JP7329996B2 - Substrate holder - Google Patents

Description

The present invention relates to a substrate holding device.

In semiconductor manufacturing equipment, an electrostatic attraction electrode is embedded in a base material, and a substrate such as a semiconductor wafer is held by electrostatic attraction in order to perform various processes such as measurement, transportation, and processing on the substrate. device is known. In such a substrate holding device, it is necessary to eliminate the deformation and hold the substrate evenly, even if the substrate is deformed by bending or warping.

Patent Document 1 discloses a divided electrostatic chuck structure in which regular hexagonal electrostatic chucks each supported by three elevating columns are arranged in a honeycomb pattern. Each electrostatic chuck tilts or ascends and descends according to the extension and contraction of each elevation column.

JP 2006-135062 A

However, since the substrate cannot be attracted by the electrostatic force at a location away from the surface of the base material, it has been difficult to flatly attract and hold a substrate that is greatly deformed.

In addition, in the divided electrostatic chuck structure disclosed in Patent Document 1, expansion and contraction of the elevating columns that support the respective electrostatic chucks must be independently controlled, which is difficult to control. Furthermore, by measuring the distance and inclination of the arrangement of the attracting surfaces of the electrostatic chuck with a laser displacement gauge provided on the XY plane, highly accurate flatness of the attracting surface is realized. However, with this method, it is impossible to measure the gap between the attraction surface of the electrostatic chuck and the substrate placed thereon, and it is not assumed that the deformed substrate is flatly attracted. .

SUMMARY OF THE INVENTION It is an object of the present invention to provide a substrate holding device capable of easily and flatly holding a deformed substrate by suction.

A substrate holding apparatus according to the present invention includes a plurality of mounting members each having a mounting surface on which a substrate is mounted, and electrostatically holding the substrate provided on at least one mounting member among the plurality of mounting members. and an electrostatic chucking electrode for chucking, wherein the mounting member has a chamfered chamfer or a rounded chamfer at an upper end corner of the mounting member, and at least the electrostatic chucking among the plurality of mounting members. A first mounting member provided with an electrode and a second mounting member interposed between the first mounting member and the first mounting member are movable in a direction perpendicular to the mounting surface. When the first mounting member moves in a direction perpendicular to the mounting surface, the mounting surface of the second mounting member moves along with the movement of the first mounting member. It is characterized by moving in a direction perpendicular to the mounting surface toward the height position of the mounting surface of the member.

According to the present invention, when the first mounting member moves in a direction perpendicular to the mounting surface, the mounting surface of the second mounting member moves along with the movement of the first mounting member. Since it moves in a direction perpendicular to the mounting surface toward the height position of the mounting surface, only by moving the first mounting member, the second mounting member also moves to the height of these mounting surfaces. move to reduce the difference between Therefore, when the mounting surface of the first mounting member is moved to come into contact with or approach the substrate, the mounting surface of the second mounting member also comes into contact with or comes close to the substrate. Moving. Therefore, it is possible to eliminate the deformation of the substrate and hold it flat without performing a large number of expansion/contraction controls as described in Patent Document 1 above.

In the present invention, it is preferable that the interposed member is a connecting member made of an elastic body, and the first mounting member and the second mounting member are connected by the connecting member.

Further, in the present invention, the first placement member and the second placement member have a portion that overlaps with the placement surface in a direction perpendicular to the placement surface, and the first placement member and the second placement member overlap each other. It is also preferable that the intervening member made of an elastic material is arranged between the overlapping portions of the placement member.

In these cases, it is possible to easily realize a configuration in which the second mounting member moves along with the first mounting member arranged via the intervening member.

In the present invention, it is preferable that all gaps between adjacent mounting members of the plurality of mounting members are airtightly sealed.

