JP2010157526A - Substrate mounting device with alignment function, and film forming device including substrate mounting device - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a durable and inexpensive substrate placing device with an alignment function, and a film forming device including the substrate placing device. <P>SOLUTION: Through-holes 9 are arranged on four sides of a placing table 12. A cylinder part 3 and a shaft part 4 in which the cylinder part 3 is inserted are arranged in the through-hole 9. A flange part 8 is arranged on an upper end of the shaft part 4. A substrate 20 positioned above the placing table 12 is put on the flange part 8 by raising the cylinder part 3 and shaft part 4. The shaft parts 4 of the two sides out of the four sides are inclined by an inclination mechanism toward the shaft parts 4, which are other two sides for positioning, to press the substrate 20 and make in contact with a side surface of the shaft parts 4 of the sides for positioning to position the substrate. A camera and an XYθ stage are not necessary and accurate positioning can be achieved. <P>COPYRIGHT: (C)2010,JPO&INPIT

Description

  The present invention relates to a substrate mounting apparatus, and more particularly to a substrate mounting apparatus having an alignment function and a film forming apparatus in which the substrate mounting apparatus is arranged.

  Instead of photolithography that forms a thin film into a desired pattern by patterning a photoresist mask and etching, a shadow mask is placed on the surface of the film formation target during film formation. A technique for forming a thin film having a desired pattern by forming a shade has attracted attention.

  It is possible to use an alignment device such as a camera and an XYθ stage to align the film formation target with the shadow mask, but accuracy such as sub-micron order photolithography is required for the shadow mask. Therefore, there is a demand for development of a device that satisfies the required accuracy with a low-cost device.

  The present invention is a substrate mounting apparatus created in response to the above requirements, a substrate mounting apparatus that has a simple structure, has high durability against use, and can ensure the required accuracy, and a film forming apparatus using the substrate mounting apparatus About.

In order to solve the above problems, the present invention penetrates the mounting table at each of the four sides of the mounting table on which the quadrangular substrate is mounted and the quadrilateral larger than the substrate on the mounting table. A through-hole, a cylindrical portion inserted through the through-hole and capable of placing a substrate on the upper end, and inserted through the cylindrical portions, with the upper end positioned above the upper end of the through-hole and the cylindrical portion. A shaft part, formed below the tube part of each shaft part, a pedestal part on which the tube part is placed, and the pedestal part are placed, and is configured to be movable up and down with respect to the mounting table, A tilt member that tilts the shaft portion positioned on two sides of the four sides perpendicular to each other when the lift member moves up and down to move the tube portion up and down together with the shaft portion. A substrate mounting apparatus with an alignment function provided with a mechanism.
Moreover, this invention is a board | substrate mounting apparatus with an alignment function by which two or more said axial parts are arrange | positioned in one side of the remaining two sides different from the said two sides among the said four sides.
Further, according to the present invention, the tilt mechanism is deformed by the ascending / descending member ascending, and a downward restoring force to be restored is located on the inner side of the mounting table than the shaft portion of the pedestal portion. It is the board | substrate mounting apparatus with an alignment function which has the 1st spring member applied to a part.
Moreover, this invention is a board | substrate mounting apparatus with an alignment function which is a leaf | plate spring which the said spring member is provided in the said mounting base back surface, and is bent in contact with the said base part when the said raising / lowering member raises.
Further, the present invention provides a substrate mounting with an alignment function in which an inclined surface directed to the inside of the mounting table is provided at an upper end of the shaft portion located on at least two orthogonal sides among the four sides on which the shaft portion is disposed. Device.
Further, the present invention is the substrate mounting apparatus with an alignment function, wherein an upper end of the shaft portion having the inclined surface is formed in a conical shape, and a side surface of the cone is formed into the inclined surface.
Moreover, this invention has a flange part extended in a horizontal direction in the upper end of the said cylinder part, and the said board | substrate is a board | substrate mounting apparatus with an alignment function mounted on the said flange part.
In addition, the present invention has an alignment function that applies a downward restoring force, which is deformed when the elevating member is raised above a predetermined position, and is not inclined by the tilt mechanism, to the pedestal portion that is not inclined by the tilt mechanism. It is a substrate mounting device.
Further, the present invention provides a mounting table, a through-hole formed in at least two orthogonal positions of the quadrilateral on the mounting table, and a position on the other two sides of the two sides, A positioning member that stops at a fixed position, a cylindrical portion that is inserted through the through-hole and on which the substrate can be placed, and an upper end that is inserted into each cylindrical portion from the through-hole and the upper end of the cylindrical portion. A shaft portion positioned above, a pedestal portion on which each cylindrical portion is placed, and a pedestal portion on which each cylindrical portion is placed, and the pedestal portion is placed and moved up and down with respect to the mounting table. Alignment function comprising: an elevating member configured to move up and down together with the shaft portion, and an inclination mechanism that tilts the shaft portion inward of the mounting table when the elevating member is raised. This is a substrate mounting apparatus.
In addition, the present invention provides any one of the above-described substrate placement apparatuses, a mask placement apparatus for placing a shadow mask located above the substrate placement apparatus, and a film formation located above the mask placement apparatus. The film forming apparatus includes a source, a substrate mounting apparatus, the mask mounting apparatus, a vacuum chamber in which the film forming source is disposed, and a power mechanism for moving the lifting member up and down.

