JP6491017B2 - 被加工物の搬送トレー - Google Patents
被加工物の搬送トレー Download PDFInfo
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- JP6491017B2 JP6491017B2 JP2015079455A JP2015079455A JP6491017B2 JP 6491017 B2 JP6491017 B2 JP 6491017B2 JP 2015079455 A JP2015079455 A JP 2015079455A JP 2015079455 A JP2015079455 A JP 2015079455A JP 6491017 B2 JP6491017 B2 JP 6491017B2
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- 230000002093 peripheral effect Effects 0.000 claims description 59
- 238000012545 processing Methods 0.000 claims description 44
- 239000002390 adhesive tape Substances 0.000 claims description 8
- 230000001105 regulatory effect Effects 0.000 claims 1
- 230000032258 transport Effects 0.000 description 69
- 238000004140 cleaning Methods 0.000 description 14
- 238000005520 cutting process Methods 0.000 description 12
- 239000000758 substrate Substances 0.000 description 5
- 239000000853 adhesive Substances 0.000 description 4
- 230000001070 adhesive effect Effects 0.000 description 4
- 238000012986 modification Methods 0.000 description 4
- 230000004048 modification Effects 0.000 description 4
- 238000003466 welding Methods 0.000 description 4
- 238000000034 method Methods 0.000 description 3
- 238000000465 moulding Methods 0.000 description 3
- 239000004065 semiconductor Substances 0.000 description 3
- 238000003860 storage Methods 0.000 description 3
- 229920003002 synthetic resin Polymers 0.000 description 3
- 239000000057 synthetic resin Substances 0.000 description 3
- 239000000919 ceramic Substances 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 238000003754 machining Methods 0.000 description 2
- 239000000463 material Substances 0.000 description 2
- 230000003287 optical effect Effects 0.000 description 2
- JBRZTFJDHDCESZ-UHFFFAOYSA-N AsGa Chemical compound [As]#[Ga] JBRZTFJDHDCESZ-UHFFFAOYSA-N 0.000 description 1
- 229910001218 Gallium arsenide Inorganic materials 0.000 description 1
- 239000004820 Pressure-sensitive adhesive Substances 0.000 description 1
- 239000000470 constituent Substances 0.000 description 1
- 238000001035 drying Methods 0.000 description 1
- 239000011521 glass Substances 0.000 description 1
- 229910010272 inorganic material Inorganic materials 0.000 description 1
- 239000011147 inorganic material Substances 0.000 description 1
- 239000007788 liquid Substances 0.000 description 1
- 229920001296 polysiloxane Polymers 0.000 description 1
- 238000007634 remodeling Methods 0.000 description 1
- 229920005989 resin Polymers 0.000 description 1
- 239000011347 resin Substances 0.000 description 1
- 229910052594 sapphire Inorganic materials 0.000 description 1
- 239000010980 sapphire Substances 0.000 description 1
- 238000007493 shaping process Methods 0.000 description 1
- 229910052710 silicon Inorganic materials 0.000 description 1
- 239000010703 silicon Substances 0.000 description 1
- 238000006467 substitution reaction Methods 0.000 description 1
- 238000012546 transfer Methods 0.000 description 1
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 1
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Classifications
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67763—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67703—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations
- H01L21/6773—Conveying cassettes, containers or carriers
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
- B65D—CONTAINERS FOR STORAGE OR TRANSPORT OF ARTICLES OR MATERIALS, e.g. BAGS, BARRELS, BOTTLES, BOXES, CANS, CARTONS, CRATES, DRUMS, JARS, TANKS, HOPPERS, FORWARDING CONTAINERS; ACCESSORIES, CLOSURES, OR FITTINGS THEREFOR; PACKAGING ELEMENTS; PACKAGES
