KR101593927B1 - 화학적 기계적 폴리싱의 스펙트럼 기반 모니터링을 위한 장치 및 방법 - Google Patents
화학적 기계적 폴리싱의 스펙트럼 기반 모니터링을 위한 장치 및 방법 Download PDFInfo
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- KR101593927B1 KR101593927B1 KR1020147029677A KR20147029677A KR101593927B1 KR 101593927 B1 KR101593927 B1 KR 101593927B1 KR 1020147029677 A KR1020147029677 A KR 1020147029677A KR 20147029677 A KR20147029677 A KR 20147029677A KR 101593927 B1 KR101593927 B1 KR 101593927B1
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- delete delete
- polishing
- substrate
- spectra
- spectrum
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Images
Classifications
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
- H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
- H01L21/302—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
- H01L21/304—Mechanical treatment, e.g. grinding, polishing, cutting
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B37/00—Lapping machines or devices; Accessories
- B24B37/005—Control means for lapping machines or devices
- B24B37/013—Devices or means for detecting lapping completion
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B37/00—Lapping machines or devices; Accessories
- B24B37/04—Lapping machines or devices; Accessories designed for working plane surfaces
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B37/00—Lapping machines or devices; Accessories
- B24B37/11—Lapping tools
- B24B37/20—Lapping pads for working plane surfaces
- B24B37/205—Lapping pads for working plane surfaces provided with a window for inspecting the surface of the work being lapped
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B37/00—Lapping machines or devices; Accessories
- B24B37/34—Accessories
- B24B37/345—Feeding, loading or unloading work specially adapted to lapping
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B49/00—Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation
- B24B49/12—Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation involving optical means
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B53/00—Devices or means for dressing or conditioning abrasive surfaces
- B24B53/017—Devices or means for dressing, cleaning or otherwise conditioning lapping tools
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/64—Manufacture or treatment of solid state devices other than semiconductor devices, or of parts thereof, not peculiar to a single device provided for in groups H01L31/00 - H10K99/00
Landscapes
- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Mechanical Treatment Of Semiconductor (AREA)
- Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
- Constituent Portions Of Griding Lathes, Driving, Sensing And Control (AREA)
Applications Claiming Priority (13)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US71068205P | 2005-08-22 | 2005-08-22 | |
US60/710,682 | 2005-08-22 | ||
US11/213,675 US7306507B2 (en) | 2005-08-22 | 2005-08-26 | Polishing pad assembly with glass or crystalline window |
US11/213,344 | 2005-08-26 | ||
US11/213,674 | 2005-08-26 | ||
US11/213,675 | 2005-08-26 | ||
US11/213,344 US7764377B2 (en) | 2005-08-22 | 2005-08-26 | Spectrum based endpointing for chemical mechanical polishing |
US11/213,674 US7226339B2 (en) | 2005-08-22 | 2005-08-26 | Spectrum based endpointing for chemical mechanical polishing |
US11/261,742 | 2005-10-28 | ||
US11/261,742 US7406394B2 (en) | 2005-08-22 | 2005-10-28 | Spectra based endpointing for chemical mechanical polishing |
US74776806P | 2006-05-19 | 2006-05-19 | |
US60/747,768 | 2006-05-19 | ||
PCT/US2006/032659 WO2007024807A2 (en) | 2005-08-22 | 2006-08-21 | Apparatus and methods for spectrum based monitoring of chemical mechanical polishing |
Related Parent Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
KR1020147002129A Division KR101521414B1 (ko) | 2005-08-22 | 2006-08-21 | 화학적 기계적 폴리싱의 스펙트럼 기반 모니터링을 위한 장치 및 방법 |
Publications (2)
Publication Number | Publication Date |
---|---|
KR20140140598A KR20140140598A (ko) | 2014-12-09 |
KR101593927B1 true KR101593927B1 (ko) | 2016-02-15 |
Family
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Family Applications (5)
Application Number | Title | Priority Date | Filing Date |
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KR1020137008965A KR101398567B1 (ko) | 2005-08-22 | 2006-08-21 | 화학적 기계적 폴리싱의 스펙트럼 기반 모니터링을 위한 장치 및 방법 |
KR1020137008961A KR101423579B1 (ko) | 2005-08-22 | 2006-08-21 | 화학적 기계적 폴리싱의 스펙트럼 기반 모니터링을 위한 장치 및 방법 |
KR1020147002129A KR101521414B1 (ko) | 2005-08-22 | 2006-08-21 | 화학적 기계적 폴리싱의 스펙트럼 기반 모니터링을 위한 장치 및 방법 |
KR1020137008968A KR101398570B1 (ko) | 2005-08-22 | 2006-08-21 | 화학적 기계적 폴리싱의 스펙트럼 기반 모니터링을 위한 장치 및 방법 |
