201201316 六、發明說明： 【發明所屬之技術領域】 本發明，係有關於基板載置裝置，特別是有關於具有 對位功能之基板載置裝置、及被配置有該基板載置裝置之 成膜裝置。 【先前技術】 代替經由被作了圖案化之光阻的遮罩以及蝕刻來將薄 膜成形爲所期望之圖案的光微影方法，目前係對於在成膜 時而將陰影遮罩配置在成膜對象物之表面上並經由陰影遮 罩來形成成膜物質之陰影以成膜所期望之圖案的薄膜之技 術有所注目。 爲了將成膜對象物對於陰影遮罩而作對位，雖然亦可 使用攝像機與ΧΥ0平台等之對位裝置，但是，在陰影遮 罩中，由於係並未被要求有如同光微影法中一般之次微米 尺度的精確度，因此，係期望開發一種能夠以低成本之裝 置來滿足所要求之精確度的裝置。 【發明內容】 [發明所欲解決之課題] 本發明，係爲因應於上述之要求所創作的基板載置裝 置，並爲有關於一種構造爲簡單且對於使用上之耐性爲高 並能夠確保所要求之精確度的基板載置裝置、以及使用有 該基板載置裝置之成膜裝置。 -5- 201201316 [用以解決課題之手段] 爲了解決上述課題，本發明，係爲一種具 之基板載置裝置，其特徵爲，具備有：載置台 有四邊形之基板；和貫通孔，係在前述載置台 基板更大的四邊形之各四邊的位置處，而分別 置台；和筒部’係分別被插通於前述貫通孔中 端將基板作載置；和軸部，係被插通於前述各 上端爲位置在較前述貫通孔與前述筒部之上端 :和台座部，係被形成在前述各軸部之較前述 下方處’並將前述各筒部作承載；和升降構件 台座部作承載，並被構成爲能夠相對於前述載 降移動，而使前述筒部與前述軸部一同進行升 傾斜機構，若是前述升降構件上升，則使位置 之相互正交的二邊處之前述軸部朝向前述載置 向而傾斜。 又，本發明，係爲一種具有對位功能之基 ，其中，在前述四邊中之與前述二邊相異的另 至少一邊處，係被配置有2個以上之並不會藉 機構而被作傾斜之前述軸部。 又，本發明，係爲一種具有對位功能之基 ’其中，前述傾斜機構，係具備有：第1彈簧 由前述升降構件之上升而變形，並將欲使變形 下方的復原力施加在前述台座部之位置在較前 靠前述載置台之內側的部分處。 有對位功能 ，係被載置 上之較前述 貫通前述載 ，並可在上 筒部中，且 而更上方處 各筒部而更 ，係將前述 置台而作升 降移動；和 前述四邊中 台之內側方 板載置裝置 外二邊中之 由前述傾斜 板載置裝置 構件，係藉 復原之朝向 述軸部而更 -6- 201201316 又’本發明，係爲一種具有對位功能之基板載置裝置 ’其中’前述彈簧構件，係爲被設置在前述載置台之背面 處’且若是前述升降構件上升，則與前述台座部相接觸並 被作彎曲的板狀彈簧。 又，本發明，係爲一種具有對位功能之基板載置裝置 ’其中，在前述軸部所被作配置之前述四邊中的至少位置 於相正交之二邊處的前述軸部之上端處，係被設置有朝向 前述載置台之內側的斜面。 又’本發明’係爲一種具有對位功能之基板載置裝置 ’其中’具備有前述斜面之前述軸部的上端，係被形成爲 圓錐狀’圓錐之側面，係被作爲前述斜面。 又’本發明，係爲一種具有對位功能之基板載置裝置 ’其中’在前述筒部之上端處，係具備有朝向水平方向而 擴張之凸緣部，前述基板，係被載置於前述凸緣部上。 又’本發明，係爲一種具有對位功能之基板載置裝置 ’其中’若是前述升降構件相較於特定位置而更加上升， 則係作變形，並將欲使變形復原之朝向下方的復原力施加 在不會藉由前述傾斜機構而被作傾斜之前述軸部的前述台 座部處。 又，本發明，係爲一種具有對位功能之基板載置裝置 ，其特徵爲，具備有：載置台；和貫通孔，係在前述載置 台上之四邊形的至少相正交之二邊的位置處而被形成；和 定位構件，係被設置在前述二邊之剩餘的其他二邊之位置 處，並使基板在定位置處而停止；和筒部，係分別被插通 201201316 於前述貫通孔中，並可在上端將基板作載置；和軸部，係 被插通於前述各筒部中，且上端爲位置在較前述貫通孔與 前述筒部之上端而更上方處；和台座部，係被形成在前述 各軸部之較前述各筒部而更下方處，並將前述各筒部作承 載；和升降構件，係將前述台座部作承載，並被構成爲能 夠相對於前述載置台而作升降移動，而使前述筒部與前述 軸部一同進行升降移動；和傾斜機構，若是前述升降構件 上升，則使前述軸部朝向前述載置台之內側方向而傾斜。 又，本發明，係爲一種成膜裝置，其特徵爲，具備有 :上述之任一者的基板載置裝置；和位置在前述基板載置 裝置之上方處的將陰影遮罩作載置之遮罩載置裝置；和位 置在前述遮罩載置裝置之上方處的成膜源；和被配置有前 述基板載置裝置與前述遮罩載置裝置以及前述成膜源之真 空槽；和使前述升降構件作升降移動之動力機構。 [發明之效果] 載置台上方之陰影遮罩，係以當基板被配置在對位位 置處時而能夠在基板之表面的特定位置處形成薄膜的方式 ，而被作配置，陰影遮罩與對位位置之基板，係成爲被作 了對位的狀態，而能夠形成位置精確度爲高之薄膜。 由於在傾斜裝置處，係具備有彈性，又，在被配置於 定位用之邊上的軸部處，亦係被設置有彈簧構件，因此， 在將基板作移動並進行定位時，係能夠對於基板之破損作 抑制。 -8- 201201316 【實施方式】 圖1 (a)之符號10’係代表本發明之成膜裝置。此成 膜裝置10’係具備有：真空槽11'和基板載置裝置2、和 遮罩載置裝置13。 基板載置裝置2，係具備有載置台12。遮罩載置裝置 13，係被安裝於未圖示之遮罩載置裝置升降裝置上，若是 使遮罩載置裝置升降裝置動作，則遮罩載置裝置13係成爲 能夠於真空槽11內而在將真空槽11內之真空氛圍作了維持 的狀態下來作上下移動》 載置台12，係經由在真空槽11之底面處而被氣密地作 插通之第1升降軸19a而被作支持。第1升降軸19a，係被與 被設置在真空槽11之外部的上下移動機構27相連接，若是 上下移動機構27動作並使第1升降軸19a作上下移動，則載 置台12，係成爲能夠於真空槽11之內部而在將真空氛圍作 了維持的狀態下來作升降移動。遮罩載置裝置13與載置台 1 2，係被作水平配置。 遮罩載置裝置13，係在中央部分處被形成有開□，若 是將陰影遮罩14配置在遮罩載置裝置13上，則係成爲能夠 使陰影遮罩14從此開口而朝向鉛直下方方向露出。 在遮罩載置裝置13上，係被承載有陰影遮罩14。 當在基板上形成薄膜的情況時，係經由真空排氣系23 來將真空槽Π之內部作真空排氣，並將陰影遮罩I4與遮罩 載置裝置13—同地而從載置台12分離並使其朝向上方移動 ，再將基板搬入至真空槽11內，並使其靜止於陰影遮罩14 -9 - 201201316 與載置台12之間，再使載置台12朝向上方移動，並將基板 承載於載置台12上，再使其更進而上升，而使基板與陰影 遮罩14相密著。 圖1 ( b )，係對於該狀態作展示，基板20，係被配置 在載置台12上，並與陰影遮罩14相密著。 於此，此成膜裝置10，係爲具備有標靶之濺鍍裝置或 是具備有將原料氣體作導入的噴淋板之CVD裝置等的在真 空氛圍中而形成薄膜之裝置，標靶或是噴淋板等之成膜源 15，係被配置在真空槽11之頂板附近，在成膜源15之下方 位置處，係從上方起而被依序配置有陰影遮罩14與基板20 〇 圖2，係爲載置台12和遮罩載置裝置13以及陰影遮罩 14之槪略立體圖。 在陰影遮罩14處，係被形成有一乃至複數之開口 21， 從標靶所飛出之濺鍍粒子或者是從噴淋板所被放出之原料 氣體等之從成膜源15所供給之成膜物質，若是通過開口 21 並到達基板20之表面，則係依據開口 21之形成圖案，而在 基板20之表面上被形成有薄膜。 此時，若是陰影遮罩14與基板20係被作對位，則係能 夠將薄膜形成在基板20之特定位置上。 對於本發明之對位方法作說明。 於圖3中，展示載置台12之平面圖，於圖6(a)中， 展示基板20之搬入前的載置台12之縱方向切斷剖面圖。 在載置台12上，係沿著較基板20更大之長方形或是正 -10- 201201316 方形的四邊形28之四邊，而被形成有貫通孔9，在各貫通 孔9處，係被鉛直插通有筒部3。於此’該四邊形28，係作 爲通過各軸部4之中心軸線的四邊形而被作展示。 各筒部3之上端，係被形成爲朝向水平方向而擴張之 凸緣部8，位置在四邊上之筒部3的凸緣部8，係位置在相 同之高度處，凸緣部8之寬幅，係成爲使凸緣部8之端部的 朝向載置台12之內側的部分與較基板20更小之四邊形26相 接一般的寬幅。故而，在凸緣部8上，係能夠將較四邊形 28更小且較四邊形26更大之基板作承載。 在各筒部3處，係被鉛直插通有軸部4，軸部4之上端 ，係較筒部3之上端而更朝向上方突出。 在各軸部4之下端處，係被設置有較軸部4之直徑更大 的台座部5，筒部3，係以能夠從台座部5上離開的方式， 而被承載在台座部5上。 在載置台12之下方，係被配置有升降構件18。在真空 槽11之外部，係被配置有上下移動機構。 升降構件1 8，係經由在真空槽1 1之底面處而被氣密地 作插通之圖1的第2升降軸19b而被作支持。第2升降軸19b ’係被與上下移動機構27相連接，並構成爲：若是上下移 動機構27動作並使第2升降軸19b作上下移動，則升降構件 18，係成爲能夠於真空槽11之內部而在將真空槽11之內部 的真空氛圍作了維持的狀態下來作升降移動。 在本例中’第2升降軸19b係爲筒狀，且第1升降軸19a 係被插通於第2升降軸19b中，但是，第1、第2升降軸19a -11 - 201201316 ' 19b，係亦可設爲並不使其中一方被插通於另外一方中 ，而是被配置在相互分離了的位置處。 升降構件18之朝向上方的表面，係存在有平坦之部分 ，各軸部4之台座部5，係被承載於升降構件18之平坦的部 分之上。若是升降構件1 8作升降移動，則各軸部4與軸部4 之台座部5上的筒部3，係一起作升降移動。 圖6 ( a)係爲在將基板20作配置前而使升降構件18下 降並在載置台12與載置台12上方之陰影遮罩14之間形成了 空隙的狀態。 