JP7274350B2 - 搬送システム、検査システム及び検査方法 - Google Patents
搬送システム、検査システム及び検査方法 Download PDFInfo
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- G01R31/2855—Environmental, reliability or burn-in testing
- G01R31/286—External aspects, e.g. related to chambers, contacting devices or handlers
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- G—PHYSICS
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- G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
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- G—PHYSICS
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- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
- G01R1/02—General constructional details
- G01R1/06—Measuring leads; Measuring probes
- G01R1/067—Measuring probes
- G01R1/073—Multiple probes
- G01R1/07307—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card
- G01R1/07314—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card the body of the probe being perpendicular to test object, e.g. bed of nails or probe with bump contacts on a rigid support
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
- G01R1/02—General constructional details
- G01R1/06—Measuring leads; Measuring probes
- G01R1/067—Measuring probes
- G01R1/073—Multiple probes
- G01R1/07307—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card
- G01R1/07342—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card the body of the probe being at an angle other than perpendicular to test object, e.g. probe card
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
- G01R31/28—Testing of electronic circuits, e.g. by signal tracer
- G01R31/2851—Testing of integrated circuits [IC]
- G01R31/2855—Environmental, reliability or burn-in testing
- G01R31/2872—Environmental, reliability or burn-in testing related to electrical or environmental aspects, e.g. temperature, humidity, vibration, nuclear radiation
- G01R31/2874—Environmental, reliability or burn-in testing related to electrical or environmental aspects, e.g. temperature, humidity, vibration, nuclear radiation related to temperature
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- G—PHYSICS
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- G01S—RADIO DIRECTION-FINDING; RADIO NAVIGATION; DETERMINING DISTANCE OR VELOCITY BY USE OF RADIO WAVES; LOCATING OR PRESENCE-DETECTING BY USE OF THE REFLECTION OR RERADIATION OF RADIO WAVES; ANALOGOUS ARRANGEMENTS USING OTHER WAVES
- G01S19/00—Satellite radio beacon positioning systems; Determining position, velocity or attitude using signals transmitted by such systems
- G01S19/01—Satellite radio beacon positioning systems transmitting time-stamped messages, e.g. GPS [Global Positioning System], GLONASS [Global Orbiting Navigation Satellite System] or GALILEO
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- H01L21/67011—Apparatus for manufacture or treatment
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- H—ELECTRICITY
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- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
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- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67242—Apparatus for monitoring, sorting or marking
- H01L21/67248—Temperature monitoring
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
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- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67242—Apparatus for monitoring, sorting or marking
- H01L21/67259—Position monitoring, e.g. misposition detection or presence detection
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67242—Apparatus for monitoring, sorting or marking
- H01L21/67276—Production flow monitoring, e.g. for increasing throughput
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67242—Apparatus for monitoring, sorting or marking
- H01L21/67294—Apparatus for monitoring, sorting or marking using identification means, e.g. labels on substrates or labels on containers
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67703—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations
- H01L21/67724—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations by means of a cart or a vehicule
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67703—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations
- H01L21/67727—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations using a general scheme of a conveying path within a factory
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67703—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations
- H01L21/6773—Conveying cassettes, containers or carriers
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67763—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading
- H01L21/67769—Storage means
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
- G01R31/28—Testing of electronic circuits, e.g. by signal tracer
- G01R31/2851—Testing of integrated circuits [IC]
- G01R31/2855—Environmental, reliability or burn-in testing
