WO2007024807A3 - Apparatus and methods for spectrum based monitoring of chemical mechanical polishing - Google Patents
Apparatus and methods for spectrum based monitoring of chemical mechanical polishing Download PDFInfo
- Publication number
- WO2007024807A3 WO2007024807A3 PCT/US2006/032659 US2006032659W WO2007024807A3 WO 2007024807 A3 WO2007024807 A3 WO 2007024807A3 US 2006032659 W US2006032659 W US 2006032659W WO 2007024807 A3 WO2007024807 A3 WO 2007024807A3
- Authority
- WO
- WIPO (PCT)
- Prior art keywords
- spectrum based
- spectrum
- endpoint
- chemical mechanical
- methods
- Prior art date
Links
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B37/00—Lapping machines or devices; Accessories
- B24B37/04—Lapping machines or devices; Accessories designed for working plane surfaces
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B37/00—Lapping machines or devices; Accessories
- B24B37/04—Lapping machines or devices; Accessories designed for working plane surfaces
- B24B37/042—Lapping machines or devices; Accessories designed for working plane surfaces operating processes therefor
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B37/00—Lapping machines or devices; Accessories
- B24B37/11—Lapping tools
- B24B37/20—Lapping pads for working plane surfaces
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B37/00—Lapping machines or devices; Accessories
- B24B37/11—Lapping tools
- B24B37/20—Lapping pads for working plane surfaces
- B24B37/205—Lapping pads for working plane surfaces provided with a window for inspecting the surface of the work being lapped
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B49/00—Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation
- B24B49/12—Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation involving optical means
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer
- H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic System or AIIIBV compounds with or without impurities, e.g. doping materials
- H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
- H01L21/302—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
- H01L21/304—Mechanical treatment, e.g. grinding, polishing, cutting
Abstract
Priority Applications (8)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
KR1020147029677A KR101593927B1 (en) | 2005-08-22 | 2006-08-21 | Apparatus and methods for spectrum based monitoring of chemical mechanical polishing |
KR1020147002129A KR101521414B1 (en) | 2005-08-22 | 2006-08-21 | Apparatus and methods for spectrum based monitoring of chemical mechanical polishing |
KR1020087006475A KR101324644B1 (en) | 2005-08-22 | 2006-08-21 | Apparatus and methods for spectrum based monitoring of chemical mechanical polishing |
CN2006800304049A CN101242931B (en) | 2005-08-22 | 2006-08-21 | Apparatus and methods for spectrum based monitoring of chemical mechanical polishing |
KR1020137008968A KR101398570B1 (en) | 2005-08-22 | 2006-08-21 | Apparatus and methods for spectrum based monitoring of chemical mechanical polishing |
JP2008528048A JP5534672B2 (en) | 2005-08-22 | 2006-08-21 | Apparatus and method for spectrum-based monitoring of chemical mechanical polishing |
KR1020137008961A KR101423579B1 (en) | 2005-08-22 | 2006-08-21 | Apparatus and methods for spectrum based monitoring of chemical mechanical polishing |
KR1020137008965A KR101398567B1 (en) | 2005-08-22 | 2006-08-21 | Apparatus and methods for spectrum based monitoring of chemical mechanical polishing |
Applications Claiming Priority (12)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US71068205P | 2005-08-22 | 2005-08-22 | |
US60/710,682 | 2005-08-22 | ||
US11/213,344 | 2005-08-26 | ||
