JP2019047022A5 - - Google Patents

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Publication number
JP2019047022A5
JP2019047022A5 JP2017170302A JP2017170302A JP2019047022A5 JP 2019047022 A5 JP2019047022 A5 JP 2019047022A5 JP 2017170302 A JP2017170302 A JP 2017170302A JP 2017170302 A JP2017170302 A JP 2017170302A JP 2019047022 A5 JP2019047022 A5 JP 2019047022A5
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JP
Japan
Prior art keywords
polishing
substrate
end point
insulating material
metal layer
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP2017170302A
Other languages
English (en)
Japanese (ja)
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JP6860451B2 (ja
JP2019047022A (ja
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Application filed filed Critical
Priority claimed from JP2017170302A external-priority patent/JP6860451B2/ja
Priority to JP2017170302A priority Critical patent/JP6860451B2/ja
Priority to PCT/JP2018/030894 priority patent/WO2019049659A1/ja
Priority to KR1020237021860A priority patent/KR102770137B1/ko
Priority to CN201880057226.1A priority patent/CN111095492B/zh
Priority to KR1020207005105A priority patent/KR102550564B1/ko
Priority to US16/643,124 priority patent/US11597051B2/en
Priority to TW107129857A priority patent/TWI773810B/zh
Publication of JP2019047022A publication Critical patent/JP2019047022A/ja
Publication of JP2019047022A5 publication Critical patent/JP2019047022A5/ja
Priority to JP2021053348A priority patent/JP7177207B2/ja
Publication of JP6860451B2 publication Critical patent/JP6860451B2/ja
Application granted granted Critical
Priority to US18/161,707 priority patent/US20230173636A1/en
Active legal-status Critical Current
Anticipated expiration legal-status Critical

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JP2017170302A 2017-09-05 2017-09-05 機能性チップを備える基板を研磨する方法 Active JP6860451B2 (ja)

Priority Applications (9)

Application Number Priority Date Filing Date Title
JP2017170302A JP6860451B2 (ja) 2017-09-05 2017-09-05 機能性チップを備える基板を研磨する方法
PCT/JP2018/030894 WO2019049659A1 (ja) 2017-09-05 2018-08-22 機能性チップを備える基板を研磨する方法
KR1020237021860A KR102770137B1 (ko) 2017-09-05 2018-08-22 기능성 칩을 구비하는 기판을 연마하는 방법
CN201880057226.1A CN111095492B (zh) 2017-09-05 2018-08-22 基板、具备功能性芯片的基板的研磨方法、非暂时性的计算机可读取的记录介质
KR1020207005105A KR102550564B1 (ko) 2017-09-05 2018-08-22 기능성 칩을 구비하는 기판을 연마하는 방법
US16/643,124 US11597051B2 (en) 2017-09-05 2018-08-22 Method for polishing substrate including functional chip
TW107129857A TWI773810B (zh) 2017-09-05 2018-08-28 具備功能性晶片之基板的研磨方法、使包含電腦之控制裝置執行該方法之程式、電腦可讀取之記錄媒介、及基板
JP2021053348A JP7177207B2 (ja) 2017-09-05 2021-03-26 機能性チップを備える基板を研磨する方法
US18/161,707 US20230173636A1 (en) 2017-09-05 2023-01-30 Method for polishing substrate including functional chip

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2017170302A JP6860451B2 (ja) 2017-09-05 2017-09-05 機能性チップを備える基板を研磨する方法

Related Child Applications (1)

Application Number Title Priority Date Filing Date
JP2021053348A Division JP7177207B2 (ja) 2017-09-05 2021-03-26 機能性チップを備える基板を研磨する方法

Publications (3)

Publication Number Publication Date
JP2019047022A JP2019047022A (ja) 2019-03-22
JP2019047022A5 true JP2019047022A5 (enExample) 2020-07-16
JP6860451B2 JP6860451B2 (ja) 2021-04-14

Family

ID=65633980

Family Applications (2)

Application Number Title Priority Date Filing Date
JP2017170302A Active JP6860451B2 (ja) 2017-09-05 2017-09-05 機能性チップを備える基板を研磨する方法
JP2021053348A Active JP7177207B2 (ja) 2017-09-05 2021-03-26 機能性チップを備える基板を研磨する方法

Family Applications After (1)

Application Number Title Priority Date Filing Date
JP2021053348A Active JP7177207B2 (ja) 2017-09-05 2021-03-26 機能性チップを備える基板を研磨する方法

Country Status (6)

Country Link
US (2) US11597051B2 (enExample)
JP (2) JP6860451B2 (enExample)
KR (2) KR102550564B1 (enExample)
CN (1) CN111095492B (enExample)
TW (1) TWI773810B (enExample)
WO (1) WO2019049659A1 (enExample)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP7325913B2 (ja) * 2019-11-22 2023-08-15 株式会社ディスコ ウェーハ加工装置
JP7693393B2 (ja) 2021-05-24 2025-06-17 キオクシア株式会社 半導体装置の製造方法
KR20230117970A (ko) 2022-02-03 2023-08-10 삼성전자주식회사 다층 광학 박막 구조를 포함하는 광학 장치 및 다층 광학 박막 구조의 평탄화 방법 및 장치

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US5234868A (en) * 1992-10-29 1993-08-10 International Business Machines Corporation Method for determining planarization endpoint during chemical-mechanical polishing
KR0166848B1 (ko) * 1995-04-07 1999-02-01 문정환 반도체 제조시의 연마종점 설정방법 및 장치
JPH09139369A (ja) * 1995-11-15 1997-05-27 Hitachi Ltd 半導体装置の製造方法およびそれに使用される研磨装置
MY139405A (en) * 1998-09-28 2009-09-30 Ibiden Co Ltd Printed circuit board and method for its production
JP2000124601A (ja) * 1998-10-13 2000-04-28 Ibiden Co Ltd プリント配線板の製造方法
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JP2002246352A (ja) * 2001-02-20 2002-08-30 Semiconductor Leading Edge Technologies Inc Ｃｍｐ終点検出装置、ｃｍｐ終点検出方法、及びｃｍｐ研磨面モニタ方法
JP4056854B2 (ja) * 2002-11-05 2008-03-05 新光電気工業株式会社 半導体装置の製造方法
US20050173259A1 (en) * 2004-02-06 2005-08-11 Applied Materials, Inc. Endpoint system for electro-chemical mechanical polishing
JP2007214402A (ja) 2006-02-10 2007-08-23 Cmk Corp 半導体素子及び半導体素子内蔵型プリント配線板
JP4899604B2 (ja) 2006-04-13 2012-03-21 ソニー株式会社 三次元半導体パッケージ製造方法
KR101357290B1 (ko) * 2006-10-06 2014-01-28 가부시끼가이샤 도시바 가공 종점 검지방법, 연마방법 및 연마장치
JP2008100319A (ja) * 2006-10-19 2008-05-01 Sharp Corp 研削加工方法および研削加工装置
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TWI453837B (zh) * 2011-06-13 2014-09-21 日月光半導體製造股份有限公司 具有非導電層的半導體封裝及其製造方法
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US9595492B2 (en) * 2015-03-16 2017-03-14 Taiwan Semiconductor Manufacturing Company Ltd. Device manufacture and packaging method thereof
US9754805B1 (en) * 2016-02-25 2017-09-05 Taiwan Semiconductor Manufacturing Company, Ltd. Packaging method and structure

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