JP2015522686A5 - - Google Patents
Download PDFInfo
- Publication number
- JP2015522686A5 JP2015522686A5 JP2015520242A JP2015520242A JP2015522686A5 JP 2015522686 A5 JP2015522686 A5 JP 2015522686A5 JP 2015520242 A JP2015520242 A JP 2015520242A JP 2015520242 A JP2015520242 A JP 2015520242A JP 2015522686 A5 JP2015522686 A5 JP 2015522686A5
- Authority
- JP
- Japan
- Prior art keywords
- composition
- component
- thermosetting resin
- block
- copolymer
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 claims 10
- 239000000203 mixture Substances 0.000 claims 9
- 229920001187 thermosetting polymer Polymers 0.000 claims 7
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 claims 5
- 229920001400 block copolymer Polymers 0.000 claims 5
- 239000000945 filler Substances 0.000 claims 5
- 229910052710 silicon Inorganic materials 0.000 claims 5
- 239000010703 silicon Substances 0.000 claims 5
- 239000000377 silicon dioxide Substances 0.000 claims 5
- 229920003229 poly(methyl methacrylate) Polymers 0.000 claims 4
- 239000004926 polymethyl methacrylate Substances 0.000 claims 4
- 239000011347 resin Substances 0.000 claims 4
- 229920005989 resin Polymers 0.000 claims 4
- 239000011342 resin composition Substances 0.000 claims 4
- 239000004593 Epoxy Substances 0.000 claims 3
- 239000007788 liquid Substances 0.000 claims 3
- ISWSIDIOOBJBQZ-UHFFFAOYSA-N Phenol Chemical compound OC1=CC=CC=C1 ISWSIDIOOBJBQZ-UHFFFAOYSA-N 0.000 claims 2
- 239000005062 Polybutadiene Substances 0.000 claims 2
- 239000004793 Polystyrene Substances 0.000 claims 2
- IISBACLAFKSPIT-UHFFFAOYSA-N bisphenol A Chemical compound C=1C=C(O)C=CC=1C(C)(C)C1=CC=C(O)C=C1 IISBACLAFKSPIT-UHFFFAOYSA-N 0.000 claims 2
- PXKLMJQFEQBVLD-UHFFFAOYSA-N bisphenol F Chemical compound C1=CC(O)=CC=C1CC1=CC=C(O)C=C1 PXKLMJQFEQBVLD-UHFFFAOYSA-N 0.000 claims 2
- 239000003054 catalyst Substances 0.000 claims 2
- 238000000748 compression moulding Methods 0.000 claims 2
- 229920001577 copolymer Polymers 0.000 claims 2
- 239000004643 cyanate ester Substances 0.000 claims 2
- ZUOUZKKEUPVFJK-UHFFFAOYSA-N diphenyl Chemical compound C1=CC=CC=C1C1=CC=CC=C1 ZUOUZKKEUPVFJK-UHFFFAOYSA-N 0.000 claims 2
- 239000003822 epoxy resin Substances 0.000 claims 2
- 239000011159 matrix material Substances 0.000 claims 2
- 238000000034 method Methods 0.000 claims 2
- 238000000465 moulding Methods 0.000 claims 2
- 229920003986 novolac Polymers 0.000 claims 2
- 229920002857 polybutadiene Polymers 0.000 claims 2
- 229920000647 polyepoxide Polymers 0.000 claims 2
- 229920002223 polystyrene Polymers 0.000 claims 2
- 150000003553 thiiranes Chemical class 0.000 claims 2
