|
US5693139A
(en)
*
|
1984-07-26 |
1997-12-02 |
Research Development Corporation Of Japan |
Growth of doped semiconductor monolayers
|
|
US5630314A
(en)
|
1992-09-10 |
1997-05-20 |
Hitachi, Ltd. |
Thermal stress relaxation type ceramic coated heat-resistant element
|
|
JP3761040B2
(ja)
*
|
1995-06-26 |
2006-03-29 |
株式会社アルバック |
真空装置用構造材料および真空装置用構造部材
|
|
US5819434A
(en)
*
|
1996-04-25 |
1998-10-13 |
Applied Materials, Inc. |
Etch enhancement using an improved gas distribution plate
|
|
USRE39969E1
(en)
*
|
1997-04-11 |
2008-01-01 |
Tokyo Electron Limited |
Processing system
|
|
JP3362113B2
(ja)
|
1997-07-15 |
2003-01-07 |
日本碍子株式会社 |
耐蝕性部材、ウエハー設置部材および耐蝕性部材の製造方法
|
|
US6444083B1
(en)
|
1999-06-30 |
2002-09-03 |
Lam Research Corporation |
Corrosion resistant component of semiconductor processing equipment and method of manufacturing thereof
|
|
JP3510993B2
(ja)
|
1999-12-10 |
2004-03-29 |
トーカロ株式会社 |
プラズマ処理容器内部材およびその製造方法
|
|
FI117979B
(fi)
|
2000-04-14 |
2007-05-15 |
Asm Int |
Menetelmä oksidiohutkalvojen valmistamiseksi
|
|
US6502530B1
(en)
*
|
2000-04-26 |
2003-01-07 |
Unaxis Balzers Aktiengesellschaft |
Design of gas injection for the electrode in a capacitively coupled RF plasma reactor
|
|
US6916534B2
(en)
|
2001-03-08 |
2005-07-12 |
Shin-Etsu Chemical Co., Ltd. |
Thermal spray spherical particles, and sprayed components
|
|
JP2002356387A
(ja)
|
2001-03-30 |
2002-12-13 |
Toshiba Ceramics Co Ltd |
耐プラズマ性部材
|
|
JP4277973B2
(ja)
|
2001-07-19 |
2009-06-10 |
日本碍子株式会社 |
イットリア−アルミナ複合酸化物膜の製造方法、イットリア−アルミナ複合酸化物膜および耐蝕性部材
|
|
JP4921652B2
(ja)
|
2001-08-03 |
2012-04-25 |
エイエスエム インターナショナル エヌ.ヴェー. |
イットリウム酸化物およびランタン酸化物薄膜を堆積する方法
|
|
JP3850277B2
(ja)
*
|
2001-12-03 |
2006-11-29 |
東芝セラミックス株式会社 |
耐プラズマ性部材の製造方法
|
|
US7371467B2
(en)
|
2002-01-08 |
2008-05-13 |
Applied Materials, Inc. |
Process chamber component having electroplated yttrium containing coating
|
|
JP2003277051A
(ja)
|
2002-03-22 |
2003-10-02 |
Ngk Insulators Ltd |
イットリア−アルミナ複合酸化物膜を有する積層体、イットリア−アルミナ複合酸化物膜、耐蝕性部材、耐蝕性膜およびイットリア−アルミナ複合酸化物膜の製造方法
|
|
JP2003324072A
(ja)
*
|
2002-05-07 |
2003-11-14 |
Nec Electronics Corp |
半導体製造装置
|
|
JP4151308B2
(ja)
*
|
2002-05-17 |
2008-09-17 |
東京エレクトロン株式会社 |
処理装置のガス導入方法
|
|
JP4260450B2
(ja)
*
|
2002-09-20 |
2009-04-30 |
東京エレクトロン株式会社 |
真空処理装置における静電チャックの製造方法
|
|
KR100772740B1
(ko)
|
2002-11-28 |
2007-11-01 |
동경 엘렉트론 주식회사 |
플라즈마 처리 용기 내부재
|
|
CN100495413C
(zh)
|
2003-03-31 |
2009-06-03 |
东京毅力科创株式会社 |
用于邻接在处理元件上的相邻覆层的方法
|
|
US20060037536A1
(en)
|
2003-10-24 |
2006-02-23 |
Toshiba Ceramics Co., Ltd. |
Plasma resistant member, manufacturing method for the same and method of forming a thermal spray coat
|
|
KR101172334B1
(ko)
*
|
2003-12-26 |
2012-08-14 |
고에키자이단호진 고쿠사이카가쿠 신고우자이단 |
샤워 플레이트, 플라즈마 처리 장치, 및 제품의 제조방법
|
|
JP4606121B2
(ja)
|
2004-01-29 |
2011-01-05 |
京セラ株式会社 |
耐食膜積層耐食性部材およびその製造方法
|
|
JP2006082474A
(ja)
|
2004-09-17 |
2006-03-30 |
Tosoh Corp |
樹脂部材
|
|
JP2006186306A
(ja)
|
