JP5624099B2 - 化学機械的研磨のスペクトルに基づく監視のための装置および方法 - Google Patents
化学機械的研磨のスペクトルに基づく監視のための装置および方法 Download PDFInfo
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- JP5624099B2 JP5624099B2 JP2012220364A JP2012220364A JP5624099B2 JP 5624099 B2 JP5624099 B2 JP 5624099B2 JP 2012220364 A JP2012220364 A JP 2012220364A JP 2012220364 A JP2012220364 A JP 2012220364A JP 5624099 B2 JP5624099 B2 JP 5624099B2
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer
- H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic System or AIIIBV compounds with or without impurities, e.g. doping materials
- H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
- H01L21/302—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
- H01L21/304—Mechanical treatment, e.g. grinding, polishing, cutting
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B37/00—Lapping machines or devices; Accessories
- B24B37/005—Control means for lapping machines or devices
- B24B37/013—Devices or means for detecting lapping completion
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B37/00—Lapping machines or devices; Accessories
- B24B37/04—Lapping machines or devices; Accessories designed for working plane surfaces
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B37/00—Lapping machines or devices; Accessories
- B24B37/11—Lapping tools
- B24B37/20—Lapping pads for working plane surfaces
- B24B37/205—Lapping pads for working plane surfaces provided with a window for inspecting the surface of the work being lapped
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B37/00—Lapping machines or devices; Accessories
- B24B37/34—Accessories
- B24B37/345—Feeding, loading or unloading work specially adapted to lapping
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B49/00—Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation
- B24B49/12—Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation involving optical means
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B53/00—Devices or means for dressing or conditioning abrasive surfaces
- B24B53/017—Devices or means for dressing, cleaning or otherwise conditioning lapping tools
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/64—Manufacture or treatment of solid state devices other than semiconductor devices, or of parts thereof, not peculiar to a single device provided for in groups H01L31/00 - H10K99/00
Description
ここで、Aは生スペクトル、Darkは暗い状況下で得たスペクトル、Siは剥き出しのシリコン基板から得たスペクトルである。
g=(1−0)/(rmax−rmin)
h=1−rmax *g
N=Rg+h
ここで、gは利得、hはオフセット、rmaxは正規化範囲内の最高値、rminは正規化範囲内の最低値、Nは正規化後のスペクトル、Rは正規化前のスペクトルである。
Claims (6)
- コンピュータによって実現される方法であって、
基板を研磨するステップであって、基板に接触する研磨パッドを支持するプラテンを回転することを含む、ステップと、
研磨中の基板から一連の現在のスペクトルを得るステップと、
複数の所定スペクトルと複数のインデックス値とを記憶するステップであって、前記複数の所定スペクトルの各所定スペクトルが、研磨度数を表すインデックス値に関連していて、前記インデックス値は前記所定スペクトルが研磨中の基板から観察されると予測されるプラテン回転数である、ステップと、
前記一連の現在のスペクトルの各現在のスペクトルについて、前記複数の所定スペクトルの中から特定のスペクトルを選択し、一連のインデックス値を作成するために前記特定のスペクトルのインデックス値を決定するステップであって、当該選択が前記複数の所定スペクトルの中のどの所定スペクトルが前記現在のスペクトルと最も近く合致するかを決定する工程を備える、ステップと、
前記一連のインデックス値を使用して研磨終点を決定するステップと、
を備える方法。 - 前記インデックス値が整数である、請求項1に記載の方法。
- ライブラリ中の各所定スペクトルは一意のインデックス値を有する、請求項1に記載の方法。
- 実際にマシン読み出し可能な媒体上に記憶されているコンピュータプログラムであって、前記プログラムがプロセッサに以下の動作を行わせる命令を備えており、前記動作が、
基板に接触する研磨パッドを支持する回転プラテンを有する研磨システム内の研磨中の基板から一連の現在のスペクトルを得る動作と、
さらに、複数の所定スペクトルと複数のインデックス値とを記憶する動作であり、前記複数の所定スペクトルの各所定スペクトルが研磨度数を表すインデックス値に関連し、前記インデックス値は前記所定スペクトルが研磨中の基板から観察されると予測されるプラテン回転数である、動作と、
前記一連の現在のスペクトルの各現在のスペクトルについて、前記複数の所定スペクトルの中から特定のスペクトルを選択し、一連のインデックス値を作成するために前記特定のスペクトルのインデックス値を決定する動作であって、当該選択が前記複数の所定スペクトルの中のどの所定スペクトルが前記現在のスペクトルと最も近く合致するかを決定することを含む、動作と、
一連のインデックス値を使用して研磨終点を決定する動作である、プログラム。 - 前記インデックス値が整数である、請求項4に記載のプログラム。
- ライブラリ中の各所定スペクトルは一意のインデックス値を有する、請求項4に記載のプログラム。
Applications Claiming Priority (12)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US71068205P | 2005-08-22 | 2005-08-22 | |
US60/710,682 | 2005-08-22 | ||
US11/213,674 US7226339B2 (en) | 2005-08-22 | 2005-08-26 | Spectrum based endpointing for chemical mechanical polishing |
US11/213,344 US7764377B2 (en) | 2005-08-22 | 2005-08-26 | Spectrum based endpointing for chemical mechanical polishing |
US11/213,675 US7306507B2 (en) | 2005-08-22 | 2005-08-26 | Polishing pad assembly with glass or crystalline window |
US11/213,675 | 2005-08-26 | ||
US11/213,344 | 2005-08-26 | ||
US11/213,674 | 2005-08-26 | ||
US11/261,742 US7406394B2 (en) | 2005-08-22 | 2005-10-28 | Spectra based endpointing for chemical mechanical polishing |
US11/261,742 | 2005-10-28 | ||
US74776806P | 2006-05-19 | 2006-05-19 | |
US60/747,768 | 2006-05-19 |
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CN102626895B (zh) | 2016-05-25 |
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CN105773398B (zh) | 2019-11-19 |
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