In this case, it is possible to create a pressure difference between the space on the side of the mounting surface on which the substrate is mounted and the space on the opposite side of the mounting surface. It may be possible to move

1 is a schematic top view showing a substrate holding device according to a first embodiment of the present invention; FIG. FIG. 2 is a schematic cross-sectional view taken along line II-II of FIG. 1; FIG. 4 is a schematic cross-sectional view showing a state in which the mounting member is in the process of being raised; FIG. 4 is a schematic cross-sectional view showing a state in which all mounting members are lifted; FIG. 4 is a schematic cross-sectional view showing a state in which all mounting members are lowered; FIG. 4 is a schematic cross-sectional view showing a substrate holding device according to a modification of the first embodiment of the present invention; FIG. 4 is a schematic cross-sectional view showing a state in which the mounting member is in the process of being raised; FIG. 4 is a schematic cross-sectional view showing a state in which all mounting members are lifted; FIG. 5 is a schematic top view showing a substrate holding device according to another modification of the first embodiment of the present invention; FIG. 4 is a partially enlarged schematic cross-sectional view showing a substrate holding device according to another modification of the first embodiment of the present invention; FIG. 4 is a schematic cross-sectional view showing a substrate holding device according to a second embodiment of the present invention; FIG. 5 is a schematic cross-sectional view showing a substrate holding device according to a third embodiment of the present invention;

A substrate holding device 100 according to a first embodiment of the present invention will be described with reference to the drawings. In the drawings, the substrate holding device 100 and its constituent elements are deformed for clarity, and do not represent actual ratios, and directions such as up and down are merely examples.

1 and 2, a substrate holding apparatus 100 includes a base 10 and a plurality of mounting members 11 supported by an apparatus main body 10 and having mounting surfaces 11a to 14a on which substrates W are mounted. 14. These mounting members 11 to 14 are configured to be movable with respect to the base 10 in a direction perpendicular to the mounting surfaces 11a to 14a (vertical direction in FIG. 1, hereinafter referred to as vertical direction). However, it is also possible to move in directions other than the vertical direction, that is, in directions parallel to the mounting surfaces 11a to 14a with respect to the base 10 (horizontal direction in FIG. 1, hereinafter referred to as the horizontal direction), and furthermore, the mounting surface 11a. 14a may be tiltable.

Here, the mounting surface 11a has a circular shape, and the mounting surfaces 12a to 14a have annular shapes surrounding the mounting surfaces 11a to 13a, respectively. However, gaps are provided between the mounting surfaces 11a to 14a. The mounting member 11 has a substantially columnar shape with a mounting surface 11a as an upper surface, and the mounting members 12 to 14 have a substantially cylindrical cylindrical shape with mounting surfaces 12a to 14a as upper surfaces. In this embodiment, the mounting member 11 corresponds to the first mounting member of the invention, and the mounting member 12 corresponds to the second mounting member of the invention.

Each of the mounting surfaces 11a to 14a may be a wide planar surface or may be a group of flat tip surfaces of a plurality of projections. The group of flat tip surfaces of the plurality of protrusions is, for example, a group of flat tip surfaces of a large number of pins (protrusions) or the tip surfaces of a plurality of annular ribs (protrusions). good too.

Each of the mounting surfaces 11a to 14a is a group of flush tip surfaces of a large number of pins, and the mounting surface 14a has an annular rib tip surface surrounding the group of pin tip surfaces. may At this time, the tip surface of the rib may be lower than the tip surface of the pin.

The base 10 is formed with a recess 10 a having a peripheral surface that follows the outer peripheral surface of the mounting member 14 . As a result, the mounting members 11 to 14 are accommodated in the recess 10a of the base 10. As shown in FIG.

Further, each mounting member 11-14 incorporates a single or a set of electrodes 11b-14b, respectively. These electrodes 11b to 14b are electrodes for electrostatic attraction, which generate electrostatic force between the electrodes 11b to 14b and the substrate W when electric power is supplied to electrostatically attract the substrate W to the mounting surfaces 11a to 14a. By providing such electrodes 11b to 14b, the substrate holding device 100 functions as an electrostatic chuck.

Each of the electrodes 11b to 14b is provided with power supply portions 11c to 14c whose ends are exposed on the surface (lower surface) opposite to the mounting surfaces 11a to 14a of the mounting members 11 to 14. .

Further, the base 10 has built-in power supply units 31 to 34 electrically connected to the external power supply 20, respectively, and the ends of these are exposed at the bottom surface 10b of the concave portion 10a of the base 10, respectively. there is The end portions of the power feeding portions 11c to 14c and the end portions of the power feeding portions 31 to 34 are electrically connected by connecting members 41 to 44, respectively.

The connection members 41 to 44 are preferably made of elastic bodies such as springs made of a conductive material. Also, the connection members 44 to 44 may be made of a conductive material and configured as a flexible cord. Thus, even when the mounting members 11 to 14 move vertically with respect to the base 10, the electrical connections between the electrodes 11b to 14b and the external power source 20 are maintained.

