TW200717637A - Apparatus and methods for spectrum based monitoring of chemical mechanical polishing - Google Patents
Apparatus and methods for spectrum based monitoring of chemical mechanical polishingInfo
- Publication number
- TW200717637A TW200717637A TW095130882A TW95130882A TW200717637A TW 200717637 A TW200717637 A TW 200717637A TW 095130882 A TW095130882 A TW 095130882A TW 95130882 A TW95130882 A TW 95130882A TW 200717637 A TW200717637 A TW 200717637A
- Authority
- TW
- Taiwan
- Prior art keywords
- spectrum based
- spectrum
- endpoint
- chemical mechanical
- methods
- Prior art date
Links
- 238000001228 spectrum Methods 0.000 title abstract 10
- 238000005498 polishing Methods 0.000 title abstract 5
- 238000000034 method Methods 0.000 title abstract 2
- 238000012544 monitoring process Methods 0.000 title abstract 2
- 239000000126 substance Substances 0.000 title abstract 2
- 238000011010 flushing procedure Methods 0.000 abstract 2
- 230000003287 optical effect Effects 0.000 abstract 2
- 239000011521 glass Substances 0.000 abstract 1
- 239000000758 substrate Substances 0.000 abstract 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
- H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
- H01L21/302—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
- H01L21/304—Mechanical treatment, e.g. grinding, polishing, cutting
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B37/00—Lapping machines or devices; Accessories
- B24B37/005—Control means for lapping machines or devices
- B24B37/013—Devices or means for detecting lapping completion
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B37/00—Lapping machines or devices; Accessories
- B24B37/04—Lapping machines or devices; Accessories designed for working plane surfaces
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B37/00—Lapping machines or devices; Accessories
- B24B37/11—Lapping tools
- B24B37/20—Lapping pads for working plane surfaces
- B24B37/205—Lapping pads for working plane surfaces provided with a window for inspecting the surface of the work being lapped
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B37/00—Lapping machines or devices; Accessories
- B24B37/34—Accessories
- B24B37/345—Feeding, loading or unloading work specially adapted to lapping
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B49/00—Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation
- B24B49/12—Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation involving optical means
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B53/00—Devices or means for dressing or conditioning abrasive surfaces
- B24B53/017—Devices or means for dressing, cleaning or otherwise conditioning lapping tools
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/64—Manufacture or treatment of solid state devices other than semiconductor devices, or of parts thereof, not peculiar to a single device provided for in groups H01L31/00 - H10K99/00
Landscapes
- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
- Mechanical Treatment Of Semiconductor (AREA)
- Constituent Portions Of Griding Lathes, Driving, Sensing And Control (AREA)
Abstract
Apparatus and methods for spectrum based monitoring of chemical mechanical polishing, including spectrum based endpointing, spectrum based polishing rate adjustment, flushing a top surface of an optical head, or a pad with a window. The spectrum-based endpointing uses a reference spectrum which is empirically selected for particular spectrum based endpoint determination logic so that the target thickness is achieved when endpoint is called by applying the particular spectrum based endpoint logic. The polishing endpoint can be determined using a difference trace of a sequence of index values. The flushing system creates a laminar gas flow across the top surface of the optical head. The vacuum nozzle and vacuum sources are configured so that the flow of gas is laminar. The window includes a soft plastic portion and a crystalline or glass like portion. The spectrum based polishing rate adjustment includes obtaining spectra for different zones on a substrate.
Applications Claiming Priority (6)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US71068205P | 2005-08-22 | 2005-08-22 | |
US11/213,344 US7764377B2 (en) | 2005-08-22 | 2005-08-26 | Spectrum based endpointing for chemical mechanical polishing |
US11/213,675 US7306507B2 (en) | 2005-08-22 | 2005-08-26 | Polishing pad assembly with glass or crystalline window |
US11/213,674 US7226339B2 (en) | 2005-08-22 | 2005-08-26 | Spectrum based endpointing for chemical mechanical polishing |
US11/261,742 US7406394B2 (en) | 2005-08-22 | 2005-10-28 | Spectra based endpointing for chemical mechanical polishing |
US74776806P | 2006-05-19 | 2006-05-19 |
Publications (2)
Publication Number | Publication Date |
---|---|
TW200717637A true TW200717637A (en) | 2007-05-01 |
TWI361454B TWI361454B (en) | 2012-04-01 |
Family
ID=46585383
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
TW095130882A TWI361454B (en) | 2005-08-22 | 2006-08-22 | Apparatus and methods for spectrum based monitoring of chemical mechanical polishing |
