TW200717637A - Apparatus and methods for spectrum based monitoring of chemical mechanical polishing - Google Patents

Apparatus and methods for spectrum based monitoring of chemical mechanical polishing

Info

Publication number
TW200717637A
TW200717637A TW095130882A TW95130882A TW200717637A TW 200717637 A TW200717637 A TW 200717637A TW 095130882 A TW095130882 A TW 095130882A TW 95130882 A TW95130882 A TW 95130882A TW 200717637 A TW200717637 A TW 200717637A
Authority
TW
Taiwan
Prior art keywords
spectrum based
spectrum
endpoint
chemical mechanical
methods
Prior art date
Application number
TW095130882A
Other languages
Chinese (zh)
Other versions
TWI361454B (en
Inventor
Dominic J Benvegnu
Jeffrey Drue David
Bogdan Swedek
Harry Q Lee
Lakshmanan Karuppiah
Original Assignee
Applied Materials Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from US11/213,344 external-priority patent/US7764377B2/en
Priority claimed from US11/261,742 external-priority patent/US7406394B2/en
Application filed by Applied Materials Inc filed Critical Applied Materials Inc
Publication of TW200717637A publication Critical patent/TW200717637A/en
Application granted granted Critical
Publication of TWI361454B publication Critical patent/TWI361454B/en

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
    • H01L21/302—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
    • H01L21/304—Mechanical treatment, e.g. grinding, polishing, cutting
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/005—Control means for lapping machines or devices
    • B24B37/013—Devices or means for detecting lapping completion
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/04—Lapping machines or devices; Accessories designed for working plane surfaces
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/11—Lapping tools
    • B24B37/20—Lapping pads for working plane surfaces
    • B24B37/205—Lapping pads for working plane surfaces provided with a window for inspecting the surface of the work being lapped
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/34—Accessories
    • B24B37/345—Feeding, loading or unloading work specially adapted to lapping
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B49/00—Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation
    • B24B49/12—Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation involving optical means
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B53/00—Devices or means for dressing or conditioning abrasive surfaces
    • B24B53/017—Devices or means for dressing, cleaning or otherwise conditioning lapping tools
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/64—Manufacture or treatment of solid state devices other than semiconductor devices, or of parts thereof, not peculiar to a single device provided for in groups H01L31/00 - H10K99/00

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)
  • Constituent Portions Of Griding Lathes, Driving, Sensing And Control (AREA)

Abstract

Apparatus and methods for spectrum based monitoring of chemical mechanical polishing, including spectrum based endpointing, spectrum based polishing rate adjustment, flushing a top surface of an optical head, or a pad with a window. The spectrum-based endpointing uses a reference spectrum which is empirically selected for particular spectrum based endpoint determination logic so that the target thickness is achieved when endpoint is called by applying the particular spectrum based endpoint logic. The polishing endpoint can be determined using a difference trace of a sequence of index values. The flushing system creates a laminar gas flow across the top surface of the optical head. The vacuum nozzle and vacuum sources are configured so that the flow of gas is laminar. The window includes a soft plastic portion and a crystalline or glass like portion. The spectrum based polishing rate adjustment includes obtaining spectra for different zones on a substrate.
TW095130882A 2005-08-22 2006-08-22 Apparatus and methods for spectrum based monitoring of chemical mechanical polishing TWI361454B (en)

Applications Claiming Priority (6)

Application Number Priority Date Filing Date Title
US71068205P 2005-08-22 2005-08-22
US11/213,344 US7764377B2 (en) 2005-08-22 2005-08-26 Spectrum based endpointing for chemical mechanical polishing
US11/213,675 US7306507B2 (en) 2005-08-22 2005-08-26 Polishing pad assembly with glass or crystalline window
US11/213,674 US7226339B2 (en) 2005-08-22 2005-08-26 Spectrum based endpointing for chemical mechanical polishing
US11/261,742 US7406394B2 (en) 2005-08-22 2005-10-28 Spectra based endpointing for chemical mechanical polishing
US74776806P 2006-05-19 2006-05-19

Publications (2)

Publication Number Publication Date
TW200717637A true TW200717637A (en) 2007-05-01
TWI361454B TWI361454B (en) 2012-04-01

Family

ID=46585383

Family Applications (1)

Application Number Title Priority Date Filing Date
TW095130882A TWI361454B (en) 2005-08-22 2006-08-22 Apparatus and methods for spectrum based monitoring of chemical mechanical polishing

Country Status (4)

Country Link
JP (6) JP6047327B2 (en)
KR (5) KR101593927B1 (en)
CN (3) CN105773398B (en)
TW (1) TWI361454B (en)

