KR102550564B1 - 기능성 칩을 구비하는 기판을 연마하는 방법 - Google Patents

기능성 칩을 구비하는 기판을 연마하는 방법 Download PDF

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Publication number
KR102550564B1
KR102550564B1 KR1020207005105A KR20207005105A KR102550564B1 KR 102550564 B1 KR102550564 B1 KR 102550564B1 KR 1020207005105 A KR1020207005105 A KR 1020207005105A KR 20207005105 A KR20207005105 A KR 20207005105A KR 102550564 B1 KR102550564 B1 KR 102550564B1
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South Korea
Prior art keywords
polishing
substrate
insulating material
detection element
metal layer
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Korean (ko)
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KR20200049767A (ko
Inventor
데츠지 도가와
히로시 소부카와
마사히로 하타케야마
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가부시키가이샤 에바라 세이사꾸쇼
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Priority to KR1020237021860A priority Critical patent/KR102770137B1/ko
Publication of KR20200049767A publication Critical patent/KR20200049767A/ko
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    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P52/00—Grinding, lapping or polishing of wafers, substrates or parts of devices
    • H10P52/40—Chemomechanical polishing [CMP]
    • H10P52/402—Chemomechanical polishing [CMP] of semiconductor materials
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/11—Lapping tools
    • B24B37/12—Lapping plates for working plane surfaces
    • B24B37/16—Lapping plates for working plane surfaces characterised by the shape of the lapping plate surface, e.g. grooved
    • H01L21/30625—
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/005—Control means for lapping machines or devices
    • B24B37/013—Devices or means for detecting lapping completion
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B49/00—Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation
    • B24B49/02—Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation according to the instantaneous size and required size of the workpiece acted upon, the measuring or gauging being continuous or intermittent
    • B24B49/04—Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation according to the instantaneous size and required size of the workpiece acted upon, the measuring or gauging being continuous or intermittent involving measurement of the workpiece at the place of grinding during grinding operation
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B49/00—Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation
    • B24B49/10—Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation involving electrical means
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B49/00—Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation
    • B24B49/12—Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation involving optical means
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B49/00—Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation
    • B24B49/16—Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation taking regard of the load
    • H01L21/561—
    • H01L22/26—
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P52/00—Grinding, lapping or polishing of wafers, substrates or parts of devices
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P74/00—Testing or measuring during manufacture or treatment of wafers, substrates or devices
    • H10P74/23—Testing or measuring during manufacture or treatment of wafers, substrates or devices characterised by multiple measurements, corrections, marking or sorting processes
    • H10P74/238—Testing or measuring during manufacture or treatment of wafers, substrates or devices characterised by multiple measurements, corrections, marking or sorting processes comprising acting in response to an ongoing measurement without interruption of processing, e.g. endpoint detection or in-situ thickness measurement
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings
    • H10W74/01—Manufacture or treatment
    • H10W74/012—Manufacture or treatment of encapsulations on active surfaces of flip-chip devices, e.g. forming underfills
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings
    • H10W74/01—Manufacture or treatment
    • H10W74/014—Manufacture or treatment using batch processing
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings
    • H10W74/10—Encapsulations, e.g. protective coatings characterised by their shape or disposition
    • H10W74/15—Encapsulations, e.g. protective coatings characterised by their shape or disposition on active surfaces of flip-chip devices, e.g. underfills
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/60—Insulating or insulated package substrates; Interposers; Redistribution layers
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings
    • H10W74/01—Manufacture or treatment
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/721—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bump connectors
    • H10W90/722—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bump connectors between stacked chips

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)
  • Constituent Portions Of Griding Lathes, Driving, Sensing And Control (AREA)
  • Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
KR1020207005105A 2017-09-05 2018-08-22 기능성 칩을 구비하는 기판을 연마하는 방법 Active KR102550564B1 (ko)

Priority Applications (1)

Application Number Priority Date Filing Date Title
KR1020237021860A KR102770137B1 (ko) 2017-09-05 2018-08-22 기능성 칩을 구비하는 기판을 연마하는 방법

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JPJP-P-2017-170302 2017-09-05
JP2017170302A JP6860451B2 (ja) 2017-09-05 2017-09-05 機能性チップを備える基板を研磨する方法
PCT/JP2018/030894 WO2019049659A1 (ja) 2017-09-05 2018-08-22 機能性チップを備える基板を研磨する方法

Related Child Applications (1)

Application Number Title Priority Date Filing Date
KR1020237021860A Division KR102770137B1 (ko) 2017-09-05 2018-08-22 기능성 칩을 구비하는 기판을 연마하는 방법

