JP6860451B2 - 機能性チップを備える基板を研磨する方法 - Google Patents

機能性チップを備える基板を研磨する方法 Download PDF

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Publication number
JP6860451B2
JP6860451B2 JP2017170302A JP2017170302A JP6860451B2 JP 6860451 B2 JP6860451 B2 JP 6860451B2 JP 2017170302 A JP2017170302 A JP 2017170302A JP 2017170302 A JP2017170302 A JP 2017170302A JP 6860451 B2 JP6860451 B2 JP 6860451B2
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JP
Japan
Prior art keywords
polishing
substrate
end point
insulating material
metal layer
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Application number
JP2017170302A
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English (en)
Japanese (ja)
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JP2019047022A (ja
JP2019047022A5 (enExample
Inventor
哲二 戸川
哲二 戸川
曽布川　拓司
拓司 曽布川
畠山　雅規
雅規 畠山
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Ebara Corp
Original Assignee
Ebara Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Ebara Corp filed Critical Ebara Corp
Priority to JP2017170302A priority Critical patent/JP6860451B2/ja
Priority to US16/643,124 priority patent/US11597051B2/en
Priority to PCT/JP2018/030894 priority patent/WO2019049659A1/ja
Priority to KR1020237021860A priority patent/KR102770137B1/ko
Priority to CN201880057226.1A priority patent/CN111095492B/zh
Priority to KR1020207005105A priority patent/KR102550564B1/ko
Priority to TW107129857A priority patent/TWI773810B/zh
Publication of JP2019047022A publication Critical patent/JP2019047022A/ja
Publication of JP2019047022A5 publication Critical patent/JP2019047022A5/ja
Priority to JP2021053348A priority patent/JP7177207B2/ja
Application granted granted Critical
Publication of JP6860451B2 publication Critical patent/JP6860451B2/ja
Priority to US18/161,707 priority patent/US20230173636A1/en
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Anticipated expiration legal-status Critical

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    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/11—Lapping tools
    • B24B37/12—Lapping plates for working plane surfaces
    • B24B37/16—Lapping plates for working plane surfaces characterised by the shape of the lapping plate surface, e.g. grooved
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P52/00—Grinding, lapping or polishing of wafers, substrates or parts of devices
    • H10P52/40—Chemomechanical polishing [CMP]
    • H10P52/402—Chemomechanical polishing [CMP] of semiconductor materials
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/005—Control means for lapping machines or devices
    • B24B37/013—Devices or means for detecting lapping completion
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B49/00—Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation
    • B24B49/02—Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation according to the instantaneous size and required size of the workpiece acted upon, the measuring or gauging being continuous or intermittent
    • B24B49/04—Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation according to the instantaneous size and required size of the workpiece acted upon, the measuring or gauging being continuous or intermittent involving measurement of the workpiece at the place of grinding during grinding operation
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B49/00—Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation
    • B24B49/10—Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation involving electrical means
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B49/00—Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation
    • B24B49/12—Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation involving optical means
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B49/00—Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation
    • B24B49/16—Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation taking regard of the load
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P52/00—Grinding, lapping or polishing of wafers, substrates or parts of devices
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P74/00—Testing or measuring during manufacture or treatment of wafers, substrates or devices
    • H10P74/23—Testing or measuring during manufacture or treatment of wafers, substrates or devices characterised by multiple measurements, corrections, marking or sorting processes
    • H10P74/238—Testing or measuring during manufacture or treatment of wafers, substrates or devices characterised by multiple measurements, corrections, marking or sorting processes comprising acting in response to an ongoing measurement without interruption of processing, e.g. endpoint detection or in-situ thickness measurement
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings
    • H10W74/01—Manufacture or treatment
    • H10W74/012—Manufacture or treatment of encapsulations on active surfaces of flip-chip devices, e.g. forming underfills
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings
    • H10W74/01—Manufacture or treatment
    • H10W74/014—Manufacture or treatment using batch processing
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings
    • H10W74/10—Encapsulations, e.g. protective coatings characterised by their shape or disposition
    • H10W74/15—Encapsulations, e.g. protective coatings characterised by their shape or disposition on active surfaces of flip-chip devices, e.g. underfills
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/60—Insulating or insulated package substrates; Interposers; Redistribution layers
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings
    • H10W74/01—Manufacture or treatment
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/721—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bump connectors
    • H10W90/722—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bump connectors between stacked chips