各軸部4之側面，係如同圖3之符號22所示一般，以與 較基板20更大並能夠將基板20配置在內側處之對位用的四 邊形（22 )相接觸的方式而被作配置。 在此對位用之四邊形22中，係被規定爲：當預先所設 定了的定位用二邊22 a、22b與亦爲預先被作了設定者的基 板20之二邊成爲一致時，則該基板20係被進行了對位，又 ，陰影遮罩1 4，係以能夠對於被作了對位的基板20而在所 期望之位置處形成薄膜的方式而被作配置。 在基板搬送機器人之手上，係被承載有基板20，手係 從鄰室而被搬入至真空槽11內，並在身爲陰影遮罩14與載 置台12之間的高度位置之載置台12的位置上而靜止。接著 ，若是升降構件18朝向上方移動並將軸部4與筒部3—同作 舉升，則軸部4與筒部3係通過手的手指間，並成爲欲使軸 部4之上端朝向較基板20更上方之位置而突出。 在沿著四邊而被作配置的軸部4之中，在位置於相正 -12- 201201316 交之二邊處的軸部4之上端，係被形成有朝向載置台12之 內側方向的斜面6，基板2 0，係當軸部4與筒部3較基板2 0 而更朝向上方突出時，而並不與斜面6相接觸地來承載在 凸緣部8上，或者是先暫時承載於斜面6上再從斜面6上滑 落並承載於凸緣部8上。 故而，爲了將基板20載置在凸緣部8上，係能夠使基 板20位置在較對位用之四邊形22更寬廣之將軸部4的頂點 作連結之四邊形內，並使軸部4以及筒部3從基板之下方而 上升。 圖6 ( b )，係爲對於將基板20承載在凸緣部8上的狀 態作展示之側面圖。於此狀態下，基板20係成爲在凸緣部 8上而被配置於對位用四邊形22內。於此情況，各軸部4係 成爲鉛直，被配置在對位用四邊形22內之基板20，最大係 能夠與位置在四邊中之相正交的二邊處之軸部4的側面相 接觸，但是，係無法與位置在四邊之全部軸部4的側面同 時作接觸。 此基板載置裝置2，係具備有使位置在定位用二邊22 a 、22b以外之二邊22c、22d處的軸部4作傾斜之傾斜裝置。 於此’傾斜裝置係藉由被設置在載置台1 2之背面處的 板彈簧7所構成。板彈簧7，係以當升降構件1 8上升時而能 夠使該板彈簧7之前端與台座部5之載置台1 2的內側方向之 部分作接觸的方式而被作配置，在接觸後，若是升降構件 1 8更進而上升’則板彈簧7係被彎曲，經由其之復原力， 與板彈簧7之前端相接觸之部分係被作推壓，在台座部5之 -13- 201201316 推壓部分處，係被施加有動量。 在被設置在被作推壓之台座部5處的軸部4和位置於該 軸部4之周圍的筒部3之間，係被形成有空隙，藉由動量， 位置在推壓部分之下方處的邊緣部分32，係成爲支點，而 台座部5之與被推壓的部分相反側之部分係被舉升，軸部4 係朝向板彈簧7側而傾斜。 板彈簧7，係朝向載置台1 2之內側方向、亦即是朝向 對位用四角形22中之與各軸部4所被配置之邊相對向的邊 方向而傾斜。 當軸部4作了傾斜的情況時，由於能夠與各軸部4之側 面相接觸的對位用四邊形22之大小亦係變小，而基板20係 無法超出至對位用四邊形22之外側處，因此，經由作了傾 斜的軸部4，基板20係被作推壓，並朝向定位用二邊22a、 22b之方向而移動。圖6 ( c )，係爲對於基板20被作推壓 之狀態作展示。 當對位用四邊形22變小，而其之大小係成爲與基板20 之大小相等時，則基板20之邊緣，係與位置在四邊上之軸 部4的側面相接觸。此時，預先被與定位用二邊22a、22b 作了近接配置的基板20之二邊，係與定位用二邊22a、22b 相一致。 而後，若是軸部4欲更加作傾斜，則藉由該軸部4，基 板20係被朝向並未傾斜的軸部4而被作推壓。 位置在對位用之二邊22a、22b處的軸部4，亦係與筒 部3之內周面相分離，並於其間而形成有空隙。又，在該 -14 - 201201316 軸部4之台座部5與載置台12之間，係被配置有彈簧構件17 ’當板彈簧7與軸部4作傾斜時，彈簧構件17係亦被作壓縮 。若是經由基板2〇而使得位置在對位用之二邊22a、22b處 的軸部4被作推壓’則該軸部4係作些許的傾斜，由基板2 0 所導致之推壓力’係經由彈簧構件1 7之變形而被作吸收。 若是以從該狀態而回復至原本之位置的方式而使載置 台12上升（或者是使升降構件18下降），則板彈簧7或是 彈簧構件17之變形係復原，對於基板20之推壓力係消滅， 基板20 ’係維持在使基板20之二邊與定位用二邊22a、22b 相一致了的狀態。此狀態，係爲基板20被作了對位之狀態 ，如圖4中所示一般，基板2 0，係在對位位置處，相對於 凸緣部8而靜止。 此時，板彈簧7或是彈簧構件17，由於係在使變形復 原時而經由復原力來將台座部5朝向升降構件1 8側作推壓 ，因此，筒部3或是軸部4係卡在貫通孔9之邊緣處並被固 定在載置台12處，而不會有從升降構件18而分離的情形。 在載置台12處，係被設置有將凸緣部8作收容之有底 或者是無底的溝，若是載置台12作相對移動直到成爲與凸 緣部8相同高度爲止，則基板20係在被作了對位的狀態下 而被承載在載置台12上。 進而，藉由遮罩載置裝置13之下降或是基板載置裝置 2之上升，如同圖5之平面圖以及圖6(d)之側面圖一般， 被對於載置台12之定位用二邊22a、22b而作了對位之基板 20與陰影遮罩14，係相密著，在陰影遮罩14之開口 21底面 -15- 201201316 的基板20上，係被形成薄膜。若是從圖6 ( d )之狀態起而 更進而使升降構件1 8下降，則係能夠在將筒部3載置於載 置台12上的狀態下，而將軸部4之上端較載置台12之上面 而更加下降。 如同以上所說明一般，被配置在遮罩載置裝置13上之 陰影遮罩1 4，係以當基板20被作了對位時而能夠在基板20 之表面的特定位置處形成薄膜的方式，而被作配置，若是 基板20被作對位，則陰影遮罩14與基板20係成爲被作了對 位的狀態，而能夠形成位置精確度爲高之薄膜。 另外，在上述實施例中，雖係在對位用之二邊22a、 22b之位置處，將插入了筒部3內之軸部4作了配置，但是 ，本發明之定位構件，係並不被限定於將基板20經由軸部 4之側面來作定位者，代替作傾斜並使基板20移動之軸部4 以外的軸部4，亦可採用被設置在載置台4上之突起或者是 突條等之使基板之移動停止的構件。 又，在上述實施例中，雖係在四邊之各邊處而各設置 有2個的筒部3與軸部4，但是，係並非爲被限定於該個數 者，特別是，當藉由突起或是軸部4來與基板側面作部分 性接觸並作定位的情況時，在定位用之二邊中，只要在一 邊設置1個並在另外一邊設置2個來與基板2 0作接觸即可。 另外，上述傾斜裝置7，雖係爲被設置在載置台12處 之板彈簧7，但是，亦可爲被設置在台座部5處之板彈簧， 另外，亦可並非爲板彈簧，而使用螺旋狀之彈簧。 又，當藉由板彈簧7來使軸部4傾斜的情況時，如同在 -16- 201201316 圖7(a)〜（f)中所示一般，若是設爲對於台座5a〜5f， 而在台座5a〜5f中之與板彈簧部7相抵接並被作推壓的部 分之正下方位置處，設置切缺部29a〜29f，並成爲在切缺 部29a〜29f之表面與升降構件18之表面間被形成有空隙， 而使台座5a〜5f之相較於邊緣部而更靠近軸部4之中心軸 線的部分成爲支點並使軸部4被作傾斜，則相較於不具備 有切缺部29a〜29f的情況，係成爲能夠藉由較小的推壓力 來使軸部4傾斜。 圖8之（la)，係爲圖7(a)之台座5a，若是如同圖8 之（2a )—般地而被作傾斜，則切缺部29a所位置之部分 的空隙係變小，而相反側之空隙係變大。 圖8之（lb)，係爲圖7(b)之台座5b，若是如同圖8 之（2b ) —般地而被作傾斜，則切缺部29b所位置之部分 的空隙係變小，而在與升降構件1 8相接觸之相反側的部分 處，係成爲被形成有空隙。 【圖式簡單說明】 [圖l](a) 、（b):用以對於本發明之成膜裝置作說 明的圖。 [圖2]用以對於陰影遮罩與遮罩載置裝置以及載置台之 位置關係作說明的圖。 [圖3]載置台之平面圖。 [圖4]基板被作了對位後的狀態之載置台的平面圖。 [圖5]被配置了基板與陰影遮罩之載置台的平面圖。201201316 VI. [Technical Field] The present invention relates to a substrate mounting device, and more particularly to a substrate mounting device having a alignment function and a film formation in which the substrate mounting device is disposed Device. [Prior Art] A photolithography method in which a film is formed into a desired pattern by masking and etching through a patterned photoresist, and currently a shadow mask is disposed in a film formation at the time of film formation. The technique of forming a shadow of a film-forming substance by a shadow mask on the surface of an object to form a film of a desired pattern is noticed. In order to align the film-forming object with the shadow mask, although the alignment device such as the camera and the 平台0 platform can be used, in the shadow mask, since