In FIG. 2, the connection members 41 to 44 are housed in respective recesses 10c formed in the bottom surface 10b of the recess 10a of the base 10. As shown in FIG. By constructing in this manner, the connection members 41 to 44 have a certain length, and thus the amount of change in expansion and contraction is ensured.

Further, a connecting member 51 is provided between the mounting members 11 and 12, a connecting member 52 is provided between the mounting members 12 and 13, and a connecting member 52 is provided between the mounting members 13 and 14. Connecting members 53 are respectively provided between them. Incidentally, the connecting members 51 to 53 correspond to intervening members of the present invention.

Each of the connecting members 51-53 is one or plural in number, and preferably arranged symmetrically between the mounting members 11-14. Also, the connecting members 51-53 may extend over the entire gaps between the mounting members 11-14. The connecting members 51 to 53 are preferably made of an elastic material such as silicon, natural rubber, synthetic rubber, various springs, or the like. As a result, variations in the distance between the mounting members 11 to 14 are allowed.

Since the mounting member 12 is configured in this way, the height position of the mounting surface 12a is adjusted to the mounting surface via the connecting member 51 as the mounting member 11 moves (elevates) in the vertical direction. It is configured to move toward the height position of 11a. However, at this time, the placement member 12 is not limited to one that moves only in the vertical direction, and may be one that accompanies horizontal movement or tilting.

It is preferable that the mounting member 12 moves along with the vertical movement of the mounting member 11 until the mounting surface 12a becomes flush with the mounting surface 11a. However, the mounting surface 12a and the mounting surface 11a may have a slight difference in height position, and even if the mounting surface 12a and the mounting surface 11a are not parallel and have a slight difference in inclination. good. Such a relationship between the mounting surface 11a and the mounting surface 12a also applies to the relationship between other adjacent mounting surfaces 12a to 14a.

The substrate holding device 100 further includes an elevating mechanism 21 for elevating the mounting member 11 with respect to the base 10 . This elevating mechanism 21 is, for example, a piezo element, a linear motor, an air cylinder, or the like. A control mechanism 22 is connected to the lifting mechanism 21 for controlling the lifting operation of the mounting member 11 by the lifting mechanism 21 .

Next, a method for electrostatically attracting the substrate W using the substrate holding device 100 will be described. The substrate holding apparatus 100 is particularly suitable for flattening and sucking the substrate W when the central portion of the substrate W is bent upwardly as shown in FIG. .

When the substrate W is placed on the mounting surfaces 11a to 14a, the substrate W is in contact with the mounting surface 14a located at the peripheral portion. is not in contact with the mounting surfaces 11a to 13a of the . In this state, even if power is supplied from the external power supply 20 to the electrodes 11b to 14b, the substrate W cannot be attracted to the mounting surfaces 11a to 13a, particularly the mounting surface 11a, by the electrostatic attraction force. .

Therefore, while power is being supplied from the external power source 20 to the electrodes 11b to 14b, the control mechanism 22 controls the lifting mechanism 21 to move the mounting member 11 upward, referring to FIG. 3A. The placement surface 11a is brought into contact with the substrate W. As shown in FIG. At this time, the substrate W in contact with the mounting surface 11a may be lifted and the mounting surface 14a and the substrate W may be separated. Further, there may be a gap between the mounting surface 11a and the substrate W that allows the substrate W to be attracted to the mounting surface 11a depending on the electrostatic attraction force. In FIG. 3A and subsequent figures, the electrodes 11b to 11d and a mechanism for supplying power to them are omitted from illustration.

As the mounting member 11 moves upward, the mounting member 12 connected to the mounting member 11 via the connecting member 51 also moves upward. However, since the connecting member 51 is made of an elastic material or the like, the mounting member 12 moves later than the mounting member 11 . Similarly, the mounting member 13 and the mounting member 14 move upward later than the mounting member 12 and 13, respectively.

As a result, the height position increases in the order of the mounting surface 11a, the mounting surface 12a, the mounting surface 13a, and the mounting surface 14a. Since the mode of the height position is the same as the mode of bending of the substrate W, the distance between the substrate W and each mounting surface 11a to 14a is shortened. Therefore, the substrate W can be electrostatically attracted to each of the mounting surfaces 11a to 14a.