  The shadow mask above the mounting table is arranged so that a thin film can be formed at a predetermined position on the surface of the substrate when the substrate is arranged at the alignment position. The shadow mask and the substrate at the alignment position are The film is aligned, and a thin film with high positional accuracy can be formed.

  The tilting device is elastic, and a spring member is also provided on the shaft portion arranged on the positioning side, so that the substrate is not damaged when the substrate is moved and positioned.

Reference numeral 10 in FIG. 1A denotes a film forming apparatus of the present invention. The film forming apparatus 10 includes a vacuum chamber 11, a substrate mounting device 2, and a mask mounting device 13.
The substrate mounting device 2 has a mounting table 12. The mask mounting device 13 and the mounting table 12 are arranged horizontally.
The mask mounting device 13 has an opening at the center portion, and when the shadow mask 14 is arranged in the mask mounting device 13, the shadow mask 14 can be exposed vertically downward from the opening.
A shadow mask 14 is placed on the mask placing device 13.

  When forming a thin film on the substrate, the inside of the vacuum chamber 11 is evacuated by the evacuation system 23, the shadow mask 14 is moved away from the mounting table 12 together with the mask mounting device 13, and moved into the vacuum chamber 11. The substrate is loaded, and is stationary between the shadow mask 14 and the mounting table 12, the mounting table 12 is moved upward to place the substrate on the mounting table 12, and further lifted to bring the substrate into close contact with the shadow mask 14.

FIG. 1B shows this state, where the substrate 20 is placed on the mounting table 12 and is in close contact with the shadow mask 14.
Here, the film forming apparatus 10 is an apparatus for forming a thin film in a vacuum atmosphere such as a sputtering apparatus having a target or a CVD apparatus having a shower plate for introducing a source gas. The film source 15 is disposed near the ceiling of the vacuum chamber 11, and the shadow mask 14 and the substrate 20 are disposed in this order from above at a position below the film formation source 15.

FIG. 2 is a schematic perspective view of the mounting table 12, the mask mounting device 13, and the shadow mask 14.
One or a plurality of openings 21 are formed in the shadow mask 14, and a film formation material supplied from the film formation source 15 such as sputtering particles jumping out from the target or a source gas discharged from the shower plate is formed in the openings 21. , And reaches the surface of the substrate 20, a thin film is formed on the surface of the substrate 20 according to the formation of the opening 21.
At this time, if the shadow mask 14 and the substrate 20 are aligned, the thin film can be formed at a predetermined position on the substrate 20.

The alignment method of the present invention will be described.
A plan view of the mounting table 12 is shown in FIG. 3, and a longitudinal sectional view of the mounting table 12 before the substrate 20 is carried in is shown in FIG.
On the mounting table 12, through holes 9 are formed along the four sides of a rectangular or square quadrilateral 28 larger than the substrate 20, and the cylindrical portion 3 is vertically inserted into each through hole 9. . Here, the quadrilateral 28 is shown as a quadrilateral that passes through the central axis of each shaft portion 4 and forms a step.

