CN105722939A - 有机硅粘接剂组合物和固体摄像器件 - Google Patents
有机硅粘接剂组合物和固体摄像器件 Download PDFInfo
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- CN105722939A CN105722939A CN201480061849.8A CN201480061849A CN105722939A CN 105722939 A CN105722939 A CN 105722939A CN 201480061849 A CN201480061849 A CN 201480061849A CN 105722939 A CN105722939 A CN 105722939A
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- 239000000203 mixture Substances 0.000 title claims abstract description 78
- 239000013464 silicone adhesive Substances 0.000 title claims abstract description 19
- 238000003384 imaging method Methods 0.000 title claims description 15
- 229920001296 polysiloxane Polymers 0.000 claims abstract description 74
- 239000000758 substrate Substances 0.000 claims abstract description 62
- 239000000853 adhesive Substances 0.000 claims abstract description 61
- 230000001070 adhesive effect Effects 0.000 claims abstract description 61
- 125000003342 alkenyl group Chemical group 0.000 claims abstract description 36
- 229920006395 saturated elastomer Polymers 0.000 claims abstract description 31
- 125000003118 aryl group Chemical group 0.000 claims abstract description 28
- BASFCYQUMIYNBI-UHFFFAOYSA-N platinum Chemical compound [Pt] BASFCYQUMIYNBI-UHFFFAOYSA-N 0.000 claims abstract description 27
- 150000001875 compounds Chemical class 0.000 claims abstract description 20
- 239000003054 catalyst Substances 0.000 claims abstract description 17
- 229920006136 organohydrogenpolysiloxane Polymers 0.000 claims abstract description 17
- 229910052697 platinum Inorganic materials 0.000 claims abstract description 11
- 125000001183 hydrocarbyl group Chemical group 0.000 claims abstract 8
- -1 Siloxane units Chemical group 0.000 claims description 40
- 150000002430 hydrocarbons Chemical class 0.000 claims description 38
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 claims description 29
- 229910052710 silicon Inorganic materials 0.000 claims description 29
- 239000010703 silicon Substances 0.000 claims description 29
- 125000004432 carbon atom Chemical group C* 0.000 claims description 22
- 125000000962 organic group Chemical group 0.000 claims description 18
- 239000011521 glass Substances 0.000 claims description 13
- 238000006243 chemical reaction Methods 0.000 claims description 12
- 239000003960 organic solvent Substances 0.000 claims description 12
- 125000004122 cyclic group Chemical group 0.000 claims description 10
- 239000002904 solvent Substances 0.000 claims description 9
- 229910052751 metal Inorganic materials 0.000 claims description 8
- 239000002184 metal Substances 0.000 claims description 8
- 230000001681 protective effect Effects 0.000 claims description 8
- 125000000217 alkyl group Chemical group 0.000 claims description 7
- 238000006459 hydrosilylation reaction Methods 0.000 claims description 7
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- 125000002496 methyl group Chemical group [H]C([H])([H])* 0.000 description 11
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- IJOOHPMOJXWVHK-UHFFFAOYSA-N chlorotrimethylsilane Chemical compound C[Si](C)(C)Cl IJOOHPMOJXWVHK-UHFFFAOYSA-N 0.000 description 10
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- 125000002868 norbornyl group Chemical group C12(CCC(CC1)C2)* 0.000 description 9
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- 230000000694 effects Effects 0.000 description 5
- 238000013007 heat curing Methods 0.000 description 5
- OJMIONKXNSYLSR-UHFFFAOYSA-N phosphorous acid Chemical compound OP(O)O OJMIONKXNSYLSR-UHFFFAOYSA-N 0.000 description 5
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- NFHFRUOZVGFOOS-UHFFFAOYSA-N palladium;triphenylphosphane Chemical compound [Pd].C1=CC=CC=C1P(C=1C=CC=CC=1)C1=CC=CC=C1.C1=CC=CC=C1P(C=1C=CC=CC=1)C1=CC=CC=C1.C1=CC=CC=C1P(C=1C=CC=CC=1)C1=CC=CC=C1.C1=CC=CC=C1P(C=1C=CC=CC=1)C1=CC=CC=C1 NFHFRUOZVGFOOS-UHFFFAOYSA-N 0.000 description 4
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- LFXJGGDONSCPOF-UHFFFAOYSA-N trichloro(hexyl)silane Chemical compound CCCCCC[Si](Cl)(Cl)Cl LFXJGGDONSCPOF-UHFFFAOYSA-N 0.000 description 4
- QYLFHLNFIHBCPR-UHFFFAOYSA-N 1-ethynylcyclohexan-1-ol Chemical compound C#CC1(O)CCCCC1 QYLFHLNFIHBCPR-UHFFFAOYSA-N 0.000 description 3