2004-09-30 |
2006-07-13 |
Toshiba Ceramics Co Ltd |
ガス拡散プレートおよびその製造方法
|
|
KR101226120B1
(ko)
|
2004-10-26 |
2013-01-24 |
쿄세라 코포레이션 |
내식성 부재 및 그 제조방법
|
|
US7968205B2
(en)
|
2005-10-21 |
2011-06-28 |
Shin-Etsu Chemical Co., Ltd. |
Corrosion resistant multilayer member
|
|
JP2007217782A
(ja)
|
2006-02-20 |
2007-08-30 |
Showa Denko Kk |
希土類元素のフッ化物皮膜を有する耐食性皮膜およびその製造方法
|
|
JP2008047869A
(ja)
*
|
2006-06-13 |
2008-02-28 |
Hokuriku Seikei Kogyo Kk |
シャワープレート及びその製造方法、並びにそのシャワープレートを用いたプラズマ処理装置、プラズマ処理方法及び電子装置の製造方法
|
|
JP4546447B2
(ja)
|
2006-12-22 |
2010-09-15 |
トーカロ株式会社 |
耐プラズマエロージョン性に優れる溶射皮膜被覆部材およびその製造方法
|
|
CN101207002A
(zh)
*
|
2006-12-22 |
2008-06-25 |
北京北方微电子基地设备工艺研究中心有限责任公司 |
一种半导体刻蚀设备中零件的表面处理方法
|
|
US7696117B2
(en)
|
2007-04-27 |
2010-04-13 |
Applied Materials, Inc. |
Method and apparatus which reduce the erosion rate of surfaces exposed to halogen-containing plasmas
|
|
US10622194B2
(en)
|
2007-04-27 |
2020-04-14 |
Applied Materials, Inc. |
Bulk sintered solid solution ceramic which exhibits fracture toughness and halogen plasma resistance
|
|
US8142606B2
(en)
*
|
2007-06-07 |
2012-03-27 |
Applied Materials, Inc. |
Apparatus for depositing a uniform silicon film and methods for manufacturing the same
|
|
JP5227197B2
(ja)
*
|
2008-06-19 |
2013-07-03 |
東京エレクトロン株式会社 |
フォーカスリング及びプラズマ処理装置
|
|
US9017765B2
(en)
|
2008-11-12 |
2015-04-28 |
Applied Materials, Inc. |
Protective coatings resistant to reactive plasma processing
|
|
US8858745B2
(en)
|
2008-11-12 |
2014-10-14 |
Applied Materials, Inc. |
Corrosion-resistant bonding agents for bonding ceramic components which are exposed to plasmas
|
|
JP5589839B2
(ja)
*
|
2009-03-24 |
2014-09-17 |
東レ株式会社 |
プラズマ処理装置およびこれを用いたアモルファスシリコン薄膜の製造方法
|
|
TW201100578A
(en)
|
2009-06-19 |
2011-01-01 |
Saint Gobain Ceramics & Plastics Inc |
Sealed plasma coatings
|
|
WO2011049938A2
(en)
|
2009-10-20 |
2011-04-28 |
Saint-Gobain Ceramics & Plastics, Inc. |
Microelectronic processing component having a corrosion-resistant layer, microelectronic workpiece processing apparatus incorporating same, and method of forming an article having the corrosion-resistant layer
|
|
JP5678883B2
(ja)
*
|
2009-11-02 |
2015-03-04 |
東レ株式会社 |
プラズマcvd装置、および、シリコン薄膜の製造方法
|
|
US20110198034A1
(en)
*
|
2010-02-11 |
2011-08-18 |
Jennifer Sun |
Gas distribution showerhead with coating material for semiconductor processing
|
|
JP5654862B2
(ja)
*
|
2010-04-12 |
2015-01-14 |
株式会社日立国際電気 |
半導体装置の製造方法、基板処理方法及び基板処理装置
|
|
TW201209957A
(en)
|
2010-05-28 |
2012-03-01 |
Praxair Technology Inc |
Substrate supports for semiconductor applications
|
|
US20120183790A1
(en)
*
|
2010-07-14 |
2012-07-19 |
Christopher Petorak |
Thermal spray composite coatings for semiconductor applications
|
|
US20120052216A1
(en)
*
|
2010-08-27 |
2012-03-01 |
Applied Materials, Inc. |
Gas distribution showerhead with high emissivity surface
|
|
US8916021B2
(en)
|
2010-10-27 |
2014-12-23 |
