CN111095492B - 基板、具备功能性芯片的基板的研磨方法、非暂时性的计算机可读取的记录介质 - Google Patents

基板、具备功能性芯片的基板的研磨方法、非暂时性的计算机可读取的记录介质 Download PDF

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Publication number
CN111095492B
CN111095492B CN201880057226.1A CN201880057226A CN111095492B CN 111095492 B CN111095492 B CN 111095492B CN 201880057226 A CN201880057226 A CN 201880057226A CN 111095492 B CN111095492 B CN 111095492B
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CN
China
Prior art keywords
substrate
polishing
insulating material
end point
point detection
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CN201880057226.1A
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English (en)
Chinese (zh)
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CN111095492A (zh
Inventor
户川哲二
曾布川拓司
畠山雅规
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Ebara Corp
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Ebara Corp
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Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/005—Control means for lapping machines or devices
    • B24B37/013—Devices or means for detecting lapping completion
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P52/00—Grinding, lapping or polishing of wafers, substrates or parts of devices
    • H10P52/40—Chemomechanical polishing [CMP]
    • H10P52/402—Chemomechanical polishing [CMP] of semiconductor materials
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/11—Lapping tools
    • B24B37/12—Lapping plates for working plane surfaces
    • B24B37/16—Lapping plates for working plane surfaces characterised by the shape of the lapping plate surface, e.g. grooved
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B49/00—Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation
    • B24B49/02—Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation according to the instantaneous size and required size of the workpiece acted upon, the measuring or gauging being continuous or intermittent
    • B24B49/04—Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation according to the instantaneous size and required size of the workpiece acted upon, the measuring or gauging being continuous or intermittent involving measurement of the workpiece at the place of grinding during grinding operation
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B49/00—Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation
    • B24B49/10—Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation involving electrical means
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B49/00—Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation
    • B24B49/12—Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation involving optical means
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B49/00—Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation
    • B24B49/16—Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation taking regard of the load
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P52/00—Grinding, lapping or polishing of wafers, substrates or parts of devices
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P74/00—Testing or measuring during manufacture or treatment of wafers, substrates or devices
    • H10P74/23—Testing or measuring during manufacture or treatment of wafers, substrates or devices characterised by multiple measurements, corrections, marking or sorting processes
    • H10P74/238—Testing or measuring during manufacture or treatment of wafers, substrates or devices characterised by multiple measurements, corrections, marking or sorting processes comprising acting in response to an ongoing measurement without interruption of processing, e.g. endpoint detection or in-situ thickness measurement
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings
    • H10W74/01—Manufacture or treatment
    • H10W74/012—Manufacture or treatment of encapsulations on active surfaces of flip-chip devices, e.g. forming underfills
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings
    • H10W74/01—Manufacture or treatment
    • H10W74/014—Manufacture or treatment using batch processing
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings
    • H10W74/10—Encapsulations, e.g. protective coatings characterised by their shape or disposition
    • H10W74/15—Encapsulations, e.g. protective coatings characterised by their shape or disposition on active surfaces of flip-chip devices, e.g. underfills
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/60—Insulating or insulated package substrates; Interposers; Redistribution layers
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings
    • H10W74/01—Manufacture or treatment
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/721—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bump connectors
    • H10W90/722—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bump connectors between stacked chips

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)
  • Constituent Portions Of Griding Lathes, Driving, Sensing And Control (AREA)
  • Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
CN201880057226.1A 2017-09-05 2018-08-22 基板、具备功能性芯片的基板的研磨方法、非暂时性的计算机可读取的记录介质 Active CN111095492B (zh)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2017-170302 2017-09-05
JP2017170302A JP6860451B2 (ja) 2017-09-05 2017-09-05 機能性チップを備える基板を研磨する方法
PCT/JP2018/030894 WO2019049659A1 (ja) 2017-09-05 2018-08-22 機能性チップを備える基板を研磨する方法

Publications (2)

Publication Number Publication Date
CN111095492A CN111095492A (zh) 2020-05-01
CN111095492B true CN111095492B (zh) 2023-12-01

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CN201880057226.1A Active CN111095492B (zh) 2017-09-05 2018-08-22 基板、具备功能性芯片的基板的研磨方法、非暂时性的计算机可读取的记录介质

Country Status (6)

Country Link
US (2) US11597051B2 (enExample)
JP (2) JP6860451B2 (enExample)
KR (2) KR102550564B1 (enExample)
CN (1) CN111095492B (enExample)
TW (1) TWI773810B (enExample)
WO (1) WO2019049659A1 (enExample)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP7325913B2 (ja) * 2019-11-22 2023-08-15 株式会社ディスコ ウェーハ加工装置
JP7693393B2 (ja) 2021-05-24 2025-06-17 キオクシア株式会社 半導体装置の製造方法
KR20230117970A (ko) 2022-02-03 2023-08-10 삼성전자주식회사 다층 광학 박막 구조를 포함하는 광학 장치 및 다층 광학 박막 구조의 평탄화 방법 및 장치

