KR101398567B1 - 화학적 기계적 폴리싱의 스펙트럼 기반 모니터링을 위한 장치 및 방법 - Google Patents

화학적 기계적 폴리싱의 스펙트럼 기반 모니터링을 위한 장치 및 방법 Download PDF

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Publication number
KR101398567B1
KR101398567B1 KR1020137008965A KR20137008965A KR101398567B1 KR 101398567 B1 KR101398567 B1 KR 101398567B1 KR 1020137008965 A KR1020137008965 A KR 1020137008965A KR 20137008965 A KR20137008965 A KR 20137008965A KR 101398567 B1 KR101398567 B1 KR 101398567B1
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KR
South Korea
Prior art keywords
spectrum
spectra
polishing
substrate
current
Prior art date
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KR1020137008965A
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English (en)
Korean (ko)
Other versions
KR20130042059A (ko
Inventor
도미닉 제이. 벤베그누
제프리 드류 데이비드
보그단 스웨덱
헤리 큐. 리
라크쉬마난 카루프피아
Original Assignee
어플라이드 머티어리얼스, 인코포레이티드
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from US11/213,675 external-priority patent/US7306507B2/en
Priority claimed from US11/261,742 external-priority patent/US7406394B2/en
Application filed by 어플라이드 머티어리얼스, 인코포레이티드 filed Critical 어플라이드 머티어리얼스, 인코포레이티드
Priority claimed from PCT/US2006/032659 external-priority patent/WO2007024807A2/en
Publication of KR20130042059A publication Critical patent/KR20130042059A/ko
Application granted granted Critical
Publication of KR101398567B1 publication Critical patent/KR101398567B1/ko

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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
    • H01L21/302—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
    • H01L21/304—Mechanical treatment, e.g. grinding, polishing, cutting
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/005—Control means for lapping machines or devices
    • B24B37/013—Devices or means for detecting lapping completion
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/04—Lapping machines or devices; Accessories designed for working plane surfaces
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/11—Lapping tools
    • B24B37/20—Lapping pads for working plane surfaces
    • B24B37/205—Lapping pads for working plane surfaces provided with a window for inspecting the surface of the work being lapped
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/34—Accessories
    • B24B37/345—Feeding, loading or unloading work specially adapted to lapping
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B49/00—Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation
    • B24B49/12—Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation involving optical means
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B53/00—Devices or means for dressing or conditioning abrasive surfaces
    • B24B53/017—Devices or means for dressing, cleaning or otherwise conditioning lapping tools
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/64—Manufacture or treatment of solid state devices other than semiconductor devices, or of parts thereof, not peculiar to a single device provided for in groups H01L31/00 - H10K99/00

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  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)
  • Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
  • Constituent Portions Of Griding Lathes, Driving, Sensing And Control (AREA)
KR1020137008965A 2005-08-22 2006-08-21 화학적 기계적 폴리싱의 스펙트럼 기반 모니터링을 위한 장치 및 방법 KR101398567B1 (ko)

Applications Claiming Priority (13)

Application Number Priority Date Filing Date Title
US71068205P 2005-08-22 2005-08-22
US60/710,682 2005-08-22
US11/213,675 US7306507B2 (en) 2005-08-22 2005-08-26 Polishing pad assembly with glass or crystalline window
US11/213,674 US7226339B2 (en) 2005-08-22 2005-08-26 Spectrum based endpointing for chemical mechanical polishing
US11/213,674 2005-08-26
US11/213,344 2005-08-26
US11/213,675 2005-08-26
US11/213,344 US7764377B2 (en) 2005-08-22 2005-08-26 Spectrum based endpointing for chemical mechanical polishing
US11/261,742 US7406394B2 (en) 2005-08-22 2005-10-28 Spectra based endpointing for chemical mechanical polishing
US11/261,742 2005-10-28
US74776806P 2006-05-19 2006-05-19
US60/747,768 2006-05-19
PCT/US2006/032659 WO2007024807A2 (en) 2005-08-22 2006-08-21 Apparatus and methods for spectrum based monitoring of chemical mechanical polishing

Related Parent Applications (1)

Application Number Title Priority Date Filing Date
KR1020087006475A Division KR101324644B1 (ko) 2005-08-22 2006-08-21 화학적 기계적 폴리싱의 스펙트럼 기반 모니터링을 위한 장치 및 방법