Applied Materials, Inc. |
Electrostatic chuck and showerhead with enhanced thermal properties and methods of making thereof
|
|
US9068265B2
(en)
*
|
2011-02-01 |
2015-06-30 |
Applied Materials, Inc. |
Gas distribution plate with discrete protective elements
|
|
US20120216955A1
(en)
*
|
2011-02-25 |
2012-08-30 |
Toshiba Materials Co., Ltd. |
Plasma processing apparatus
|
|
US9082593B2
(en)
*
|
2011-03-31 |
2015-07-14 |
Tokyo Electron Limited |
Electrode having gas discharge function and plasma processing apparatus
|
|
JP5782293B2
(ja)
*
|
2011-05-10 |
2015-09-24 |
東京エレクトロン株式会社 |
プラズマ生成用電極およびプラズマ処理装置
|
|
KR20130025025A
(ko)
|
2011-09-01 |
2013-03-11 |
주식회사 코미코 |
정전척
|
|
CN102352492A
(zh)
*
|
2011-11-10 |
2012-02-15 |
中微半导体设备(上海)有限公司 |
一种带冷却系统的气体注入装置
|
|
US9090046B2
(en)
|
2012-04-16 |
2015-07-28 |
Applied Materials, Inc. |
Ceramic coated article and process for applying ceramic coating
|
|
US9394615B2
(en)
*
|
2012-04-27 |
2016-07-19 |
Applied Materials, Inc. |
Plasma resistant ceramic coated conductive article
|
|
US9988702B2
(en)
|
2012-05-22 |
2018-06-05 |
Kabushiki Kaisha Toshiba |
Component for plasma processing apparatus and method for manufacturing component for plasma processing apparatus
|
|
JP6097499B2
(ja)
*
|
2012-07-20 |
2017-03-15 |
東京エレクトロン株式会社 |
プラズマ処理装置用部品及びプラズマ処理装置
|
|
US9343289B2
(en)
|
2012-07-27 |
2016-05-17 |
Applied Materials, Inc. |
Chemistry compatible coating material for advanced device on-wafer particle performance
|
|
CN103794458B
(zh)
|
2012-10-29 |
2016-12-21 |
中微半导体设备(上海)有限公司 |
用于等离子体处理腔室内部的部件及制造方法
|
|
CN103794445B
(zh)
|
2012-10-29 |
2016-03-16 |
中微半导体设备(上海)有限公司 |
用于等离子体处理腔室的静电夹盘组件及制造方法
|
|
CN103794460B
(zh)
|
2012-10-29 |
2016-12-21 |
中微半导体设备(上海)有限公司 |
用于半导体装置性能改善的涂层
|
|
US9337002B2
(en)
*
|
2013-03-12 |
2016-05-10 |
Lam Research Corporation |
Corrosion resistant aluminum coating on plasma chamber components
|
|
US9865434B2
(en)
*
|
2013-06-05 |
2018-01-09 |
Applied Materials, Inc. |
Rare-earth oxide based erosion resistant coatings for semiconductor application
|
|
US9711334B2
(en)
*
|
2013-07-19 |
2017-07-18 |
Applied Materials, Inc. |
Ion assisted deposition for rare-earth oxide based thin film coatings on process rings
|
|
US9583369B2
(en)
|
2013-07-20 |
2017-02-28 |
Applied Materials, Inc. |
Ion assisted deposition for rare-earth oxide based coatings on lids and nozzles
|
|
US9624593B2
(en)
|
2013-08-29 |
2017-04-18 |
Applied Materials, Inc. |
Anodization architecture for electro-plate adhesion
|
|
US9440886B2
(en)
*
|
2013-11-12 |
2016-09-13 |
Applied Materials, Inc. |
Rare-earth oxide based monolithic chamber material
|
|
CN104715993B
(zh)
*
|
2013-12-13 |
2017-02-22 |
中微半导体设备(上海)有限公司 |
等离子体处理腔室、气体喷淋头及其制造方法
|
|
US9484190B2
(en)
*
|
2014-01-25 |
2016-11-01 |
Yuri Glukhoy |
Showerhead-cooler system of a semiconductor-processing chamber for semiconductor wafers of large area
|
|
US9275840B2
(en)
*
|
2014-01-25 |
2016-03-01 |
