JP2017088853A5 - - Google Patents

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JP2017088853A5
JP2017088853A5 JP2016156331A JP2016156331A JP2017088853A5 JP 2017088853 A5 JP2017088853 A5 JP 2017088853A5 JP 2016156331 A JP2016156331 A JP 2016156331A JP 2016156331 A JP2016156331 A JP 2016156331A JP 2017088853 A5 JP2017088853 A5 JP 2017088853A5
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sio
curable
formula
branched polyorganosiloxane
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JP2016156331A
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JP2017088853A (ja
JP6935993B2 (ja
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JP2016156331A 2015-11-05 2016-08-09 分枝状ポリオルガノシロキサン並びに関連する硬化性組成物、方法、使用及びデバイス Active JP6935993B2 (ja)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US201562251173P 2015-11-05 2015-11-05
US62/251,173 2015-11-05

Publications (3)

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JP2017088853A JP2017088853A (ja) 2017-05-25
JP2017088853A5 true JP2017088853A5 (OSRAM) 2019-09-26
JP6935993B2 JP6935993B2 (ja) 2021-09-15

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JP2016156331A Active JP6935993B2 (ja) 2015-11-05 2016-08-09 分枝状ポリオルガノシロキサン並びに関連する硬化性組成物、方法、使用及びデバイス

Country Status (6)

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US (1) US10493723B2 (OSRAM)
EP (1) EP3196229B1 (OSRAM)
JP (1) JP6935993B2 (OSRAM)
KR (1) KR102642599B1 (OSRAM)
CN (1) CN107698766B (OSRAM)
TW (1) TWI718173B (OSRAM)

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JPWO2023080234A1 (OSRAM) * 2021-11-05 2023-05-11
JP7624377B2 (ja) * 2021-11-18 2025-01-30 信越化学工業株式会社 熱伝導性シリコーン接着剤組成物及び熱伝導性複合体
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JP2024088942A (ja) * 2022-12-21 2024-07-03 日立Astemo株式会社 車載電子制御装置

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KR102206708B1 (ko) 2013-02-11 2021-01-25 다우 실리콘즈 코포레이션 안정한 열 라디칼 경화성 실리콘 접착제 조성물
CN104968750B (zh) 2013-02-11 2017-04-19 道康宁公司 簇合官能化聚有机硅氧烷、形成所述簇合官能化聚有机硅氧烷的工艺及其使用方法
CN104968748B (zh) 2013-02-11 2017-03-29 道康宁公司 烷氧基官能化有机聚硅氧烷树脂和聚合物及其相关形成方法
US10370572B2 (en) 2013-02-11 2019-08-06 Dow Silicones Corporation Moisture-curable hot melt silicone adhesive compositions including an alkoxy-functional siloxane reactive resin

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