US11/213,674 | 2005-08-26 | ||
US11/213,344 US7764377B2 (en) | 2005-08-22 | 2005-08-26 | Spectrum based endpointing for chemical mechanical polishing |
US11/213,675 US7306507B2 (en) | 2005-08-22 | 2005-08-26 | Polishing pad assembly with glass or crystalline window |
US11/213,675 | 2005-08-26 | ||
US11/213,674 US7226339B2 (en) | 2005-08-22 | 2005-08-26 | Spectrum based endpointing for chemical mechanical polishing |
US11/261,742 US7406394B2 (en) | 2005-08-22 | 2005-10-28 | Spectra based endpointing for chemical mechanical polishing |
US11/261,742 | 2005-10-28 | ||
US74776806P | 2006-05-19 | 2006-05-19 | |
US60/747,768 | 2006-05-19 |
Publications (3)
Publication Number | Publication Date |
---|---|
WO2007024807A2 WO2007024807A2 (en) | 2007-03-01 |
WO2007024807A3 true WO2007024807A3 (en) | 2007-07-12 |
WO2007024807A9 WO2007024807A9 (en) | 2009-09-03 |
Family
ID=37560902
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
PCT/US2006/032659 WO2007024807A2 (en) | 2005-08-22 | 2006-08-21 | Apparatus and methods for spectrum based monitoring of chemical mechanical polishing |
Country Status (4)
Country | Link |
---|---|
JP (1) | JP5534672B2 (en) |
KR (1) | KR101324644B1 (en) |
TW (1) | TWI366872B (en) |
WO (1) | WO2007024807A2 (en) |
Cited By (1)
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---|---|---|---|---|
US11847776B2 (en) | 2020-06-29 | 2023-12-19 | Applied Materials, Inc. | System using film thickness estimation from machine learning based processing of substrate images |
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US7998358B2 (en) | 2006-10-31 | 2011-08-16 | Applied Materials, Inc. | Peak-based endpointing for chemical mechanical polishing |
JP5654753B2 (en) * | 2007-02-23 | 2015-01-14 | アプライド マテリアルズ インコーポレイテッドApplied Materials,Incorporated | Determination of polishing end point using spectrum |
US20090275265A1 (en) * | 2008-05-02 | 2009-11-05 | Applied Materials, Inc. | Endpoint detection in chemical mechanical polishing using multiple spectra |
US7967661B2 (en) | 2008-06-19 | 2011-06-28 | Micron Technology, Inc. | Systems and pads for planarizing microelectronic workpieces and associated methods of use and manufacture |
US8439723B2 (en) | 2008-08-11 | 2013-05-14 | Applied Materials, Inc. | Chemical mechanical polisher with heater and method |
US8414357B2 (en) | 2008-08-22 | 2013-04-09 | Applied Materials, Inc. | Chemical mechanical polisher having movable slurry dispensers and method |
KR101834944B1 (en) * | 2008-09-04 | 2018-03-06 | 어플라이드 머티어리얼스, 인코포레이티드 | Adjusting polishing rates by using spectrographic monitoring of a substrate during processing |
WO2010062497A2 (en) * | 2008-10-27 | 2010-06-03 | Applied Materials, Inc. | Goodness of fit in spectrographic monitoring of a substrate during processing |
US8751033B2 (en) * | 2008-11-14 | 2014-06-10 | Applied Materials, Inc. | Adaptive tracking spectrum features for endpoint detection |
US8292693B2 (en) * | 2008-11-26 | 2012-10-23 | Applied Materials, Inc. | Using optical metrology for wafer to wafer feed back process control |
KR101956838B1 (en) * | 2009-11-03 | 2019-03-11 | 어플라이드 머티어리얼스, 인코포레이티드 | Endpoint method using peak location of spectra contour plots versus time |
JP5728239B2 (en) | 2010-03-02 | 2015-06-03 | 株式会社荏原製作所 | Polishing monitoring method, polishing method, polishing monitoring apparatus, and polishing apparatus |
US9579767B2 (en) | 2010-04-28 | 2017-02-28 | Applied Materials, Inc. | Automatic generation of reference spectra for optical monitoring of substrates |
TWI496661B (en) * | 2010-04-28 | 2015-08-21 | Applied Materials Inc | Automatic generation of reference spectra for optical monitoring |