the system is not required to be as in the photolithography method. Submicron-scale accuracy, therefore, is expected to develop a device that can meet the required accuracy at a low cost device. [Problem to be Solved by the Invention] The present invention is a substrate mounting device created in accordance with the above requirements, and is simple in structure and high in resistance to use and capable of ensuring A substrate mounting device that requires precision, and a film forming device using the substrate mounting device. -5-201201316 [Means for Solving the Problems] In order to solve the above problems, the present invention provides a substrate mounting apparatus comprising: a substrate having a quadrilateral on a mounting table; and a through hole The mounting base plate is placed at each of four sides of a larger quadrilateral, and is placed separately; and the tubular portion is inserted into the intermediate end of the through hole to mount the substrate; and the shaft portion is inserted into the aforementioned Each of the upper ends is located at a position higher than the through hole and the upper end of the tubular portion: and the pedestal portion is formed at a lower portion of each of the shaft portions and carries the respective tubular portions; and the lifting member pedestal portion is carried And configured to move the tilting mechanism together with the shaft portion with respect to the load-carrying movement, and to raise the shaft portion at two sides orthogonal to each other when the lifting member rises The above placement is inclined. Further, the present invention is a base having a aligning function, wherein at least one of the four sides different from the two sides is disposed in two or more and is not made by a mechanism. Tilting the aforementioned shaft portion. Further, the present invention is a base having a aligning function, wherein the tilting mechanism includes a first spring that is deformed by the rising of the elevating member, and applies a restoring force under the deformation to the pedestal. The position of the portion is at a portion that is closer to the inner side of the aforementioned mounting table. The alignment function is carried by the above-mentioned load, and can be carried in the upper tubular portion and at the upper portion of the tubular portion, and the above-mentioned mounting is carried out for lifting and lowering; The slanting plate mounting device member on the outer side of the inner side panel mounting device is further oriented toward the shaft portion by the restoration. -6-201201316 Further, the present invention is a substrate having a aligning function. The device "where the spring member is provided on the back surface of the mounting table" and if the lifting member rises, is in contact with the pedestal portion and is bent. Furthermore, the present invention is a substrate mounting device having a aligning function, wherein at least one of the four sides of the shaft portion disposed at the position is at the upper end of the shaft portion at two orthogonal sides The slope is provided to the inner side of the mounting table. Further, the present invention is a substrate mounting device having a aligning function, wherein the upper end of the shaft portion in which the inclined surface is provided is formed as a side surface of a conical "cone" as the inclined surface. Further, the present invention relates to a substrate mounting device having a aligning function, wherein 'the upper end of the tubular portion is provided with a flange portion that expands in a horizontal direction, and the substrate is placed on the aforementioned On the flange. Further, the present invention is a substrate mounting device having a aligning function, in which the restoring force is deformed downward when the lifting member is raised more than a specific position, and the restoring force is intended to restore the deformation downward. The pedestal portion is applied to the shaft portion that is not inclined by the tilt mechanism. Moreover, the present invention provides a substrate mounting device having a aligning function, comprising: a mounting