JP2017088853A - 分枝状ポリオルガノシロキサン並びに関連する硬化性組成物、方法、使用及びデバイス - Google Patents
分枝状ポリオルガノシロキサン並びに関連する硬化性組成物、方法、使用及びデバイス Download PDFInfo
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- JP2017088853A JP2017088853A JP2016156331A JP2016156331A JP2017088853A JP 2017088853 A JP2017088853 A JP 2017088853A JP 2016156331 A JP2016156331 A JP 2016156331A JP 2016156331 A JP2016156331 A JP 2016156331A JP 2017088853 A JP2017088853 A JP 2017088853A
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- curable
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- branched polyorganosiloxane
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- CERQOIWHTDAKMF-UHFFFAOYSA-M methacrylate group Chemical group C(C(=C)C)(=O)[O-] CERQOIWHTDAKMF-UHFFFAOYSA-M 0.000 claims description 44
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- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
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- C08G77/08—Preparatory processes characterised by the catalysts used
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- C08G77/12—Polysiloxanes containing silicon bound to hydrogen
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- C08G77/20—Polysiloxanes containing silicon bound to unsaturated aliphatic groups
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- C08G2261/10—Definition of the polymer structure
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Abstract
Description
本発明は、分枝状ポリオルガノシロキサン;(I)平均で1分子当たり2個を超えるラジカル硬化性基を有する分枝状ポリオルガノシロキサンと(II)ラジカル開始剤とを含む硬化性シリコーン組成物;上記硬化性シリコーン組成物を硬化することで調製される硬化生成物;上記分枝状ポリオルガノシロキサン、硬化性シリコーン組成物及び硬化生成物の製造方法;これらの材料の使用方法;上記分枝状ポリオルガノシロキサン、硬化性シリコーン組成物、及び/又は硬化生成物を含むデバイス;並びに、その使用方法及び使用を開示する。