Yuri Glukhoy |
Method for providing uniform distribution of plasma density in a plasma treatment apparatus
|
|
US9384950B2
(en)
*
|
2014-01-31 |
2016-07-05 |
Applied Materials, Inc. |
Chamber coatings
|
|
US20170022595A1
(en)
|
2014-03-31 |
2017-01-26 |
Kabushiki Kaisha Toshiba |
Plasma-Resistant Component, Method For Manufacturing The Plasma-Resistant Component, And Film Deposition Apparatus Used For Manufacturing The Plasma-Resistant Component
|
|
US20150311043A1
(en)
|
2014-04-25 |
2015-10-29 |
Applied Materials, Inc. |
Chamber component with fluorinated thin film coating
|
|
US9976211B2
(en)
|
2014-04-25 |
2018-05-22 |
Applied Materials, Inc. |
Plasma erosion resistant thin film coating for high temperature application
|
|
US9869013B2
(en)
|
2014-04-25 |
2018-01-16 |
Applied Materials, Inc. |
Ion assisted deposition top coat of rare-earth oxide
|
|
US10730798B2
(en)
|
2014-05-07 |
2020-08-04 |
Applied Materials, Inc. |
Slurry plasma spray of plasma resistant ceramic coating
|
|
US10196728B2
(en)
|
2014-05-16 |
2019-02-05 |
Applied Materials, Inc. |
Plasma spray coating design using phase and stress control
|
|
US9431221B2
(en)
*
|
2014-07-08 |
2016-08-30 |
Taiwan Semiconductor Manufacturing Co., Ltd. |
Plasma-processing apparatus with upper electrode plate and method for performing plasma treatment process
|
|
JP6714978B2
(ja)
*
|
2014-07-10 |
2020-07-01 |
東京エレクトロン株式会社 |
プラズマ処理装置用の部品、プラズマ処理装置、及びプラズマ処理装置用の部品の製造方法
|
|
KR20160030812A
(ko)
|
2014-09-11 |
2016-03-21 |
삼성전자주식회사 |
플라즈마 처리 장치
|
|
US9790582B2
(en)
|
2015-04-27 |
2017-10-17 |
Lam Research Corporation |
Long lifetime thermal spray coating for etching or deposition chamber application
|
|
US20160379806A1
(en)
|
2015-06-25 |
2016-12-29 |
Lam Research Corporation |
Use of plasma-resistant atomic layer deposition coatings to extend the lifetime of polymer components in etch chambers
|
|
US20160375515A1
(en)
*
|
2015-06-29 |
2016-12-29 |
Lam Research Corporation |
Use of atomic layer deposition coatings to protect brazing line against corrosion, erosion, and arcing
|
|
KR101916872B1
(ko)
|
2015-10-15 |
2018-11-08 |
아이원스 주식회사 |
반도체 공정 장비 부품의 코팅층 재생 방법 및 이에 따른 반도체 공정 장비 부품
|
|
TWI677593B
(zh)
*
|
2016-04-01 |
2019-11-21 |
美商應用材料股份有限公司 |
用於提供均勻流動的氣體的設備及方法
|
|
US11326253B2
(en)
*
|
2016-04-27 |
2022-05-10 |
Applied Materials, Inc. |
Atomic layer deposition of protective coatings for semiconductor process chamber components
|
|
JP6950196B2
(ja)
*
|
2017-02-16 |
2021-10-13 |
三菱マテリアル株式会社 |
プラズマ処理装置用電極板およびプラズマ処理装置用電極板の再生方法
|
|
US10755900B2
(en)
*
|
2017-05-10 |
2020-08-25 |
Applied Materials, Inc. |
Multi-layer plasma erosion protection for chamber components
|
|
US12272527B2
(en)
*
|
2018-05-09 |
2025-04-08 |
Asm Ip Holding B.V. |
Apparatus for use with hydrogen radicals and method of using same
|
|
US20200087788A1
(en)
*
|
2018-09-17 |
2020-03-19 |
Applied Materials, Inc. |
Multiple channel showerheads
|