JP5622806B2 - 化学機械的研磨のスペクトルに基づく監視のための装置および方法 - Google Patents
化学機械的研磨のスペクトルに基づく監視のための装置および方法 Download PDFInfo
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- JP5622806B2 JP5622806B2 JP2012168681A JP2012168681A JP5622806B2 JP 5622806 B2 JP5622806 B2 JP 5622806B2 JP 2012168681 A JP2012168681 A JP 2012168681A JP 2012168681 A JP2012168681 A JP 2012168681A JP 5622806 B2 JP5622806 B2 JP 5622806B2
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Classifications
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
- H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
- H01L21/302—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
- H01L21/304—Mechanical treatment, e.g. grinding, polishing, cutting
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B37/00—Lapping machines or devices; Accessories
- B24B37/005—Control means for lapping machines or devices
- B24B37/013—Devices or means for detecting lapping completion
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B37/00—Lapping machines or devices; Accessories
- B24B37/04—Lapping machines or devices; Accessories designed for working plane surfaces
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B37/00—Lapping machines or devices; Accessories
- B24B37/11—Lapping tools
- B24B37/20—Lapping pads for working plane surfaces
- B24B37/205—Lapping pads for working plane surfaces provided with a window for inspecting the surface of the work being lapped
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B37/00—Lapping machines or devices; Accessories
- B24B37/34—Accessories
- B24B37/345—Feeding, loading or unloading work specially adapted to lapping
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B49/00—Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation
- B24B49/12—Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation involving optical means
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B53/00—Devices or means for dressing or conditioning abrasive surfaces
- B24B53/017—Devices or means for dressing, cleaning or otherwise conditioning lapping tools
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/64—Manufacture or treatment of solid state devices other than semiconductor devices, or of parts thereof, not peculiar to a single device provided for in groups H01L31/00 - H10K99/00
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- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
- Mechanical Treatment Of Semiconductor (AREA)
- Constituent Portions Of Griding Lathes, Driving, Sensing And Control (AREA)
Description
ここで、Aは生スペクトル、Darkは暗い状況下で得たスペクトル、Siは剥き出しのシリコン基板から得たスペクトルである。
g=(1−0)/(rmax−rmin)
h=1−rmax *g
N=Rg+h
ここで、gは利得、hはオフセット、rmaxは正規化範囲内の最高値、rminは正規化範囲内の最低値、Nは正規化後のスペクトル、Rは正規化前のスペクトルである。
Claims (4)
- コンピュータによって実現される方法であって、
少なくとも1つの正規化された所定スペクトルを記憶するステップと、
研磨中の基板から一連の現在のスペクトルを得るステップであって、前記基板の最外部層が研磨されているステップと、
一連の正規化された現在のスペクトルを生成するために、前記一連の各現在のスペクトルを正規化するステップであって、前記最外部層の下の下部層のスペクトルで除することを含むステップと、
前記少なくとも1つの正規化された所定スペクトルと前記正規化された現在のスペクトルを使用して、研磨終点を決定するステップとを備える方法。 - 前記下部層がシリコン層である、請求項1に記載の方法。
- 前記正規化するステップが、前記基板がイン・シトゥー光学監視システムのセンサ上にないことを表すスペクトルを差し引くことを含む、請求項1又は2に記載の方法。
- 前記正規化するステップが、(A−Dark)/(Si−Dark)の計算を含み、ここで、Aは現在のスペクトル、Darkはイン・シトゥー監視システム上に位置する基板がないときに得たスペクトル、Siは剥き出しのシリコン基板から得たスペクトルである、請求項1から3のいずれか1項に記載の方法。