Since the connecting members 51 to 53 made of elastic bodies or the like are deformed so as to return to the original shape, the difference in the height positions of the mounting surfaces 11a to 14a is then eliminated as shown in FIG. 3B. Thereby, the substrate W is flatly sucked and held on the mounting surfaces 11a to 14a. However, it is preferable that the mounting surfaces 11a to 14a are flush with each other without a difference in height position, but within the allowable range, a difference in height position or inclination exists between the mounting surfaces 11a to 14a. good too.

After that, the control mechanism 22 controls the lifting mechanism 21 so that the mounting member 11 moves downward. At this time, the mounting members 11 to 14 are connected not only by the connecting members 51 to 53, respectively, but also by the substrates W adsorbed and held on the mounting surfaces 11a to 14a. Here, since the substrate W is not an elastic body, the mounting members 12 to 14 move almost together with the mounting member 11 as it moves to the mounting member 11, that is, the difference in the height positions of the mounting surfaces 11a to 14a. moves almost unchanged.

As a result, as shown in FIG. 3C, the substrate W is flatly sucked and held on the mounting surfaces 11a to 14a with the mounting members 11 to 14 moved downward.

In the method described above, the mounting member 11 starts to move upward while power is being supplied from the external power source 20 to the electrodes 11b to 14b, but the method is not limited to this. For example, the mounting member 11 first starts moving upward, and the mounting surface 11a contacts the substrate W at the moment or immediately after that, or when the mounting surface 11a approaches the substrate W to such an extent that electrostatic adsorption is possible. Then, the supply of power from the external power supply 20 to each of the electrodes 11b to 14b may be started.

Next, referring to FIG. 4A, a substrate holding device 110, which is a modification of substrate holding device 100, will be described. In the substrate holding device 100 , the elevating mechanism 21 elevates the mounting member 11 , but the substrate holding device 110 differs in that the elevating mechanism 21 elevates the mounting member 14 . In this embodiment, the mounting member 14 corresponds to the first mounting member of the invention, and the mounting member 13 corresponds to the second mounting member of the invention.

The substrate holding device 110 is particularly suitable for flattening and sucking the substrate W when the central portion of the substrate W is bent downwardly.

When the substrate holding device 110 is used to electrostatically attract the substrate W thus bent, first, while power is being supplied from the external power supply 20 to the electrodes 11b to 14b, the control mechanism 22 raises the mounting member 14. The mounting surface 14a is brought into contact with the substrate W by controlling the lifting mechanism 21 so as to move in the direction.

Accompanying the upward movement of the mounting member 14, the mounting member 13, the mounting member 12, and the mounting member 11 move upward in this order with a delay. As a result, as shown in FIG. 4B, the height positions of the mounting surface 14a, the mounting surface 13a, the mounting surface 12a, and the mounting surface 11a increase in this order. Since the mode of the height position is the same as the mode of bending of the substrate W, the distance between the substrate W and each mounting surface 11a to 14a is shortened. Therefore, the substrate W can be electrostatically attracted to each of the mounting surfaces 11a to 14a.

After that, the connecting members 51 to 53 made of an elastic material or the like are deformed so as to return to the original shape, so that the difference in the height positions of the mounting surfaces 11a to 14a is eliminated as shown in FIG. 4C. Thereby, the substrate W is flatly sucked and held on the mounting surfaces 11a to 14a.

Thereafter, the elevating mechanism 21 is controlled by the control mechanism 22 so that the mounting member 14 moves downward. As the mounting member 14 moves, the mounting members 11 to 13 move substantially together with the mounting member 14 .

As a result, the substrates W are flatly adsorbed and held on the mounting surfaces 11a to 14a with the mounting members 11 to 14 moved downward.

In addition, in the above-described first embodiment and its modification, the elevating mechanism 21 raises and lowers only one mounting member 11 or 14 has been described. However, it is not limited to this, and for example, two elevating mechanisms for independently elevating the mounting members 11 and 14 may be provided. As a result, it is possible to evenly suck the substrate W that is bent such that the central portion is convex upward or downward. Furthermore, by simultaneously operating the two lifting mechanisms when lowering the sucked substrate W, it is possible to more reliably prevent the substrate W from being bent or the like during the lowering.

Also, the description has been given of the mounting surfaces 11a to 14a having a central circular shape and three ring-shaped ones surrounding it in order. However, the shape and number of the mounting surfaces 11a to 14a are not limited to this.

