクス | 半導体検査用ウエハプローバ及び検査方法 |
JP5524550B2 (ja) * | 2009-09-15 | 2014-06-18 | 株式会社ニコン | 基板接合装置、基板接合方法およびデバイスの製造方法 |
TW201133700A (en) * | 2009-12-18 | 2011-10-01 | Nikon Corp | Pair of substrate holders, method for manufacturing device, separation device, method for separating substrates, substrate holder, and device for positioning substrate |
JP2011187539A (ja) * | 2010-03-05 | 2011-09-22 | Sinfonia Technology Co Ltd | ガス注入装置、ガス排出装置、ガス注入方法及びガス排出方法 |
WO2011161760A1 (ja) * | 2010-06-22 | 2011-12-29 | 株式会社アルバック | アラインメント機能付き基板載置装置と、その基板載置装置を有する成膜装置 |
TW201201316A (en) * | 2010-06-25 | 2012-01-01 | Ulvac Inc | Substrate mounting apparatus with alignment function and film-forming apparatus having the same |
JP5675239B2 (ja) * | 2010-09-15 | 2015-02-25 | 東京エレクトロン株式会社 | ウエハ検査用インターフェース及びウエハ検査装置 |
KR101889738B1 (ko) * | 2012-09-07 | 2018-09-20 | 세메스 주식회사 | 기판 처리 장치 및 방법 |
CN104956465B (zh) * | 2012-11-30 | 2018-05-29 | 株式会社尼康 | 搬送系统、曝光装置、搬送方法、曝光方法及器件制造方法、以及吸引装置 |
WO2016024346A1 (ja) * | 2014-08-13 | 2016-02-18 | 株式会社東京精密 | プローバ及びプローブ検査方法 |
JP6333112B2 (ja) | 2014-08-20 | 2018-05-30 | 東京エレクトロン株式会社 | ウエハ検査装置 |
CN204989244U (zh) * | 2015-08-21 | 2016-01-20 | 住友电气工业株式会社 | 检查装置 |
JP6515007B2 (ja) * | 2015-09-30 | 2019-05-15 | 東京エレクトロン株式会社 | ウエハ検査方法及びウエハ検査装置 |
JP6803542B2 (ja) * | 2016-10-18 | 2020-12-23 | 株式会社東京精密 | プローバ及びプローブ検査方法 |
KR20190047216A (ko) * | 2017-10-27 | 2019-05-08 | 주식회사 이오테크닉스 | 웨이퍼 정렬 장치 및 웨이퍼 정렬 방법 |
-
2019
- 2019-05-31 JP JP2019103182A patent/JP7267111B2/ja active Active
-
2020
- 2020-05-13 US US15/930,601 patent/US11131708B2/en active Active
- 2020-05-19 KR KR1020200059802A patent/KR102422861B1/ko active IP Right Grant
- 2020-05-21 CN CN202010434554.8A patent/CN112018023B/zh active Active
Patent Citations (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2018206948A (ja) | 2017-06-05 | 2018-12-27 | 東京エレクトロン株式会社 | 検査装置、検査システム、および位置合わせ方法 |
Also Published As
Publication number | Publication date |
---|---|
US20200379037A1 (en) | 2020-12-03 |
KR102422861B1 (ko) | 2022-07-19 |
KR20200138002A (ko) | 2020-12-09 |
US11131708B2 (en) | 2021-09-28 |
CN112018023A (zh) | 2020-12-01 |
JP2020198354A (ja) | 2020-12-10 |
CN112018023B (zh) | 2024-03-22 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
JP7267111B2 (ja) | 位置決め機構及び位置決め方法 | |
JP4491513B1 (ja) | 半導体ウェハ試験装置 | |
US7859283B2 (en) | Probe apparatus, probing method, and storage medium | |
JP5889581B2 (ja) | ウエハ検査装置 | |
JP2010186998A6 (ja) | 半導体ウェハ試験装置 | |
US10557868B2 (en) | Wafer inspection device and wafer inspection method | |
JP7274350B2 (ja) | 搬送システム、検査システム及び検査方法 | |
US20120242359A1 (en) | Probe card detecting apparatus, wafer position alignment apparatus and wafer position alignment method | |
JP5904428B1 (ja) | プロービング装置及びプローブコンタクト方法 | |
US11169206B2 (en) | Inspection apparatus, inspection system, and aligning method | |
JP6620990B2 (ja) | プローバ及びプローブコンタクト方法 | |
JP2024014956A (ja) | プローバ及びプローブ検査方法 | |
JP2024096822A (ja) | プローバ及びプローブ検査方法 | |
US11933839B2 (en) | Inspection apparatus and inspection method | |
US20200225282A1 (en) | Chuck top, inspection apparatus, and chuck top recovery method | |
JP7267058B2 (ja) | 検査装置 |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
A621 | Written request for application examination |
Free format text: JAPANESE INTERMEDIATE CODE: A621 Effective date: 20220415 |
|
TRDD | Decision of grant or rejection written | ||
A977 | Report on retrieval |
Free format text: JAPANESE INTERMEDIATE CODE: A971007 Effective date: 20230316 |
|
A01 | Written decision to grant a patent or to grant a registration (utility model) |
Free format text: JAPANESE INTERMEDIATE CODE: A01 Effective date: 20230322 |
|
A61 | First payment of annual fees (during grant procedure) |
Free format text: JAPANESE INTERMEDIATE CODE: A61 Effective date: 20230419 |
|
R150 | Certificate of patent or registration of utility model |
Ref document number: 7267111 Country of ref document: JP Free format text: JAPANESE INTERMEDIATE CODE: R150 |