JP2017520915A - Uv保護を備えた可撓性ledアセンブリ - Google Patents
Uv保護を備えた可撓性ledアセンブリ Download PDFInfo
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- 230000006750 UV protection Effects 0.000 title 1
- 239000000758 substrate Substances 0.000 claims abstract description 92
- 239000000919 ceramic Substances 0.000 claims abstract description 61
- 229920005570 flexible polymer Polymers 0.000 claims description 40
- 238000000034 method Methods 0.000 claims description 31
- 229910052751 metal Inorganic materials 0.000 claims description 15
- 239000002184 metal Substances 0.000 claims description 15
- 238000007747 plating Methods 0.000 claims description 15
- 239000000853 adhesive Substances 0.000 claims description 9
- 230000001070 adhesive effect Effects 0.000 claims description 9
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 claims description 8
- 230000005496 eutectics Effects 0.000 claims description 6
- 229920000642 polymer Polymers 0.000 claims description 5
- 239000004642 Polyimide Substances 0.000 claims description 4
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 claims description 4
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 claims description 4
- 229910052737 gold Inorganic materials 0.000 claims description 4
- 239000010931 gold Substances 0.000 claims description 4
- 229910052759 nickel Inorganic materials 0.000 claims description 4
- 229920001721 polyimide Polymers 0.000 claims description 4
- 229910052709 silver Inorganic materials 0.000 claims description 4
- 239000004332 silver Substances 0.000 claims description 4
- 229910018072 Al 2 O 3 Inorganic materials 0.000 claims description 3
- PMHQVHHXPFUNSP-UHFFFAOYSA-M copper(1+);methylsulfanylmethane;bromide Chemical compound Br[Cu].CSC PMHQVHHXPFUNSP-UHFFFAOYSA-M 0.000 claims description 3
- 238000004544 sputter deposition Methods 0.000 claims description 3
- 239000004593 Epoxy Substances 0.000 claims description 2
- 238000010030 laminating Methods 0.000 claims description 2
- 229910000679 solder Inorganic materials 0.000 claims 1
- 238000004519 manufacturing process Methods 0.000 abstract description 10
- 230000015556 catabolic process Effects 0.000 abstract description 2
- 238000006731 degradation reaction Methods 0.000 abstract description 2
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 4
- 229910052802 copper Inorganic materials 0.000 description 4
- 239000010949 copper Substances 0.000 description 4
- 239000000463 material Substances 0.000 description 4
- 230000000712 assembly Effects 0.000 description 3
- 238000000429 assembly Methods 0.000 description 3
- 230000001680 brushing effect Effects 0.000 description 3
- 238000007772 electroless plating Methods 0.000 description 3
- 238000009713 electroplating Methods 0.000 description 3
- 238000007654 immersion Methods 0.000 description 3
- 229920000106 Liquid crystal polymer Polymers 0.000 description 2
- 239000004696 Poly ether ether ketone Substances 0.000 description 2
- 238000005530 etching Methods 0.000 description 2
- 229920000515 polycarbonate Polymers 0.000 description 2
- 239000004417 polycarbonate Substances 0.000 description 2
- 229920002530 polyetherether ketone Polymers 0.000 description 2
- 229920000139 polyethylene terephthalate Polymers 0.000 description 2
- 238000005476 soldering Methods 0.000 description 2
- 229920001169 thermoplastic Polymers 0.000 description 2
- 239000004020 conductor Substances 0.000 description 1
- 230000006866 deterioration Effects 0.000 description 1
- 239000003989 dielectric material Substances 0.000 description 1