table; and a through hole at a position of at least two orthogonal sides of a quadrilateral on the mounting table And the positioning member is disposed at the remaining two sides of the two sides, and stops the substrate at a fixed position; and the tubular portion is inserted through the through hole 201201316 The substrate may be placed at the upper end; and the shaft portion is inserted into each of the cylindrical portions, and the upper end is located above the through hole and the upper end of the tubular portion; and the pedestal portion And each of the shaft portions is formed further below the respective tubular portions, and the respective tubular portions are supported; and the lifting member is configured to carry the pedestal portion and configured to be movable relative to the load When the table is moved up and down, the tubular portion is moved up and down together with the shaft portion, and the tilting mechanism is configured such that the shaft portion is inclined toward the inner side of the mounting table when the lifting member is raised. Moreover, the present invention provides a film forming apparatus including: the substrate mounting device of any of the above; and a shadow mask placed at a position above the substrate mounting device a mask mounting device; and a film forming source positioned above the mask mounting device; and a vacuum chamber configured with the substrate mounting device, the mask mounting device, and the film forming source; and The lifting member is used as a power mechanism for lifting and lowering. [Effects of the Invention] The shadow mask above the mounting table is configured such that a film can be formed at a specific position on the surface of the substrate when the substrate is placed at the alignment position, and the shadow mask and the pair are arranged. The substrate in the positional position is in a state of being aligned, and a film having a high positional accuracy can be formed. Since the tilting device is provided with elasticity, and the shaft member disposed on the side of the positioning is also provided with a spring member, when the substrate is moved and positioned, it is possible to The damage of the substrate is suppressed. -8-201201316 [Embodiment] The symbol 10' of Fig. 1 (a) represents a film forming apparatus of the present invention. This film forming apparatus 10' is provided with a vacuum chamber 11', a substrate mounting device 2, and a mask mounting device 13. The substrate mounting device 2 is provided with a mounting table 12 . The mask mounting device 13 is attached to a mask mounting device lifting device (not shown). When the mask mounting device lifting device is operated, the mask mounting device 13 can be installed in the vacuum chamber 11. In the state in which the vacuum atmosphere in the vacuum chamber 11 is maintained, the mounting table 12 is placed on the first lifting shaft 19a that is airtightly inserted through the bottom surface of the vacuum chamber 11. stand by. The first lifting shaft 19a is connected to the vertical movement mechanism 27 provided outside the vacuum chamber 11. When the vertical movement mechanism 27 is operated and the first lifting shaft 19a is moved up and down, the mounting table 12 is capable of being mounted. The inside of the vacuum chamber 11 is moved up and down while maintaining the vacuum atmosphere. The mask mounting device 13 and the mounting table 12 are horizontally arranged. The mask mounting device 13 is formed with an opening at the center portion. If the shadow mask 14 is placed on the mask mounting device 13, the shadow mask 14 can be oriented from the opening toward the vertical direction. Exposed. A shadow mask 14 is carried on the mask mounting device 13. When a thin film is formed on the substrate, the inside of the vacuum chamber is vacuum-exhausted via the vacuum exhaust system 23, and the shadow mask I4 is placed in the same manner as the mask mounting device 13 from the mounting table 12. Separating and moving it upwards, and then loading the substrate into the vacuum chamber 11 and resting it between the shadow mask 14 -9 - 201201316 and the mounting table 