Country Status (4)
Country | Link |
---|---|
JP (6) | JP6047327B2 (en) |
KR (5) | KR101593927B1 (en) |
CN (3) | CN105773398B (en) |
TW (1) | TWI361454B (en) |
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TWI496661B (en) * | 2010-04-28 | 2015-08-21 | Applied Materials Inc | Automatic generation of reference spectra for optical monitoring |
TWI498689B (en) * | 2009-11-03 | 2015-09-01 | Applied Materials Inc | Computer program product and method for polishing |
TWI574787B (en) * | 2011-04-28 | 2017-03-21 | 應用材料股份有限公司 | Varying coefficients and functions for polishing control |
TWI593513B (en) * | 2010-05-17 | 2017-08-01 | 應用材料股份有限公司 | Method for feedback for polishing rate correction in chemical mechanical polishing |
US10543579B2 (en) | 2017-08-08 | 2020-01-28 | Micron Technology, Inc. | Polishing apparatuses and polishing methods |
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JP5654753B2 (en) * | 2007-02-23 | 2015-01-14 | アプライド マテリアルズ インコーポレイテッドApplied Materials,Incorporated | Determination of polishing end point using spectrum |
US9579767B2 (en) | 2010-04-28 | 2017-02-28 | Applied Materials, Inc. | Automatic generation of reference spectra for optical monitoring of substrates |
US10012494B2 (en) * | 2013-10-25 | 2018-07-03 | Applied Materials, Inc. | Grouping spectral data from polishing substrates |
US9997420B2 (en) * | 2013-12-27 | 2018-06-12 | Taiwan Semiconductor Manufacturing Company Limited | Method and/or system for chemical mechanical planarization (CMP) |
US9352440B2 (en) * | 2014-04-30 | 2016-05-31 | Applied Materials, Inc. | Serial feature tracking for endpoint detection |
US10350728B2 (en) * | 2014-12-12 | 2019-07-16 | Applied Materials, Inc. | System and process for in situ byproduct removal and platen cooling during CMP |
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JP2017064899A (en) * | 2015-10-01 | 2017-04-06 | 株式会社荏原製作所 | Polishing device |
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2006
- 2006-08-21 KR KR1020147029677A patent/KR101593927B1/en active IP Right Grant
- 2006-08-21 CN CN201610227541.7A patent/CN105773398B/en active Active
- 2006-08-21 KR KR1020137008961A patent/KR101423579B1/en active IP Right Grant
- 2006-08-21 KR KR1020137008968A patent/KR101398570B1/en active IP Right Grant
- 2006-08-21 CN CN201210109226.6A patent/CN102626895B/en active Active
- 2006-08-21 CN CN201410667878.0A patent/CN104526536B/en active Active
- 2006-08-21 KR KR1020147002129A patent/KR101521414B1/en active IP Right Grant
- 2006-08-21 KR KR1020137008965A patent/KR101398567B1/en active IP Right Grant
- 2006-08-22 TW TW095130882A patent/TWI361454B/en active
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2012
- 2012-07-30 JP JP2012168680A patent/JP6047327B2/en active Active
- 2012-07-30 JP JP2012168681A patent/JP5622806B2/en active Active
- 2012-07-30 JP JP2012168682A patent/JP5622807B2/en active Active
- 2012-10-02 JP JP2012220364A patent/JP5624099B2/en active Active
-
2014
- 2014-12-10 JP JP2014249936A patent/JP6052906B2/en active Active
- 2014-12-10 JP JP2014249935A patent/JP6438288B2/en active Active
Cited By (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
TWI498689B (en) * | 2009-11-03 | 2015-09-01 | Applied Materials Inc | Computer program product and method for polishing |
TWI496661B (en) * | 2010-04-28 | 2015-08-21 | Applied Materials Inc | Automatic generation of reference spectra for optical monitoring |
TWI593513B (en) * | 2010-05-17 | 2017-08-01 | 應用材料股份有限公司 | Method for feedback for polishing rate correction in chemical mechanical polishing |
TWI574787B (en) * | 2011-04-28 | 2017-03-21 | 應用材料股份有限公司 | Varying coefficients and functions for polishing control |
US10543579B2 (en) | 2017-08-08 | 2020-01-28 | Micron Technology, Inc. | Polishing apparatuses and polishing methods |
TWI709456B (en) * | 2017-08-08 | 2020-11-11 | 美商美光科技公司 | Polishing apparatuses and polishing methods |
Also Published As
Publication number | Publication date |
---|---|
TWI361454B (en) | 2012-04-01 |
KR101521414B1 (en) | 2015-05-19 |
JP5622807B2 (en) | 2014-11-12 |
JP2012256912A (en) | 2012-12-27 |
CN105773398B (en) | 2019-11-19 |
JP6438288B2 (en) | 2018-12-12 |
CN105773398A (en) | 2016-07-20 |
KR101423579B1 (en) | 2014-07-25 |
JP5622806B2 (en) | 2014-11-12 |
JP2012256913A (en) | 2012-12-27 |
JP2013048259A (en) | 2013-03-07 |
CN102626895B (en) | 2016-05-25 |
JP6052906B2 (en) | 2016-12-27 |
CN104526536A (en) | 2015-04-22 |
JP2015079984A (en) | 2015-04-23 |
JP2012256911A (en) | 2012-12-27 |
CN102626895A (en) | 2012-08-08 |
KR20140140598A (en) | 2014-12-09 |
KR101593927B1 (en) | 2016-02-15 |
KR101398567B1 (en) | 2014-05-22 |
KR20130042059A (en) | 2013-04-25 |
JP6047327B2 (en) | 2016-12-21 |
KR20140019484A (en) | 2014-02-14 |
KR20130041397A (en) | 2013-04-24 |
CN104526536B (en) | 2017-09-22 |
JP2015077684A (en) | 2015-04-23 |
JP5624099B2 (en) | 2014-11-12 |
KR101398570B1 (en) | 2014-05-22 |
KR20130041396A (en) | 2013-04-24 |
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