JP2017520915A5 - - Google Patents

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Publication number
JP2017520915A5
JP2017520915A5 JP2016569869A JP2016569869A JP2017520915A5 JP 2017520915 A5 JP2017520915 A5 JP 2017520915A5 JP 2016569869 A JP2016569869 A JP 2016569869A JP 2016569869 A JP2016569869 A JP 2016569869A JP 2017520915 A5 JP2017520915 A5 JP 2017520915A5
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JP
Japan
Prior art keywords
conductive feature
substrate
flexible
ceramic
flexible polymer
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2016569869A
Other languages
English (en)
Japanese (ja)
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JP2017520915A (ja
Filing date
Publication date
Application filed filed Critical
Priority claimed from PCT/US2015/032363 external-priority patent/WO2015191273A1/en
Publication of JP2017520915A publication Critical patent/JP2017520915A/ja
Publication of JP2017520915A5 publication Critical patent/JP2017520915A5/ja
Pending legal-status Critical Current

Links

JP2016569869A 2014-06-10 2015-05-26 Ｕｖ保護を備えた可撓性ｌｅｄアセンブリ Pending JP2017520915A (ja)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US201462010224P 2014-06-10 2014-06-10
US62/010,224 2014-06-10
PCT/US2015/032363 WO2015191273A1 (en) 2014-06-10 2015-05-26 Flexible led assembly with uv protection

Publications (2)

Publication Number Publication Date
JP2017520915A JP2017520915A (ja) 2017-07-27
JP2017520915A5 true JP2017520915A5 (enExample) 2018-06-28

Family

ID=53366306

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2016569869A Pending JP2017520915A (ja) 2014-06-10 2015-05-26 Ｕｖ保護を備えた可撓性ｌｅｄアセンブリ

Country Status (7)

Country Link
US (2) US10121947B2 (enExample)
EP (1) EP3155880A1 (enExample)
JP (1) JP2017520915A (enExample)
KR (1) KR20170019408A (enExample)
CN (1) CN106414061B (enExample)
TW (1) TW201603310A (enExample)
WO (1) WO2015191273A1 (enExample)

Families Citing this family (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN106414061B (zh) 2014-06-10 2019-08-16 3M创新有限公司 具有紫外线防护的柔性led组件
KR101802733B1 (ko) * 2016-05-10 2017-11-29 (주)우주일렉트로닉스 차량용 램프
EP3258258B1 (de) * 2016-06-13 2024-07-31 Airbus Defence and Space GmbH Sensorhaut
JP2018088498A (ja) * 2016-11-29 2018-06-07 デクセリアルズ株式会社 異方性導電接着剤
CN110324984B (zh) * 2019-07-26 2020-01-17 微智医疗器械有限公司 电子元件与电路板的连接方法、电路板组件及电子设备
CN112310115B (zh) * 2019-07-26 2023-06-06 京东方科技集团股份有限公司 一种驱动背板、显示面板及显示装置
KR102694326B1 (ko) 2019-10-11 2024-08-13 삼성전자주식회사 디스플레이 모듈 및 이의 제조 방법
CN110828647B (zh) * 2019-11-20 2020-12-18 深圳市乐的美光电股份有限公司 一种柔性led灯串的制造方法
US11837684B2 (en) * 2019-11-21 2023-12-05 Creeled, Inc. Submount structures for light emitting diode packages

Family Cites Families (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB2185437B (en) * 1985-12-26 1989-12-06 Hitachi Chemical Co Ltd Ceramic coated laminate and process for producing the same
JPH11145173A (ja) * 1997-11-07 1999-05-28 Sony Corp 半導体装置の製造方法
JP4290953B2 (ja) * 2002-09-26 2009-07-08 奇美電子股▲ふん▼有限公司 画像表示装置、有機ｅｌ素子および画像表示装置の製造方法
AT500259B1 (de) 2003-09-09 2007-08-15 Austria Tech & System Tech Dünnschichtanordnung und verfahren zum herstellen einer solchen dünnschichtanordnung
US8171627B2 (en) * 2007-12-21 2012-05-08 Spansion Llc Method of forming an electronic device
US9179543B2 (en) * 2010-11-03 2015-11-03 3M Innovative Properties Company Flexible LED device with wire bond free die
JP2012151191A (ja) 2011-01-17 2012-08-09 Ibiden Co Ltd Ｌｅｄ用配線基板、発光モジュール、ｌｅｄ用配線基板の製造方法、及び発光モジュールの製造方法
KR101931395B1 (ko) 2011-02-18 2018-12-20 쓰리엠 이노베이티브 프로퍼티즈 컴파니 가요성 발광 반도체 디바이스
EP2490513A2 (en) * 2011-02-20 2012-08-22 Essence Solar Solutions Ltd. Light and heat resistant circuit board apparatus and method
KR20140097404A (ko) 2011-11-23 2014-08-06 쓰리엠 이노베이티브 프로퍼티즈 컴파니 3차원 구조를 갖는 가요성 발광 반도체 디바이스
JP6004795B2 (ja) * 2012-07-06 2016-10-12 シチズンホールディングス株式会社 Ｌｅｄ光源装置及び光反射性基板
JP2015111620A (ja) * 2013-12-06 2015-06-18 シチズンホールディングス株式会社 発光デバイス及びその製造方法
CN106414061B (zh) 2014-06-10 2019-08-16 3M创新有限公司 具有紫外线防护的柔性led组件

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