- B65D1/00—Containers having bodies formed in one piece, e.g. by casting metallic material, by moulding plastics, by blowing vitreous material, by throwing ceramic material, by moulding pulped fibrous material, by deep-drawing operations performed on sheet material
- B65D1/34—Trays or like shallow containers
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
- B65G—TRANSPORT OR STORAGE DEVICES, e.g. CONVEYORS FOR LOADING OR TIPPING, SHOP CONVEYOR SYSTEMS OR PNEUMATIC TUBE CONVEYORS
- B65G49/00—Conveying systems characterised by their application for specified purposes not otherwise provided for
- B65G49/05—Conveying systems characterised by their application for specified purposes not otherwise provided for for fragile or damageable materials or articles
- B65G49/06—Conveying systems characterised by their application for specified purposes not otherwise provided for for fragile or damageable materials or articles for fragile sheets, e.g. glass
- B65G49/062—Easels, stands or shelves, e.g. castor-shelves, supporting means on vehicles
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67703—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations
- H01L21/67715—Changing the direction of the conveying path
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/6835—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support
- H01L21/6836—Wafer tapes, e.g. grinding or dicing support tapes
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/6838—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping with gripping and holding devices using a vacuum; Bernoulli devices
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/70—Manufacture or treatment of devices consisting of a plurality of solid state components formed in or on a common substrate or of parts thereof; Manufacture of integrated circuit devices or of parts thereof
- H01L21/77—Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate
- H01L21/78—Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate with subsequent division of the substrate into plural individual devices
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
- B65G—TRANSPORT OR STORAGE DEVICES, e.g. CONVEYORS FOR LOADING OR TIPPING, SHOP CONVEYOR SYSTEMS OR PNEUMATIC TUBE CONVEYORS
- B65G2201/00—Indexing codes relating to handling devices, e.g. conveyors, characterised by the type of product or load being conveyed or handled
- B65G2201/02—Articles
- B65G2201/0235—Containers
- B65G2201/0258—Trays, totes or bins
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Physics & Mathematics (AREA)
- Power Engineering (AREA)
- Ceramic Engineering (AREA)
- Mechanical Engineering (AREA)
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
- Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
- Packaging Frangible Articles (AREA)
- Dicing (AREA)
Description
実施形態1に係る加工装置及び被加工物の搬送トレーの構成例について説明する。図1は、実施形態1に係る加工装置の構成例を示す斜視図である。図2は、実施形態1に係るカセットの構成例を示す正面図である。図3は、実施形態1に係る被加工物の構成例を示す斜視図である。図4は、実施形態1に係る搬送トレーの構成例を示す斜視図である。図5は、実施形態1に係る搬送トレーに被加工物を載置した載置例を示す斜視図である。図6は、実施形態1に係る搬送トレーに被加工物を載置した載置例を示すP−P矢印の断面図である。
次に、実施形態1の変形例について説明する。1個の被加工物W1を搬送トレー5に固定する例について説明したが、複数個の被加工物W1を搬送トレー5に固定してもよい。この場合、例えば、搬送トレー5の本体フレーム部5aに複数個の開口部5bを設け、それぞれの開口部5bに被加工物W1を固定する。
次に、実施形態2に係る被加工物の搬送トレーの構成例について説明する。図9は、実施形態2に係る搬送トレーに被加工物を載置した載置例を示す断面図である。図10は、実施形態2に係るチャックテーブルに被加工物が載置された搬送トレーを搬入する搬入例を示す断面図である。図11は、実施形態2に係るチャックテーブルに保持された被加工物を加工する加工例を示す断面図である。
次に、実施形態2の変形例について説明する。外周支持部6dは、本体フレーム部6が開口された開口穴の下部の内周壁面に、内周壁面の周方向に沿って一定幅の板状部材が溶接や接着剤等により固定された別体成形の例を説明したが、外周支持部6dは、本体フレーム部6と一体成型にしてもよい。また、外周支持部6dと本体フレーム部6とを別体成形とする場合、本体フレーム部6に外周支持部6dを強固に固定するために、本体フレーム部6の開口穴の下部の内周壁面に板状部材の外周支持部6dを嵌合するための凹部を設け、本体フレーム部6の凹部に外周支持部6dを固定してもよい。
5,6 搬送トレー
5a,6a 本体フレーム部
5b,6b 開口部
5d,6d 外周支持部
5e,6e 移動規制部
10A チャックテーブル
10B 凸状のチャックテーブル
11a,11b 保持面
50 第1搬送手段