- HCNHNBLSNVSJTJ-UHFFFAOYSA-N 1,1-Bis(4-hydroxyphenyl)ethane Chemical compound C=1C=C(O)C=CC=1C(C)C1=CC=C(O)C=C1 HCNHNBLSNVSJTJ-UHFFFAOYSA-N 0.000 claims 1
- 150000003923 2,5-pyrrolediones Chemical class 0.000 claims 1
- IMSODMZESSGVBE-UHFFFAOYSA-N 2-Oxazoline Chemical compound C1CN=CO1 IMSODMZESSGVBE-UHFFFAOYSA-N 0.000 claims 1
- BCHZICNRHXRCHY-UHFFFAOYSA-N 2h-oxazine Chemical compound N1OC=CC=C1 BCHZICNRHXRCHY-UHFFFAOYSA-N 0.000 claims 1
- FKAWETHEYBZGSR-UHFFFAOYSA-N 3-methylidenepyrrolidine-2,5-dione Chemical compound C=C1CC(=O)NC1=O FKAWETHEYBZGSR-UHFFFAOYSA-N 0.000 claims 1
- VPWNQTHUCYMVMZ-UHFFFAOYSA-N 4,4'-sulfonyldiphenol Chemical compound C1=CC(O)=CC=C1S(=O)(=O)C1=CC=C(O)C=C1 VPWNQTHUCYMVMZ-UHFFFAOYSA-N 0.000 claims 1
- PEEHTFAAVSWFBL-UHFFFAOYSA-N Maleimide Chemical compound O=C1NC(=O)C=C1 PEEHTFAAVSWFBL-UHFFFAOYSA-N 0.000 claims 1
- 125000002723 alicyclic group Chemical group 0.000 claims 1
- 235000010290 biphenyl Nutrition 0.000 claims 1
- 239000004305 biphenyl Substances 0.000 claims 1
- 239000003795 chemical substances by application Substances 0.000 claims 1
- 230000006835 compression Effects 0.000 claims 1
- 238000007906 compression Methods 0.000 claims 1
- 238000001816 cooling Methods 0.000 claims 1
- 150000001913 cyanates Chemical class 0.000 claims 1
- 239000003085 diluting agent Substances 0.000 claims 1
- 150000004893 oxazines Chemical class 0.000 claims 1
- 150000002918 oxazolines Chemical class 0.000 claims 1
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US201261668643P | 2012-07-06 | 2012-07-06 | |
| US61/668,643 | 2012-07-06 | ||
| PCT/US2013/045176 WO2014007950A1 (en) | 2012-07-06 | 2013-06-11 | Liquid compression molding encapsulants |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| JP2015522686A JP2015522686A (ja) | 2015-08-06 |
| JP2015522686A5 true JP2015522686A5 (enExample) | 2016-07-28 |
| JP6195921B2 JP6195921B2 (ja) | 2017-09-13 |
Family
ID=49877917
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2015520242A Active JP6195921B2 (ja) | 2012-07-06 | 2013-06-11 | 液体圧縮成型封止材料 |
Country Status (5)
| Country | Link |
|---|---|
| US (1) | US9263360B2 (enExample) |
| JP (1) | JP6195921B2 (enExample) |
| KR (1) | KR101979482B1 (enExample) |
| TW (1) | TWI545154B (enExample) |
| WO (1) | WO2014007950A1 (enExample) |
Families Citing this family (13)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2014091744A (ja) * | 2012-10-31 | 2014-05-19 | 3M Innovative Properties Co | アンダーフィル組成物、半導体装置およびその製造方法 |
| US9245815B2 (en) * | 2014-04-29 | 2016-01-26 | Intel Corporation | Underfill material including block copolymer to tune coefficient of thermal expansion and tensile modulus |
