JP6438288B2 - 化学機械的研磨のスペクトルに基づく監視のための装置および方法 - Google Patents
化学機械的研磨のスペクトルに基づく監視のための装置および方法 Download PDFInfo
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Classifications
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
- H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
- H01L21/302—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
- H01L21/304—Mechanical treatment, e.g. grinding, polishing, cutting
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B37/00—Lapping machines or devices; Accessories
- B24B37/005—Control means for lapping machines or devices
- B24B37/013—Devices or means for detecting lapping completion
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B37/00—Lapping machines or devices; Accessories
- B24B37/04—Lapping machines or devices; Accessories designed for working plane surfaces
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B37/00—Lapping machines or devices; Accessories
- B24B37/11—Lapping tools
- B24B37/20—Lapping pads for working plane surfaces
- B24B37/205—Lapping pads for working plane surfaces provided with a window for inspecting the surface of the work being lapped
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B37/00—Lapping machines or devices; Accessories
- B24B37/34—Accessories
- B24B37/345—Feeding, loading or unloading work specially adapted to lapping
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B49/00—Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation
- B24B49/12—Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation involving optical means
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B53/00—Devices or means for dressing or conditioning abrasive surfaces
- B24B53/017—Devices or means for dressing, cleaning or otherwise conditioning lapping tools
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/64—Manufacture or treatment of solid state devices other than semiconductor devices, or of parts thereof, not peculiar to a single device provided for in groups H01L31/00 - H10K99/00
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- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
- Mechanical Treatment Of Semiconductor (AREA)
- Constituent Portions Of Griding Lathes, Driving, Sensing And Control (AREA)
Description
ここで、Aは生スペクトル、Darkは暗い状況下で得たスペクトル、Siは剥き出しのシリコン基板から得たスペクトルである。
g=(1−0)/(rmax−rmin)
h=1−rmax *g
N=Rg+h
ここで、gは利得、hはオフセット、rmaxは正規化範囲内の最高値、rminは正規化範囲内の最低値、Nは正規化後のスペクトル、Rは正規化前のスペクトルである。
Claims (6)
- コンピュータによって実現される方法であって、
少なくとも1つのスペクトルを記憶するステップと、
研磨中の基板から一連の現在のスペクトルを得るステップと、
対象膜以外の媒体から寄与される光反射を除去するように一連の正規化された現在のスペクトルを生成するために、前記一連の現在のスペクトルの各々を正規化するステップであって、正規化が修正スペクトルを生成することを含み、修正スペクトルは現在のスペクトルから暗い状態で得られたスペクトルを減算することを含み、正規化が前記修正スペクトルのある範囲内での最高値と最低値とを決定することを含み、正規化が正規化された現在のスペクトルの各々の最高から最低の振幅を前記記憶されたスペクトルの最高から最低の振幅と等しくする、正規化するステップと、
前記少なくとも1つの記憶されたスペクトルと前記正規化された現在のスペクトルを使用して、研磨終点を決定するステップとを備える方法。 - 正規化が、各正規化されたスペクトルからの前記範囲内の最高点と最低点がそれぞれ1と0に正規化されることをもたらす、請求項1に記載の方法。
- 正規化が、gは利得、hはオフセット、rmaxは前記範囲内の前記現在のスペクトルの最高値、rminは前記範囲内の前記現在のスペクトルの最低値、Rは前記現在のスペクトル、Nは前記正規化されたスペクトルとして、g=(1−0)/(rmax−rmin)を計算し、h=1−rmaxgを計算し、N=Rg+hを計算することを含む、請求項2に記載の方法。
- プロセッサに、
少なくとも1つのスペクトルを記憶させ、
研磨中の基板から一連の現在のスペクトルを取得させ、
対象膜以外の媒体から寄与される光反射を除去するように一連の正規化された現在のスペクトルを生成するために、前記一連の現在のスペクトルの各々を正規化させることであって、正規化が修正スペクトルを生成することを含み、修正スペクトルは現在のスペクトルから暗い状態で得られたスペクトルを減算することを含み、正規化が前記修正スペクトルのある範囲内での最高値と最低値とを決定し、正規化された現在のスペクトルの各々の最高から最低の振幅を前記記憶されたスペクトルの最高から最低の振幅と等しくするよう、正規化させ、
前記少なくとも1つの記憶されたスペクトルと前記正規化された現在のスペクトルを使用して、研磨終点を決定させる、
ための命令を含むコンピュータプログラム。 - 正規化が、各正規化されたスペクトルからの前記範囲内の最高点と最低点がそれぞれ1と0に正規化されることをもたらす、請求項4に記載のコンピュータプログラム。
- 正規化が、gは利得、hはオフセット、rmaxは前記範囲内の前記現在のスペクトルの最高値、rminは前記範囲内の前記現在のスペクトルの最低値、Rは前記現在のスペクトル、Nは前記正規化されたスペクトルとして、g=(1−0)/(rmax−rmin)を計算し、h=1−rmaxgを計算し、N=Rg+hを計算することを含む、請求項5に記載のコンピュータプログラム。
Applications Claiming Priority (12)
Application Number | Priority Date | Filing Date | Title |
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US71068205P | 2005-08-22 | 2005-08-22 | |
US60/710,682 | 2005-08-22 | ||
US11/213,344 | 2005-08-26 | ||
US11/213,675 US7306507B2 (en) | 2005-08-22 | 2005-08-26 | Polishing pad assembly with glass or crystalline window |
US11/213,674 | 2005-08-26 | ||
US11/213,675 | 2005-08-26 | ||
US11/213,674 US7226339B2 (en) | 2005-08-22 | 2005-08-26 | Spectrum based endpointing for chemical mechanical polishing |
US11/213,344 US7764377B2 (en) | 2005-08-22 | 2005-08-26 | Spectrum based endpointing for chemical mechanical polishing |
US11/261,742 | 2005-10-28 | ||
US11/261,742 US7406394B2 (en) | 2005-08-22 | 2005-10-28 | Spectra based endpointing for chemical mechanical polishing |
US74776806P | 2006-05-19 | 2006-05-19 | |
US60/747,768 | 2006-05-19 |
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JP2012220364A Active JP5624099B2 (ja) | 2005-08-22 | 2012-10-02 | 化学機械的研磨のスペクトルに基づく監視のための装置および方法 |
JP2014249935A Active JP6438288B2 (ja) | 2005-08-22 | 2014-12-10 | 化学機械的研磨のスペクトルに基づく監視のための装置および方法 |
JP2014249936A Active JP6052906B2 (ja) | 2005-08-22 | 2014-12-10 | 化学機械的研磨のスペクトルに基づく監視のための装置および方法 |
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JP2012168681A Active JP5622806B2 (ja) | 2005-08-22 | 2012-07-30 | 化学機械的研磨のスペクトルに基づく監視のための装置および方法 |
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CN104526536A (zh) | 2015-04-22 |
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JP6052906B2 (ja) | 2016-12-27 |
JP2012256913A (ja) | 2012-12-27 |
CN102626895B (zh) | 2016-05-25 |
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JP5624099B2 (ja) | 2014-11-12 |
KR101398570B1 (ko) | 2014-05-22 |
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JP2012256911A (ja) | 2012-12-27 |
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