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TWI496661B (en) * 2010-04-28 2015-08-21 Applied Materials Inc Automatic generation of reference spectra for optical monitoring
TWI498689B (en) * 2009-11-03 2015-09-01 Applied Materials Inc Computer program product and method for polishing
TWI574787B (en) * 2011-04-28 2017-03-21 應用材料股份有限公司 Varying coefficients and functions for polishing control
TWI593513B (en) * 2010-05-17 2017-08-01 應用材料股份有限公司 Method for feedback for polishing rate correction in chemical mechanical polishing
US10543579B2 (en) 2017-08-08 2020-01-28 Micron Technology, Inc. Polishing apparatuses and polishing methods

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JP5654753B2 (en) * 2007-02-23 2015-01-14 アプライド マテリアルズ インコーポレイテッドＡｐｐｌｉｅｄ Ｍａｔｅｒｉａｌｓ，Ｉｎｃｏｒｐｏｒａｔｅｄ Determination of polishing end point using spectrum
US9579767B2 (en) 2010-04-28 2017-02-28 Applied Materials, Inc. Automatic generation of reference spectra for optical monitoring of substrates
US10012494B2 (en) * 2013-10-25 2018-07-03 Applied Materials, Inc. Grouping spectral data from polishing substrates
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CN107520740A (en) * 2017-09-18 2017-12-29 北京半导体专用设备研究所（中国电子科技集团公司第四十五研究所） The detection method of optical spectrum end-point, apparatus and system in a kind of chemically mechanical polishing
KR101890331B1 (en) * 2017-10-16 2018-08-21 에스케이씨 주식회사 Polishing pad protected leakage and manufecturing method thereof
CN107900788B (en) * 2017-11-24 2020-04-24 上海华力微电子有限公司 Method for improving thickness stability of interlayer medium grinding process
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KR20210052559A (en) * 2018-09-24 2021-05-10 어플라이드 머티어리얼스, 인코포레이티드 Machine vision as input to the CMP process control algorithm
WO2021262450A1 (en) 2020-06-24 2021-12-30 Applied Materials, Inc. Determination of substrate layer thickness with polishing pad wear compensation
CN112025547B (en) * 2020-09-15 2021-11-02 泉芯集成电路制造(济南)有限公司 Laser projection virtual correction device and method
CN113478382B (en) * 2021-07-20 2022-11-04 湖北鼎汇微电子材料有限公司 Detection window, chemical mechanical polishing pad and polishing system

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* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI498689B (en) * 2009-11-03 2015-09-01 Applied Materials Inc Computer program product and method for polishing
TWI496661B (en) * 2010-04-28 2015-08-21 Applied Materials Inc Automatic generation of reference spectra for optical monitoring
TWI593513B (en) * 2010-05-17 2017-08-01 應用材料股份有限公司 Method for feedback for polishing rate correction in chemical mechanical polishing
TWI574787B (en) * 2011-04-28 2017-03-21 應用材料股份有限公司 Varying coefficients and functions for polishing control
US10543579B2 (en) 2017-08-08 2020-01-28 Micron Technology, Inc. Polishing apparatuses and polishing methods
TWI709456B (en) * 2017-08-08 2020-11-11 美商美光科技公司 Polishing apparatuses and polishing methods

Also Published As

Publication number Publication date
TWI361454B (en) 2012-04-01
KR101521414B1 (en) 2015-05-19
JP5622807B2 (en) 2014-11-12
JP2012256912A (en) 2012-12-27
CN105773398B (en) 2019-11-19
JP6438288B2 (en) 2018-12-12
CN105773398A (en) 2016-07-20
KR101423579B1 (en) 2014-07-25
JP5622806B2 (en) 2014-11-12
JP2012256913A (en) 2012-12-27
JP2013048259A (en) 2013-03-07
CN102626895B (en) 2016-05-25
JP6052906B2 (en) 2016-12-27
CN104526536A (en) 2015-04-22
JP2015079984A (en) 2015-04-23
JP2012256911A (en) 2012-12-27
CN102626895A (en) 2012-08-08
KR20140140598A (en) 2014-12-09
KR101593927B1 (en) 2016-02-15
KR101398567B1 (en) 2014-05-22
KR20130042059A (en) 2013-04-25
JP6047327B2 (en) 2016-12-21
KR20140019484A (en) 2014-02-14
KR20130041397A (en) 2013-04-24
CN104526536B (en) 2017-09-22
JP2015077684A (en) 2015-04-23
JP5624099B2 (en) 2014-11-12
KR101398570B1 (en) 2014-05-22
KR20130041396A (en) 2013-04-24

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