KR1020147029677A KR101593927B1 (ko) | 2005-08-22 | 2006-08-21 | 화학적 기계적 폴리싱의 스펙트럼 기반 모니터링을 위한 장치 및 방법 |
Family Applications Before (4)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
KR1020137008965A KR101398567B1 (ko) | 2005-08-22 | 2006-08-21 | 화학적 기계적 폴리싱의 스펙트럼 기반 모니터링을 위한 장치 및 방법 |
KR1020137008961A KR101423579B1 (ko) | 2005-08-22 | 2006-08-21 | 화학적 기계적 폴리싱의 스펙트럼 기반 모니터링을 위한 장치 및 방법 |
KR1020147002129A KR101521414B1 (ko) | 2005-08-22 | 2006-08-21 | 화학적 기계적 폴리싱의 스펙트럼 기반 모니터링을 위한 장치 및 방법 |
KR1020137008968A KR101398570B1 (ko) | 2005-08-22 | 2006-08-21 | 화학적 기계적 폴리싱의 스펙트럼 기반 모니터링을 위한 장치 및 방법 |
Country Status (4)
Country | Link |
---|---|
JP (6) | JP6047327B2 (ja) |
KR (5) | KR101398567B1 (ja) |
CN (3) | CN104526536B (ja) |
TW (1) | TWI361454B (ja) |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
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KR101890331B1 (ko) * | 2017-10-16 | 2018-08-21 | 에스케이씨 주식회사 | 누수 방지된 연마패드 및 이의 제조방법 |
WO2020068345A1 (en) * | 2018-09-24 | 2020-04-02 | Applied Materials, Inc. | Machine vision as input to a cmp process control algorithm |
Families Citing this family (20)
Publication number | Priority date | Publication date | Assignee | Title |
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WO2008103964A2 (en) * | 2007-02-23 | 2008-08-28 | Applied Materials, Inc. | Using spectra to determine polishing endpoints |
JP5968783B2 (ja) * | 2009-11-03 | 2016-08-10 | アプライド マテリアルズ インコーポレイテッドApplied Materials,Incorporated | スペクトルの等高線図のピーク位置と時間の関係を使用する終点方法 |
US9579767B2 (en) | 2010-04-28 | 2017-02-28 | Applied Materials, Inc. | Automatic generation of reference spectra for optical monitoring of substrates |
TWI496661B (zh) * | 2010-04-28 | 2015-08-21 | Applied Materials Inc | 用於光學監測之參考光譜的自動產生 |
US8190285B2 (en) * | 2010-05-17 | 2012-05-29 | Applied Materials, Inc. | Feedback for polishing rate correction in chemical mechanical polishing |
WO2012148716A2 (en) * | 2011-04-28 | 2012-11-01 | Applied Materials, Inc. | Varying coefficients and functions for polishing control |
US10012494B2 (en) * | 2013-10-25 | 2018-07-03 | Applied Materials, Inc. | Grouping spectral data from polishing substrates |
US9997420B2 (en) | 2013-12-27 | 2018-06-12 | Taiwan Semiconductor Manufacturing Company Limited | Method and/or system for chemical mechanical planarization (CMP) |
US9352440B2 (en) * | 2014-04-30 | 2016-05-31 | Applied Materials, Inc. | Serial feature tracking for endpoint detection |
US10350728B2 (en) * | 2014-12-12 | 2019-07-16 | Applied Materials, Inc. | System and process for in situ byproduct removal and platen cooling during CMP |
CN104802091A (zh) * | 2015-05-19 | 2015-07-29 | 肥西县三星玻璃有限公司 | 一种玻璃磨边机 |
JP2017064899A (ja) * | 2015-10-01 | 2017-04-06 | 株式会社荏原製作所 | 研磨装置 |
KR101870701B1 (ko) | 2016-08-01 | 2018-06-25 | 에스케이실트론 주식회사 | 폴리싱 측정 장치 및 그의 연마 시간 제어 방법, 및 그를 포함한 폴리싱 제어 시스템 |
US10286517B2 (en) * | 2017-08-08 | 2019-05-14 | Micron Technology, Inc. | Polishing apparatuses |
CN107520740A (zh) * | 2017-09-18 | 2017-12-29 | 北京半导体专用设备研究所(中国电子科技集团公司第四十五研究所) | 一种化学机械抛光中光谱终点的检测方法、装置及系统 |
CN107900788B (zh) * | 2017-11-24 | 2020-04-24 | 上海华力微电子有限公司 | 一种改善层间介质研磨工艺厚度稳定性的方法 |
KR102527659B1 (ko) | 2017-11-27 | 2023-05-03 | 삼성전자주식회사 | 공기청정기 |
CN117900999A (zh) * | 2020-06-24 | 2024-04-19 | 应用材料公司 | 使用研磨垫磨损补偿的基板层厚度确定 |
CN112025547B (zh) * | 2020-09-15 | 2021-11-02 | 泉芯集成电路制造(济南)有限公司 | 激光投影虚拟校正设备和方法 |
CN113478382B (zh) * | 2021-07-20 | 2022-11-04 | 湖北鼎汇微电子材料有限公司 | 检测窗口、化学机械抛光垫及抛光系统 |
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WO2005025804A1 (en) | 2003-09-10 | 2005-03-24 | Ebara Corporation | Polished state monitoring apparatus and polishing apparatus using the same |
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JP5622806B2 (ja) | 2014-11-12 |
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TWI361454B (en) | 2012-04-01 |
KR20130041397A (ko) | 2013-04-24 |
JP2012256912A (ja) | 2012-12-27 |
KR101398567B1 (ko) | 2014-05-22 |
CN104526536A (zh) | 2015-04-22 |
CN104526536B (zh) | 2017-09-22 |
JP6052906B2 (ja) | 2016-12-27 |
JP2012256913A (ja) | 2012-12-27 |
CN102626895B (zh) | 2016-05-25 |
KR101521414B1 (ko) | 2015-05-19 |
JP2015077684A (ja) | 2015-04-23 |
JP5622807B2 (ja) | 2014-11-12 |
JP2013048259A (ja) | 2013-03-07 |
JP5624099B2 (ja) | 2014-11-12 |
KR101398570B1 (ko) | 2014-05-22 |
KR20140140598A (ko) | 2014-12-09 |
KR20140019484A (ko) | 2014-02-14 |
JP2012256911A (ja) | 2012-12-27 |
JP6438288B2 (ja) | 2018-12-12 |
CN105773398A (zh) | 2016-07-20 |
KR101423579B1 (ko) | 2014-07-25 |
CN105773398B (zh) | 2019-11-19 |
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