12, and then moving the mounting table 12 upward, and the substrate It is carried on the mounting table 12, and is further raised to make the substrate adhere to the shadow mask 14. Fig. 1(b) shows the state in which the substrate 20 is placed on the mounting table 12 and is in close contact with the shadow mask 14. Here, the film forming apparatus 10 is a device including a target sputtering device or a CVD device including a shower plate for introducing a raw material gas in a vacuum atmosphere, and a target or a target. A film formation source 15 such as a shower plate is disposed in the vicinity of the top plate of the vacuum chamber 11, and a shadow mask 14 and a substrate 20 are sequentially disposed from above at a position below the film formation source 15 2 is a schematic perspective view of the mounting table 12, the mask mounting device 13, and the shadow mask 14. At the shadow mask 14, a plurality of openings 21 are formed, and the sputter particles flying from the target or the material gas discharged from the shower plate are supplied from the film forming source 15. When the film material passes through the opening 21 and reaches the surface of the substrate 20, a film is formed on the surface of the substrate 20 in accordance with the pattern formed by the opening 21. At this time, if the shadow mask 14 and the substrate 20 are aligned, the film can be formed at a specific position of the substrate 20. The alignment method of the present invention will be described. In Fig. 3, a plan view of the mounting table 12 is shown. In Fig. 6(a), a cross-sectional view in the longitudinal direction of the mounting table 12 before the substrate 20 is carried in is shown. The mounting table 12 is formed with a through hole 9 along a rectangular shape larger than the substrate 20 or four sides of a square -10-201201316 square, and is vertically inserted at each of the through holes 9. Tube portion 3. Here, the quadrilateral 28 is shown as a quadrangle passing through the central axis of each shaft portion 4. The upper end of each tubular portion 3 is formed as a flange portion 8 which is expanded in the horizontal direction, and the flange portion 8 of the tubular portion 3 which is positioned on four sides is at the same height, and the width of the flange portion 8 is wide. The width is such that a portion of the end portion of the flange portion 8 facing the inside of the mounting table 12 and a rectangular portion 26 smaller than the substrate 20 are generally wide. Therefore, on the flange portion 8, it is possible to carry a substrate which is smaller than the quadrilateral 28 and larger than the quadrilateral 26. In each of the tubular portions 3, the shaft portion 4 is vertically inserted, and the upper end of the shaft portion 4 is protruded upward from the upper end of the tubular portion 3. At the lower end of each shaft portion 4, a pedestal portion 5 having a larger diameter than the shaft portion 4 is provided, and the cylindrical portion 3 is carried on the pedestal portion 5 so as to be able to be separated from the pedestal portion 5. . Below the mounting table 12, a lifting member 18 is disposed. Outside the vacuum chamber 11, a vertical movement mechanism is disposed. The elevating member 18 is supported by the second elevating shaft 19b of Fig. 1 that is airtightly inserted through the bottom surface of the vacuum chamber 1 1 . The second elevating shaft 19b' is connected to the vertical movement mechanism 27, and the elevating member 18 is configured to be able to be in the vacuum chamber 11 when the vertical movement mechanism 27 is operated and the second elevating shaft 19b is moved up and down. The inside is moved up and down while maintaining the vacuum atmosphere inside the vacuum chamber 11. In this example, the second lifting shaft 19b is cylindrical, and the first lifting shaft 19a is inserted into the second lifting shaft 19b. However, the first and second lifting shafts 19a-11 - 201201316' 19b, Alternatively, it may be arranged such that one of them is not inserted into the other, but is disposed at a position separated from each other. The upper surface of the elevating member 