- 239000003822 epoxy resin Substances 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 230000000704 physical effect Effects 0.000 description 1
- 238000005498 polishing Methods 0.000 description 1
- 229920000647 polyepoxide Polymers 0.000 description 1
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- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/62—Arrangements for conducting electric current to or from the semiconductor body, e.g. lead-frames, wire-bonds or solder balls
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- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
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- H05K1/0313—Organic insulating material
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- H05K3/22—Secondary treatment of printed circuits
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- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/03—Use of materials for the substrate
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- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/03—Use of materials for the substrate
- H05K1/0313—Organic insulating material
- H05K1/032—Organic insulating material consisting of one material
- H05K1/0346—Organic insulating material consisting of one material containing N
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- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/18—Printed circuits structurally associated with non-printed electric components
- H05K1/189—Printed circuits structurally associated with non-printed electric components characterised by the use of a flexible or folded printed circuit
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- H05K2201/01—Dielectrics
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- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
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- H05K2201/10106—Light emitting diode [LED]
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- Led Device Packages (AREA)
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Abstract
Description
実施形態1は、可撓性LEDアセンブリであって、
可撓性ポリマー基板と、
可撓性基板内及び可撓性基板の表面上に位置付けられた第1の導電性特徴部と、
第1の導電性特徴部から所定の距離において前記可撓性基板内及び可撓性基板の表面上に位置付けられた第2の導電性特徴部であって、前記第1の導電性特徴部と前記第2の導電性特徴部との間に前記可撓性ポリマー基板の一部分が露出されるようになっている、第2の導電性特徴部と、
前記第1の導電性特徴部と前記第2の導電性特徴部との間の前記露出した可撓性ポリマーの表面上に位置付けられる、セラミック層と、を備える、可撓性LEDアセンブリである。
可撓性ポリマー基板を貫通して延在するビアを備える当該可撓性ポリマー基板と、
前記可撓性基板の下面に位置付けられた第1の導電性特徴部であって、前記第1の導電性特徴部の一部分が前記ビアの下に位置付けられている、第1の導電性特徴部と、
前記可撓性ポリマー基板の上面に位置付けられたセラミック層と、を備える、可撓性LEDアセンブリ。
セラミック層を基板の表面に適用する工程であって、前記基板が、前記セラミックの適用前に、露出した上面がポリマーである第1の部分と、前記露出した上面が導電性金属である第2の部分と、を備える、工程と、
前記セラミックを前記基板の表面の前記第2の部分から除去する工程と、
前記基板の表面の前記第2の部分内の前記導電性金属に表面仕上げする工程と、を含む、方法。
Claims (15)
- 可撓性ポリマー基板と、
前記可撓性基板内及び可撓性基板の表面上に位置付けられた第1の導電性特徴部と、
前記第1の導電性特徴部から所定の距離において前記可撓性基板内及び可撓性基板の表面上に位置付けられた第2の導電性特徴部であって、前記第1の導電性特徴部と前記第2の導電性特徴部との間に前記可撓性ポリマー基板の一部分が露出されるようになっている、第2の導電性特徴部と、
前記第1の導電性特徴部と前記第2の導電性特徴部との間の前記露出した可撓性ポリマーの表面上に位置付けられた、セラミック層と、
を備える、可撓性LEDアセンブリ。 - 前記第1の導電性特徴部及び前記第2の導電性特徴部の両方に搭載されたLEDを更に備え、前記可撓性ポリマー基板が、前記セラミック層によって前記LEDから放射されるUV光から遮蔽されている、請求項1に記載の可撓性LEDアセンブリ。
- 前記可撓性ポリマー基板がポリイミドを含む、請求項1に記載の可撓性LEDアセンブリ。
- 前記セラミックが、Al2O3、AlN、又はBNを含む、請求項1に記載の可撓性LEDアセンブリ。
- 前記LEDが、前記第1の導電性特徴部及び前記第2の導電性特徴部にはんだ接合されたフリップチップを備える、請求項2に記載の可撓性LEDアセンブリ。
- 前記LEDが前記第1の導電性特徴部及び前記第2の導電性特徴部に共晶接合されている、請求項2に記載の可撓性LEDアセンブリ。
- 前記第2の導電性特徴部ではなく前記第1の導電性特徴部に搭載されたLEDを更に備え、前記可撓性ポリマー基板が前記セラミック層によって、前記LEDから放射されるUV光から遮蔽されている、請求項1に記載の可撓性LEDアセンブリ。
- 前記LEDが、エポキシ結合接着剤、導電性ペースト、異方性導電性ペースト(ACP)、異方性導電性フィルム(ACF)、又は共晶接合を使用して、前記第1の導電性特徴部に取り付けられている、請求項7に記載の可撓性LEDアセンブリ。
- 可撓性ポリマー基板を貫通して延在するビアを備える当該可撓性ポリマー基板と、