| JP6274092B2 (ja) * | 2014-12-03 | 2018-02-07 | 信越化学工業株式会社 | 光半導体素子封止用熱硬化性エポキシ樹脂組成物及びそれを用いた光半導体装置 |
| JP7454906B2 (ja) * | 2016-10-14 | 2024-03-25 | 株式会社レゾナック | アンダーフィル材、電子部品装置及び電子部品装置の製造方法 |
| JP7031206B2 (ja) * | 2017-10-02 | 2022-03-08 | 味の素株式会社 | 樹脂組成物 |
| KR102710152B1 (ko) * | 2018-06-15 | 2024-09-25 | 린텍 가부시키가이샤 | 봉지제 조성물, 봉지 시트 및 봉지체 |
| TWI847997B (zh) * | 2018-08-17 | 2024-07-11 | 德商漢高股份有限及兩合公司 | 液體壓縮成型或封裝組合物 |
| TWI700330B (zh) * | 2018-11-09 | 2020-08-01 | 台光電子材料股份有限公司 | 樹脂組合物及由其製成之物品 |
| CA3183897C (en) | 2020-06-24 | 2023-09-05 | Arxada Ag | Compositions comprising cyanate ester resins and substituted bisimides |
| IL312591B2 (en) | 2021-12-14 | 2025-10-01 | Arxada Ag | Preparations with improved properties |
| WO2025203722A1 (ja) * | 2024-03-26 | 2025-10-02 | ナミックス株式会社 | 液状コンプレッションモールド材、電子部品、半導体装置および電子部品の製造方法 |
| JP7606797B1 (ja) * | 2024-03-26 | 2024-12-26 | ナミックス株式会社 | 液状コンプレッションモールド材、電子部品、半導体装置および電子部品の製造方法 |
| CN118213328A (zh) * | 2024-05-15 | 2024-06-18 | 荣耀终端有限公司 | 晶圆级封装结构、封装方法、芯片制品及电子设备 |
Family Cites Families (34)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US4528366A (en) | 1982-09-28 | 1985-07-09 | The Dow Chemical Company | Production of polytriazines from aromatic polycyanates with cobalt salt of a carboxylic acid as catalyst |
| US4477629A (en) | 1983-07-27 | 1984-10-16 | The Dow Chemical Company | Cyanate-containing polymers |
| US4902732A (en) * | 1985-09-30 | 1990-02-20 | Shin-Etsu Chemical Co., Ltd. | Epoxy resin-based curable compositions |
| US5041254A (en) | 1988-10-17 | 1991-08-20 | Dexter Corporation | Method of encapsulating a semiconductor device with a flame retardant epoxy molding compound |
| US5037898A (en) | 1990-02-27 | 1991-08-06 | Shell Oil Company | Polysiloxane-polylactone block copolymer modified thermostat compositions |
| KR950011902B1 (ko) * | 1990-04-04 | 1995-10-12 | 도오레 가부시끼가이샤 | 반도체 장치 캡슐 봉입 에폭시 수지 조성물 |
| JPH10176036A (ja) | 1996-12-19 | 1998-06-30 | Shin Etsu Chem Co Ltd | エポキシ樹脂組成物及び半導体装置 |
| KR100502222B1 (ko) * | 1999-01-29 | 2005-07-18 | 마츠시타 덴끼 산교 가부시키가이샤 | 전자부품의 실장방법 및 그 장치 |
| JP2000273289A (ja) * | 1999-03-23 | 2000-10-03 | Sumitomo Bakelite Co Ltd | エポキシ樹脂組成物、タブレット及び半導体装置 |
| JP4438973B2 (ja) | 2000-05-23 | 2010-03-24 | アムコア テクノロジー，インコーポレイテッド | シート状樹脂組成物及びそれを用いた半導体装置の製造方法 |
| FR2809741B1 (fr) | 2000-05-31 | 2002-08-16 | Atofina | Materiaux thermodurs a tenue au choc amelioree |
| JP2002194062A (ja) * | 2000-12-26 | 2002-07-10 | Toshiba Chem Corp | エポキシ樹脂組成物および半導体装置 |
| JP4633249B2 (ja) * | 2000-12-26 | 2011-02-16 | 京セラケミカル株式会社 | 半導体封止用エポキシ樹脂組成物および半導体装置 |
| US6887574B2 (en) | 2003-06-06 | 2005-05-03 | Dow Global Technologies Inc. | Curable flame retardant epoxy compositions |