- G01R31/286—External aspects, e.g. related to chambers, contacting devices or handlers
- G01R31/2868—Complete testing stations; systems; procedures; software aspects
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- Condensed Matter Physics & Semiconductors (AREA)
- Manufacturing & Machinery (AREA)
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- General Engineering & Computer Science (AREA)
- Environmental & Geological Engineering (AREA)
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- Radar, Positioning & Navigation (AREA)
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- Health & Medical Sciences (AREA)
- Computer Networks & Wireless Communication (AREA)
- Automation & Control Theory (AREA)
- Testing Or Measuring Of Semiconductors Or The Like (AREA)
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
- Testing Of Individual Semiconductor Devices (AREA)
Description
第1の実施形態の検査システムについて説明する。検査システムは、被検査体に形成された複数の被検査デバイス(DUT:Device Under Test)に電気信号を与えてデバイスの種々の電気特性を検査するシステムである。被検査体は、例えば半導体ウエハ(以下「ウエハ」という。)等の基板である。
第2の実施形態の検査システムについて説明する。
10 シェル
11 ウエハ
12 プローブカード
100 検査ユニット
200 搬送システム
220 カセットユニット
221 格納部
221a 載置台
222 受け渡し部
223 駆動部
224 温調部
300 管理装置
Claims (8)
- 構造体を複数格納して検査ユニットに対して前記構造体を供給可能な移動式の複数のカセットユニットを備える搬送システムであって、
当該搬送システムは、
複数の前記カセットユニットの各々の位置を計測する測位装置と、
前記測位装置により計測される複数の前記カセットユニットの位置情報に基づいて、複数の前記カセットユニットの動作を制御する管理装置と、
を備え、
前記検査ユニットは、複数の検査装置を有し、
前記構造体は、
複数のデバイスが形成された基板と、
前記複数のデバイスの電極と電気的に接触した接触部を含む配線部材と、
を有し、
前記カセットユニットは、自動搬送車であり、
前記管理装置は、複数の前記カセットユニットの位置情報に基づいて、どの前記カセットユニットを前記検査装置に向かわせるかを決定する、
搬送システム。 - 前記カセットユニットは、
前記構造体を格納する格納部と、
前記格納部と前記検査ユニットとの間で前記構造体の受け渡しを行う受け渡し部と、
前記カセットユニットを駆動させる駆動部と、
を有する、
請求項1に記載の搬送システム。 - 前記カセットユニットは、前記格納部に格納された前記構造体の温度を調整する温調部を有する、
請求項2に記載の搬送システム。 - 前記管理装置は、複数の前記カセットユニットの各々の前記格納部に格納された前記構造体の数を取得し、取得した前記構造体の数に基づいて、複数の前記カセットユニットの動作を制御する、
請求項2又は3に記載の搬送システム。 - 前記配線部材は、前記複数のデバイスの電極に接触させるプローブを有するプローブカードである、
請求項1乃至4のいずれか一項に記載の搬送システム。 - 複数の前記カセットユニットは、互いに同じ誘導線に沿って自走可能である、
請求項1乃至5のいずれか一項に記載の搬送システム。 - 複数の検査ユニットと、
構造体を複数格納して前記複数の検査ユニットに対して前記構造体を供給可能な移動式の複数のカセットユニットと、
複数の前記カセットユニットの各々の位置を計測する測位装置と、
前記測位装置により計測される複数の前記カセットユニットの位置情報に基づいて、複数の前記カセットユニットの動作を制御する管理装置と、
を備え、
前記検査ユニットは、複数の検査装置を有し、
前記構造体は、
複数のデバイスが形成された基板と、
前記複数のデバイスの電極と電気的に接触した接触部を含む配線部材と、
を有し、
前記カセットユニットは、自動搬送車であり、
前記管理装置は、複数の前記カセットユニットの位置情報に基づいて、どの前記カセットユニットを前記検査装置に向かわせるかを決定する、
検査システム。 - 基板の上に形成された複数のデバイスの電極に、前記電極と対応して設けられた配線部材の接触部を接触させて、前記基板と前記配線部材とが組み付けられた構造体を形成する工程と、
移動式のカセットユニットに前記構造体を格納する工程と、
前記カセットユニットに格納された前記構造体を検査ユニットに供給する工程と、
前記検査ユニットにおいて前記構造体に含まれる前記複数のデバイスの検査を行う工程と、
を有し、
前記カセットユニットは、複数設けられており、
前記検査ユニットは、複数の検査装置を有し、
前記検査ユニットに供給する工程は、複数の前記カセットユニットの各々の位置を計測することと、計測された複数の前記カセットユニットの位置情報に基づいて、どの前記カセットユニットを前記検査装置に向かわせるかを決定することを含む、
検査方法。
Priority Applications (6)
Application Number | Priority Date | Filing Date | Title |
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JP2019099727A JP7274350B2 (ja) | 2019-05-28 | 2019-05-28 | 搬送システム、検査システム及び検査方法 |
CN202080036678.9A CN113841227B (zh) | 2019-05-28 | 2020-05-15 | 搬送系统、检查系统及检查方法 |
US17/595,461 US12013429B2 (en) | 2019-05-28 | 2020-05-15 | Transport system, inspection system, and inspection method |
PCT/JP2020/019449 WO2020241306A1 (ja) | 2019-05-28 | 2020-05-15 | 搬送システム、検査システム及び検査方法 |
KR1020217041144A KR20220009438A (ko) | 2019-05-28 | 2020-05-15 | 반송 시스템, 검사 시스템 및 검사 방법 |
TW109116860A TW202121554A (zh) | 2019-05-28 | 2020-05-21 | 搬運系統、檢查系統及檢查方法 |
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JP7274350B2 (ja) * | 2019-05-28 | 2023-05-16 | 東京エレクトロン株式会社 | 搬送システム、検査システム及び検査方法 |
DE112021007357T5 (de) * | 2021-03-23 | 2024-03-21 | Kioxia Corporation | Kassettengehäuse, sondenvorrichtung, server-rack und lagersystem technisches gebiet |
WO2022201283A1 (ja) | 2021-03-23 | 2022-09-29 | キオクシア株式会社 | ストレージシステム |
KR20230032399A (ko) | 2021-08-31 | 2023-03-07 | 삼성전자주식회사 | 기판 분석 설비 및 방법 |
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Citations (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2010171139A (ja) | 2009-01-21 | 2010-08-05 | Tokyo Electron Ltd | プローブ装置 |
JP2011108832A (ja) | 2009-11-17 | 2011-06-02 | Tokyo Electron Ltd | プローブ装置 |
WO2015098892A1 (ja) | 2013-12-26 | 2015-07-02 | コニカミノルタ株式会社 | 電子デバイスの印刷製造システム |
JP2017183422A (ja) | 2016-03-29 | 2017-10-05 | 株式会社東京精密 | プローバ |
JP2018049989A (ja) | 2016-09-23 | 2018-03-29 | 東京エレクトロン株式会社 | 基板検査装置 |
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- 2020-05-15 US US17/595,461 patent/US12013429B2/en active Active
- 2020-05-15 CN CN202080036678.9A patent/CN113841227B/zh active Active
- 2020-05-15 KR KR1020217041144A patent/KR20220009438A/ko not_active Application Discontinuation
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US20220206058A1 (en) | 2022-06-30 |
KR20220009438A (ko) | 2022-01-24 |
JP2020194889A (ja) | 2020-12-03 |
TW202121554A (zh) | 2021-06-01 |
WO2020241306A1 (ja) | 2020-12-03 |
CN113841227B (zh) | 2024-03-22 |
US12013429B2 (en) | 2024-06-18 |
CN113841227A (zh) | 2021-12-24 |
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