KR101979482B1 - 액체 압축 성형 캡슐화제 - Google Patents

액체 압축 성형 캡슐화제 Download PDF

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Publication number
KR101979482B1
KR101979482B1 KR1020157000002A KR20157000002A KR101979482B1 KR 101979482 B1 KR101979482 B1 KR 101979482B1 KR 1020157000002 A KR1020157000002 A KR 1020157000002A KR 20157000002 A KR20157000002 A KR 20157000002A KR 101979482 B1 KR101979482 B1 KR 101979482B1
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South Korea
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composition
epoxy
thermosetting resin
block
wafer
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Korean (ko)
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KR20150035981A (ko
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지 바이
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헨켈 아이피 앤드 홀딩 게엠베하
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    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L63/00—Compositions of epoxy resins; Compositions of derivatives of epoxy resins
    • C08L63/04—Epoxynovolacs
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/40—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the curing agents used
    • C08G59/42—Polycarboxylic acids; Anhydrides, halides or low molecular weight esters thereof
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/01—Use of inorganic substances as compounding ingredients characterized by their specific function
    • C08K3/013—Fillers, pigments or reinforcing additives
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/34—Silicon-containing compounds
    • C08K3/36—Silica
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L53/00—Compositions of block copolymers containing at least one sequence of a polymer obtained by reactions only involving carbon-to-carbon unsaturated bonds; Compositions of derivatives of such polymers
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L63/00—Compositions of epoxy resins; Compositions of derivatives of epoxy resins
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
    • H01L23/29—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the material, e.g. carbon
    • H01L23/293—Organic, e.g. plastic
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/562—Protection against mechanical damage
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

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  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Health & Medical Sciences (AREA)
  • Power Engineering (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
  • Epoxy Resins (AREA)
  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
  • Wire Bonding (AREA)
  • Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
KR1020157000002A 2012-07-06 2013-06-11 액체 압축 성형 캡슐화제 Active KR101979482B1 (ko)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US201261668643P 2012-07-06 2012-07-06
US61/668,643 2012-07-06
PCT/US2013/045176 WO2014007950A1 (en) 2012-07-06 2013-06-11 Liquid compression molding encapsulants

Publications (2)

Publication Number Publication Date
KR20150035981A KR20150035981A (ko) 2015-04-07
KR101979482B1 true KR101979482B1 (ko) 2019-05-16

Family

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KR1020157000002A Active KR101979482B1 (ko) 2012-07-06 2013-06-11 액체 압축 성형 캡슐화제

Country Status (5)

Country Link
US (1) US9263360B2 (enExample)
JP (1) JP6195921B2 (enExample)
KR (1) KR101979482B1 (enExample)
TW (1) TWI545154B (enExample)
WO (1) WO2014007950A1 (enExample)

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JP2014091744A (ja) * 2012-10-31 2014-05-19 3M Innovative Properties Co アンダーフィル組成物、半導体装置およびその製造方法
US9245815B2 (en) * 2014-04-29 2016-01-26 Intel Corporation Underfill material including block copolymer to tune coefficient of thermal expansion and tensile modulus
JP6274092B2 (ja) * 2014-12-03 2018-02-07 信越化学工業株式会社 光半導体素子封止用熱硬化性エポキシ樹脂組成物及びそれを用いた光半導体装置
JP7454906B2 (ja) * 2016-10-14 2024-03-25 株式会社レゾナック アンダーフィル材、電子部品装置及び電子部品装置の製造方法
JP7031206B2 (ja) * 2017-10-02 2022-03-08 味の素株式会社 樹脂組成物
WO2019240261A1 (ja) * 2018-06-15 2019-12-19 リンテック株式会社 デバイス封止用接着シート、及びデバイス封止体を製造する方法
TWI847997B (zh) 2018-08-17 2024-07-11 德商漢高股份有限及兩合公司 液體壓縮成型或封裝組合物
TWI700330B (zh) * 2018-11-09 2020-08-01 台光電子材料股份有限公司 樹脂組合物及由其製成之物品
KR102556138B1 (ko) 2020-06-24 2023-07-14 아륵사다 아게 개선된 특성을 갖는 신규의 조성물
IL312591B2 (en) 2021-12-14 2025-10-01 Arxada Ag Preparations with improved properties
JP7606797B1 (ja) * 2024-03-26 2024-12-26 ナミックス株式会社 液状コンプレッションモールド材、電子部品、半導体装置および電子部品の製造方法
WO2025203722A1 (ja) * 2024-03-26 2025-10-02 ナミックス株式会社 液状コンプレッションモールド材、電子部品、半導体装置および電子部品の製造方法
CN118213328A (zh) * 2024-05-15 2024-06-18 荣耀终端有限公司 晶圆级封装结构、封装方法、芯片制品及电子设备

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WO2012046636A1 (ja) * 2010-10-05 2012-04-12 住友ベークライト株式会社 液状封止樹脂組成物および半導体パッケージ

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WO2009018193A1 (en) * 2007-08-02 2009-02-05 Dow Global Technologies Inc. Amphiphilic block copolymers and inorganic nanofillers to enhance performance of thermosetting polymers
WO2012046636A1 (ja) * 2010-10-05 2012-04-12 住友ベークライト株式会社 液状封止樹脂組成物および半導体パッケージ

Also Published As

Publication number Publication date
TW201410778A (zh) 2014-03-16
JP2015522686A (ja) 2015-08-06
US9263360B2 (en) 2016-02-16
KR20150035981A (ko) 2015-04-07
TWI545154B (zh) 2016-08-11
US20140008822A1 (en) 2014-01-09
JP6195921B2 (ja) 2017-09-13
WO2014007950A1 (en) 2014-01-09

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