JP6195921B2 - 液体圧縮成型封止材料 - Google Patents

液体圧縮成型封止材料 Download PDF

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Publication number
JP6195921B2
JP6195921B2 JP2015520242A JP2015520242A JP6195921B2 JP 6195921 B2 JP6195921 B2 JP 6195921B2 JP 2015520242 A JP2015520242 A JP 2015520242A JP 2015520242 A JP2015520242 A JP 2015520242A JP 6195921 B2 JP6195921 B2 JP 6195921B2
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composition
epoxy
thermosetting resin
bisphenol
component
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Japanese (ja)
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JP2015522686A (ja
JP2015522686A5 (enExample
Inventor
ジエ バイ、
ジエ バイ、
Original Assignee
ヘンケル アイピー アンド ホールディング ゲゼルシャフト ミット ベシュレンクテル ハフツング
ヘンケル アイピー アンド ホールディング ゲゼルシャフト ミット ベシュレンクテル ハフツング
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    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L63/00—Compositions of epoxy resins; Compositions of derivatives of epoxy resins
    • C08L63/04—Epoxynovolacs
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/40—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the curing agents used
    • C08G59/42—Polycarboxylic acids; Anhydrides, halides or low molecular weight esters thereof
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/01—Use of inorganic substances as compounding ingredients characterized by their specific function
    • C08K3/013—Fillers, pigments or reinforcing additives
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/34—Silicon-containing compounds
    • C08K3/36—Silica
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L53/00—Compositions of block copolymers containing at least one sequence of a polymer obtained by reactions only involving carbon-to-carbon unsaturated bonds; Compositions of derivatives of such polymers
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L63/00—Compositions of epoxy resins; Compositions of derivatives of epoxy resins
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
    • H01L23/29—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the material, e.g. carbon
    • H01L23/293—Organic, e.g. plastic
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/562—Protection against mechanical damage
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

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  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Health & Medical Sciences (AREA)
  • Power Engineering (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
  • Wire Bonding (AREA)
  • Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
  • Epoxy Resins (AREA)
  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
JP2015520242A 2012-07-06 2013-06-11 液体圧縮成型封止材料 Active JP6195921B2 (ja)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US201261668643P 2012-07-06 2012-07-06
US61/668,643 2012-07-06
PCT/US2013/045176 WO2014007950A1 (en) 2012-07-06 2013-06-11 Liquid compression molding encapsulants

Publications (3)

Publication Number Publication Date
JP2015522686A JP2015522686A (ja) 2015-08-06
JP2015522686A5 JP2015522686A5 (enExample) 2016-07-28
JP6195921B2 true JP6195921B2 (ja) 2017-09-13

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Family Applications (1)

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JP2015520242A Active JP6195921B2 (ja) 2012-07-06 2013-06-11 液体圧縮成型封止材料

Country Status (5)

Country Link
US (1) US9263360B2 (enExample)
JP (1) JP6195921B2 (enExample)
KR (1) KR101979482B1 (enExample)
TW (1) TWI545154B (enExample)
WO (1) WO2014007950A1 (enExample)

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JP6274092B2 (ja) * 2014-12-03 2018-02-07 信越化学工業株式会社 光半導体素子封止用熱硬化性エポキシ樹脂組成物及びそれを用いた光半導体装置
JP7454906B2 (ja) * 2016-10-14 2024-03-25 株式会社レゾナック アンダーフィル材、電子部品装置及び電子部品装置の製造方法
JP7031206B2 (ja) * 2017-10-02 2022-03-08 味の素株式会社 樹脂組成物
KR102710152B1 (ko) * 2018-06-15 2024-09-25 린텍 가부시키가이샤 봉지제 조성물, 봉지 시트 및 봉지체
TWI847997B (zh) * 2018-08-17 2024-07-11 德商漢高股份有限及兩合公司 液體壓縮成型或封裝組合物
TWI700330B (zh) * 2018-11-09 2020-08-01 台光電子材料股份有限公司 樹脂組合物及由其製成之物品
CA3183897C (en) 2020-06-24 2023-09-05 Arxada Ag Compositions comprising cyanate ester resins and substituted bisimides
IL312591B2 (en) 2021-12-14 2025-10-01 Arxada Ag Preparations with improved properties
WO2025203722A1 (ja) * 2024-03-26 2025-10-02 ナミックス株式会社 液状コンプレッションモールド材、電子部品、半導体装置および電子部品の製造方法
JP7606797B1 (ja) * 2024-03-26 2024-12-26 ナミックス株式会社 液状コンプレッションモールド材、電子部品、半導体装置および電子部品の製造方法
CN118213328A (zh) * 2024-05-15 2024-06-18 荣耀终端有限公司 晶圆级封装结构、封装方法、芯片制品及电子设备

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Publication number Publication date
JP2015522686A (ja) 2015-08-06
TWI545154B (zh) 2016-08-11
US9263360B2 (en) 2016-02-16
US20140008822A1 (en) 2014-01-09
KR20150035981A (ko) 2015-04-07
WO2014007950A1 (en) 2014-01-09
TW201410778A (zh) 2014-03-16
KR101979482B1 (ko) 2019-05-16

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