18 has a flat portion, and the pedestal portion 5 of each shaft portion 4 is carried on a flat portion of the elevating member 18. When the elevating member 18 is moved up and down, the shaft portions 4 and the tubular portion 3 on the pedestal portion 5 of the shaft portion 4 are moved up and down together. Fig. 6(a) shows a state in which the elevating member 18 is lowered before the substrate 20 is placed, and a gap is formed between the mounting table 12 and the shadow mask 14 above the mounting table 12. The side surface of each of the shaft portions 4 is generally formed as shown by reference numeral 22 in Fig. 3, and is in contact with the quadrilateral (22) which is larger than the substrate 20 and which can arrange the substrate 20 at the inner side. Configuration. In the quadrilateral 22 for alignment, it is defined that when the two positioning edges 22a and 22b which are set in advance are identical to the two sides of the substrate 20 which is also set in advance, the The substrate 20 is aligned, and the shadow mask 14 is disposed so as to form a film at a desired position with respect to the aligned substrate 20. In the hand of the substrate transfer robot, the substrate 20 is carried, and the hand is carried into the vacuum chamber 11 from the adjacent chamber, and the stage 12 is placed at a height between the shadow mask 14 and the mounting table 12. The position is still and still. Next, when the elevating member 18 moves upward and the shaft portion 4 and the tubular portion 3 are lifted together, the shaft portion 4 and the tubular portion 3 pass between the fingers of the hand, and the upper end of the shaft portion 4 is oriented. The substrate 20 protrudes above the position. Among the shaft portions 4 arranged along the four sides, at the upper end of the shaft portion 4 located at the intersection of the two sides of the phase -12-201201316, a slope 6 facing the inner side of the mounting table 12 is formed. The substrate 20 is supported on the flange portion 8 without being in contact with the inclined surface 6 when the shaft portion 4 and the tubular portion 3 protrude upward from the substrate 20, or is temporarily carried on the inclined surface. The upper portion 6 is slid down from the inclined surface 6 and carried on the flange portion 8. Therefore, in order to mount the substrate 20 on the flange portion 8, the substrate 20 can be positioned in a quadrangular shape in which the apex of the shaft portion 4 is wider than the alignment quadrilateral 22, and the shaft portion 4 and the shaft portion 4 are provided. The tubular portion 3 rises from below the substrate. Fig. 6 (b) is a side view showing a state in which the substrate 20 is carried on the flange portion 8. In this state, the substrate 20 is placed on the flange portion 8 and placed in the alignment quadrangle 22. In this case, each of the shaft portions 4 is vertical, and the substrate 20 disposed in the alignment quadrilateral 22 is most likely to be in contact with the side surface of the shaft portion 4 at two sides orthogonal to the four sides. However, it is impossible to make contact with the side faces of all the shaft portions 4 positioned on the four sides at the same time. The substrate mounting device 2 is provided with a tilting device for tilting the shaft portion 4 at two sides 22c and 22d other than the positioning two sides 22a and 22b. Here, the tilting device is constituted by a leaf spring 7 provided on the back surface of the mounting table 12. The leaf spring 7 is disposed such that the front end of the leaf spring 7 comes into contact with the inner side of the mounting table 1 of the pedestal portion 5 when the lifting member 18 is raised, and after the contact, if When the lifting member 18 is further raised, the leaf spring 7 is bent, and the portion in contact with the front end of the leaf spring 7 is pressed by the restoring force thereof, and the pressing portion of the pedestal portion 5-13-201201316 is pressed. At the moment, the momentum is applied. Between the shaft portion 4 provided at the pedestal portion 5 to be pressed and the cylindrical portion 3 positioned around the shaft