JP6689160B2 - 板状物搬送装置及び加工装置 - Google Patents
板状物搬送装置及び加工装置 Download PDFInfo
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- JP6689160B2 JP6689160B2 JP2016164029A JP2016164029A JP6689160B2 JP 6689160 B2 JP6689160 B2 JP 6689160B2 JP 2016164029 A JP2016164029 A JP 2016164029A JP 2016164029 A JP2016164029 A JP 2016164029A JP 6689160 B2 JP6689160 B2 JP 6689160B2
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- H01L21/67739—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations into and out of processing chamber
- H01L21/67742—Mechanical parts of transfer devices
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- H01L21/67739—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations into and out of processing chamber
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B25—HAND TOOLS; PORTABLE POWER-DRIVEN TOOLS; MANIPULATORS
- B25J—MANIPULATORS; CHAMBERS PROVIDED WITH MANIPULATION DEVICES
- B25J15/00—Gripping heads and other end effectors
- B25J15/06—Gripping heads and other end effectors with vacuum or magnetic holding means
- B25J15/0616—Gripping heads and other end effectors with vacuum or magnetic holding means with vacuum
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- B—PERFORMING OPERATIONS; TRANSPORTING
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- B25J15/00—Gripping heads and other end effectors
- B25J15/0014—Gripping heads and other end effectors having fork, comb or plate shaped means for engaging the lower surface on a object to be transported
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B25—HAND TOOLS; PORTABLE POWER-DRIVEN TOOLS; MANIPULATORS
- B25J—MANIPULATORS; CHAMBERS PROVIDED WITH MANIPULATION DEVICES
- B25J15/00—Gripping heads and other end effectors
- B25J15/08—Gripping heads and other end effectors having finger members
- B25J15/10—Gripping heads and other end effectors having finger members with three or more finger members
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- H01L21/67005—Apparatus not specifically provided for elsewhere
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- H01L21/67005—Apparatus not specifically provided for elsewhere
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- H—ELECTRICITY
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- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67739—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations into and out of processing chamber
- H01L21/67751—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations into and out of processing chamber vertical transfer of a single workpiece
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- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/68—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for positioning, orientation or alignment
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- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
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- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
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- H01L21/6838—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping with gripping and holding devices using a vacuum; Bernoulli devices
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- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
- H01L21/68707—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a robot blade, or gripped by a gripper for conveyance
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
- H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
- H01L21/68721—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support characterised by edge clamping, e.g. clamping ring
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
- H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
- H01L21/68728—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support characterised by a plurality of separate clamping members, e.g. clamping fingers
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- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Robotics (AREA)
- Mechanical Engineering (AREA)
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
- Constituent Portions Of Griding Lathes, Driving, Sensing And Control (AREA)
- Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
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Description
本発明の実施形態1に係る板状物搬送装置及び加工装置を図面に基いて説明する。図1は、実施形態1に係る板状物搬送装置を備える加工装置である切削装置の構成例を示す斜視図である。図2は、実施形態1に係る板状物搬送装置の構成を示す斜視図である。図3は、実施形態1に係る板状物搬送装置を分解して示す斜視図である。図4は、図2に示された板状物搬送装置の保持部材の配置を示す平面図である。図5は、図2中のV−V線に沿う断面図である。図6は、図5に示された保持部材のロッド部が上下動する状態を示す断面図である。図7は、図5に示された保持部材のロッド部の下面の平面図である。
本発明の実施形態2に係る板状物搬送装置及び加工装置を図面に基いて説明する。図15は、実施形態2に係る板状物搬送装置の要部の断面図である。図16は、図15に示された保持部材が揺動する状態を示す断面図である。なお、図15及び図16は、実施形態1と同一部分に同一符号を付して説明を省略する。
本発明の各実施形態の変形例に係る板状物搬送装置及び加工装置を図面に基いて説明する。図17は、各実施形態の第1の変形例に係る板状物搬送装置の保持部材の配置を示す平面図である。図18は、各実施形態の第2の変形例に係る保持部材の移動方向を示す平面図である。図19は、各実施形態の第3の変形例に係る板状物搬送装置の保持部材を示す斜視図である。図20は、各実施形態の第4の変形例に係る板状物搬送装置の規制ピン等を示す断面図である。図21は、図20に示された規制ピンが揺動する状態を示す断面図である。なお、図17から図21は、実施形態1と同一部分に同一符号を付して説明を省略する。
2 保持ユニット
3 移動機構
10,10−2 保持部材
11,11−2 ロッド部
11a 下面
12 係合部
13 ノズル部
20 支持プレート部
30 移動ユニット
41,41−4 規制ピン
41c 下面
42 規制ピンノズル
100 切削装置(加工装置)
110,181 チャックテーブル
110a 保持面
120 切削手段(加工ユニット)
W 被加工物(板状物)
Claims (4)
- 板状物を保持する保持ユニットと、該保持ユニットを移動させる移動機構と、を備え、チャックテーブルの保持面に板状物を搬入又は搬出する板状物搬送装置であって、
該保持ユニットは、
板状物の外周縁を保持する少なくとも2個の保持部材と、
板状物の外周縁に近接または離間する接離方向に該保持部材を移動可能に支持する支持プレート部と、
該保持部材を接離方向に移動させる移動ユニットと、を有し、
該保持部材は、
該支持プレート部に上下動可能に垂下するロッド部と、
該ロッド部の下端外周に形成され板状物の外周縁に係合する係合部と、
該ロッド部の下面から該保持面に向かって流体を噴射し板状物を該保持面から浮上させるノズル部と、を備える板状物搬送装置。 - 該ロッド部は、
該支持プレート部に遊挿され揺動可能に垂下し、
該ノズル部からの流体を噴射すると、該ロッド部の該下面が該保持面と平行に傾きが調整される請求項1に記載の板状物搬送装置。 - 該保持部材に保持される板状物の外周に、該支持プレート部に上下動可能に垂下する規制ピンを備え、該規制ピンの下面には該保持面に向かって流体を噴射し該規制ピンの下面を該保持面近傍に位置付ける規制ピンノズルを備えることを特徴とする請求項1又は2に記載の板状物搬送装置。
- 被加工物を保持するチャックテーブルと、該チャックテーブルに保持された被加工物を加工する加工ユニットと、該チャックテーブルに被加工物を搬入又は搬出する搬送ユニットと、を備える加工装置であって、
該搬送ユニットは、請求項1、2又は3に記載の板状物搬送装置である加工装置。
Priority Applications (6)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2016164029A JP6689160B2 (ja) | 2016-08-24 | 2016-08-24 | 板状物搬送装置及び加工装置 |
TW106122725A TWI721191B (zh) | 2016-08-24 | 2017-07-06 | 板狀物搬送裝置及加工裝置 |
US15/676,585 US10040204B2 (en) | 2016-08-24 | 2017-08-14 | Plate-shaped workpiece transfer apparatus and processing apparatus |
KR1020170103984A KR102252839B1 (ko) | 2016-08-24 | 2017-08-17 | 판상물 반송 장치 및 가공 장치 |
DE102017214522.6A DE102017214522B4 (de) | 2016-08-24 | 2017-08-21 | Transfervorrichtung für ein plattenförmiges Werkstück und Bearbeitungsvorrichtung |
CN201710717399.9A CN107785297B (zh) | 2016-08-24 | 2017-08-21 | 板状物搬送装置和加工装置 |
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JP2016164029A JP6689160B2 (ja) | 2016-08-24 | 2016-08-24 | 板状物搬送装置及び加工装置 |
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JP2018032747A JP2018032747A (ja) | 2018-03-01 |
JP6689160B2 true JP6689160B2 (ja) | 2020-04-28 |
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US (1) | US10040204B2 (ja) |
JP (1) | JP6689160B2 (ja) |
KR (1) | KR102252839B1 (ja) |
CN (1) | CN107785297B (ja) |
DE (1) | DE102017214522B4 (ja) |
TW (1) | TWI721191B (ja) |
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JP2020102573A (ja) * | 2018-12-25 | 2020-07-02 | 株式会社ディスコ | 搬送装置及び加工装置 |
JP7205047B2 (ja) * | 2019-01-30 | 2023-01-17 | 株式会社東京精密 | 被搬送物の位置決め装置及び位置決め方法 |
CN109943699A (zh) * | 2019-04-10 | 2019-06-28 | 江阴振宏重型锻造有限公司 | 大型低温异构件生产用输送装置 |
CN111113787A (zh) * | 2020-01-16 | 2020-05-08 | 智汇轩田智能系统(杭州)有限公司 | 一种异形零件同步抓取机构 |
JP7406247B2 (ja) * | 2020-05-22 | 2023-12-27 | アピックヤマダ株式会社 | 樹脂モールド装置 |
CN114433444B (zh) * | 2022-04-11 | 2022-07-01 | 四川上特科技有限公司 | 用于晶圆涂覆玻璃粉的盛料转移装置 |
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JP3162144B2 (ja) * | 1990-11-16 | 2001-04-25 | 株式会社渡邊商行 | 薄板状基体搬送装置 |
JPH1159895A (ja) * | 1997-08-27 | 1999-03-02 | Matsushita Electric Ind Co Ltd | 基板取り離し装置およびそれを用いた基板取り離し方法 |
JP3602359B2 (ja) * | 1999-02-10 | 2004-12-15 | エスペック株式会社 | 平板状ワークの位置決め装置 |
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JP5623213B2 (ja) | 2010-09-17 | 2014-11-12 | 株式会社ディスコ | 切削加工装置 |
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KR102211380B1 (ko) * | 2012-11-30 | 2021-02-03 | 가부시키가이샤 니콘 | 반송 시스템, 노광 장치, 반송 방법, 노광 방법 및 디바이스 제조방법, 및 흡인 장치 |
JP2014150153A (ja) * | 2013-01-31 | 2014-08-21 | Shin Etsu Handotai Co Ltd | ウェーハ保持装置 |
JP6082682B2 (ja) * | 2013-10-02 | 2017-02-15 | 株式会社ディスコ | テーブルの整形方法 |
JP2015082570A (ja) * | 2013-10-22 | 2015-04-27 | 株式会社ディスコ | ウエーハ加工システム |
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