- ZNRLMGFXSPUZNR-UHFFFAOYSA-N 2,2,4-trimethyl-1h-quinoline Chemical compound C1=CC=C2C(C)=CC(C)(C)NC2=C1 ZNRLMGFXSPUZNR-UHFFFAOYSA-N 0.000 description 3
- HXIQYSLFEXIOAV-UHFFFAOYSA-N 2-tert-butyl-4-(5-tert-butyl-4-hydroxy-2-methylphenyl)sulfanyl-5-methylphenol Chemical compound CC1=CC(O)=C(C(C)(C)C)C=C1SC1=CC(C(C)(C)C)=C(O)C=C1C HXIQYSLFEXIOAV-UHFFFAOYSA-N 0.000 description 3
- XOUQAVYLRNOXDO-UHFFFAOYSA-N 2-tert-butyl-5-methylphenol Chemical compound CC1=CC=C(C(C)(C)C)C(O)=C1 XOUQAVYLRNOXDO-UHFFFAOYSA-N 0.000 description 3
- VSAWBBYYMBQKIK-UHFFFAOYSA-N 4-[[3,5-bis[(3,5-ditert-butyl-4-hydroxyphenyl)methyl]-2,4,6-trimethylphenyl]methyl]-2,6-ditert-butylphenol Chemical compound CC1=C(CC=2C=C(C(O)=C(C=2)C(C)(C)C)C(C)(C)C)C(C)=C(CC=2C=C(C(O)=C(C=2)C(C)(C)C)C(C)(C)C)C(C)=C1CC1=CC(C(C)(C)C)=C(O)C(C(C)(C)C)=C1 VSAWBBYYMBQKIK-UHFFFAOYSA-N 0.000 description 3
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- BGYHLZZASRKEJE-UHFFFAOYSA-N [3-[3-(3,5-ditert-butyl-4-hydroxyphenyl)propanoyloxy]-2,2-bis[3-(3,5-ditert-butyl-4-hydroxyphenyl)propanoyloxymethyl]propyl] 3-(3,5-ditert-butyl-4-hydroxyphenyl)propanoate Chemical compound CC(C)(C)C1=C(O)C(C(C)(C)C)=CC(CCC(=O)OCC(COC(=O)CCC=2C=C(C(O)=C(C=2)C(C)(C)C)C(C)(C)C)(COC(=O)CCC=2C=C(C(O)=C(C=2)C(C)(C)C)C(C)(C)C)COC(=O)CCC=2C=C(C(O)=C(C=2)C(C)(C)C)C(C)(C)C)=C1 BGYHLZZASRKEJE-UHFFFAOYSA-N 0.000 description 3
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- PWWSSIYVTQUJQQ-UHFFFAOYSA-N distearyl thiodipropionate Chemical compound CCCCCCCCCCCCCCCCCCOC(=O)CCSCCC(=O)OCCCCCCCCCCCCCCCCCC PWWSSIYVTQUJQQ-UHFFFAOYSA-N 0.000 description 3
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- NWHNXXMYEICZAT-UHFFFAOYSA-N 1,2,2,6,6-pentamethylpiperidin-4-ol Chemical compound CN1C(C)(C)CC(O)CC1(C)C NWHNXXMYEICZAT-UHFFFAOYSA-N 0.000 description 2
- VNQNXQYZMPJLQX-UHFFFAOYSA-N 1,3,5-tris[(3,5-ditert-butyl-4-hydroxyphenyl)methyl]-1,3,5-triazinane-2,4,6-trione Chemical compound CC(C)(C)C1=C(O)C(C(C)(C)C)=CC(CN2C(N(CC=3C=C(C(O)=C(C=3)C(C)(C)C)C(C)(C)C)C(=O)N(CC=3C=C(C(O)=C(C=3)C(C)(C)C)C(C)(C)C)C2=O)=O)=C1 VNQNXQYZMPJLQX-UHFFFAOYSA-N 0.000 description 2
- HMUNWXXNJPVALC-UHFFFAOYSA-N 1-[4-[2-(2,3-dihydro-1H-inden-2-ylamino)pyrimidin-5-yl]piperazin-1-yl]-2-(2,4,6,7-tetrahydrotriazolo[4,5-c]pyridin-5-yl)ethanone Chemical compound C1C(CC2=CC=CC=C12)NC1=NC=C(C=N1)N1CCN(CC1)C(CN1CC2=C(CC1)NN=N2)=O HMUNWXXNJPVALC-UHFFFAOYSA-N 0.000 description 2
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- BVUXDWXKPROUDO-UHFFFAOYSA-N 2,6-di-tert-butyl-4-ethylphenol Chemical compound CCC1=CC(C(C)(C)C)=C(O)C(C(C)(C)C)=C1 BVUXDWXKPROUDO-UHFFFAOYSA-N 0.000 description 2
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- SSADPHQCUURWSW-UHFFFAOYSA-N 3,9-bis(2,6-ditert-butyl-4-methylphenoxy)-2,4,8,10-tetraoxa-3,9-diphosphaspiro[5.5]undecane Chemical compound CC(C)(C)C1=CC(C)=CC(C(C)(C)C)=C1OP1OCC2(COP(OC=3C(=CC(C)=CC=3C(C)(C)C)C(C)(C)C)OC2)CO1 SSADPHQCUURWSW-UHFFFAOYSA-N 0.000 description 2
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- CGRTZESQZZGAAU-UHFFFAOYSA-N [2-[3-[1-[3-(3-tert-butyl-4-hydroxy-5-methylphenyl)propanoyloxy]-2-methylpropan-2-yl]-2,4,8,10-tetraoxaspiro[5.5]undecan-9-yl]-2-methylpropyl] 3-(3-tert-butyl-4-hydroxy-5-methylphenyl)propanoate Chemical compound CC(C)(C)C1=C(O)C(C)=CC(CCC(=O)OCC(C)(C)C2OCC3(CO2)COC(OC3)C(C)(C)COC(=O)CCC=2C=C(C(O)=C(C)C=2)C(C)(C)C)=C1 CGRTZESQZZGAAU-UHFFFAOYSA-N 0.000 description 2
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- 238000002156 mixing Methods 0.000 description 2
- MBAUOPQYSQVYJV-UHFFFAOYSA-N octyl 3-[4-hydroxy-3,5-di(propan-2-yl)phenyl]propanoate Chemical compound OC1=C(C=C(C=C1C(C)C)CCC(=O)OCCCCCCCC)C(C)C MBAUOPQYSQVYJV-UHFFFAOYSA-N 0.000 description 2
- 150000002989 phenols Chemical class 0.000 description 2
- 239000005054 phenyltrichlorosilane Substances 0.000 description 2
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- CNUJLMSKURPSHE-UHFFFAOYSA-N trioctadecyl phosphite Chemical compound CCCCCCCCCCCCCCCCCCOP(OCCCCCCCCCCCCCCCCCC)OCCCCCCCCCCCCCCCCCC CNUJLMSKURPSHE-UHFFFAOYSA-N 0.000 description 1
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- ILLOBGFGKYTZRO-UHFFFAOYSA-N tris(2-ethylhexyl) phosphite Chemical compound CCCCC(CC)COP(OCC(CC)CCCC)OCC(CC)CCCC ILLOBGFGKYTZRO-UHFFFAOYSA-N 0.000 description 1