60 第2搬送手段
91 カセット
92 カセット載置手段
W(W1,W2) 被加工物
U 被加工物保持ユニット
U1A,U1B 搬送トレーユニット
U2 フレームユニット
Claims (1)
- 環状フレームの開口に粘着テープを介して被加工物が支持されたフレームユニットの被加工物を保持する保持面を備えるチャックテーブルと、該チャックテーブルに保持される被加工物を加工する加工手段と、該フレームユニットを複数収容するカセットを載置するカセット載置領域と、該カセット載置領域に載置された該カセットと該チャックテーブルとの間で該環状フレームを支持して該フレームユニットを搬送する搬送手段と、を備える加工装置で、板状の被加工物を該チャックテーブルに搬出入する際に用いる搬送トレーであって、
該板状の被加工物の外形より大きい内周を備える環状の本体フレーム部と、
該本体フレーム部の内周から中心に向かって突出し、被加工物の下面側の外周領域を支持する外周支持部と、
該本体フレーム部と該外周支持部との境界に形成され、載置した被加工物の面方向への移動を規制する移動規制部と、を備え、
該本体フレーム部は、該環状フレームと同じ外径に形成され、該カセットに収容可能であることを特徴とする被加工物の搬送トレー。
Priority Applications (4)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2015079455A JP6491017B2 (ja) | 2015-04-08 | 2015-04-08 | 被加工物の搬送トレー |
TW105107363A TWI689027B (zh) | 2015-04-08 | 2016-03-10 | 被加工物之搬運托盤 |
CN201610186899.XA CN106057715B (zh) | 2015-04-08 | 2016-03-29 | 被加工物的搬送托盘 |
KR1020160040880A KR102348542B1 (ko) | 2015-04-08 | 2016-04-04 | 피가공물의 반송 트레이 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2015079455A JP6491017B2 (ja) | 2015-04-08 | 2015-04-08 | 被加工物の搬送トレー |
Publications (2)
Publication Number | Publication Date |
---|---|
JP2016201421A JP2016201421A (ja) | 2016-12-01 |
JP6491017B2 true JP6491017B2 (ja) | 2019-03-27 |
Family
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Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2015079455A Active JP6491017B2 (ja) | 2015-04-08 | 2015-04-08 | 被加工物の搬送トレー |
Country Status (4)
Country | Link |
---|---|
JP (1) | JP6491017B2 (ja) |
KR (1) | KR102348542B1 (ja) |
CN (1) | CN106057715B (ja) |
TW (1) | TWI689027B (ja) |
Families Citing this family (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP6762220B2 (ja) * | 2016-12-15 | 2020-09-30 | 株式会社ディスコ | 加工装置の搬送機構 |
JP6813367B2 (ja) * | 2017-01-13 | 2021-01-13 | 株式会社ディスコ | フレームユニット搬送システム |
JP7009194B2 (ja) * | 2017-12-12 | 2022-01-25 | 株式会社ディスコ | ウエーハ生成装置および搬送トレー |
JP7083692B2 (ja) * | 2018-05-01 | 2022-06-13 | 株式会社ディスコ | 切削装置 |
JP7374591B2 (ja) * | 2019-02-13 | 2023-11-07 | 株式会社東京精密 | ウェーハの在荷検知装置 |
JP7486265B2 (ja) * | 2020-01-09 | 2024-05-17 | 株式会社ディスコ | 被加工物の加工方法 |
Family Cites Families (11)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH07201948A (ja) * | 1993-12-29 | 1995-08-04 | Dainippon Screen Mfg Co Ltd | 基板搬送治具 |
JPH08316287A (ja) * | 1995-05-16 | 1996-11-29 | Murata Mfg Co Ltd | 基板取扱方法及びそれに用いる基板フレーム |
JP4511706B2 (ja) | 2000-09-26 | 2010-07-28 | 株式会社ディスコ | 被加工物の支持フレーム |
JP2003203887A (ja) * | 2002-01-10 | 2003-07-18 | Disco Abrasive Syst Ltd | 切削装置 |
JP4580806B2 (ja) * | 2004-11-30 | 2010-11-17 | アピックヤマダ株式会社 | ワーク支持枠体、ワーク洗浄乾燥装置及び切断装置 |
JP2010073884A (ja) * | 2008-09-18 | 2010-04-02 | Fujitsu Microelectronics Ltd | 半導体ウェーハ用治具及び半導体装置の製造方法 |
JP5860217B2 (ja) * | 2011-03-04 | 2016-02-16 | 株式会社ディスコ | レーザー加工装置 |
JP2013073110A (ja) * | 2011-09-28 | 2013-04-22 | Disco Abrasive Syst Ltd | 光導波路基板の分割方法 |
JP6110136B2 (ja) * | 2012-12-28 | 2017-04-05 | 株式会社ディスコ | ウエーハのレーザー加工方法およびレーザー加工装置 |
JP6210726B2 (ja) | 2013-05-14 | 2017-10-11 | 株式会社ディスコ | 加工装置 |
JP6108999B2 (ja) * | 2013-07-18 | 2017-04-05 | 株式会社ディスコ | 切削装置 |
-
2015
- 2015-04-08 JP JP2015079455A patent/JP6491017B2/ja active Active
-
2016
- 2016-03-10 TW TW105107363A patent/TWI689027B/zh active
- 2016-03-29 CN CN201610186899.XA patent/CN106057715B/zh active Active
- 2016-04-04 KR KR1020160040880A patent/KR102348542B1/ko active IP Right Grant
Also Published As
Publication number | Publication date |
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CN106057715A (zh) | 2016-10-26 |
JP2016201421A (ja) | 2016-12-01 |
CN106057715B (zh) | 2021-05-25 |
TW201705339A (zh) | 2017-02-01 |
TWI689027B (zh) | 2020-03-21 |
KR102348542B1 (ko) | 2022-01-06 |
KR20160120666A (ko) | 2016-10-18 |
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