| RU2006138618A (ru) | 2004-04-02 | 2008-05-10 | Дау Глобал Текнолоджиз Инк. (Us) | Модифицированные амфифильным блок-сополимером термоотверждающиеся смолы с повышенной ударной вязкостью |
| US7820760B2 (en) * | 2004-11-10 | 2010-10-26 | Dow Global Technologies Inc. | Amphiphilic block copolymer-modified epoxy resins and adhesives made therefrom |
| CA2582415A1 (en) * | 2004-11-10 | 2006-05-18 | Dow Global Technologies Inc. | Amphiphilic block copolymer-toughened epoxy resins and ambient cure high-solids coatings made therefrom |
| JP4379387B2 (ja) * | 2005-06-27 | 2009-12-09 | パナソニック電工株式会社 | エポキシ樹脂無機複合シート及び成形品 |
| JP2009521562A (ja) * | 2005-12-22 | 2009-06-04 | ダウ グローバル テクノロジーズ インコーポレイティド | 混合触媒系を含む硬化性エポキシ樹脂組成物およびそれから作られた積層体 |
| US7745535B2 (en) * | 2006-07-21 | 2010-06-29 | Arkema Inc. | Amphiphilic block copolymers |
| KR101546983B1 (ko) | 2007-08-02 | 2015-08-24 | 다우 글로벌 테크놀로지스 엘엘씨 | 열경화성 중합체의 성능을 개선시키기 위한 양친매성 블록 공중합체 및 무기 나노충진제 |
| TWI339865B (en) * | 2007-08-17 | 2011-04-01 | Chipmos Technologies Inc | A dice rearrangement package method |
| JP4989402B2 (ja) * | 2007-10-04 | 2012-08-01 | 日東電工株式会社 | 中空型デバイス封止用樹脂組成物シートおよびそれを用いて封止した中空型デバイス |
| JP5083070B2 (ja) * | 2007-11-19 | 2012-11-28 | 日立化成工業株式会社 | 封止用フィルム |
| CN101784614A (zh) * | 2008-01-31 | 2010-07-21 | 积水化学工业株式会社 | 树脂组合物及使用其的层叠树脂薄膜 |
| CN101952365B (zh) * | 2008-02-15 | 2013-07-31 | 可乐丽股份有限公司 | 固化性树脂组合物及树脂固化物 |
| EP2303953A1 (en) | 2008-07-17 | 2011-04-06 | Dow Global Technologies Inc. | Structural composites with improved toughness |
| EP2161274B1 (de) * | 2008-08-27 | 2010-05-19 | Sika Technology AG | Silan-/Harnstoff-Verbindung als hitzeaktivierbarer Härter für Epoxidharzzusammensetzungen |
| US8647963B2 (en) * | 2009-07-08 | 2014-02-11 | Taiwan Semiconductor Manufacturing Company, Ltd. | Structure and method of wafer level chip molded packaging |
| KR20130026519A (ko) * | 2010-03-31 | 2013-03-13 | 다우 글로벌 테크놀로지스 엘엘씨 | 경화성 조성물 |
| JP2012017422A (ja) * | 2010-07-08 | 2012-01-26 | Nitto Denko Corp | 熱硬化性樹脂組成物硬化体の製法およびそれにより得られた硬化物 |
| JP2013256547A (ja) * | 2010-10-05 | 2013-12-26 | Sumitomo Bakelite Co Ltd | 液状封止樹脂組成物および半導体パッケージ |
| JP6026095B2 (ja) * | 2011-10-31 | 2016-11-16 | 太陽インキ製造株式会社 | 熱硬化性樹脂組成物及びその硬化物、並びにそれを用いたプリント配線板 |
| JP5930704B2 (ja) * | 2011-12-22 | 2016-06-08 | 太陽インキ製造株式会社 | プリント配線板の製造方法、プリント配線板およびフリップチップ実装基板 |
-
2013
- 2013-03-14 US US13/803,051 patent/US9263360B2/en active Active
- 2013-06-11 JP JP2015520242A patent/JP6195921B2/ja active Active
- 2013-06-11 WO PCT/US2013/045176 patent/WO2014007950A1/en not_active Ceased
- 2013-06-11 KR KR1020157000002A patent/KR101979482B1/ko active Active
- 2013-06-21 TW TW102122264A patent/TWI545154B/zh active