Publications (2)

Publication Number Publication Date
KR20200049767A KR20200049767A (ko) 2020-05-08
KR102550564B1 true KR102550564B1 (ko) 2023-07-04

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KR1020207005105A Active KR102550564B1 (ko) 2017-09-05 2018-08-22 기능성 칩을 구비하는 기판을 연마하는 방법
KR1020237021860A Active KR102770137B1 (ko) 2017-09-05 2018-08-22 기능성 칩을 구비하는 기판을 연마하는 방법

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KR1020237021860A Active KR102770137B1 (ko) 2017-09-05 2018-08-22 기능성 칩을 구비하는 기판을 연마하는 방법

Country Status (6)

Country Link
US (2) US11597051B2 (enExample)
JP (2) JP6860451B2 (enExample)
KR (2) KR102550564B1 (enExample)
CN (1) CN111095492B (enExample)
TW (1) TWI773810B (enExample)
WO (1) WO2019049659A1 (enExample)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP7325913B2 (ja) * 2019-11-22 2023-08-15 株式会社ディスコ ウェーハ加工装置
JP7693393B2 (ja) 2021-05-24 2025-06-17 キオクシア株式会社 半導体装置の製造方法
KR20230117970A (ko) 2022-02-03 2023-08-10 삼성전자주식회사 다층 광학 박막 구조를 포함하는 광학 장치 및 다층 광학 박막 구조의 평탄화 방법 및 장치

Citations (2)

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US20050173259A1 (en) * 2004-02-06 2005-08-11 Applied Materials, Inc. Endpoint system for electro-chemical mechanical polishing
US20050258522A1 (en) * 1998-09-28 2005-11-24 Ibiden Co., Ltd. Printed wiring board and method for producing the same

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JPS628981A (ja) * 1985-07-04 1987-01-16 Daido Steel Co Ltd 巻取ドラムアダプタ
US5234868A (en) * 1992-10-29 1993-08-10 International Business Machines Corporation Method for determining planarization endpoint during chemical-mechanical polishing
KR0166848B1 (ko) * 1995-04-07 1999-02-01 문정환 반도체 제조시의 연마종점 설정방법 및 장치
JPH09139369A (ja) * 1995-11-15 1997-05-27 Hitachi Ltd 半導体装置の製造方法およびそれに使用される研磨装置
JP2000124601A (ja) * 1998-10-13 2000-04-28 Ibiden Co Ltd プリント配線板の製造方法
JP3141939B2 (ja) 1998-11-26 2001-03-07 日本電気株式会社 金属配線形成方法
JP3774094B2 (ja) * 1999-12-02 2006-05-10 株式会社日立製作所 膜厚、加工深さ測定装置及び成膜加工方法
JP2002246352A (ja) * 2001-02-20 2002-08-30 Semiconductor Leading Edge Technologies Inc Ｃｍｐ終点検出装置、ｃｍｐ終点検出方法、及びｃｍｐ研磨面モニタ方法
JP4056854B2 (ja) * 2002-11-05 2008-03-05 新光電気工業株式会社 半導体装置の製造方法
JP2007214402A (ja) 2006-02-10 2007-08-23 Cmk Corp 半導体素子及び半導体素子内蔵型プリント配線板
JP4899604B2 (ja) 2006-04-13 2012-03-21 ソニー株式会社 三次元半導体パッケージ製造方法
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Publication number Priority date Publication date Assignee Title
US20050258522A1 (en) * 1998-09-28 2005-11-24 Ibiden Co., Ltd. Printed wiring board and method for producing the same
US20050173259A1 (en) * 2004-02-06 2005-08-11 Applied Materials, Inc. Endpoint system for electro-chemical mechanical polishing

Also Published As

Publication number Publication date
KR20230101949A (ko) 2023-07-06
KR20200049767A (ko) 2020-05-08
CN111095492A (zh) 2020-05-01
US20200391341A1 (en) 2020-12-17
TWI773810B (zh) 2022-08-11
CN111095492B (zh) 2023-12-01
US20230173636A1 (en) 2023-06-08
JP7177207B2 (ja) 2022-11-22
TW201919822A (zh) 2019-06-01
KR102770137B1 (ko) 2025-02-20
JP6860451B2 (ja) 2021-04-14
JP2019047022A (ja) 2019-03-22
US11597051B2 (en) 2023-03-07
JP2021103789A (ja) 2021-07-15
WO2019049659A1 (ja) 2019-03-14

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