The upper end of each cylinder part 3 is formed with a flange part 8 that expands in the horizontal direction. The flange part 8 of the cylinder part 3 located on the four sides is located at the same height, and the width of the flange part 8 is the flange part. A portion facing the inside of the mounting table 12 at the end of 8 is in contact with a quadrangle 26 smaller than the substrate 20. Therefore, the substrate can be placed on the flange portion 8.
A shaft portion 4 is vertically inserted into each tube portion 3, and an upper end of the shaft portion 4 protrudes above the upper end of the tube portion 3.

A pedestal portion 5 larger than the diameter of the shaft portion 4 is provided at the lower end of each shaft portion 4, and the cylindrical portion 3 is placed on the pedestal portion 5 so as to be separated from the pedestal portion 5.
Below the mounting table 12, an elevating member 18 is disposed. A vertical movement mechanism is disposed outside the vacuum chamber 11.

The elevating member 18 is connected to the vertical movement mechanism by the elevating shaft 19 of FIG. 1 that is airtightly inserted through the bottom surface of the vacuum chamber 11, and when the vertical movement mechanism operates, the elevating member 18 is evacuated inside the vacuum chamber 11. You can move up and down while maintaining the atmosphere.
The surface facing upward of the elevating member 18 has a flat portion, and the pedestal portion 5 of each shaft portion 4 is placed on the flat portion of the elevating member 18. When the elevating member 18 moves up and down, each shaft portion 4 and the tube portion 3 on the pedestal portion 5 of the shaft portion 4 move up and down together.

FIG. 6A shows a state in which the elevating member 18 is lowered before the substrate 20 is arranged, and a gap is formed between the mounting table 12 and the shadow mask 14 above the mounting table 12.
As shown by reference numeral 22 in FIG. 3, the side surface of each cylindrical portion 3 is larger than the substrate 20 and is disposed so as to contact a positioning quadrilateral (22) that allows the substrate 20 to be disposed inside. .

  Among the quadrilaterals 22 for alignment, the substrate 20 is aligned when the two predetermined sides 20a and 22b coincide with the preset two sides of the substrate 20. The shadow mask 14 is defined so that a thin film is formed at a desired position with respect to the aligned substrate 20.

  The substrate 20 is placed on the hand of the substrate transfer robot, the hand is carried into the vacuum chamber 11 from the adjacent chamber, and is stationary at a position on the mounting table 12 at a height between the shadow mask 14 and the mounting table 12. Next, when the elevating member 18 moves upward and the shaft portion 4 and the tube portion 3 are lifted together, the shaft portion 4 and the tube portion 3 pass between the fingers of the hand, and the shaft 20 is positioned above the substrate 20. The upper end of the part 4 tries to protrude.

An inclined surface 6 facing the inner side of the mounting table 12 is formed at the upper end of the shaft portion 4 located on two orthogonal sides among the shaft portions 4 arranged along the four sides. When 4 and the cylindrical portion 3 protrude above the substrate 20, they ride on the flange portion 8 without contacting the slope 6, or once ride on the slope 6 and slide down on the slope 6 and ride on the flange portion 8. .
Therefore, in order to place the substrate 20 on the flange portion 8, the substrate 20 is positioned in a quadrilateral that connects the side surfaces and apexes of the shaft portion 4 wider than the quadrangle 22 for alignment, and the shaft portion 4. And the cylinder part 3 can be raised from the downward direction of a board | substrate.

FIG. 6B is a side view showing a state in which the substrate 20 is on the flange portion 8. In this state, the substrate 20 is disposed in the alignment quadrilateral 22 on the flange portion 8. In this case, each shaft portion 4 is vertical, and the substrate 20 disposed in the alignment quadrilateral 22 is in contact with the side surfaces of the shaft portion 4 that are located on two orthogonal sides at the maximum. Although it can do, it cannot touch simultaneously the side surface of all the axial parts 4 located in four sides.
The substrate mounting device 2 has a tilting device that tilts the shaft portion 4 positioned on the two sides 22c and 22d other than the positioning two sides 22a and 22b.

Here, the tilting device is composed of a leaf spring 7 provided on the back surface of the mounting table 12. When the elevating member 18 is raised, the leaf spring 7 is disposed on the pedestal portion 5 so as to be able to come into contact with the inner side portion of the mounting table 12. After the elevating member 18 is further raised after contact, The leaf spring 7 is bent, and the portion that contacts the tip of the leaf spring 7 is pressed by the restoring force.
A gap is formed between the shaft portion 4 on the pedestal portion 5 and the cylindrical portion 3, and the shaft portion 4 against which the pedestal portion 5 is pressed is inclined toward the inner side of the mounting table 12. .