Applications Claiming Priority (12)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US71068205P | 2005-08-22 | 2005-08-22 | |
US60/710,682 | 2005-08-22 | ||
US11/213,344 US7764377B2 (en) | 2005-08-22 | 2005-08-26 | Spectrum based endpointing for chemical mechanical polishing |
US11/213,675 US7306507B2 (en) | 2005-08-22 | 2005-08-26 | Polishing pad assembly with glass or crystalline window |
US11/213,674 US7226339B2 (en) | 2005-08-22 | 2005-08-26 | Spectrum based endpointing for chemical mechanical polishing |
US11/213,675 | 2005-08-26 | ||
US11/213,674 | 2005-08-26 | ||
US11/213,344 | 2005-08-26 | ||
US11/261,742 US7406394B2 (en) | 2005-08-22 | 2005-10-28 | Spectra based endpointing for chemical mechanical polishing |
US11/261,742 | 2005-10-28 | ||
US74776806P | 2006-05-19 | 2006-05-19 | |
US60/747,768 | 2006-05-19 |
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JP2008528048A Division JP5534672B2 (ja) | 2005-08-22 | 2006-08-21 | 化学機械的研磨のスペクトルに基づく監視のための装置および方法 |
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JP2012256912A JP2012256912A (ja) | 2012-12-27 |
JP5622806B2 true JP5622806B2 (ja) | 2014-11-12 |
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JP2012168681A Active JP5622806B2 (ja) | 2005-08-22 | 2012-07-30 | 化学機械的研磨のスペクトルに基づく監視のための装置および方法 |
JP2012168682A Active JP5622807B2 (ja) | 2005-08-22 | 2012-07-30 | 化学機械的研磨のスペクトルに基づく監視のための装置および方法 |
JP2012220364A Active JP5624099B2 (ja) | 2005-08-22 | 2012-10-02 | 化学機械的研磨のスペクトルに基づく監視のための装置および方法 |
JP2014249936A Active JP6052906B2 (ja) | 2005-08-22 | 2014-12-10 | 化学機械的研磨のスペクトルに基づく監視のための装置および方法 |
JP2014249935A Active JP6438288B2 (ja) | 2005-08-22 | 2014-12-10 | 化学機械的研磨のスペクトルに基づく監視のための装置および方法 |
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JP2012220364A Active JP5624099B2 (ja) | 2005-08-22 | 2012-10-02 | 化学機械的研磨のスペクトルに基づく監視のための装置および方法 |
JP2014249936A Active JP6052906B2 (ja) | 2005-08-22 | 2014-12-10 | 化学機械的研磨のスペクトルに基づく監視のための装置および方法 |
JP2014249935A Active JP6438288B2 (ja) | 2005-08-22 | 2014-12-10 | 化学機械的研磨のスペクトルに基づく監視のための装置および方法 |
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JP (6) | JP6047327B2 (ja) |
KR (5) | KR101593927B1 (ja) |
CN (3) | CN105773398B (ja) |
TW (1) | TWI361454B (ja) |
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JP5968783B2 (ja) * | 2009-11-03 | 2016-08-10 | アプライド マテリアルズ インコーポレイテッドApplied Materials,Incorporated | スペクトルの等高線図のピーク位置と時間の関係を使用する終点方法 |
US9579767B2 (en) | 2010-04-28 | 2017-02-28 | Applied Materials, Inc. | Automatic generation of reference spectra for optical monitoring of substrates |
TWI496661B (zh) * | 2010-04-28 | 2015-08-21 | Applied Materials Inc | 用於光學監測之參考光譜的自動產生 |
US8190285B2 (en) * | 2010-05-17 | 2012-05-29 | Applied Materials, Inc. | Feedback for polishing rate correction in chemical mechanical polishing |
KR101981814B1 (ko) * | 2011-04-28 | 2019-05-23 | 어플라이드 머티어리얼스, 인코포레이티드 | 연마를 위한 모델 기반 스펙트럼 라이브러리의 생성 |
US10012494B2 (en) * | 2013-10-25 | 2018-07-03 | Applied Materials, Inc. | Grouping spectral data from polishing substrates |
US9997420B2 (en) * | 2013-12-27 | 2018-06-12 | Taiwan Semiconductor Manufacturing Company Limited | Method and/or system for chemical mechanical planarization (CMP) |
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