portion 4, a space is formed, and the position is below the pressing portion by the momentum. The edge portion 32 is a fulcrum, and the portion of the pedestal portion 5 opposite to the portion to be pressed is lifted, and the shaft portion 4 is inclined toward the side of the leaf spring 7. The leaf springs 7 are inclined toward the inner side of the mounting table 1 2, that is, toward the side direction of the alignment quadrangles 22 facing the side where the respective shaft portions 4 are arranged. When the shaft portion 4 is inclined, the size of the alignment quadrilateral 22 which can be brought into contact with the side faces of the respective shaft portions 4 is also small, and the substrate 20 cannot be beyond the outer side of the alignment quadrilateral 22 Therefore, the substrate 20 is pressed by the inclined shaft portion 4, and moves toward the positioning two sides 22a, 22b. Fig. 6 (c) shows a state in which the substrate 20 is pressed. When the alignment quadrilateral 22 becomes smaller and the size is equal to the size of the substrate 20, the edge of the substrate 20 is in contact with the side surface of the shaft portion 4 positioned on the four sides. At this time, the two sides of the substrate 20 which are arranged in close proximity to the positioning two sides 22a and 22b are aligned with the positioning two sides 22a and 22b. Then, if the shaft portion 4 is to be more inclined, the base plate 20 is pressed toward the shaft portion 4 which is not inclined by the shaft portion 4. The shaft portion 4 positioned at the two sides 22a, 22b of the alignment is also separated from the inner peripheral surface of the tubular portion 3, and a gap is formed therebetween. Further, between the pedestal portion 5 of the shaft portion 4 and the mounting table 12, the spring member 17' is disposed between the spring member 17 and the shaft portion 4, and the spring member 17 is also compressed. . If the shaft portion 4 at the two sides 22a, 22b of the alignment is pressed by the substrate 2, the shaft portion 4 is slightly inclined, and the pressing force caused by the substrate 20 is It is absorbed by the deformation of the spring member 17. When the mounting table 12 is raised (or the elevating member 18 is lowered) in such a manner as to return to the original position from this state, the deformation of the leaf spring 7 or the spring member 17 is restored, and the pressing force of the substrate 20 is restored. The substrate 20' is maintained in a state in which the two sides of the substrate 20 are aligned with the positioning two sides 22a and 22b. This state is in a state in which the substrate 20 is aligned. As shown in Fig. 4, the substrate 20 is at the alignment position and is stationary with respect to the flange portion 8. At this time, since the leaf spring 7 or the spring member 17 presses the pedestal portion 5 toward the elevating member 18 via the restoring force when the deformation is restored, the tubular portion 3 or the shaft portion 4 is stuck. At the edge of the through hole 9 and fixed to the mounting table 12, there is no case where it is separated from the lifting member 18. At the mounting table 12, a bottomed or bottomless groove for accommodating the flange portion 8 is provided, and when the mounting table 12 is relatively moved until the same height as the flange portion 8, the substrate 20 is attached. It is placed on the mounting table 12 in a state of being aligned. Further, by the lowering of the mask mounting device 13 or the rise of the substrate mounting device 2, as shown in the plan view of FIG. 5 and the side view of FIG. 6(d), the positioning side 22a for the mounting table 12 is The substrate 20 and the shadow mask 14 which are aligned in 22b are closely adhered to each other, and a film is formed on the substrate 20 on the bottom surface -15-201201316 of the opening 21 of the shadow mask 14. When the elevating member 18 is further lowered from the state of FIG. 6(d), the upper end of the shaft portion 4 can be placed on the stage 12 in a state where the tubular portion 3 is placed on the mounting table 12. It is even more declining. As described above, the