For example, as shown in FIG. 5, four mounting surfaces 62a to 65a are formed in an annular shape as a whole around a circular mounting surface 61a, and four mounting surfaces 66a to 69a are formed as a whole on the outer side of the circular mounting surface 61a. It may be circular. In this case, adjacent placement surfaces 61a to 69a are connected by intervening members . In this case, the elevating mechanism 21 is not shown, but when sucking the substrate W bent so that the central portion is convex upward, the mounting member 61 having the mounting surface 61a can be moved up and down so that the central portion is In the case of sucking a substrate W bent in a downwardly protruding manner, all or at least one of the mounting members 66 to 69 having mounting surfaces 66a to 69a may be made vertically movable. .

In addition, one mounting member (corresponding to the first mounting member of the present invention) configured to be vertically movable by an elevating mechanism, and another mounting member that is not directly elevated by the elevating mechanism (this (corresponding to the second placing member of the invention) is included in the scope of the present invention. For example, although not shown, referring to Patent Document 1, a plurality of regular hexagonal mounting surfaces are arranged in a honeycomb pattern, and mounting members having these mounting surfaces are arranged via intervening members. It is sufficient that at least one of the mounting members is configured to be vertically movable by a lifting mechanism.

The shape, arrangement and number of mounting surfaces, and the number and selection of mounting members that can be raised and lowered by the lifting mechanism may be determined according to the deformation mode of the substrate W to be picked up. Further, the placement members may be configured to be movable up and down independently of the other placement members, and for example, all the placement members may not be connected to the other placement members by intervening members.

Furthermore, as shown in FIG. 2, it is preferable that the connecting members 51 to 53 are provided over the entire side surfaces of the mounting members 11 to 14 in the vertical direction. As a result, it is possible to improve the strength of the connecting members 51 to 53, and to stabilize the movement of the mounting members 11 to 14 in the vertical direction. However, although not shown, the connecting members 51 to 53 may be provided only on part of the side surfaces of the mounting members 11 to 14 in the vertical direction, and may be arranged so as to connect the lower surfaces of the mounting members 11 to 14. may be provided in

Furthermore, when the height positions of the mounting surfaces 11a to 14a are different, the corners of the mounting surfaces 11a to 14a may come into contact with the rear surface of the substrate W, causing the substrate W to float with respect to the mounting surfaces 11a to 14a. occurs. Therefore, as shown in FIG. 6, chamfering such as C-chamfering or R-chamfering is performed on the upper end corners of the mounting members 11 to 14 . This makes it possible to prevent the substrate W from floating.

Furthermore, the case where power is independently supplied from the power supply units 31 to 34 arranged on the base 10 side to the electrodes 11b to 14b embedded in the mounting members 11 to 14 has been described. However, not limited to this, the electrodes 11b to 14b are fed via power supply units (not shown) disposed on the mounting members 11 to 14 adjacent to the mounting members 11 to 14 in which the electrodes 11b to 14b are embedded. Electric power may be supplied from a power supply unit arranged on the base 10 side.

Next, a substrate holding device 200 according to a second embodiment of the present invention will be described with reference to FIG. This substrate holding device 200 includes the shape, number, mechanism, and arrangement of the substrate holding device 100, the mounting surfaces 11a to 14a, and the elevating mechanism 21, and the shape, number, mechanism, and arrangement of the electrodes 11b to 14b. have the same feeding mechanism for these electrodes 11b to 14b. Therefore, the description of these and the illustration of the power feeding mechanism are omitted.

In the substrate holding device 200, the mounting members 71 to 74 having adjacent mounting surfaces 11a to 14a have overlapping portions in a direction perpendicular to the mounting surfaces 11a to 14a, that is, in the vertical direction. Interposed members 81 to 83 are arranged therebetween. In this embodiment, the mounting member 71 corresponds to the first mounting member of the invention, and the mounting member 72 corresponds to the second mounting member of the invention.

Here, specifically, annular protrusions 71a to 73a are formed in the lower portions of the mounting members 71 to 73 so as to protrude outward, and the upper portions of the mounting members 72 to 74 are provided on the center side. Annular protrusions 72b to 74b are formed so as to protrude toward. The projecting portions 71a to 73a and the projecting portions 72b to 74b are configured to have overlapping portions in the vertical direction, and intervening members 81 to 83 are respectively arranged between the overlapping portions.