- WGKLOLBTFWFKOD-UHFFFAOYSA-N tris(2-nonylphenyl) phosphite Chemical compound CCCCCCCCCC1=CC=CC=C1OP(OC=1C(=CC=CC=1)CCCCCCCCC)OC1=CC=CC=C1CCCCCCCCC WGKLOLBTFWFKOD-UHFFFAOYSA-N 0.000 description 1
- FEVFLQDDNUQKRY-UHFFFAOYSA-N tris(4-methylphenyl) phosphite Chemical compound C1=CC(C)=CC=C1OP(OC=1C=CC(C)=CC=1)OC1=CC=C(C)C=C1 FEVFLQDDNUQKRY-UHFFFAOYSA-N 0.000 description 1
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Classifications
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J183/00—Adhesives based on macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon, with or without sulfur, nitrogen, oxygen, or carbon only; Adhesives based on derivatives of such polymers
- C09J183/04—Polysiloxanes
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B7/00—Layered products characterised by the relation between layers; Layered products characterised by the relative orientation of features between layers, or by the relative values of a measurable parameter between layers, i.e. products comprising layers having different physical, chemical or physicochemical properties; Layered products characterised by the interconnection of layers
- B32B7/04—Interconnection of layers
- B32B7/12—Interconnection of layers using interposed adhesives or interposed materials with bonding properties
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G77/00—Macromolecular compounds obtained by reactions forming a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon in the main chain of the macromolecule
- C08G77/04—Polysiloxanes
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G77/00—Macromolecular compounds obtained by reactions forming a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon in the main chain of the macromolecule
- C08G77/04—Polysiloxanes
- C08G77/06—Preparatory processes
- C08G77/08—Preparatory processes characterised by the catalysts used
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G77/00—Macromolecular compounds obtained by reactions forming a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon in the main chain of the macromolecule
- C08G77/04—Polysiloxanes
- C08G77/12—Polysiloxanes containing silicon bound to hydrogen
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G77/00—Macromolecular compounds obtained by reactions forming a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon in the main chain of the macromolecule
- C08G77/04—Polysiloxanes
- C08G77/20—Polysiloxanes containing silicon bound to unsaturated aliphatic groups
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K5/00—Use of organic ingredients
- C08K5/56—Organo-metallic compounds, i.e. organic compounds containing a metal-to-carbon bond
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L83/00—Compositions of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon only; Compositions of derivatives of such polymers
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/12—Mountings, e.g. non-detachable insulating substrates
- H01L23/14—Mountings, e.g. non-detachable insulating substrates characterised by the material or its electrical properties
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Abstract
本发明的目的在于提供使用了有机硅高分子化合物的粘接剂组合物,由于在制造中不需要曝光、烘焙、显影工序,因此制造成本低,生产率高,作为粘接剂要求的粘接性、热固化后的气密密封性、低吸湿性等的特性良好,耐热性、耐光性等的固化膜的可靠性高,而且可以抑制在三维安装制造中必需的背面研削后的粘接基板的翘曲。有机硅粘接剂组合物,其包含:(A)含有非芳香族饱和1价烃基及烯基的有机聚硅氧烷,(B)在1分子内含有2个以上的SiH基的有机氢聚硅氧烷:其量使得(B)成分中的SiH基与(A)成分中的烯基的摩尔比成为0.5~10,(C)铂系催化剂:有效量。
Description
技术领域
本发明涉及具有粘接性、耐热性、耐化学品性、绝缘性及高透射率性、适合用于保护玻璃与半导体元件、特别是CCD、CMOS等固体摄像元件硅基板与保护玻璃的贴合用途的有机硅粘接剂组合物及固体摄像器件。
背景技术
以往,面向CCD、CMOS图像传感器的封装体结构,为了保护传感器部分免受水分、灰尘等异物的影响,采取了用采用分配等印刷法涂布的液状或膜状的光固化型感光性树脂组合物与保护玻璃粘接的方法。
对于该采用光刻法的粘接剂层的成型,首先,在硅基板或玻璃基板上涂布感光性粘接剂组合物或者层叠感光性粘接剂膜,形成感光性粘接剂层。接下来,对该感光性粘接剂层曝光、烘焙、显影后,使保护玻璃基板(硅基板)密合,通过加热、加压,将粘接剂层与保护玻璃粘接。然后,通过进行热固化、切片,从而得到中空结构型封装体。作为这样的感光性树脂组合物,已知具有丙烯酸系树脂、光聚合性化合物及光聚合引发剂的感光性树脂组合物(专利文献1:特开2002-351070号公报)、具有感光性的改性环氧树脂、光聚合引发剂、稀释溶剂及热固化性化合物的感光性树脂组合物(专利文献2:特开2003-177528号公报)等。
另外,作为单纯的热固化性的粘接剂,也公开了包含聚酰亚胺树脂、固化性化合物及硅烷偶联剂的粘接性干膜(专利文献3:特开2003-253220号公报)。
但是,对于专利文献1及专利文献2记载的感光性树脂组合物,作为粘接剂要求的粘接性、热固化后的气密密封性、低吸湿性等特性不充分,并且曝光、烘焙、显影这3个工序在制造中成为必需,因此具有价格高、生产率低的缺点。另外,在专利文献3记载的热固化性的粘接剂中,粘接性、耐热性、耐光性等特性不充分。
此外,最近使用了贯通电极(TSV)的三维安装技术逐渐成为了CMOS图像传感器制造的主流,该三维安装中,与保护玻璃粘接、对热固化后的硅基板进行背面研削、将硅基板薄膜化到100μm以下成为必需。此时,薄型晶片可没断裂地研削变得重要,而且粘接基板大幅地翘曲成为了新的问题,特别是在8英寸以上的大口径晶片中变得显著。