(SiO4/2)m(R1SiO3/2)n(R1 2SiO2/2)o(R2R1SiO2/2)p(R2R1 2SiO1/2)q(R1 3SiO1/2)r(R3)sのラジカル硬化性分枝状ポリオルガノシロキサンであり、式中、各R1は独立して、脂肪族不飽和を含まない一価の有機基であり;各R2は、独立して、ラジカル硬化性基であり、各R3は、独立して、2〜12個の炭素原子を有する二価炭化水素であり、下付き文字mは0〜20であり、下付き文字nは0〜20であり、ただし、下付き文字の和m+nは1〜20であり、下付き文字oは50〜1000であり、下付き文字pは0〜100であり、下付き文字qは0〜42であり、ただし、下付き文字の和p+qは2を超え、下付き文字rは0〜42であり、ただし、下付き文字の和q+r=n+2m+2であり、下付き文字sは2を超え100未満である。ラジカル硬化性分枝状ポリオルガノシロキサン(I)は、平均で、1分子当たり少なくとも2個のラジカル硬化性基(例えば、R2)を有する。式(I)の繰返し単位は、従来のポリオルガノシロキサンのQ、T、D及びM単位及び上記ラジカル硬化性分枝状ポリオルガノシロキサン(I)の製造に使用されるヒドロシリル化反応によって形成される内部リンカー(R3)である。下付き文字m、n、o、p、q、r、及びsは、独立して、本明細書の定義による有利数又は無理数であり、ラジカル硬化性分枝状ポリオルガノシロキサン(I)内でのそれぞれの繰返し単位の平均モル分率を表す。下付き文字mは、独立して、式SiO4/2のQ単位の平均モル分率である。下付き文字nは、独立して、式R1SiO3/2のT型単位の平均モル分率である。下付き文字oは、独立して、式R1 2SiO2/2の第1のD型単位の平均モル分率である。下付き文字pは、独立して、式R2R1SiO2/2の第2のD型単位の平均モル分率である。下付き文字qは、独立して、式R2R1 2SiO1/2の第1のM型繰返し単位の平均モル分率である。下付き文字rは、独立して、式R1 3SiO1/2の第2のM型繰返し単位の平均モル分率である。下付き文字sは、独立して、式R3のアルキレンリンカーの平均モル分率であり、これは上記のT型、D型、又はM型繰返し単位のうち2つに共有結合する。上記式(I)の繰返し単位(下付き文字m、n、o、p、q、及びrで修飾された単位)並びにリンカー(R3)は、便宜上示したものであり、この式は、式(I)に包含される所与の巨大分子がその中に繰返し単位の任意の特定の配列を有することを要求又は表示するものではない。
(SiO4/2)mm(R1SiO3/2)nn(R1 2SiO)oo(R2R1SiO)pp(R2R1 2SiO1/2)qq(R1 3SiO1/2)rr(R3)ssによって表すことができ、式中、各R1は、独立して、脂肪族不飽和を含まない一価の有機基であり、各R2は、独立して、構成要素(I)に関する上記定義によるラジカル硬化性基であり、各R3は、独立して、2〜12個の炭素原子を有する二価炭化水素であり、下付き文字mmは0〜5であり、下付き文字nnは0〜5であり、ただし、下付き文字の和mm+nnは0〜5であり、下付き文字ooは0〜400であり、下付き文字ppは0〜10であり、下付き文字qqは0〜10であり、ただし、下付き文字の和pp+qqは1以上の値を有し、下付き文字rrは0〜10であり、ただし、下付き文字の和qq+rr=nn+2mm+2であり、下付き文字ssは1〜20の値を有する。R1及びR2のそれぞれは、独立して、上記定義のとおりであってよい。いくつかの態様において、シリコーン反応性希釈剤(III)は、後で実施例に記載するDil1、Dil2、及びDil3のいずれか1つである。
実施例
Claims (16)
- 式:
(SiO4/2)m(R1SiO3/2)n(R1 2SiO2/2)o(R2R1SiO2/2)p(R2R1 2SiO1/2)q(R1 3SiO1/2)r(R3)sのラジカル硬化性分枝状ポリオルガノシロキサンであって、
式中、
各R1は、独立して、脂肪族不飽和を含まない一価の有機基であり、
各R2は、独立して、ラジカル硬化性基であり、
各R3は、独立して、2〜12個の炭素原子を有するアルキレンであり、
下付き文字mは0〜20であり、
下付き文字nは0〜20であり、
ただし、下付き文字の和m+nは1〜20であり、
下付き文字oは50〜1000であり、
下付き文字pは0〜100であり、
下付き文字qは0〜42であり、
ただし、下付き文字の和p+qは2を超え、かつ
下付き文字rは0〜42であり、
ただし、下付き文字の和q+r=n+2m+2であり、
下付き文字sは2を超え100未満であり、
かつ、
前記分枝状ポリオルガノシロキサンは、平均で、1分子当たり少なくとも2個のラジカル硬化性基(例えば、R2)を有する、ラジカル硬化性分枝状ポリオルガノシロキサン。 - 各ラジカル硬化性基は、独立して、アクリレート基、メタクリレート基、又はこれらの組合せを含有する一価の有機基である、請求項1に記載の分枝状ポリオルガノシロキサン。