Although the intervening members 81 to 83 are O-rings made of silicon rubber here, they may be members made of other elastic bodies, such as annular ones made of other rubber, annular springs, and the like. Such an annular shape is preferable because it is stably held between the protrusions 71a to 73a and the protrusions 72b to 74b.

However, the intervening members 81 to 83 are not limited to an annular shape, and may be an annular shape having a notch, or may be composed of a plurality of members. When the intervening members 81 to 83 are composed of a plurality of members, at least one of the protrusions 71a to 73a or the protrusions 72b to 74b is provided with a It is preferable to provide a guide or the like to prevent these from coming off.

In the substrate holding device 200 configured as described above, as the mounting member 71 moves upward, the mounting member 72 connected to the mounting member 71 via the intervening member 81 also moves. Move up. However, since the intervening member 81 is made of an elastic material, the placement member 72 moves later than the placement member 11 . Similarly, the mounting member 73 and the mounting member 74 move upward later than the mounting member 72 and 73, respectively.

In this manner, the substrate holding device 200 operates in the same manner as the substrate holding device 100, so that it is possible to flatly support the substrate W that is bent so that the central portion protrudes from the substrate holding device 100. becomes.

Next, a substrate holding device 300 according to a third embodiment of the present invention will be described with reference to FIG. The substrate holding device 300 includes the above-described substrate holding device 100, the mounting surfaces 11a to 14a, the mounting members 11 to 14, etc. in shape, number, mechanism, and arrangement, and the electrodes 11b to 14b in shape, number, mechanism, and arrangement. The arrangement as well as the feeding mechanism for these electrodes 11b-14b are the same. Therefore, the description of these and the illustration of the power feeding mechanism are omitted.

Unlike the substrate holding apparatus 100, the substrate holding apparatus 300 does not include the lifting mechanism 21 and the control mechanism 22 for controlling it. Instead, the substrate holding device 300 is connected so as to communicate with the space S1 formed by the gaps between the recess 10a of the base 10 and the mounting members 11 to 14, and is capable of changing the pressure in the space S1. A pressure adjustment mechanism 91 is provided.

The entire substrate holding apparatus 300 is also surrounded by a vacuum chamber 92 . In this vacuum chamber 92, more specifically, an internal pressure adjusting mechanism 93 is provided so as to communicate with the space S2 outside the substrate holding device 300 and is capable of changing the pressure in the space S2. . The internal pressure adjustment mechanisms 91 and 93 are each composed of, for example, a pump such as a vacuum pump and a control mechanism for controlling the pump.

Furthermore, the connecting members 51 to 53 are configured so that all the gaps between the adjacent mounting members 11 to 14 are hermetically sealed. For example, in the connecting member 51, an adhesive agent made of silicone rubber or the like fills an annular gap between the mounting members 11 and 12 in an airtight manner. Further, as in the above-described second embodiment, the mounting members 71 to 74 may be formed of O-rings or the like disposed between the vertically overlapping portions.

Further, the outer peripheral surface of the mounting member 14 and the inner peripheral surface of the concave portion 10a of the base 10 are airtight. Moreover, it may be constructed so as to be airtight with a packing, an O-ring, or the like between them.

Furthermore, the connecting member 51 is configured to deform more easily than the connecting member 52 , and the connecting member 52 is configured to deform more easily than the connecting member 53 .

Next, a method for electrostatically attracting the substrate W using the substrate holding device 300 will be described. The substrate holding apparatus 300 is particularly suitable for flattening and sucking the substrate W when the central portion of the substrate W is bent upwardly.

First, by controlling at least one of the internal pressure adjusting mechanisms 91 and 93 while supplying power from the external power supply 20 to the electrodes 11b to 11d, the internal pressure P1 of the space S1 is made higher than the internal pressure P2 of the space S2. Let As a result, the mounting members 11 to 14 move upward so as to increase the volume of the space S1.

At this time, by varying the material, height (thickness) and width of the connecting members 51 to 53, the connecting members 51, 52 and 53 are easily deformed in this order. As a result, the mounting member 12 moves upward after the mounting member 11, the mounting member 13 moves upward after the mounting member 12, and the mounting member 14 moves upward after the mounting member 13. do. As a result, the height position increases in the order of the mounting surface 11a, the mounting surface 12a, the mounting surface 13a, and the mounting surface 14a. Since the mode of the height position is the same as the mode of bending of the substrate W, the distance between the substrate W and each mounting surface 11a to 14a is shortened. Therefore, the substrate W can be electrostatically attracted to each of the mounting surfaces 11a to 14a.

