JP2016074040A5 - - Google Patents

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Publication number
JP2016074040A5
JP2016074040A5 JP2015250885A JP2015250885A JP2016074040A5 JP 2016074040 A5 JP2016074040 A5 JP 2016074040A5 JP 2015250885 A JP2015250885 A JP 2015250885A JP 2015250885 A JP2015250885 A JP 2015250885A JP 2016074040 A5 JP2016074040 A5 JP 2016074040A5
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JP
Japan
Prior art keywords
workpiece
alignment
already known
laser beam
processing
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Granted
Application number
JP2015250885A
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English (en)
Japanese (ja)
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JP2016074040A (ja
JP6147325B2 (ja
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Publication date
Priority claimed from US11/417,269 external-priority patent/US7834293B2/en
Application filed filed Critical
Publication of JP2016074040A publication Critical patent/JP2016074040A/ja
Publication of JP2016074040A5 publication Critical patent/JP2016074040A5/ja
Application granted granted Critical
Publication of JP6147325B2 publication Critical patent/JP6147325B2/ja
Expired - Fee Related legal-status Critical Current
Anticipated expiration legal-status Critical

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JP2015250885A 2006-05-02 2015-12-24 レーザ加工のための方法および装置 Expired - Fee Related JP6147325B2 (ja)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US11/417,269 US7834293B2 (en) 2006-05-02 2006-05-02 Method and apparatus for laser processing
US11/417,269 2006-05-02

Related Parent Applications (1)

Application Number Title Priority Date Filing Date
JP2013024399A Division JP2013126691A (ja) 2006-05-02 2013-02-12 レーザ加工のための方法および装置

Publications (3)

Publication Number Publication Date
JP2016074040A JP2016074040A (ja) 2016-05-12
JP2016074040A5 true JP2016074040A5 (https=) 2017-03-16
JP6147325B2 JP6147325B2 (ja) 2017-06-14

Family

ID=38660278

Family Applications (3)

Application Number Title Priority Date Filing Date
JP2009510034A Pending JP2009535222A (ja) 2006-05-02 2007-05-01 レーザ加工のための方法および装置
JP2013024399A Pending JP2013126691A (ja) 2006-05-02 2013-02-12 レーザ加工のための方法および装置
JP2015250885A Expired - Fee Related JP6147325B2 (ja) 2006-05-02 2015-12-24 レーザ加工のための方法および装置

Family Applications Before (2)

Application Number Title Priority Date Filing Date
JP2009510034A Pending JP2009535222A (ja) 2006-05-02 2007-05-01 レーザ加工のための方法および装置
JP2013024399A Pending JP2013126691A (ja) 2006-05-02 2013-02-12 レーザ加工のための方法および装置

Country Status (8)

Country Link
US (1) US7834293B2 (https=)
JP (3) JP2009535222A (https=)
KR (2) KR20140146666A (https=)
CN (1) CN101432857B (https=)
DE (1) DE112007001065T5 (https=)
GB (1) GB2451782A (https=)
TW (1) TWI386266B (https=)
WO (1) WO2007130986A1 (https=)

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KR20250039487A (ko) 2018-06-05 2025-03-20 일렉트로 싸이언티픽 인더스트리이즈 인코포레이티드 레이저 가공 장치, 그 작동 방법 및 이를 사용한 작업물 가공 방법
DE102018119313B4 (de) * 2018-08-08 2023-03-30 Rogers Germany Gmbh Verfahren zum Bearbeiten eines Metall-Keramik-Substrats und Anlage zum Durchführen des Verfahrens
KR102122778B1 (ko) * 2018-10-10 2020-06-15 (주)성현 테크놀로지 레이저 및 드릴을 이용한 미세 홀 가공방법
TWI843784B (zh) 2019-01-31 2024-06-01 美商伊雷克托科學工業股份有限公司 雷射加工設備、與設備一起使用的控制器及非暫時性電腦可讀取媒體
WO2020251782A1 (en) 2019-06-10 2020-12-17 Electro Scientific Industries, Inc. Laser processing apparatus, methods of operating the same, and methods of processing workpieces using the same
CN110899998A (zh) * 2019-11-29 2020-03-24 上海精测半导体技术有限公司 一种激光切割设备以及校准方法
KR102429862B1 (ko) * 2019-12-12 2022-08-05 두원포토닉스 주식회사 이종파장의 레이저 빔을 이용한 레이저 가공 장치 및 그 방법
JP7575971B2 (ja) * 2021-03-09 2024-10-30 Ｊｓｗアクティナシステム株式会社 レーザ照射装置、レーザ照射方法、及び有機ｅｌディスプレイの製造方法
CN113618262B (zh) * 2021-10-12 2021-12-14 江油星联电子科技有限公司 一种铝基印制电路板用开料装置
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