- (a)平均で、1分子当たり2個を超えるケイ素結合水素原子を有する分枝状ポリオルガノシロキサンと、
(b)1分子当たり、少なくとも1個の脂肪族不飽和有機基並びにアクリレート基及びメタクリレート基から選択される1個以上のラジカル硬化性基を有する反応種と、を含む構成要素の
(c)ヒドロシリル化触媒の存在下での反応の反応生成物である、請求項1に記載の分枝状ポリオルガノシロキサン。 - (a’)平均で、1分子当たり2個を超える脂肪族不飽和基を有する分枝状ポリオルガノシロキサンと、
(b’)1分子当たり、少なくとも1個のケイ素結合水素並びにアクリレート基及びメタクリレート基から選択される1個以上のラジカル硬化性基を有する反応種と、を含む構成要素の、
(c)ヒドロシリル化触媒の存在下での反応の反応生成物である、請求項1に記載の分枝状ポリオルガノシロキサン。 - 請求項1〜4のいずれか一項に記載の分枝状ポリオルガノシロキサンであって、
式中、下付き文字nは0であり、下付き文字pは0であり、前記分枝状ポリオルガノシロキサン(I)は、式(SiO4/2)m(R1 2SiO2/2)o(R2R1 2SiO1/2)q(R1 3SiO1/2)r(R3)sであり、式中、下付き文字mは1〜20であり、R1、R2、R3、並びに下付き文字o、q、r、及びsは上記の定義のとおりである、又は、
式中、下付き文字mは0であり、下付き文字pは0であり、下付き文字rは0であり、前記分枝状ポリオルガノシロキサン(I)は、式(R1SiO3/2)n(R1 2SiO2/2)o(R2R1 2SiO1/2)q(R3)sであり、式中、下付き文字nは1〜20であり、R1、R2、R3、並びに下付き文字o、q、及びsは上記の定義のとおりである、又は、
式中、下付き文字mは>0であり、下付き文字nは>0であり、前記分枝状ポリオルガノシロキサンは、式
(SiO4/2)m(R1SiO3/2)n(R1 2SiO2/2)o(R2R1SiO2/2)p(R2R1 2SiO1/2)q(R1 3SiO1/2)r(R3)sであり、
式中、下付き文字mは>0〜<20であり、下付き文字nは>0〜<20であり、ただし、下付き文字の和m+nは1〜20であり、R1、R2、R3、並びに下付き文字o、p、q、r、及びsは上記の定義による、分枝状ポリオルガノシロキサン。 - 硬化性シリコーン組成物であって、
(I)式:
(SiO4/2)m(R1SiO3/2)n(R1 2SiO2/2)o(R2R1SiO2/2)p(R2R1 2SiO1/2)q(R1 3SiO1/2)r(R3)sのラジカル硬化性分枝状ポリオルガノシロキサン
(式中、
各R1は、独立して、脂肪族不飽和を含まない一価の有機基であり、
各R2は、独立して、ラジカル硬化性基であり、
各R3は、独立して、2〜12個の炭素原子を有するアルキレンであり、
下付き文字mは0〜20であり、
下付き文字nは0〜20であり、
ただし、下付き文字の和m+nは1〜20であり、
下付き文字oは50〜1000であり、
下付き文字pは0〜100であり、
下付き文字qは0〜42であり、
ただし、下付き文字の和p+qは2を超え、と、
下付き文字rは0〜42であり、
ただし、下付き文字の和q+r=n+2m+2であり、
下付き文字sは、2を超え100未満であり、
前記ラジカル硬化性分枝状ポリオルガノシロキサン(I)は、平均で、1分子当たり少なくとも2個のラジカル硬化性基を有する)及び
(II)ラジカル開始剤を含む、硬化性シリコーン組成物。 - R2が、アクリレート基、メタクリレート基、又はこれらの組合せを含有する一価の有機基である、請求項6に記載の硬化性シリコーン組成物。
- 前記ラジカル硬化性分枝状ポリオルガノシロキサン(I)が、
(a)平均で、1分子当たり2個を超えるケイ素結合水素原子を有する分枝状ポリオルガノシロキサンと、
(b)1分子当たり、少なくとも1個の脂肪族不飽和有機基並びにアクリレート基及びメタクリレート基から選択される1個以上のラジカル硬化性基を有する反応種と、を含む構成要素の
(c)ヒドロシリル化触媒の存在下での反応の反応生成物を含む、請求項6に記載の硬化性シリコーン組成物。 - 構成要素(a)が、