为了抑制粘接基板的翘曲,也公开了含有环氧基的热固化性有机硅高分子化合物(专利文献4:特开2012-188650号公报)。使用了该有机硅组合物的粘接基板虽然翘曲量变低,但在高温长时间(例如50小时以上)的耐热性试验中分光特性大幅地降低成为了问题。同样地,也公开了有机硅高分子化合物(专利文献5:特开2012-229333号公报、专利文献6:特开2013-82801号公报),显示良好的接合性、耐热性、背面研削性,但由于是热塑性,因此尚未充分地满足作为永久膜必需的特性。
现有技术文献
专利文献
专利文献1:特开2002-351070号公报
专利文献2:特开2003-177528号公报
专利文献3:特开2003-253220号公报
专利文献4:特开2012-188650号公报
专利文献5:特开2012-229333号公报
专利文献6:特开2013-82801号公报
发明内容
发明要解决的课题
本发明鉴于上述实际情况而完成,目的在于提供使用了有机硅高分子化合物的加成固化型的有机硅粘接剂组合物,其由于在制造中不需要曝光、烘焙、显影工序,因此制造成本低,生产率高,作为粘接剂要求的粘接性、热固化后的气密密封性、低吸湿性等特性良好,耐热性、耐光性等固化膜的可靠性高,而且可以抑制在三维安装制造中必需的背面研削后的粘接基板的翘曲。
用于解决课题的手段
本发明人为了实现上述目的反复进行深入研究,结果发现下述的有机硅粘接剂组合物作为CCD、CMOS图像传感器制造用粘接剂优异,直至完成本发明。
因此,本发明提供下述的有机硅粘接剂组合物和固体摄像器件。
[1]有机硅粘接剂组合物,其特征在于,含有:
(A)含有非芳香族饱和1价烃基和烯基的有机聚硅氧烷,
(B)在1分子内含有2个以上的SiH基的有机氢聚硅氧烷:其量使得(B)成分中的SiH基与(A)成分中的烯基的摩尔比成为0.5~10,
(C)铂系催化剂:有效量,
(A)成分的含有非芳香族饱和1价烃基的有机聚硅氧烷为包含由下述(I)~(III)表示的单元的重均分子量为2,000~60,000的有机聚硅氧烷(A-1)或者使由下述通式(1)表示的1种以上的有机氢聚硅氧烷以相对于上述有机聚硅氧烷(A-1)的总烯基、上述有机氢聚硅氧烷的总SiH基以摩尔比计成为0.4~0.8倍的量与该有机聚硅氧烷(A-1)进行氢化硅烷化反应而得到的重均分子量为20,000~400,000的高分子量化的有机聚硅氧烷(A-2)。
(I)由R1SiO3/2表示的硅氧烷单元(T单元):50~99摩尔%
(II)由R2R3SiO2/2表示的硅氧烷单元(D单元):0~49摩尔%
(III)由R4 3SiO1/2表示的硅氧烷单元(M单元):1~15摩尔%
(式中,R1~R3各自为1价的有机基团,并且由R1~R3表示的全部有机基团中的2~10摩尔%为碳原子数2~7的烯基,由R1~R3表示的全部有机基团中的40摩尔%以上是相同或不同的、碳原子数5~10的包含下述环状结构的任一个的非芳香族饱和1价烃基,
[化1]
并且10~40摩尔%为相同或不同的、碳原子数6~15的取代或未取代的1价的非环状饱和烃基。此外,残部为上述烯基、碳原子数5~10的环状饱和1价烃基、碳原子数6~15的非环状饱和1价烃基以外的由R1~R3表示的有机基团,以及R4为相同或不同的、碳原子数1~7的取代或未取代的1价烃基。)
[化2]
(式中,R5~R7可相同也可不同,表示不包括烯基的碳原子数1~12的1价烃基。n为0~200的整数。)
[2][1]所述的粘接剂组合物,其中,还含有(D)反应控制剂。
[3][1]或[2]所述的粘接剂组合物,其中,还含有(E)抗氧化剂。
[4][1]~[3]的任一项所述的粘接剂组合物,其中,还含有(F)有机溶剂。
[5][4]所述的粘接剂组合物,其特征在于,上述(F)有机溶剂是沸点为120~240℃的烃溶剂。
[6][1]~[5]的任一项所述的粘接剂组合物,其层叠于选自硅晶片、固体摄像元件硅晶片、塑料基板、陶瓷基板和金属制电路基板的任一个的基板与保护玻璃基板之间。
[7]固体摄像器件,其包含在选自硅晶片、固体摄像元件硅晶片、塑料基板,陶瓷基板和金属制电路基板的任一个的基板上依次层叠[1]~[5]的任一项所述的粘接剂组合物的固化物层和保护玻璃基板的层叠物。
发明的效果
通过使用本发明的有机硅粘接剂组合物,由于在制造中不需要曝光、烘焙、显影工序,因此制造成本低,生产率高,作为粘接剂所要求的粘接性、热固化后的气密密封性、低吸湿性等特性良好,耐热性、耐光性等固化膜的可靠性也高,而且能够抑制在三维安装制造中所必需的背面研削后的粘接基板的翘曲,适合用于CCD、CMOS图像传感器制造。
具体实施方式
以下对本发明的有机硅粘接剂组合物详细地说明,本发明并不限定于它们。
<有机硅粘接剂组合物>
本发明的有机硅粘接剂组合物,其特征在于,包含:
(A)含有非芳香族饱和1价烃基和烯基的有机聚硅氧烷:100质量份,
(B)在1分子内含有2个以上的SiH基的有机氢聚硅氧烷:其量使得(B)成分中的SiH基与(A)成分中的烯基的摩尔比成为0.5~10,和
(C)铂系催化剂:有效量。
[(A)成分]
本发明的(A)成分是含有非芳香族饱和1价烃基和烯基的有机聚硅氧烷,在粘接剂组合物中包含的有机聚硅氧烷可1种单独地使用,也可将2种以上并用。作为优选使用的有机聚硅氧烷,大致划分可列举下述(A-1)、(A-2)的二种。以下依次进行说明。
有机聚硅氧烷(A-1)
有机聚硅氧烷(A-1)是重均分子量(Mw)[采用GPC(凝胶渗透色谱)的聚苯乙烯换算值]为2,000~60,000、包含由下述(I)~(III)表示的单元的含有非芳香族饱和1价烃基和烯基的有机聚硅氧烷。
(I)由R1SiO3/2表示的硅氧烷单元(T单元):50~99摩尔%
(II)由R2R3SiO2/2表示的硅氧烷单元(D单元):0~49摩尔%
(III)由R4 3SiO1/2表示的硅氧烷单元(M单元):1~15摩尔%
由上述(I)~(III)表示的单元的R1~R4各自为1价的有机基团。在此,1价的有机基团包括下述(i)~(iv)中所示的基团。
(i)为碳原子数5~10的包含环状结构的非芳香族饱和1价烃基,可列举包含下述所示的、1价和/或2价的环戊基骨架、环己基骨架、双环[2.2.1]骨架、双环[3.1.1]骨架
[化3]
的任一个的碳原子数5~10、特别地5~7的包含环状结构的1价的非芳香族饱和烃基,具体地,可列举环戊基、环己基、降冰片基、降冰片基乙基、金刚烷基等。
(ii)可列举碳原子数6~15的取代(特别地卤素取代)或未取代的碳原子数6~15的1价的非环状饱和烃基,具体地,可列举正己基、辛基、正癸基、正十二烷基等,更优选为正己基、正十二烷基。
(iii)可列举碳原子数2~7的烯基,具体地,乙烯基、烯丙基、丁烯基、己烯基、环己烯基、降冰片烯基等,更优选为乙烯基。
(iv)为碳原子数1~7的取代(特别地卤素取代)或未取代的1价烃基,具体地,可列举甲基、乙基、丙基、丁基、戊基等烷基;苯基、甲苯基等芳基;苄基等芳烷基;氯甲基、3-氯丙基、3,3,3-三氟丙基等卤代烷基等,优选甲基、丙基、苯基。
这种情况下,特别是在使耐化学品性显现方面,包含环状结构的非芳香族饱和1价烃基(非芳香族环状饱和1价烃基(i))的含量是重要的,上述R1~R3中非芳香族环状饱和1价烃基的含量优选为40摩尔%以上,特别优选为50~80摩尔%。如果为40摩尔%以上,则变得耐热性、耐光性优异。
另外,为了提高聚硅氧烷的接合性,非环状饱和1价烃基(ii)的含量也变得重要。上述R1~R3中碳原子数6~15的取代或未取代的1价的非环状饱和烃基的含量优选为10~40摩尔%。如果为10摩尔%以上,能够期待接合性的提高,如果为40摩尔%以下,固化后的膜不会变得过于柔软而成为适度的硬度。
优选由上述R1~R3表示的全部有机基团中的2~10摩尔%为碳原子数2~7的烯基(iii),特别优选为4~8摩尔%。如果为2摩尔%以上,固化时能够期待获得充分的交联密度,如果为10摩尔%以下,固化后的膜不会变得过硬而成为适度的硬度。
再有,R1~R3的合计量没有达到100摩尔%的情况下,其余的基团为上述(iv)的基团,另外,R4也为上述(iv)的基团,作为R4,可包含(i)~(iii)的基团。
作为本发明的(A)成分的含有非芳香族饱和1价烃基的有机聚硅氧烷优选的有机聚硅氧烷(A-1),如上述那样,包含50~99摩尔%的T单元、0~49摩尔%的D单元、1~15摩尔%的M单元。
作为(A-1)成分的含有非芳香族饱和1价烃基的有机聚硅氧烷,在处理上优选在不超过40℃的温度下具有固体形状的有机聚硅氧烷。
通过包含50~99摩尔%、优选地55~90摩尔%、更优选地60~85摩尔%的T单元,(A)成分的含有非芳香族饱和1价烃基的有机聚硅氧烷在40℃以下容易成为固体,对于基板间的接合变得适合。
通过包含49摩尔%以下、优选地45摩尔%以下、更优选地40摩尔%以下的D单元,(A)成分的含有非芳香族饱和1价烃基的有机聚硅氧烷在40℃以下容易成为固体,并且用于粘接剂组合物的情况下能够使基板之间充分地接合。
另外,从后述的热稳定性的观点出发,优选在(A-1)成分的含有非芳香族饱和1价烃基的有机聚硅氧烷中没有残留反应性的末端基、即硅烷醇基等。因此,优选在末端导入M单元的结构,作为M单元的含量,优选包含1摩尔%以上。更优选为1~15摩尔%,进一步优选为3~10摩尔%。
通过包含1~15摩尔%的M单元,(A-1)成分的含有非芳香族饱和1价烃基的有机聚硅氧烷成为反应性末端基充分减少了的结构。如果为1摩尔%以上,能够成为使硅烷醇基等反应性末端基充分减少的结构。另外,如果为15摩尔%以下,也不会担心由于末端基过度增多而使分子量相对地变小,是优选的。
没有用M单元封闭的分子末端基、即硅烷醇基等存在的情况下,这些反应性末端基的含量优选尽可能地少。如果硅烷醇基的末端残基在分子内为少量,则加热时由缩合反应生成水而可能成为脱气的原因能被抑制,耐热性提高,因此优选。另外,优选硅烷醇基的OH基的总量为全部树脂固形分中的5质量%以下,更优选为3质量%以下。通过M单元的导入,能够使这样的反应性末端基减少到所期望的量。