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5234868A (en) * 1992-10-29 1993-08-10 International Business Machines Corporation Method for determining planarization endpoint during chemical-mechanical polishing
JP2000124601A (ja) * 1998-10-13 2000-04-28 Ibiden Co Ltd プリント配線板の製造方法
CN101523565A (zh) * 2006-10-06 2009-09-02 株式会社荏原制作所 加工终点检测方法、研磨方法及研磨装置

Family Cites Families (23)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS628981A (ja) * 1985-07-04 1987-01-16 Daido Steel Co Ltd 巻取ドラムアダプタ
KR0166848B1 (ko) * 1995-04-07 1999-02-01 문정환 반도체 제조시의 연마종점 설정방법 및 장치
JPH09139369A (ja) * 1995-11-15 1997-05-27 Hitachi Ltd 半導体装置の製造方法およびそれに使用される研磨装置
MY139405A (en) * 1998-09-28 2009-09-30 Ibiden Co Ltd Printed circuit board and method for its production
JP3141939B2 (ja) 1998-11-26 2001-03-07 日本電気株式会社 金属配線形成方法
JP3774094B2 (ja) * 1999-12-02 2006-05-10 株式会社日立製作所 膜厚、加工深さ測定装置及び成膜加工方法
JP2002246352A (ja) * 2001-02-20 2002-08-30 Semiconductor Leading Edge Technologies Inc Ｃｍｐ終点検出装置、ｃｍｐ終点検出方法、及びｃｍｐ研磨面モニタ方法
JP4056854B2 (ja) * 2002-11-05 2008-03-05 新光電気工業株式会社 半導体装置の製造方法
US20050173259A1 (en) * 2004-02-06 2005-08-11 Applied Materials, Inc. Endpoint system for electro-chemical mechanical polishing
JP2007214402A (ja) 2006-02-10 2007-08-23 Cmk Corp 半導体素子及び半導体素子内蔵型プリント配線板
JP4899604B2 (ja) 2006-04-13 2012-03-21 ソニー株式会社 三次元半導体パッケージ製造方法
JP2008100319A (ja) * 2006-10-19 2008-05-01 Sharp Corp 研削加工方法および研削加工装置
JP2011000647A (ja) * 2009-06-16 2011-01-06 Ebara Corp 研磨監視方法
TWI453837B (zh) * 2011-06-13 2014-09-21 日月光半導體製造股份有限公司 具有非導電層的半導體封裝及其製造方法
JP2013044782A (ja) * 2011-08-22 2013-03-04 Seiko Epson Corp 光学素子、電気光学装置、投射型映像装置及び光学素子の製造方法
CN103814439B (zh) 2011-09-09 2016-10-19 株式会社村田制作所 模块基板
JP6005467B2 (ja) * 2011-10-26 2016-10-12 株式会社荏原製作所 研磨方法および研磨装置
US9358660B2 (en) * 2011-11-07 2016-06-07 Taiwan Semiconductor Manufacturing Company, Ltd. Grinding wheel design with elongated teeth arrangement
JP6157890B2 (ja) * 2013-03-26 2017-07-05 日東電工株式会社 アンダーフィル材、封止シート及び半導体装置の製造方法
US9490186B2 (en) * 2013-11-27 2016-11-08 Applied Materials, Inc. Limiting adjustment of polishing rates during substrate polishing
TWI591764B (zh) * 2015-01-12 2017-07-11 精材科技股份有限公司 晶片封裝體及其製造方法
US9595492B2 (en) * 2015-03-16 2017-03-14 Taiwan Semiconductor Manufacturing Company Ltd. Device manufacture and packaging method thereof
US9754805B1 (en) * 2016-02-25 2017-09-05 Taiwan Semiconductor Manufacturing Company, Ltd. Packaging method and structure

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5234868A (en) * 1992-10-29 1993-08-10 International Business Machines Corporation Method for determining planarization endpoint during chemical-mechanical polishing
JP2000124601A (ja) * 1998-10-13 2000-04-28 Ibiden Co Ltd プリント配線板の製造方法
CN101523565A (zh) * 2006-10-06 2009-09-02 株式会社荏原制作所 加工终点检测方法、研磨方法及研磨装置

Also Published As

Publication number Publication date
KR20230101949A (ko) 2023-07-06
KR20200049767A (ko) 2020-05-08
CN111095492A (zh) 2020-05-01
US20200391341A1 (en) 2020-12-17
TWI773810B (zh) 2022-08-11
KR102550564B1 (ko) 2023-07-04
US20230173636A1 (en) 2023-06-08
JP7177207B2 (ja) 2022-11-22
TW201919822A (zh) 2019-06-01
KR102770137B1 (ko) 2025-02-20
JP6860451B2 (ja) 2021-04-14
JP2019047022A (ja) 2019-03-22
US11597051B2 (en) 2023-03-07
JP2021103789A (ja) 2021-07-15
WO2019049659A1 (ja) 2019-03-14

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