After that, the connecting members 51 to 53 made of an elastic body are deformed so as to return to the original shape, so that the difference in the height positions of the mounting surfaces 11a to 14a is eliminated. Thereby, the substrate W is flatly sucked and held on the mounting surfaces 11a to 14a. However, although it is preferable that the mounting surfaces 11a to 14a are flush with each other without any difference in height position, if the mounting surfaces 11a to 14a have a difference in height position or an inclination within an allowable range, the mounting surfaces 11a to 14a may have different heights. good too.

After that, by controlling at least one of the internal pressure adjusting mechanisms 91 and 93, the internal pressure P1 of the space S1 is made smaller than the internal pressure P2 of the space S2. As a result, the mounting members 11 to 14 move downward so as to reduce the volume of the space S1. As a result, the mounting members 11 to 14 move substantially together, that is, the difference in height position between the mounting surfaces 11a to 14a does not substantially change. As a result, the substrate W is flatly sucked and held on the mounting surfaces 11a to 14a.

If the connecting member 51 is configured to be less deformable than the connecting member 52 and the connecting member 52 is more difficult to deform than the connecting member 53, then the mounting member 14 is placed behind the mounting member 13. 13 moves upward with a delay from the mounting member 12, and the mounting member 12 moves upward with a delay from the mounting member 11, respectively. As a result, it is possible to flatly suck and hold the substrate W whose central portion is curved downward.

The mounting surfaces 11a to 14a of the mounting members 11 to 14 are not necessarily limited to moving in the vertical direction while being parallel to each other. The mounting surfaces 11a to 14a of the mounting members 11 to 14 are inclined in different directions in the radial direction or the circumferential direction, and the entire mounting surfaces 11a to 14a move in a substantially uneven shape. good too.

DESCRIPTION OF SYMBOLS 10... Base, 10a... Recessed part, 11... Mounting member (1st mounting member), 12... Mounting member (2nd mounting member), 13... Mounting member (2nd mounting member) 14 Mounting member (first mounting member) 11a to 14a, 61a to 69a Mounting surface 11b to 14b Electrode (electrostatic adsorption electrode) 11c to 14c Power supply unit 20 External power supply 21 Elevating mechanism 22 Control mechanism 31 to 34 Power feeder 41 to 44 Connecting member 51 to 53 Connecting member (intervening member) 61 to 69 Mounting member 70 Connecting member (intervening member) 71 Placement member (first placement member) 72 Placement member (second placement member) 73, 74 Placement member 71a to 73a Projection 72b to 74b Protrusions 81 to 83 Interposed member 91, 93 Internal pressure adjusting mechanism 92 Vacuum chamber 100, 110, 200, 300 Substrate holding device S1, S2 Space W Substrate.

Claims (4)

a plurality of mounting members each having a mounting surface on which a substrate is mounted; and an electrostatic attraction electrode for electrostatically attracting the substrate provided on at least one of the plurality of mounting members. and a substrate holding device comprising:
having a C-chamfer or R-chamfer at the upper end corner of the mounting member;
A first mounting member provided with at least the electrostatic attraction electrode among the plurality of mounting members, and a second mounting member disposed between the first mounting member and the first mounting member with an intervening member interposed therebetween. are movable in a direction perpendicular to the mounting surface,
When the first placement member moves in a direction perpendicular to the placement surface, the placement surface of the second placement member moves along with the movement of the placement surface of the first placement member. A substrate holding device that moves in a direction perpendicular to the mounting surface toward a height position of the surface. The intervening member is a connecting member made of an elastic body,
2. The substrate holding apparatus according to claim 1, wherein said first mounting member and said second mounting member are connected by said connecting member. The first mounting member and the second mounting member have overlapping portions in a direction perpendicular to the mounting surface, and the overlapping portions of the first mounting member and the second mounting member 2. The substrate holding device according to claim 1, wherein said intervening member made of an elastic material is arranged between said. 4. The substrate holding device according to claim 1, wherein all gaps between adjacent mounting members of said plurality of mounting members are airtightly sealed.

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