上述结构的有机聚硅氧烷能够通过一边控制一边进行成为原料的水解性硅烷的水解和缩合反应而制造。
作为能够用作原料的水解性硅烷,可列举甲基三氯硅烷、苯基三氯硅烷、正丙基三氯硅烷、异丙基三氯硅烷、正丁基三氯硅烷、异丁基三氯硅烷、正戊基三氯硅烷、异戊基三氯硅烷、正己基三氯硅烷、环己基三氯硅烷、正辛基三氯硅烷、正癸基三氯硅烷、正十二烷基三氯硅烷、双环[2.2.1]庚基三氯硅烷(下述(C1))、双环[2.2.1]壬基三氯硅烷(下述(C2))、二甲基二氯硅烷、正丙基甲基二氯硅烷、异丙基甲基二氯硅烷、正丁基甲基二氯硅烷、异丁基甲基二氯硅烷、正己基甲基二氯硅烷、正辛基甲基二氯硅烷、正癸基甲基二氯硅烷、正十二烷基甲基二氯硅烷、环己基甲基二氯硅烷、二苯基二氯硅烷、双环[2.2.1]庚基甲基二氯硅烷(下述(C3))、双环[2.2.1]壬基甲基二氯硅烷(下述(C4))及它们的水解性基团为甲氧基、乙氧基的水解性硅烷。
特别是具有多个环状结构的下述(C1)~(C4)存在内型体、外型体的立体异构体,这些都可以使用。
[化4]
(Me表示甲基。)
(A)成分的含有非芳香族饱和1价烃基的有机聚硅氧烷的分子量的分布非常重要。即,以采用GPC(凝胶渗透色谱)、根据用聚苯乙烯标准物质制作的校正曲线得到的重均分子量的值计,为2,000以上。如果含有非芳香族饱和1价烃基的有机聚硅氧烷的重均分子量为2,000以上,则固化后获得充分的膜强度,如果为60,000以下,含有非芳香族饱和1价烃基的有机聚硅氧烷的分子量能够再现性良好地稳定地合成。作为更优选的含有非芳香族饱和1价烃基的有机聚硅氧烷的重均分子量的范围,为3,000~50,000左右,更优选为5,000~30,000左右。
作为可以进行这样的分析、解析的GPC装置,能够使用东曹(株)制的HLC-8120GPC、HLC-8220GPC、HLC-8230GPC(下同)。
有机聚硅氧烷(A-2)
有机聚硅氧烷(A-2)是以上述有机聚硅氧烷(A-1)作为原料而高分子量化的产物。
即,在铂系催化剂的存在下使上述(A-1)与由下述通式(1)
[化5]
(式中,R5~R7可相同也可不同,表示不包括烯基的碳原子数1~12的1价烃基。n为0~200的整数。)
表示的1种以上的有机氢聚硅氧烷、即相对于上述含有烯基的有机聚硅氧烷(A-1)的全部烯基、全部SiH基成为0.4~0.8倍的量的上述式(1)的有机氢聚硅氧烷进行氢化硅烷化反应而得到的重均分子量为20,000~400,000的有机聚硅氧烷。
式(1)成分的全部SiH量相对于(A-1)成分的全部烯基优选0.4~0.8倍。如果为0.4倍以上,分子量的増加充分,树脂强度提高。另外,如果为0.8倍以下,则粘接剂组合物的采用交联反应的固化成为可能。
作为上述R5~R7的不包括烯基的碳原子数1~12的1价烃基,具体地,可例示甲基、丙基、己基、环己基、癸基、十二烷基等烷基、苯基等芳基。特别优选为甲基、环己基、苯基。
由上述通式(1)表示的有机氢聚硅氧烷的聚合度n优选为0~200的整数,优选为20~150、特别优选为40~120的整数。如果n为200以下,合成时,也不会担心与含有烯基的有机聚硅氧烷(A-1)的烯基的氢化硅烷化反应难以进行,反应充分地进行,而且固化的有机聚硅氧烷与硅基板的密合性也变得良好。
另外,如果为上述的范围内,也可以使用不同的有机氢聚硅氧烷进行加成反应。
[高分子量化的有机聚硅氧烷的制造方法]
对于含有烯基的有机聚硅氧烷(A-1)与有机氢聚硅氧烷(1)的反应,例如通过使含有烯基的有机聚硅氧烷(A-1)溶解于有机溶剂,添加作为氢化硅烷化催化剂的铂系的金属催化剂后,边加热到50~150℃,边滴入有机氢聚硅氧烷(1),从而能够得到高分子量化的有机聚硅氧烷。
铂系催化剂是用于促进与SiH基的氢化硅烷化加成反应的催化剂,作为该加成反应催化剂,可列举铂黑、氯化铂、氯铂酸、氯铂酸与1元醇的反应物、氯铂酸与烯烃类的络合物、双乙酰乙酸铂等铂系催化剂、钯系催化剂、铑系催化剂等铂族金属催化剂。再有,该加成反应催化剂的配合量能够设为催化剂量,通常,以铂族金属计,相对于(A-1)成分的质量,优选配合1~800ppm、特别地2~300ppm左右。
这些氢化硅烷化加成反应后的有机聚硅氧烷的分子量对于粘接剂组合物的特性、特别是加热时的热变形、粘接界面处的空隙产生等产生影响。
加成反应后的高分子量化的有机聚硅氧烷的重均分子量Mw,以使用GPC(凝胶渗透色谱)根据采用聚苯乙烯标准物质制作的校正曲线得到的重均分子量的值计,优选为20,000~400,000。如果为上述的重均分子量,则成为耐热性优异并且不产生空隙的有机聚硅氧烷。作为更优选的重均分子量的范围,为25,000~300,000左右,更优选为30,000~150,000左右。
[(B)成分]
(B)成分为交联剂,是在1分子内含有至少2个以上、优选地3个以上的SiH基的有机氢聚硅氧烷,能够使用直链状、分支状或环状的有机氢聚硅氧烷。再有,SiH基在1分子内优选为20个以下。
作为上述(B)成分,能够例示下述通式(2)或(3)的化合物,但并不限定于这些。
[化6]
HcR8 3-cSiO-(HR8SiO)x-(R8 2SiO)y-SiR8 3-cHc(2)
(式中,R8各自独立地为碳原子数1~10、特别地1~7的烷基、芳基、芳烷基等1价烃基,优选不具有烯基等脂肪族不饱和键。c为0或1,x和y为整数,2c+x≧2,并且x+y表示使式(2)的有机氢聚硅氧烷的25℃下的粘度成为1~5,000mPa·s的数,优选地表示x+y≧4,更优选地表示200≧x+y≧4的整数。s为2以上的整数,t为0以上的整数,并且表示s+t≧3、优选地8≧s+t≧3的整数。)
上述(B)成分的有机氢聚硅氧烷的采用旋转粘度计的25℃下的粘度优选为1~5,000mPa·s,更优选为1~2,000mPa·s,进一步优选为5~500mPa·s。该有机氢聚硅氧烷可以是2种以上的混合物。
优选以(B)成分中的SiH基与(A)成分中的烯基量的摩尔比(SiH基/烯基)成为0.5~10、特别地1~5的范围的方式配合上述(B)成分的使用量。如果该SiH基与烯基的摩尔比为0.5以上,交联密度不会降低,也不会发生组合物没有固化的问题。如果为10以下,交联密度不会过度升高,在接合后的耐热性试验时也能够抑制起因于残存SiH基的发泡,因此优选。
[(C)成分]
(C)成分为铂系催化剂(即,铂族金属催化剂),例如可列举氯铂酸、氯铂酸的醇溶液、氯铂酸与醇的反应物、氯铂酸与烯烃化合物的反应物、氯铂酸与含有乙烯基的硅氧烷的反应物等。
上述(C)成分的添加量为有效量,通常相对于上述(A)及(B)成分的合计,以铂分(质量换算)计,为1~5,000ppm,优选为5~2,000ppm。如果为1ppm以上,有机硅粘接剂组合物的固化性不会降低,交联密度也不会降低。如果为5,000ppm以下,保存稳定性变得良好。
在本发明的有机硅粘接剂组合物中,除了上述(A)、(B)、(C)成分以外,能够含有下述(D)、(E)、(F)成分、其他的成分。
[(D)成分]
(D)成分为反应控制剂,在将有机硅粘接剂组合物调和乃至涂布于基材时,为了在加热固化前不使处理液发生粘度增加、凝胶化而根据需要任意地添加。
作为具体例,可列举3-甲基-1-丁炔-3-醇、3-甲基-1-戊炔-3-醇、3,5-二甲基-1-己炔-3-醇、1-乙炔基环己醇、3-甲基-3-三甲基甲硅烷氧基-1-丁炔、3-甲基-3-三甲基甲硅烷氧基-1-戊炔、3,5-二甲基-3-三甲基甲硅烷氧基-1-己炔、1-乙炔基-1-三甲基甲硅烷氧基环己烷、双(2,2-二甲基-3-丁炔氧基)二甲基硅烷、1,3,5,7-四甲基-1,3,5,7-四乙烯基环四硅氧烷、1,1,3,3-四甲基-1,3-二乙烯基二硅氧烷等,优选为1-乙炔基环己醇及3-甲基-1-丁炔-3-醇。
上述(D)成分的配合量,通常,相对于上述(A)及(B)成分的合计100质量份,为0~8.0质量份的范围即可,优选为0.01~8.0质量份,特别优选为0.05~2.0质量份。如果为8.0质量份以下,有机硅粘接剂组合物的固化性不会降低,如果为0.01质量份以上,则充分地发挥反应控制的效果。
[(E)成分]
进而,本发明的组合物中,作为用于提高热稳定性的(E)成分,可配合抗氧化剂。
(E)成分的抗氧化剂优选为选自受阻酚系化合物、受阻胺系化合物、有机磷化合物和有机硫化合物中的至少1种的化合物。
受阻酚系化合物;
对本发明中使用的受阻酚系化合物并无特别限定,优选以下列举的受阻酚系化合物。