前記可撓性基板の下面に位置付けられた第1の導電性特徴部であって、前記第1の導電性特徴部の一部分が前記ビアの下に位置付けられている、第1の導電性特徴部と、
前記可撓性ポリマー基板の上面に位置付けられたセラミック層と、
を備える、可撓性LEDアセンブリ。 - 前記可撓性ポリマー基板内にある第2のビアと、前記可撓性基板の下面に位置付けられた第2の導電性特徴部とを更に備え、前記第2の導電性特徴部の一部分が前記第2のビアの下に位置付けられている、請求項9に記載の可撓性LEDアセンブリ。
- LEDアセンブリを作製する方法であって、
セラミック層を基板の表面に適用する工程であって、前記基板が、前記セラミックの適用前に、露出した上面がポリマーである第1の部分と、前記露出した上面が導電性金属である第2の部分と、を備える、工程と、
前記セラミックを前記基板の表面の前記第2の部分から除去する工程と、
前記基板の表面の前記第2の部分内の前記導電性金属を表面仕上げする工程と、
を含む、方法。 - 前記セラミックを前記基板の表面の前記第2の部分から除去する工程が、粘着性のライナーを前記第2の部分に対応するセラミックの領域上に積層する工程と、前記粘着性のライナーを除去することによって前記セラミックを前記第2の部分から剥離する工程とを含む、請求項11に記載の方法。
- 前記導電性金属を表面仕上げする工程が、最初にニッケル層をめっきし、次に金又は銀の層をめっきする工程を含む、請求項11に記載の方法。
- 前記セラミック層がスパッタリングプロセスを使用して適用される、請求項11に記載の方法。
- 前記セラミックが窒化アルミニウムを含む、請求項11に記載の方法。
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US201462010224P | 2014-06-10 | 2014-06-10 | |
US62/010,224 | 2014-06-10 | ||
PCT/US2015/032363 WO2015191273A1 (en) | 2014-06-10 | 2015-05-26 | Flexible led assembly with uv protection |
Publications (2)
Publication Number | Publication Date |
---|---|
JP2017520915A true JP2017520915A (ja) | 2017-07-27 |
JP2017520915A5 JP2017520915A5 (ja) | 2018-06-28 |
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Application Number | Title | Priority Date | Filing Date |
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JP2016569869A Pending JP2017520915A (ja) | 2014-06-10 | 2015-05-26 | Uv保護を備えた可撓性ledアセンブリ |
Country Status (7)
Country | Link |
---|---|
US (2) | US10121947B2 (ja) |
EP (1) | EP3155880A1 (ja) |
JP (1) | JP2017520915A (ja) |
KR (1) | KR20170019408A (ja) |
CN (1) | CN106414061B (ja) |
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US11362249B2 (en) | 2019-10-11 | 2022-06-14 | Samsung Electronics Co., Ltd. | Display module and manufacturing method thereof |
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JP2017520915A (ja) | 2014-06-10 | 2017-07-27 | スリーエム イノベイティブ プロパティズ カンパニー | Uv保護を備えた可撓性ledアセンブリ |
KR101802733B1 (ko) * | 2016-05-10 | 2017-11-29 | (주)우주일렉트로닉스 | 차량용 램프 |
EP3258258A1 (de) * | 2016-06-13 | 2017-12-20 | Airbus Defence and Space GmbH | Sensorhaut |
JP2018088498A (ja) * | 2016-11-29 | 2018-06-07 | デクセリアルズ株式会社 | 異方性導電接着剤 |
CN112310115B (zh) * | 2019-07-26 | 2023-06-06 | 京东方科技集团股份有限公司 | 一种驱动背板、显示面板及显示装置 |
CN110324984B (zh) * | 2019-07-26 | 2020-01-17 | 微智医疗器械有限公司 | 电子元件与电路板的连接方法、电路板组件及电子设备 |
CN110828647B (zh) * | 2019-11-20 | 2020-12-18 | 深圳市乐的美光电股份有限公司 | 一种柔性led灯串的制造方法 |
US11837684B2 (en) * | 2019-11-21 | 2023-12-05 | Creeled, Inc. | Submount structures for light emitting diode packages |
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- 2015-05-26 JP JP2016569869A patent/JP2017520915A/ja active Pending
- 2015-05-26 KR KR1020177000124A patent/KR20170019408A/ko unknown
- 2015-05-26 WO PCT/US2015/032363 patent/WO2015191273A1/en active Application Filing
- 2015-05-26 EP EP15727807.8A patent/EP3155880A1/en not_active Withdrawn
- 2015-05-26 CN CN201580028138.5A patent/CN106414061B/zh not_active Expired - Fee Related
- 2015-05-26 US US15/316,028 patent/US10121947B2/en not_active Expired - Fee Related
- 2015-06-09 TW TW104118645A patent/TW201603310A/zh unknown
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CN106414061A (zh) | 2017-02-15 |
US10424707B2 (en) | 2019-09-24 |
TW201603310A (zh) | 2016-01-16 |
US20190035993A1 (en) | 2019-01-31 |
KR20170019408A (ko) | 2017-02-21 |
US20170104143A1 (en) | 2017-04-13 |
EP3155880A1 (en) | 2017-04-19 |
WO2015191273A1 (en) | 2015-12-17 |
CN106414061B (zh) | 2019-08-16 |
US10121947B2 (en) | 2018-11-06 |
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