  When the shaft portion 4 is inclined, the size of the alignment quadrilateral 22 that can come into contact with the side surface of each shaft portion 4 is also reduced, and the substrate 20 cannot protrude outside the alignment quadrilateral 22. The board | substrate 20 is pressed by the part 4, and moves to the direction of two sides 22a and 22b for positioning. FIG. 6C shows a state where the substrate 20 is pressed.

When the alignment quadrilateral 22 becomes smaller and the size thereof becomes equal to the size of the substrate 20, the edge of the substrate 20 comes into contact with the side surface of the shaft portion 4 located on the four sides. At this time, the two sides of the substrate 20 that are disposed in proximity to the positioning two sides 22a and 22b in advance coincide with the positioning two sides 22a and 22b.
When further tilting is attempted, the shaft portion 4 presses the substrate 20 toward the shaft portion 4 that does not tilt.

  The shaft portion 4 positioned on the two sides 22a and 22b for alignment is also separated from the inner peripheral surface of the cylindrical portion 3, and a gap is formed therebetween. Further, a spring member 17 is disposed between the pedestal portion 5 of the shaft portion 4 and the mounting table 12, and the spring member 17 is also compressed when the plate spring 7 tilts the shaft portion 4. When the shaft portion 4 positioned on the alignment two sides 22 a and 22 b is pressed by the substrate 20, the shaft portion 4 is slightly tilted, and the pressing force by the substrate 20 is absorbed by the deformation of the spring member 17.

  When the mounting table 12 is raised (or the elevating member 18 is lowered) so as to return to the original position from that state, the deformation of the leaf spring 7 and the spring member 17 is restored, and the pressing force on the substrate 20 disappears. The substrate 20 maintains a state in which the two sides of the substrate 20 coincide with the positioning two sides 22a and 22b. This state is a state in which the substrate 20 is aligned. As shown in FIG. 4, the substrate 20 is stationary with respect to the flange portion 8 at the alignment position.

  At this time, when the plate spring 7 and the spring member 17 are restored in deformation, the pedestal portion 5 is pressed toward the lifting member 18 by the restoring force, so that the cylindrical portion 3 and the shaft portion 4 are caught by the edge of the through hole 9. It is not fixed to the mounting table 12 and separated from the lifting member 18.

The mounting table 12 is provided with a bottomed or non-bottomed groove for accommodating the flange portion 8. When the mounting table 12 is relatively moved to the same height as the flange portion 8, the substrate 20 is in an aligned state. It is placed on the mounting table 12.
Further, due to the lowering of the mask placing device 13 and the raising of the substrate placing device 2, as shown in the plan view of FIG. 5 and the side view of FIG. The aligned substrate 20 and the shadow mask 14 are in close contact with each other, and a thin film is formed on the substrate 20 on the bottom surface of the opening 21 of the shadow mask 14.

  As described above, the shadow mask 14 arranged in the mask placing device 13 is arranged so that a thin film can be formed at a predetermined position on the surface of the substrate 20 when the substrate 20 is aligned. When the substrate 20 is aligned, the shadow mask 14 and the substrate 20 are aligned, and a thin film with high positional accuracy can be formed.

  In the above embodiment, the shaft portion 4 inserted into the cylindrical portion 3 is disposed at the positions of the two sides 22a and 22b for alignment. However, the positioning member of the present invention has the substrate 20 on the side surface of the shaft portion 4. The member is not limited to the positioning member, and may be a member that stops the movement of the substrate such as a protrusion or a ridge instead of the shaft portion 4 other than the shaft portion 4 that moves the substrate 20 in an inclined manner.

  In the above embodiment, two cylindrical portions 3 and shaft portions 4 are provided on each of the four sides. However, the number of the cylindrical portions 3 and the shaft portions 4 is not limited to this. When positioning by partial contact, one of the two positioning sides may be provided on one side and two on the other side so as to be in contact with the substrate 20.

  In addition, although the said inclination apparatus 7 was the leaf | plate spring 7 provided in the mounting base 12, the leaf | plate spring provided in the base part 5 may be sufficient, and not a leaf | plate spring but a spiral spring, Also good.