1,3,5-三甲基-2,4,6-三(3,5-二-叔丁基-4-羟基苄基)苯(商品名:IRGANOX1330)、2,6-二-叔丁基-4-甲基苯酚(商品名:SumilizerBHT)、2,5-二-叔丁基-氢醌(商品名:NocracNS-7)、2,6-二-叔丁基-4-乙基苯酚(商品名:NocracM-17)、2,5-二-叔戊基氢醌(商品名:NocracDAH)、2,2’-亚甲基双(4-甲基-6-叔丁基苯酚)(商品名:NocracNS-6)、3,5-二-叔丁基-4-羟基-苄基膦酸酯-二乙基酯(商品名:IRGANOX1222)、4,4’-硫代双(3-甲基-6-叔丁基苯酚)(商品名:Nocrac300)、2,2’-亚甲基双(4-乙基-6-叔丁基苯酚)(商品名:NocracNS-5)、4,4’-亚丁基双(3-甲基-6-叔丁基苯酚)(アデカスタブAO-40)、2-叔丁基-6-(3-叔丁基-2-羟基-5-甲基苄基)-4-甲基苯基丙烯酸酯(商品名:SumilizerGM)、2-[1-(2-羟基-3,5-二-叔戊基苯基)乙基]-4,6-二-叔-戊基苯基丙烯酸酯(商品名:SumilizerGS)、2,2’-亚甲基双[4-甲基-6-(α-甲基-环己基)苯酚]、4,4’-亚甲基双(2,6-二-叔丁基苯酚)(商品名:シーノックス226M)、4,6-双(辛硫基甲基)-邻-甲酚(商品名:IRGANOX1520L)、2,2’-亚乙基双(4,6-二-叔丁基苯酚)、十八烷基-3-(3,5-二-叔丁基-4-羟基苯基)丙酸酯(商品名:IRGANOX1076)、1,1,3-三-(2-甲基-4-羟基-5-叔丁基苯基)丁烷(商品名:アデカスタブAO-30)、四[亚甲基-(3,5-二-叔丁基-4-羟基氢化肉桂酸酯)]甲烷(商品名:アデカスタブAO-60)、三甘醇双[3-(3-叔丁基-5-甲基-4-羟基苯基)丙酸酯](商品名:IRGANOX245)、2,4-双-(正辛硫基)-6-(4-羟基-3,5-二-叔丁基苯胺基)-1,3,5-三嗪(商品名:IRGANOX565)、N,N’-六亚甲基双(3,5-二-叔丁基-4-羟基-氢化肉桂酰胺)(商品名:IRGANOX1098)、1,6-己二醇-双[3-(3,5-二-叔丁基-4-羟基苯基)丙酸酯](商品名:IRGANOX259)、2,2-硫代-二亚乙基双[3-(3,5-二-叔丁基-4-羟基苯基)丙酸酯](商品名:IRGANOX1035)、3,9-双[2-[3-(3-叔丁基-4-羟基-5-甲基苯基)丙酰氧基]1,1-二甲基乙基]2,4,8,10-四氧杂螺[5.5]十一烷(商品名:SumilizerGA-80)、三-(3,5-二-叔丁基-4-羟基苄基)异氰脲酸酯(商品名:IRGANOX3114)、双(3,5-二-叔丁基-4-羟基苄基膦酸乙酯)钙/聚乙烯蜡混合物(50:50)(商品名:IRGANOX1425WL)、异辛基-3-(3,5-二-叔丁基-4-羟基苯基)丙酸酯(商品名:IRGANOX1135)、4,4’-硫代双(6-叔丁基-3-甲基苯酚)(商品名:SumilizerWX-R)、6-[3-(3-叔丁基-4-羟基-5-甲基苯基)丙氧基]-2,4,8,10-四-叔丁基二苯并[d,f][1,3,2]二氧杂磷杂环庚烯(商品名:SumilizerGP)等。
受阻胺系化合物;
对本发明中使用的受阻胺系化合物并无特别限定,优选以下列举的受阻胺系化合物。
对,对’-二辛基二苯基胺(商品名:IRGANOX5057)、苯基-α-萘基胺(NocracPA)、聚(2,2,4-三甲基-1,2-二氢喹啉)(商品名:Nocrac224,224-S)、6-乙氧基-2,2,4-三甲基-1,2-二氢喹啉(商品名:NocracAW)、N,N’-二苯基-对-苯二胺(商品名:NocracDP)、N,N’-二-β-萘基-对-苯二胺(商品名:NocracWhite)、N-苯基-N’-异丙基-对-苯二胺(商品名:Nocrac810NA)、N,N’-二烯丙基-对-苯二胺(商品名:NonflexTP)、4,4’(α,α-二甲基苄基)二苯基胺(商品名:NocracCD)、对,对-甲苯磺酰氨基二苯基胺(商品名:NocracTD)、N-苯基-N’-(3-甲基丙烯酰氧基-2-羟基丙基)-对-苯二胺(商品名:NocracG1)、N-(1-甲基庚基)-N’-苯基-对-苯二胺(商品名:Ozonon35)、N,N’-二-仲丁基-对-苯二胺(商品名:SumilizerBPA)、N-苯基-N’-1,3-二甲基丁基-对-苯二胺(商品名:Antigene6C)、烷基化二苯基胺(商品名:Sumilizer9A)、琥珀酸二甲酯-1-(2-羟基乙基)-4-羟基-2,2,6,6-四甲基哌啶缩聚物(商品名:Tinuvin622LD)、聚[[6-(1,1,3,3-四甲基丁基)氨基-1,3,5-三嗪-2,4-二基][(2,2,6,6-四甲基-4-哌啶基)亚氨基]六亚甲基[(2,2,6,6-四甲基-4-哌啶基)亚氨基]](商品名:CHIMASSORB944)、N,N’-双(3-氨基丙基)乙二胺-2,4-双[N-丁基-N-(1,2,2,6,6-五甲基-4-哌啶基)氨基]-6-氯-1,3,5-三嗪缩合物(商品名:CHIMASSORB119FL)、双(1-辛氧基-2,2,6,6-四甲基-4-哌啶基)癸二酸酯(商品名:TINUVIN123)、双(2,2,6,6-四甲基-4-哌啶基)癸二酸酯(商品名:TINUVIN770)、2-(3,5-二-叔丁基-4-羟基苄基)-2-正丁基丙二酸双(1,2,2,6,6-五甲基-4-哌啶基)酯(商品名:TINUVIN144)、双(1,2,2,6,6-五甲基-4-哌啶基)癸二酸酯(商品名:TINUVIN765)、四(1,2,2,6,6-五甲基-4-哌啶基)1,2,3,4-丁烷四羧酸酯(商品名:LA-57)、四(2,2,6,6-四甲基-4-哌啶基)1,2,3,4-丁烷四羧酸酯(商品名:LA-52)、1,2,3,4-丁烷四羧酸与1,2,2,6,6-五甲基-4-哌啶醇及1-十三烷醇的混合酯化物(商品名:LA-62)、1,2,3,4-丁烷四羧酸和2,2,6,6-四甲基-4-哌啶醇及1-十三烷醇的混合酯化物(商品名:LA-67)、1,2,3,4-丁烷四羧酸和1,2,2,6,6-五甲基-4-哌啶醇及3,9-双(2-羟基-1,1-二甲基乙基)-2,4,8,10-四氧杂螺[5.5]十一烷的混合酯化物(商品名:LA-63P)、1,2,3,4-丁烷四羧酸和2,2,6,6-四甲基-4-哌啶醇及3,9-双(2-羟基-1,1-二甲基乙基)-2,4,8,10-四氧杂螺[5.5]十一烷的混合酯化物(商品名:LA-68LD)、(2,2,6,6-四亚甲基-4-哌啶基)-2-丙烯羧酸酯(商品名:アデカスタブLA-82)、(1,2,2,6,6-五甲基-4-哌啶基)-2-丙烯羧酸酯(商品名:アデカスタブLA-87)等。
有机磷化合物;
对本发明中使用的有机磷化合物并无特别限定,优选以下列举的有机磷化合物。
双(2,4-二-叔丁基苯基)[1,1-联苯基]-4,4’-二基双亚磷酸酯、9,10-二氢-9-氧杂-10-磷杂菲-10-氧化物(商品名:SANKO-HCA)、亚磷酸三乙酯(商品名:JP302)、亚磷酸三正丁酯(商品名:304)、亚磷酸三苯酯(商品名:アデカスタブTPP)、二苯基单辛基亚磷酸酯(商品名:アデカスタブC)、三(对-甲苯基)亚磷酸酯(商品名:Chelex-PC)、二苯基单癸基亚磷酸酯(商品名:アデカスタブ135A)、二苯基单(十三烷基)亚磷酸酯(商品名:JPM313)、三(2-乙基己基)亚磷酸酯(商品名:JP308)、苯基二癸基亚磷酸酯(アデカスタブ517)、亚磷酸三癸酯(商品名:アデカスタブ3010)、四苯基二丙二醇二亚磷酸酯(商品名:JPP100)、双(2,4-二-叔丁基苯基)季戊四醇二亚磷酸酯(商品名:アデカスタブPEP-24G)、三(十三烷基)亚磷酸酯(商品名:JP333E)、双(壬基苯基)季戊四醇二亚磷酸酯(商品名:アデカスタブPEP-4C)、双(2,6-二-叔丁基-4-甲基苯基)季戊四醇二亚磷酸酯(商品名:アデカスタブPEP-36)、双[2,4-二(1-苯基异丙基)苯基]季戊四醇二亚磷酸酯(商品名:アデカスタブPEP-45)、三月桂基三硫代亚磷酸酯(商品名:JPS312)、三(2,4-二-叔丁基苯基)亚磷酸酯(IRGAFOS168)、三(壬基苯基)亚磷酸酯(商品名:アデカスタブ1178)、二硬脂基季戊四醇二亚磷酸酯(商品名:アデカスタブPEP-8)、三(单、二壬基苯基)亚磷酸酯(商品名:アデカスタブ329K)、亚磷酸三油酯(商品名:Chelex-OL)、亚磷酸三硬脂酯(商品名:JP318E)、4,4’-亚丁基双(3-甲基-6-叔丁基苯基二(十三烷基))亚磷酸酯(商品名:JPH1200)、四(C12-C15混合烷基)-4,4’-亚异丙基二苯基二亚磷酸酯(商品名:アデカスタブ1500)、四(十三烷基)-4,4’-亚丁基双(3-甲基-6-叔丁基苯酚)二亚磷酸酯(商品名:アデカスタブ260)、六(十三烷基)-1,1,3-三(2-甲基-5-叔丁基-4-羟基苯基)丁烷-三亚磷酸酯(商品名:アデカスタブ522A)、氢化双酚A亚磷酸酯聚合物(HBP)、四(2,4-二-叔丁基苯氧基)4,4’-亚联苯基-二-膦(商品名:P-EPQ)、四(2,4-二-叔丁基-5-甲基苯氧基)4,4’-亚联苯基-二-膦(商品名:GSY-101P)、2-[[2,4,8,10-四(1,1-二甲基乙基)二苯并[d,f][1,3,2]二氧杂磷杂环庚烯-6-基]氧]-N,N-双[2-[[2,4,8,10-四(1,1-二甲基乙基)二苯并[d,f][1,3,2]二氧杂磷杂环庚烯-6-基]氧]-乙基]乙胺(商品名:IRGAFOS12)、2,2’-亚甲基双(4,6-二-叔丁基苯基)辛基亚磷酸酯(商品名:アデカスタブHP-10)等。
有机硫化合物;
对本发明中使用的有机硫化合物并无特别限定,优选以下列举的有机硫化合物。
二月桂基-3,3’-硫代二丙酸酯(商品名:SumilizerTPL-R)、二肉豆蔻基-3,3’-硫代二丙酸酯(商品名:SumilizerTPM)、二硬脂基-3,3’-硫代二丙酸酯(商品名:SumilizerTPS)、季戊四醇四(3-月桂基硫代丙酸酯)(商品名:SumilizerTP-D)、二(十三烷基)-3,3’-硫代二丙酸酯(商品名:SumilizerTL)、2-巯基苯并咪唑(商品名:SumilizerMB)、二(十三烷基)-3,3’-硫代二丙酸酯(商品名:アデカスタブAO-503A)、1,3,5-三-β-硬脂基硫代丙酰氧基乙基异氰脲酸酯、3,3’-硫代双丙酸二(十二烷基)酯(商品名:IRGANOXPS800FL)、3,3’-硫代双丙酸二(十八烷基)酯(商品名:IRGANOXPS802FL)等。
上述的抗氧化剂中,如果考虑与(A)成分的含有非芳香族饱和1价烃基的有机聚硅氧烷、(B)成分及后述的有机溶剂的相容性,特别优选地,可列举アデカスタブAO-60、IRGANOX1076、IRGANOX1135、IRGANOX1520L(以上为商品名)等。
作为(E)成分的添加量,相对于(A)成分100质量份,为0.1~5质量份,优选为0.2~3质量份。如果比其少,无法获得充分的效果,如果装入其以上的量,有可能无法获得相容性。
再有,(E)成分并不限定于1种,可将多种并用。
此外,本发明中,除了(A)、(B)、(C)、(D)及(E)成分以外,可含有(F)有机溶剂。
