TWI545154B - 液體壓縮成形封裝劑 - Google Patents

液體壓縮成形封裝劑 Download PDF

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Publication number
TWI545154B
TWI545154B TW102122264A TW102122264A TWI545154B TW I545154 B TWI545154 B TW I545154B TW 102122264 A TW102122264 A TW 102122264A TW 102122264 A TW102122264 A TW 102122264A TW I545154 B TWI545154 B TW I545154B
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TW
Taiwan
Prior art keywords
group
composition
wafer
weight
block
Prior art date
Application number
TW102122264A
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English (en)
Chinese (zh)
Other versions
TW201410778A (zh
Inventor
白潔
Original Assignee
漢高智慧財產控股公司
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Filing date
Publication date
Application filed by 漢高智慧財產控股公司 filed Critical 漢高智慧財產控股公司
Publication of TW201410778A publication Critical patent/TW201410778A/zh
Application granted granted Critical
Publication of TWI545154B publication Critical patent/TWI545154B/zh

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Classifications

    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L63/00—Compositions of epoxy resins; Compositions of derivatives of epoxy resins
    • C08L63/04—Epoxynovolacs
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/40—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the curing agents used
    • C08G59/42—Polycarboxylic acids; Anhydrides, halides or low molecular weight esters thereof
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/01—Use of inorganic substances as compounding ingredients characterized by their specific function
    • C08K3/013—Fillers, pigments or reinforcing additives
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/34—Silicon-containing compounds
    • C08K3/36—Silica
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L53/00—Compositions of block copolymers containing at least one sequence of a polymer obtained by reactions only involving carbon-to-carbon unsaturated bonds; Compositions of derivatives of such polymers
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L63/00—Compositions of epoxy resins; Compositions of derivatives of epoxy resins
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
    • H01L23/29—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the material, e.g. carbon
    • H01L23/293—Organic, e.g. plastic
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/562—Protection against mechanical damage
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Landscapes

  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Health & Medical Sciences (AREA)
  • Power Engineering (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
  • Epoxy Resins (AREA)
  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
  • Wire Bonding (AREA)
  • Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
TW102122264A 2012-07-06 2013-06-21 液體壓縮成形封裝劑 TWI545154B (zh)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US201261668643P 2012-07-06 2012-07-06

Publications (2)

Publication Number Publication Date
TW201410778A TW201410778A (zh) 2014-03-16
TWI545154B true TWI545154B (zh) 2016-08-11

Family

ID=49877917

Family Applications (1)

Application Number Title Priority Date Filing Date
TW102122264A TWI545154B (zh) 2012-07-06 2013-06-21 液體壓縮成形封裝劑

Country Status (5)

Country Link
US (1) US9263360B2 (enExample)
JP (1) JP6195921B2 (enExample)
KR (1) KR101979482B1 (enExample)
TW (1) TWI545154B (enExample)
WO (1) WO2014007950A1 (enExample)

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US9245815B2 (en) * 2014-04-29 2016-01-26 Intel Corporation Underfill material including block copolymer to tune coefficient of thermal expansion and tensile modulus
JP6274092B2 (ja) * 2014-12-03 2018-02-07 信越化学工業株式会社 光半導体素子封止用熱硬化性エポキシ樹脂組成物及びそれを用いた光半導体装置
JP7454906B2 (ja) * 2016-10-14 2024-03-25 株式会社レゾナック アンダーフィル材、電子部品装置及び電子部品装置の製造方法
JP7031206B2 (ja) * 2017-10-02 2022-03-08 味の素株式会社 樹脂組成物
WO2019240261A1 (ja) * 2018-06-15 2019-12-19 リンテック株式会社 デバイス封止用接着シート、及びデバイス封止体を製造する方法
TWI847997B (zh) 2018-08-17 2024-07-11 德商漢高股份有限及兩合公司 液體壓縮成型或封裝組合物
TWI700330B (zh) * 2018-11-09 2020-08-01 台光電子材料股份有限公司 樹脂組合物及由其製成之物品
KR102556138B1 (ko) 2020-06-24 2023-07-14 아륵사다 아게 개선된 특성을 갖는 신규의 조성물
IL312591B2 (en) 2021-12-14 2025-10-01 Arxada Ag Preparations with improved properties
JP7606797B1 (ja) * 2024-03-26 2024-12-26 ナミックス株式会社 液状コンプレッションモールド材、電子部品、半導体装置および電子部品の製造方法
WO2025203722A1 (ja) * 2024-03-26 2025-10-02 ナミックス株式会社 液状コンプレッションモールド材、電子部品、半導体装置および電子部品の製造方法
CN118213328A (zh) * 2024-05-15 2024-06-18 荣耀终端有限公司 晶圆级封装结构、封装方法、芯片制品及电子设备

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Also Published As

Publication number Publication date
TW201410778A (zh) 2014-03-16
JP2015522686A (ja) 2015-08-06
US9263360B2 (en) 2016-02-16
KR20150035981A (ko) 2015-04-07
US20140008822A1 (en) 2014-01-09
KR101979482B1 (ko) 2019-05-16
JP6195921B2 (ja) 2017-09-13
WO2014007950A1 (en) 2014-01-09

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