US8834229B2 (en) | 2010-05-05 | 2014-09-16 | Applied Materials, Inc. | Dynamically tracking spectrum features for endpoint detection |
KR101907965B1 (en) * | 2010-05-05 | 2018-10-16 | 어플라이드 머티어리얼스, 인코포레이티드 | Dynamically or adaptively tracking spectrum features for endpoint detection |
US20110281510A1 (en) * | 2010-05-12 | 2011-11-17 | Applied Materials, Inc. | Pad Window Insert |
US8190285B2 (en) * | 2010-05-17 | 2012-05-29 | Applied Materials, Inc. | Feedback for polishing rate correction in chemical mechanical polishing |
JP2012019114A (en) * | 2010-07-08 | 2012-01-26 | Tokyo Seimitsu Co Ltd | Polishing end point detection system and polishing end point detection method |
TWI478259B (en) * | 2010-07-23 | 2015-03-21 | Applied Materials Inc | Tracking spectrum features in two dimensions for endpoint detection |
JP5612945B2 (en) | 2010-07-23 | 2014-10-22 | 株式会社荏原製作所 | Method and apparatus for monitoring progress of substrate polishing |
US8954186B2 (en) * | 2010-07-30 | 2015-02-10 | Applied Materials, Inc. | Selecting reference libraries for monitoring of multiple zones on a substrate |
EP2641268A4 (en) * | 2010-11-18 | 2017-01-25 | Cabot Microelectronics Corporation | Polishing pad comprising transmissive region |
JP5980476B2 (en) | 2010-12-27 | 2016-08-31 | 株式会社荏原製作所 | Polishing apparatus and polishing method |
US8547538B2 (en) * | 2011-04-21 | 2013-10-01 | Applied Materials, Inc. | Construction of reference spectra with variations in environmental effects |
WO2012148716A2 (en) * | 2011-04-28 | 2012-11-01 | Applied Materials, Inc. | Varying coefficients and functions for polishing control |
JP5715034B2 (en) * | 2011-11-30 | 2015-05-07 | 株式会社東京精密 | Polishing method by polishing apparatus |
US9289875B2 (en) * | 2012-04-25 | 2016-03-22 | Applied Materials, Inc. | Feed forward and feed-back techniques for in-situ process control |
US9221147B2 (en) * | 2012-10-23 | 2015-12-29 | Applied Materials, Inc. | Endpointing with selective spectral monitoring |
WO2014149330A1 (en) * | 2013-03-15 | 2014-09-25 | Applied Materials, Inc. | Dynamic residue clearing control with in-situ profile control (ispc) |
US10012494B2 (en) | 2013-10-25 | 2018-07-03 | Applied Materials, Inc. | Grouping spectral data from polishing substrates |
JP7197999B2 (en) | 2018-05-11 | 2022-12-28 | キオクシア株式会社 | polishing equipment and polishing pads |
KR102586252B1 (en) * | 2018-07-06 | 2023-10-11 | 주식회사 케이씨텍 | Device and method for detecting thickness of silicon oxide film on wafer |
US11577356B2 (en) | 2018-09-24 | 2023-02-14 | Applied Materials, Inc. | Machine vision as input to a CMP process control algorithm |
JP7469032B2 (en) * | 2019-12-10 | 2024-04-16 | 株式会社荏原製作所 | Polishing method and polishing apparatus |
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- 2006-08-21 JP JP2008528048A patent/JP5534672B2/en active Active
- 2006-08-21 KR KR1020087006475A patent/KR101324644B1/en active IP Right Grant
- 2006-08-21 WO PCT/US2006/032659 patent/WO2007024807A2/en active Application Filing
- 2006-08-22 TW TW099119185A patent/TWI366872B/en active
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Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US11847776B2 (en) | 2020-06-29 | 2023-12-19 | Applied Materials, Inc. | System using film thickness estimation from machine learning based processing of substrate images |
Also Published As
Publication number | Publication date |
---|---|
KR20080042895A (en) | 2008-05-15 |
TWI366872B (en) | 2012-06-21 |
TW201103085A (en) | 2011-01-16 |
WO2007024807A9 (en) | 2009-09-03 |
JP2009505847A (en) | 2009-02-12 |
KR101324644B1 (en) | 2013-11-01 |
JP5534672B2 (en) | 2014-07-02 |
WO2007024807A2 (en) | 2007-03-01 |
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