(a1)平均で、1分子当たり2個を超える脂肪族不飽和基を有する分枝状ポリオルガノシロキサンと、
(a2)2個のケイ素結合水素原子を有するポリオルガノシロキサンと、を含む構成要素の
(c)ヒドロシリル化触媒の存在下での反応の反応生成物を含む、又は
構成要素(a)が、
(a1)平均で、1分子当たり2個を超える脂肪族不飽和基を有する分枝状ポリオルガノシロキサンと、
(a2)2個のケイ素結合水素原子を有するポリオルガノシロキサンと、を含む構成要素の
(c)ヒドロシリル化触媒の存在下での反応の反応生成物を含む、請求項8に記載の硬化性シリコーン組成物。 - 前記ラジカル硬化性分枝状ポリオルガノシロキサン(I)が、
(a’)平均で、1分子当たり2個を超える脂肪族不飽和基を有する分枝状ポリオルガノシロキサンと、
(b’)1分子当たり、少なくとも1個のケイ素結合水素並びにアクリレート基及びメタクリレート基から選択される1個以上のラジカル硬化性基を有する反応種と、を含む構成要素の、
(c)ヒドロシリル化触媒の存在下での反応の反応生成物を含む、請求項6に記載の硬化性シリコーン組成物。 - 請求項6〜10のいずれか一項に記載の硬化性シリコーン組成物であって、
(III)式:
(SiO4/2)mm(R1SiO3/2)nn(R1 2SiO2/2)oo(R2R1SiO2/2)pp(R2R1 2SiO1/2)qq(R1 3SiO1/2)rr(R3)ssのシリコーン反応性希釈剤
(式中、
各R1は、独立して、脂肪族不飽和を含まない一価の有機基であり、
各R2は、独立して、構成要素(I)に関する上記定義によるラジカル硬化性基であり、
各R3は、独立して、2〜12個の炭素原子を有する二価炭化水素であり、
下付き文字mmは0〜5であり、
下付き文字nnは0〜5であり、
ただし、下付き文字の和(mm+nn)は0〜5であり、
下付き文字ooは0〜400であり、
下付き文字ppは0〜10であり、
下付き文字qqは0〜10であり、
ただし、下付き文字の和(pp+qq)は1以上であり、
下付き文字rrは0〜10であり、
ただし、下付き文字の和qq+rr=nn+2mm+2であり、
下付き文字ssは1〜20である)又は
(IV)充填剤、又は
(V)充填剤処理剤、又は
(IV)充填剤及び(V)充填剤処理剤、又は
(VI)湿気硬化開始剤及び(VII)架橋剤を更に含む、硬化性シリコーン組成物。 - 硬化物品を形成する方法であって、請求項6に記載の硬化性シリコーン組成物を基材に塗布する工程、及び基材上に塗布した硬化性シリコーン組成物を硬化する工程、を含む方法。
- 請求項6〜11のいずれか一項に記載の硬化性シリコーン組成物の硬化の硬化生成物。
- 電子デバイスであって、請求項6〜11のいずれか一項に記載の硬化性シリコーン組成物又は請求項13に記載の硬化生成物及び前記デバイスと作用的に接触する少なくとも1つのその他のデバイスコンポーネントを含む、電子デバイス。
- 基材及びその上の作用的接触を封止して配置されたシーラント、又は第1及び第2の基材並びにその間に接着作用で接触して配置された接着剤を含むアセンブリ、を含む製造物品であって、前記シーラント又は前記接着剤が請求項6〜11のいずれか一項に記載の硬化性シリコーン組成物又は請求項13に記載の硬化生成物を含む、製造物品。
- 熱伝導性部材及び該熱伝導性部材と熱的連通する少なくとも1つのその他のコンポーネントを含むデバイスであって、前記熱伝導部材が請求項6〜11のいずれか一項に記載の硬化性シリコーン組成物又は請求項13に記載の硬化生成物を含む、デバイス。
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CN107698766B (zh) | 2021-02-23 |
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JP6935993B2 (ja) | 2021-09-15 |
EP3196229B1 (en) | 2018-09-26 |
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US20170130108A1 (en) | 2017-05-11 |
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