作为本发明的粘接剂组合物中所含的(A)有机聚硅氧烷,能够使用前述的含有非芳香族饱和1价烃基的有机聚硅氧烷(A-1)及高分子量化的有机聚硅氧烷(A-2),这种情况下,(F)成分只要将(A)、(B)、(C)、(D)及(E)成分溶解,采用旋涂等公知的涂膜形成方法能够形成膜厚1~200μm的薄膜则优选。此时,更优选的膜厚为5~180μm,进一步优选为30~150μm,优选能够形成这样的范围的膜厚的(F)有机溶剂。
作为这样溶解(A)、(B)、(C)、(D)及(E)成分的(F)有机溶剂,能够使用酮、酯、醇等以外的有机溶剂。此外,即使是醚系溶剂,也能够将本发明的粘接剂组合物溶解,如果考虑作业性、安全性、例如溶剂的气味等,优选非芳香族烃。
作为这样的(F)有机溶剂,可列举碳原子数4~15的非芳香族烃化合物,作为具体例,可列举戊烷、己烷、环戊烷、环己烷、甲基环己烷、辛烷、异辛烷、异壬烷、癸烷、十一烷、异十二烷、柠檬烯、蒎烯等。
这些中,作为给予可以旋涂并且安全性也高的粘接剂组合物的(F)有机溶剂,优选沸点为120~240℃的烃溶剂。即,从该观点出发,优选异壬烷、癸烷、异癸烷、十二烷、异十二烷。如果沸点为120℃以上,由于挥发速度变慢,旋涂时的涂布性也变得良好,因此优选。另外,如果沸点为240℃以下,将烃溶剂涂布后的加热干燥中容易挥发,难以留在膜内。因此,在将粘接剂组合物在基板接合后的加热工序中暴露于高温时,也能够抑制在接合面处的气泡的形成,因此优选。
作为(F)成分的添加量,相对于(A)及(B)成分100质量份,为10~1,000质量份,优选为20~200质量份。如果比其少,粘接剂组合物的粘度过度升高,不能涂布于晶片,如果添加其以上的量,则涂布后无法获得充分的膜厚。
再有,(F)成分并不限定于1种,可将多种并用。
[其他成分]
除了上述成分以外,在本发明的粘接剂组合物中,在不妨碍本发明的效果的范围内,能够进一步添加通常的粘接剂组合物中使用的成分。
例如,为了提高涂布性,在本发明的粘接剂组合物中可添加公知的表面活性剂。对其并无特别限定,具体地,可列举聚氧乙烯月桂基醚、聚氧乙烯硬脂基醚、聚氧乙烯十六烷基醚、聚氧乙烯油基醚等聚氧乙烯烷基醚类,聚氧乙烯辛基苯酚醚、聚氧乙烯壬基苯酚醚等聚氧乙烯烷基芳基醚类,聚氧乙烯聚氧丙烯嵌段共聚物类,山梨糖醇酐单月桂酸酯、山梨糖醇酐单棕榈酸酯、山梨糖醇酐单硬脂酸酯等山梨糖醇酐脂肪酸酯类,聚氧乙烯山梨糖醇酐单月桂酸酯、聚氧乙烯山梨糖醇酐单棕榈酸酯、聚氧乙烯山梨糖醇酐单硬脂酸酯、聚氧乙烯山梨糖醇酐三油酸酯、聚氧乙烯山梨糖醇酐三硬脂酸酯等聚氧乙烯山梨糖醇酐脂肪酸酯的非离子系表面活性剂,エフトップEF301,EF303,EF352(トーケムプロダクツ)、メガファックF171,F172,F173(大日本油墨化学工业)、フロラードFC430,FC431(住友スリーエム)、アサヒガードAG710,サーフロンS-381,S-382,SC101,SC102,SC103,SC104,SC105,SC106、サーフィノールE1004,KH-10,KH-20,KH-30,KH-40(旭硝子)等氟系表面活性剂,有机硅氧烷聚合物KP341,X-70-092,X-70-093(信越化学工业),丙烯酸系或甲基丙烯酸系ポリフローNo.75,No.95(共荣社油脂化学工业)。这些能够单独使用或者将2种以上组合使用。
另外,本发明的粘接剂组合物与硅晶片等的基板、玻璃基板等的基材基本上不反应,但为了进一步提高粘接剂组合物的粘接性,可添加公知的粘接助剂、例如硅烷偶联剂。
通过使用这样的有机硅粘接剂组合物,由于制造中不需要曝光、烘焙、显影工序,因此制造成本低,生产率高,作为粘接剂所要求的粘接性、热固化后的气密密封性、低吸湿性等特性良好,耐热性、耐光性等固化膜的可靠性也高,进而可以抑制在三维安装制造中必需的背面研削后的粘接基板的翘曲。
接下来,对使用了上述粘接剂组合物的本发明的CCD、CMOS图像传感器制造时的硅晶片与玻璃基板的接合方法进行说明。
首先,将上述粘接剂组合物在基板上涂布。作为上述基板,可列举例如固体摄像元件硅晶片等。
作为涂布法,能够采用公知的光刻技术进行。例如,能够采用浸渍法、旋涂法、辊涂法等方法进行涂布。
在此,为了减少与保护玻璃基板的接合时的脱气,根据需要可采用预加热(预烘焙)预先使溶剂等挥发。预加热能够在例如40~100℃下进行。
能够使用接合装置进行这样得到的带粘接剂组合物的硅基板(固体摄像元件硅晶片)与保护玻璃基板的临时接合。作为临时接合的条件,接合温度优选为50~200℃,更优选为70~150℃,接合前保持时间优选为0~10分钟,更优选为1~5分钟,接合时减压优选为100mbar以下,更优选为10mbar以下的条件。进而,能够在接合压力为0.1~50kN、更优选地0.5~20kN下进行临时接合。进而,根据需要可以将临时接合基板加热,使组合物固化。作为热固化温度,优选为100~220℃,更优选为120~200℃,固化时间优选为1~60分钟,更优选为3~30分钟,能够在这样的热固化温度和固化时间下进行。
因此,在选自硅晶片、固体摄像元件硅晶片、塑料基板,陶瓷基板及金属制电路基板的任一个的基板上形成本发明涉及的粘接剂组合物层,包含在其上配置了保护玻璃基板的层叠物,能够得到用于CCD、CMOS的固体摄像器件。再有,该器件的制造时,可以在上述硅晶片等基板上形成粘接剂组合物层,在其上层叠保护玻璃基板,或者可以在保护玻璃基板上形成粘接剂组合物层,在其上层叠硅晶片等基板。
实施例
以下示出合成例和比较合成例、实施例和比较例,对本发明具体地说明,但本发明并不受下述例限制。应予说明,下述例中,Me表示甲基,粘度是采用旋转粘度计在25℃下测定的值,重均分子量为采用GPC的聚苯乙烯换算值。
[有机聚硅氧烷的合成]
(合成例1)
在安装有搅拌装置、冷却装置、温度计的1L烧杯中装入水234g(13摩尔)、甲苯35g,用油浴加热到80℃。在滴液漏斗中装入环己基三氯硅烷108.8g(0.5摩尔)、正己基三氯硅烷65.9g(0.3摩尔)、二甲基二氯硅烷6.5g(0.05摩尔)、甲基乙烯基二氯硅烷7.1g(0.05摩尔)、三甲基氯硅烷10.9g(0.1摩尔),在烧杯内边搅拌边用1小时滴入,滴入结束后,进一步在80℃下进行了1小时搅拌熟化。边冷却到室温边静置,将分离而来的水相除去,接着混合10质量%硫酸钠水溶液,搅拌10分钟后,静置30分钟,将分离而来的水相除去的水清洗操作反复进行直至甲苯相成为中性,停止反应。安装酯接合器(esteradaptor),将包含有机聚硅氧烷的甲苯相加热回流,从甲苯相将水除去,内温达到了110℃后,进一步继续1小时后,冷却到室温。将得到的有机聚硅氧烷溶液过滤,将不溶物除去,接着通过减压蒸馏将甲苯除去,得到了固体的有机聚硅氧烷(A-I)115.2g。
得到的有机聚硅氧烷(A-I)包含T单元80摩尔%和D单元10摩尔%和M单元10摩尔%,相对于每100g有机聚硅氧烷(A-I)末端含有硅烷醇基0.09摩尔、乙烯基0.043摩尔。外观为无色透明固体,重均分子量为7,500。全部有机基团中的环己基含量为38摩尔%,正己基含量为23摩尔%,乙烯基含量为3.8摩尔%。另外,由R1~R3所示的全部有机基团中的50摩尔%为环己基,30摩尔%为正己基,15摩尔%为甲基,5摩尔%为乙烯基。
(合成例2-1)
采用与合成例1同样的方法在2L烧杯中装入水468g(26摩尔)、甲苯70g,用油浴加热到80℃。在滴液漏斗中装入降冰片基三氯硅烷275.6g(1.2摩尔)、正己基三氯硅烷65.8g(0.3摩尔)、二甲基二氯硅烷25.8g(0.2摩尔)、甲基乙烯基二氯硅烷14.2g(0.1摩尔)、三甲基氯硅烷21.8g(0.2摩尔)以外,与合成例1同样地调制,得到了固体的有机聚硅氧烷228.8g。
得到的有机聚硅氧烷包含T单元75摩尔%和D单元15摩尔%和M单元10摩尔%,每100g含有硅烷醇基0.07摩尔、乙烯基0.039摩尔。外观为无色透明固体,重均分子量为9,300。全部有机基团中的降冰片基含量为44摩尔%,正己基含量为11摩尔%,乙烯基含量为3.7摩尔%。另外,由R1~R3表示的全部有机基团中的57摩尔%为降冰片基,14摩尔%为正己基,24摩尔%为甲基,5摩尔%为乙烯基。
(合成例2-2)
作为含有烯基的有机聚硅氧烷,将合成例2-1中得到的固形的有机聚硅氧烷100g溶解于甲苯100g中,调制固形分浓度50质量%的溶液。在该溶液中,相对于树脂以铂原子计添加20ppm的铂系催化剂,在加热到60℃的状态下,作为含有氢甲硅烷基的化合物,滴入由下述式(4)表示的化合物(SiH当量2,287g/mol)44.6g(该量以H/Vi比(相对于全部烯基的SiH基的比率)计相当于0.5),结果观测到反应产生的放热。在100℃下进行2小时反应,使反应完成。然后,通过减压馏除进行浓缩,将甲苯馏除,使反应生成物成为固体,得到了有机聚硅氧烷(A-II)。此外,对该树脂采用GPC测定了重均分子量Mw,结果为41,000,每100g含有乙烯基0.019摩尔。
[化7]
(合成例3-1)
与合成例1同样地,在1L烧杯中装入水234g(13摩尔)、甲苯35g,用油浴加热到80℃。在滴液漏斗中装入降冰片基三氯硅烷160.7g(0.7摩尔)、正十二烷基三氯硅烷45.6g(0.15摩尔)、甲基乙烯基二氯硅烷7.1g(0.05摩尔)、三甲基氯硅烷10.9g(0.1摩尔)以外,与合成例1同样地调制,得到了固体的有机聚硅氧烷143.8g。
得到的有机聚硅氧烷包含T单元85摩尔%和D单元5摩尔%和M单元10摩尔%,每100g含有硅烷醇基0.1摩尔、乙烯基0.034摩尔。外观为无色透明固体,重均分子量为6,100。全部有机基团中的降冰片基含量为56摩尔%,正十二烷基含量为12摩尔%,乙烯基含量为4.0摩尔%。此外,由R1~R3表示的全部有机基团中的74摩尔%为降冰片基,16摩尔%为正十二烷基,5摩尔%为甲基,5摩尔%为乙烯基。
(合成例3-2)
