JP2017501591A5 - - Google Patents

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JP2017501591A5
JP2017501591A5 JP2016559150A JP2016559150A JP2017501591A5 JP 2017501591 A5 JP2017501591 A5 JP 2017501591A5 JP 2016559150 A JP2016559150 A JP 2016559150A JP 2016559150 A JP2016559150 A JP 2016559150A JP 2017501591 A5 JP2017501591 A5 JP 2017501591A5
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Japan
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layer
dielectric constant
low dielectric
copper
constant material
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JP2016559150A
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Japanese (ja)
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JP6620112B2 (ja
JP2017501591A (ja
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Priority claimed from US14/523,523 external-priority patent/US9312168B2/en
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JP2016559150A 2013-12-16 2014-12-03 処理システムを使用した空隙構造の組込 Active JP6620112B2 (ja)

Applications Claiming Priority (5)

Application Number Priority Date Filing Date Title
US201361916726P 2013-12-16 2013-12-16
US61/916,726 2013-12-16
US14/523,523 2014-10-24
US14/523,523 US9312168B2 (en) 2013-12-16 2014-10-24 Air gap structure integration using a processing system
PCT/US2014/068344 WO2015094667A1 (en) 2013-12-16 2014-12-03 Air gap structure integration using a processing system

Publications (3)

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JP2017501591A JP2017501591A (ja) 2017-01-12
JP2017501591A5 true JP2017501591A5 (cg-RX-API-DMAC10.html) 2018-01-18
JP6620112B2 JP6620112B2 (ja) 2019-12-11

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JP2016559150A Active JP6620112B2 (ja) 2013-12-16 2014-12-03 処理システムを使用した空隙構造の組込

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US (1) US9312168B2 (cg-RX-API-DMAC10.html)
JP (1) JP6620112B2 (cg-RX-API-DMAC10.html)
KR (1) KR102308047B1 (cg-RX-API-DMAC10.html)
CN (1) CN105814678B (cg-RX-API-DMAC10.html)
TW (1) TWI626688B (cg-RX-API-DMAC10.html)
WO (1) WO2015094667A1 (cg-RX-API-DMAC10.html)

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