shadow mask 14 disposed on the mask mounting device 13 is a method capable of forming a film at a specific position on the surface of the substrate 20 when the substrate 20 is aligned. On the other hand, if the substrate 20 is aligned, the shadow mask 14 and the substrate 20 are aligned, and a film having a high positional accuracy can be formed. Further, in the above embodiment, the shaft portion 4 inserted into the tubular portion 3 is disposed at the position of the two sides 22a, 22b for alignment, but the positioning member of the present invention is not It is limited to the position where the substrate 20 is positioned via the side surface of the shaft portion 4, and instead of the shaft portion 4 other than the shaft portion 4 which is tilted to move the substrate 20, a protrusion or a protrusion provided on the mounting table 4 may be used. A member such as a strip that stops the movement of the substrate. Further, in the above-described embodiment, the two tubular portions 3 and the shaft portion 4 are provided on each of the four sides, but they are not limited to the number, in particular, by When the protrusion or the shaft portion 4 is in partial contact with the side surface of the substrate and is positioned, two of the two sides for positioning are provided on one side and two on the other side to be in contact with the substrate 20, that is, can. Further, the tilting device 7 is a leaf spring 7 provided on the mounting table 12, but may be a leaf spring provided at the pedestal portion 5, or may be a leaf spring instead of a spiral. Spring. Further, when the shaft portion 4 is tilted by the leaf spring 7, as shown in Figs. 7(a) to (f) of -16-201201316, if it is set to the pedestals 5a to 5f, the pedestal is provided. At positions immediately below the portion of the 5a to 5f that abuts against the plate spring portion 7 and is pressed, the cutout portions 29a to 29f are provided and become the surfaces of the cutout portions 29a to 29f and the surface of the elevation member 18 A gap is formed therebetween, and a portion of the pedestals 5a to 5f that is closer to the central axis of the shaft portion 4 than the edge portion serves as a fulcrum and the shaft portion 4 is inclined, and the missing portion is not provided. In the case of 29a to 29f, the shaft portion 4 can be tilted by a small pressing force. (la) of Fig. 8 is a pedestal 5a of Fig. 7(a), and if it is inclined as in the case of (2a) of Fig. 8, the gap of the portion where the cutout portion 29a is located becomes small, and The gap on the opposite side becomes larger. (lb) of Fig. 8 is a pedestal 5b of Fig. 7(b), and if it is inclined as in the case of (2b) of Fig. 8, the gap of the portion where the cutout portion 29b is located becomes small, and At a portion on the opposite side to the contact with the elevating member 18, a void is formed. BRIEF DESCRIPTION OF THE DRAWINGS [Fig. 1] (a) and (b) are views for explaining a film forming apparatus of the present invention. Fig. 2 is a view for explaining a positional relationship between a shadow mask and a mask mounting device and a mounting table. [Fig. 3] A plan view of a mounting table. Fig. 4 is a plan view showing a mounting table in a state in which the substrate is aligned. Fig. 5 is a plan view showing a stage on which a substrate and a shadow mask are placed.
C -17- 201201316 [圖6] ( a)〜（d):用以對於載置台之基板的對位作 說明之圖。 [圖7] ( a)〜（f):用以對於在台座處而設置了空隙 之例作說明的圖。 [圖 8](1〇 、（2a) 、（lb) 、（2b):用以對於具 備有空隙之台座上的軸部作傾斜之狀態作說明的圖。 【主要元件符號說明】 2 :基板載置裝置 3 :筒部 4 :軸部 5 :台座部 6 :斜面 7:傾斜裝置（板狀彈簧） 8 :凸緣部 9 :貫通孔 12 :載置台 20 :基板 -18-C -17- 201201316 [Fig. 6] (a) to (d): a diagram for explaining the alignment of the substrate on the mounting table. [Fig. 7] (a) to (f): a diagram for explaining an example in which a gap is provided at a pedestal. [Fig. 8] (1〇, (2a), (lb), (2b): A diagram for explaining a state in which a shaft portion on a pedestal having a gap is inclined. [Description of main components] 2: Substrate Mounting device 3: tubular portion 4: shaft portion 5: pedestal portion 6: inclined surface 7: tilting device (plate spring) 8: flange portion 9: through hole 12: mounting table 20: substrate-18-