(a), (b): The figure for demonstrating the film-forming apparatus of this invention The figure for demonstrating the positional relationship of a shadow mask, a mask mounting apparatus, and a mounting base. Plan view of mounting table Plan view of mounting table with substrate aligned Plan view of mounting table with substrate and shadow mask (a)-(d): The figure for demonstrating alignment of the board | substrate of a mounting base

Explanation of symbols

2 ... Substrate placing device 3 ... Cylinder 4 ... Shaft 5 ... Pedestal 6 ... Slope 7 ... Tilt device (leaf spring)
8 ... Flange 9 ... Through-hole 12 ... Mounting table 20 ... Substrate

Claims (10)

A mounting table on which a quadrilateral substrate is mounted;
A through hole penetrating the mounting table at each of the four sides of the quadrilateral larger than the substrate on the mounting table,
A cylindrical portion that is inserted through each of the through holes and on which the substrate can be placed;
A shaft portion that is inserted through each of the tube portions, and whose upper end is located above the through hole and the upper end of the tube portion;
A pedestal portion formed below each cylindrical portion of each shaft portion, on which each cylindrical portion is placed;
An elevating member that mounts the pedestal portion and is configured to be movable up and down relative to the mounting table, and moves the cylindrical portion up and down together with the shaft portion;
When the elevating member rises, an inclination mechanism that inclines the shaft portion positioned on two sides orthogonal to each other in the four sides toward the inner side of the mounting table,
A substrate mounting apparatus with an alignment function provided with   The substrate mounting apparatus with an alignment function according to claim 1, wherein two or more of the shaft portions are arranged on one side of the remaining two sides different from the two sides among the four sides.   The tilting mechanism is deformed by the ascending / descending member ascending, and applies a downward restoring force to which the deformation is to be restored to a portion of the pedestal portion that is located inside the mounting table before the shaft portion. The board | substrate mounting apparatus with an alignment function of any one of Claim 1 or Claim 2 which has this spring member.   4. The substrate mounting apparatus with an alignment function according to claim 3, wherein the spring member is a plate spring provided on the back surface of the mounting table and bent when contacting the pedestal portion when the lifting member is raised.   The slope according to any one of claims 1 to 4, wherein an inclined surface directed to the inside of the mounting table is provided at an upper end of the shaft portion located at least on two sides orthogonal to each other among the four sides on which the shaft portion is disposed. The substrate mounting apparatus with an alignment function according to the item.   6. The substrate mounting apparatus with an alignment function according to claim 5, wherein an upper end of the shaft portion having the inclined surface is formed in a conical shape, and a side surface of the cone is formed into the inclined surface.   The substrate mounting with an alignment function according to any one of claims 1 to 6, wherein a flange portion that extends in a horizontal direction is provided at an upper end of the cylindrical portion, and the substrate is mounted on the flange portion. apparatus.   8. The device according to claim 1, wherein the lifting member is deformed when it is raised above a predetermined position, and a downward restoring force to restore the deformation is applied to the pedestal portion of the shaft portion that is not tilted by the tilt mechanism. The substrate mounting apparatus with an alignment function according to claim 1. A mounting table;
A through-hole formed at the position of at least two orthogonal sides of the quadrilateral on the mounting table;
A positioning member provided at the position of the other two sides of the two sides and stopping the substrate at a fixed position;
A cylindrical portion that is inserted through each of the through holes and on which the substrate can be placed;
A shaft portion that is inserted through each of the tube portions, and whose upper end is located above the through hole and the upper end of the tube portion;
A pedestal portion formed below each cylindrical portion of each shaft portion, on which each cylindrical portion is placed;
An elevating member that mounts the pedestal portion and is configured to be movable up and down relative to the mounting table, and moves the cylindrical portion up and down together with the shaft portion;
When the elevating member rises, an inclination mechanism that inclines the shaft portion toward the inner side of the mounting table,
A substrate mounting apparatus with an alignment function.   10. The substrate placement device according to claim 1, a mask placement device for placing a shadow mask positioned above the substrate placement device, and above the mask placement device. A film forming apparatus comprising: a film forming source positioned; a substrate mounting apparatus; the mask mounting apparatus; a vacuum chamber in which the film forming source is disposed; and a power mechanism for moving the elevating member up and down.

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