作为含有烯基的有机聚硅氧烷,使用合成例3-1中得到的固形的有机聚硅氧烷100g,作为含有氢甲硅烷基的化合物,使用由下述式(5)表示的化合物(SiH当量1,547g/mol)31.6g(该量以H/Vi比计,相当于0.6)以外,进行与合成例2-2同样的反应,得到了重均分子量46,400的有机聚硅氧烷(A-III)。该树脂每100g含有乙烯基0.02摩尔。
[化8]
(比较合成例1)
与合成例1同样地,在1L烧杯中装入水234g(13摩尔)、甲苯35g,用油浴加热到80℃。在滴液漏斗中装入苯基三氯硅烷137.5g(0.65摩尔)、二苯基二氯硅烷50.6g(0.2摩尔)、甲基乙烯基二氯硅烷7.1g(0.05摩尔)、三甲基氯硅烷10.8g(0.1摩尔)以外,与合成例1同样地调制,得到了固形的有机聚硅氧烷(A-IV)137g。
得到的有机聚硅氧烷(A-IV)包含T单元65摩尔%和D单元25摩尔%和M单元10摩尔%,相对于每100g有机聚硅氧烷末端含有硅烷醇基0.01摩尔、乙烯基0.034摩尔。外观为无色透明固体,重均分子量为11,700。另外,由R1~R3表示的全部有机基团中的92摩尔%为苯基(芳香族不饱和烃基),4摩尔%为甲基,4摩尔%为乙烯基。
(比较合成例2)
与合成例1同样地,在1L烧杯中装入水234g(13摩尔)、甲苯35g,用油浴加热到80℃。在滴液漏斗中装入降冰片基三氯硅烷91.8g(0.4摩尔)、正己基三氯硅烷24.7g(0.15摩尔)、二甲基二氯硅烷45.2g(0.35摩尔)、甲基乙烯基二氯硅烷7.1g(0.05摩尔)、三甲基氯硅烷5.4g(0.05摩尔)以外,与合成例1同样地调制,得到了固体的有机聚硅氧烷(A-V)143.8g。
得到的有机聚硅氧烷包含T单元55摩尔%和D单元40摩尔%和M单元5摩尔%,每100g含有硅烷醇基0.12摩尔、乙烯基0.044摩尔。外观为无色透明固体,重均分子量为10,500。全部有机基团中的降冰片基含量为27摩尔%,正己基含量为10摩尔%,乙烯基为3.3摩尔%。此外,由R1~R3表示的全部有机基团中的30摩尔%为降冰片基,11摩尔%为正己基,55摩尔%为甲基,4摩尔%为乙烯基。
[实施例1~3、比较例1,2]
作为(A)成分,以上述合成的有机聚硅氧烷A-I、A-II、A-III和比较有机聚硅氧烷A-IV、A-V为基础,分别以表1中记载的组成配合(B)成分、(C)成分、(D)成分、(E)成分、(F)成分,然后,搅拌、混合、溶解。特别地,作为(B)成分,使用了以下所示的(B-I)、(B-II)。
[化9]
此外,作为(C)成分使用了铂催化剂CAT-PL-50T(信越化学工业(株)制),作为(D)成分,使用了乙炔基环己醇,作为(E)成分使用了酚系抗氧化剂アデカスタブAO-60,作为(F)成分,使用了异壬烷。对这些组合物使用特氟隆(注册商标)制0.2μm过滤器进行精密过滤,得到了实施例1~3中的本发明的粘接剂组合物及比较例1、2中的粘接剂组合物。
使用表1的实施例1~3及比较例1、2中所示的组合物,在8英寸硅晶片使用旋涂器以表1记载的膜厚涂布各实施例及比较例的粘接剂组合物。然后,为了将溶剂除去,采用热板在80℃下进行了5分钟预烘焙。在得到的带粘接剂组合物的8英寸硅晶片,使用接合装置,在接合温度100℃、接合前保持时间1分钟、接合时减压4×10-3mbar、接合压力2kN下进行了临时接合。进而,使本临时接合基板在150℃下热固化5分钟,得到了最终的接合基板。
接下来,各评价按照以下的方法实施。
[粘接性试验]
8英寸的晶片接合使用EVG社的晶片接合装置520IS进行。接合后,通过目视确认冷却到室温后的界面的粘接状况,将没有发生界面处的气泡等异常的情形用○表示,将发生了异常的情形用×表示。
[背面耐研削性试验]
使用研磨机(DAG810DISCO制)进行了硅基板的背面研削。进行研磨直至最终基板厚50μm后,用光学显微镜考察开裂、剥离等异常的有无。将没有发生异常的情形用○表示,将发生了异常的情形用×表示。
[耐热性]
将硅晶片进行了背面研削后的接合体在空气中230℃或260℃下在热板上加热3分钟后,考察外观异常的有无。将没有发生外观异常的情形评价为良好,用(○)表示,将发生了外观异常(剥离)的情形评价为不良,用(×)表示。
[耐光性]
作为耐光性试验,进行了以下所示的短期耐光性、长期耐光性试验。
对于短期耐光性,将粘接剂组合物在膜厚500μm的玻璃基板旋涂后,在150℃下进行10分钟的热固化,测定初期的透射率(波长400nm),接下来,在空气中230℃或260℃下在热板上加热3分钟,再次测定加热后的透射率(波长400nm),求出衰减率(%)=[加热后的透射率(波长400nm)/初期的透射率(波长400nm)]×100。将衰减率90%以上评价为(○),将比90%低的情形评价为(×)。
对于长期耐光性,将粘接剂组合物在膜厚500μm的玻璃基板旋涂后,在150℃下进行10分钟的热固化,测定初期的透射率(波长400nm),再次测定将模拟太阳光(将波长350nm以下截止)500万勒克斯照射后的透射率(波长400nm),求出衰减率(%)=[照射后的透射率(波长400nm)/初期的透射率(波长400nm)]×100。将衰减率90%以上评价为(○),将比90%低的情形评价为(×)。
[翘曲性(接合晶片的翘曲量)]
对于使用了粘接剂组合物的8英寸硅晶片基板和保护玻璃基板的接合热固化后的基板,使用背面研磨装置对硅侧实施研磨直至初期725~100μm,测定背面研磨后的接合8英寸晶片的翘曲量。
将上述评价结果记载于表1。
[表1]
如上述表1的比较例1那样使用了不含降冰片基的苯基有机硅树脂的情况下,耐光性、翘曲性恶化,比较例2的降冰片基的含量少的情况下,翘曲性良好,但耐热性降低。另一方面,实施例1~3中,都是耐热性、耐光性、翘曲性优异。即,如果是本发明的粘接剂组合物,显示出满足上述的要求特性。
由以上可知,如果是本发明的粘接剂组合物,由于制造中不需要曝光、烘焙、显影工序,因此制造成本低,生产率高,作为粘接剂所要求的粘接性、热固化后的气密密封性、低吸湿性等的特性良好,耐热性、耐光性等的固化膜的可靠性高,而且可以抑制三维安装制造中必需的背面研削后的粘接基板的翘曲。
应予说明,本发明并不限定于上述实施方式。上述实施方式是例示,具有与本发明的专利权利要求中记载的技术思想实质上相同的构成、发挥同样的作用效果的实施方式都包含在本发明的技术范围中。
Claims (7)
1.有机硅粘接剂组合物,其特征在于,含有:
(A)含有非芳香族饱和1价烃基及烯基的有机聚硅氧烷,
(B)在1分子内含有2个以上的SiH基的有机氢聚硅氧烷:其量使得(B)成分中的SiH基与(A)成分中的烯基的摩尔比成为0.5~10,
(C)铂系催化剂:有效量,
(A)成分的含有非芳香族饱和1价烃基的有机聚硅氧烷为:
包含由下述(I)~(III)表示的单元的重均分子量为2,000~60,000的有机聚硅氧烷(A-1),
或者,
使下述通式(1)所示的1种以上的有机氢聚硅氧烷与该有机聚硅氧烷(A-1)以相对于上述有机聚硅氧烷(A-1)的全部烯基、上述有机氢聚硅氧烷的全部SiH基以摩尔比计成为0.4~0.8倍的量进行氢化硅烷化反应而得到的重均分子量为20,000~400,000的高分子量化的有机聚硅氧烷(A-2),
(I)由R1SiO3/2表示的硅氧烷单元(T单元):50~99摩尔%
(II)由R2R3SiO2/2表示的硅氧烷单元(D单元):0~49摩尔%
(III)由R4 3SiO1/2表示的硅氧烷单元(M单元):1~15摩尔%
式中,R1~R3各自为1价的有机基团,并且由R1~R3表示的全部有机基团中的2~10摩尔%为碳原子数2~7的烯基,由R1~R3表示的全部有机基团中的40摩尔%以上为相同或不同的、碳原子数5~10的包含下述环状结构的任一个的非芳香族饱和1价烃基,
[化1]
并且10~40摩尔%为相同或不同的、碳原子数6~15的取代或未取代的1价的非环状饱和烃基;而且残部为上述烯基、碳原子数5~10的环状饱和1价烃基、碳原子数6~15的非环状饱和1价烃基以外的由R1~R3表示的有机基团,以及R4为相同或不同的、碳原子数1~7的取代或未取代的1价烃基,
[化2]
式中,R5~R7可相同也可不同,表示不包括烯基的碳原子数1~12的1价烃基;n为0~200的整数。
2.根据权利要求1所述的粘接剂组合物,其中,还含有(D)反应控制剂。
3.根据权利要求1或2所述的粘接剂组合物,其中,还含有(E)抗氧化剂。
4.根据权利要求1~3的任一项所述的粘接剂组合物,其中,还含有(F)有机溶剂。
5.根据权利要求4所述的粘接剂组合物,其特征在于,上述(F)有机溶剂是沸点为120~240℃的烃溶剂。
6.根据权利要求1~5的任一项所述的粘接剂组合物,其层叠于选自硅晶片、固体摄像元件硅晶片、塑料基板、陶瓷基板及金属制电路基板的任一个的基板与保护玻璃基板之间。
7.固体摄像器件,其包含在选自硅晶片、固体摄像元件硅晶片、塑料基板,陶瓷基板和金属制电路基板的任一个的基板上依次层叠根据权利要求1~5的任一项所述的粘接剂组合物的固化物层和保护玻璃基板的层叠物。
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US20160289519A1 (en) | 2016-10-06 |
WO2015072418A1 (ja) | 2015-05-21 |
KR20160083880A (ko) | 2016-07-12 |
EP3070137A1 (en) | 2016-09-21 |
CN105722939B (zh) | 2019-12-17 |
JP6119874B2 (ja) | 2017-04-26 |
US9796892B2 (en) | 2017-10-24 |
EP3070137B1 (en) | 2023-12-27 |
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KR102045519B1 (ko) | 2019-11-18 |
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