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)
  • Constituent Portions Of Griding Lathes, Driving, Sensing And Control (AREA)
  • Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
JP2017170302A 2017-09-05 2017-09-05 機能性チップを備える基板を研磨する方法 Active JP6860451B2 (ja)

Priority Applications (9)

Application Number Priority Date Filing Date Title
JP2017170302A JP6860451B2 (ja) 2017-09-05 2017-09-05 機能性チップを備える基板を研磨する方法
PCT/JP2018/030894 WO2019049659A1 (ja) 2017-09-05 2018-08-22 機能性チップを備える基板を研磨する方法
KR1020237021860A KR102770137B1 (ko) 2017-09-05 2018-08-22 기능성 칩을 구비하는 기판을 연마하는 방법
CN201880057226.1A CN111095492B (zh) 2017-09-05 2018-08-22 基板、具备功能性芯片的基板的研磨方法、非暂时性的计算机可读取的记录介质
KR1020207005105A KR102550564B1 (ko) 2017-09-05 2018-08-22 기능성 칩을 구비하는 기판을 연마하는 방법
US16/643,124 US11597051B2 (en) 2017-09-05 2018-08-22 Method for polishing substrate including functional chip
TW107129857A TWI773810B (zh) 2017-09-05 2018-08-28 具備功能性晶片之基板的研磨方法、使包含電腦之控制裝置執行該方法之程式、電腦可讀取之記錄媒介、及基板
JP2021053348A JP7177207B2 (ja) 2017-09-05 2021-03-26 機能性チップを備える基板を研磨する方法
US18/161,707 US20230173636A1 (en) 2017-09-05 2023-01-30 Method for polishing substrate including functional chip

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2017170302A JP6860451B2 (ja) 2017-09-05 2017-09-05 機能性チップを備える基板を研磨する方法

Related Child Applications (1)

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JP2021053348A Division JP7177207B2 (ja) 2017-09-05 2021-03-26 機能性チップを備える基板を研磨する方法

Publications (3)

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JP2019047022A JP2019047022A (ja) 2019-03-22
JP2019047022A5 JP2019047022A5 (enExample) 2020-07-16
JP6860451B2 true JP6860451B2 (ja) 2021-04-14

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JP2017170302A Active JP6860451B2 (ja) 2017-09-05 2017-09-05 機能性チップを備える基板を研磨する方法
JP2021053348A Active JP7177207B2 (ja) 2017-09-05 2021-03-26 機能性チップを備える基板を研磨する方法

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Application Number Title Priority Date Filing Date
JP2021053348A Active JP7177207B2 (ja) 2017-09-05 2021-03-26 機能性チップを備える基板を研磨する方法

Country Status (6)

Country Link
US (2) US11597051B2 (enExample)
JP (2) JP6860451B2 (enExample)
KR (2) KR102550564B1 (enExample)
CN (1) CN111095492B (enExample)
TW (1) TWI773810B (enExample)
WO (1) WO2019049659A1 (enExample)

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* Cited by examiner, † Cited by third party
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JP7325913B2 (ja) * 2019-11-22 2023-08-15 株式会社ディスコ ウェーハ加工装置
JP7693393B2 (ja) 2021-05-24 2025-06-17 キオクシア株式会社 半導体装置の製造方法
KR20230117970A (ko) 2022-02-03 2023-08-10 삼성전자주식회사 다층 광학 박막 구조를 포함하는 광학 장치 및 다층 광학 박막 구조의 평탄화 방법 및 장치

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Also Published As

Publication number Publication date
KR20230101949A (ko) 2023-07-06
KR20200049767A (ko) 2020-05-08
CN111095492A (zh) 2020-05-01
US20200391341A1 (en) 2020-12-17
TWI773810B (zh) 2022-08-11
KR102550564B1 (ko) 2023-07-04
CN111095492B (zh) 2023-12-01
US20230173636A1 (en) 2023-06-08
JP7177207B2 (ja) 2022-11-22
TW201919822A (zh) 2019-06-01
KR102770137B1 (ko) 2025-02-20
JP2019047022A (ja) 2019-03-22
US11597051B2 (en) 2023-03-07
JP2021103789A (ja) 2021-07-15
WO2019049659A1 (ja) 2019-03-14

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