Publications (2)

Publication Number Publication Date
KR20130042059A KR20130042059A (ko) 2013-04-25
KR101398567B1 true KR101398567B1 (ko) 2014-05-22

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Family Applications (5)

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KR1020137008961A KR101423579B1 (ko) 2005-08-22 2006-08-21 화학적 기계적 폴리싱의 스펙트럼 기반 모니터링을 위한 장치 및 방법
KR1020147029677A KR101593927B1 (ko) 2005-08-22 2006-08-21 화학적 기계적 폴리싱의 스펙트럼 기반 모니터링을 위한 장치 및 방법
KR1020137008968A KR101398570B1 (ko) 2005-08-22 2006-08-21 화학적 기계적 폴리싱의 스펙트럼 기반 모니터링을 위한 장치 및 방법
KR1020147002129A KR101521414B1 (ko) 2005-08-22 2006-08-21 화학적 기계적 폴리싱의 스펙트럼 기반 모니터링을 위한 장치 및 방법
KR1020137008965A KR101398567B1 (ko) 2005-08-22 2006-08-21 화학적 기계적 폴리싱의 스펙트럼 기반 모니터링을 위한 장치 및 방법

Family Applications Before (4)

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KR1020137008961A KR101423579B1 (ko) 2005-08-22 2006-08-21 화학적 기계적 폴리싱의 스펙트럼 기반 모니터링을 위한 장치 및 방법
KR1020147029677A KR101593927B1 (ko) 2005-08-22 2006-08-21 화학적 기계적 폴리싱의 스펙트럼 기반 모니터링을 위한 장치 및 방법
KR1020137008968A KR101398570B1 (ko) 2005-08-22 2006-08-21 화학적 기계적 폴리싱의 스펙트럼 기반 모니터링을 위한 장치 및 방법
KR1020147002129A KR101521414B1 (ko) 2005-08-22 2006-08-21 화학적 기계적 폴리싱의 스펙트럼 기반 모니터링을 위한 장치 및 방법

Country Status (4)

Country Link
JP (6) JP5622807B2 (ja)
KR (5) KR101423579B1 (ja)
CN (3) CN105773398B (ja)
TW (1) TWI361454B (ja)

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KR101870701B1 (ko) 2016-08-01 2018-06-25 에스케이실트론 주식회사 폴리싱 측정 장치 및 그의 연마 시간 제어 방법, 및 그를 포함한 폴리싱 제어 시스템
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KR101890331B1 (ko) * 2017-10-16 2018-08-21 에스케이씨 주식회사 누수 방지된 연마패드 및 이의 제조방법
CN107900788B (zh) * 2017-11-24 2020-04-24 上海华力微电子有限公司 一种改善层间介质研磨工艺厚度稳定性的方法
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Publication number Publication date
TW200717637A (en) 2007-05-01
KR20130042059A (ko) 2013-04-25
CN102626895B (zh) 2016-05-25
JP2012256911A (ja) 2012-12-27
KR101423579B1 (ko) 2014-07-25
JP5624099B2 (ja) 2014-11-12
KR101398570B1 (ko) 2014-05-22
JP2013048259A (ja) 2013-03-07
KR101593927B1 (ko) 2016-02-15
JP2015079984A (ja) 2015-04-23
CN105773398B (zh) 2019-11-19
KR20130041397A (ko) 2013-04-24
JP6047327B2 (ja) 2016-12-21
KR20140140598A (ko) 2014-12-09
JP6438288B2 (ja) 2018-12-12
CN102626895A (zh) 2012-08-08
JP5622806B2 (ja) 2014-11-12
KR20140019484A (ko) 2014-02-14
JP6052906B2 (ja) 2016-12-27
TWI361454B (en) 2012-04-01
CN105773398A (zh) 2016-07-20
CN104526536B (zh) 2017-09-22
KR101521414B1 (ko) 2015-05-19
JP2015077684A (ja) 2015-04-23
JP2012256912A (ja) 2012-12-27
KR20130041396A (ko) 2013-04-24
JP5622807B2 (ja) 2014-11-12
JP2012256913A (ja) 2012-12-27
CN104526536A (zh) 2015-04-22

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