TWI727977B - 包含混合樹脂系統之調配物及其於3d tsv封裝之晶圓級底部填充之用途 - Google Patents
包含混合樹脂系統之調配物及其於3d tsv封裝之晶圓級底部填充之用途 Download PDFInfo
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- TWI727977B TWI727977B TW105132313A TW105132313A TWI727977B TW I727977 B TWI727977 B TW I727977B TW 105132313 A TW105132313 A TW 105132313A TW 105132313 A TW105132313 A TW 105132313A TW I727977 B TWI727977 B TW I727977B
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Abstract
本文提供混合樹脂系統及其於用於三維TSV封裝之晶圓級底部填充(WAUF)之用途。在一態樣中，提供包含以下組分之組合物：(1)環氧樹脂，(2)馬來醯亞胺、納迪醯亞胺或衣康醯胺，(3)丙烯酸酯及(4)填充劑。在某些態樣中，該環氧樹脂為經矽氧烷改質之樹脂。在某些態樣中，本發明係關於自本發明組合物製得之底部填充膜。在某些態樣中，本發明係關於包括本文所述之該等底部填充膜之物件。
Description
本發明係關於混合樹脂系統及其用於製備三維直通矽晶穿孔(TSV；through-silica via)封裝之晶圓級底部填充(WAUF)之方法。在一態樣中，本發明係關於包含至少下列組分之組合之組合物：(1)環氧樹脂，(2)順丁烯二醯亞胺、納迪醯亞胺或衣康醯胺，(3)丙烯酸酯及(4)填充劑。在某些態樣中，該環氧樹脂為經矽氧烷改質之樹脂。在某些態樣中，本發明係關於自本發明組合物製得之底部填充膜。在某些態樣中，本發明係關於包括本文所述之該等底部填充膜之物件。在某些實施例中，本發明係關於包括藉由如本文所述之調配物之固化等分試樣使第一物件永久黏附至第二物件之組件。
按照本發明，提供混合樹脂系統及其用於製備三維直通矽晶穿孔(TSV)封裝之晶圓級底部填充(WAUF)之方法。
在一態樣中，提供包含至少下列組分之組合之組合物：(1)環氧樹脂，
(2)馬來醯亞胺、納迪醯亞胺或衣康醯胺，(3)丙烯酸酯及(4)填充劑。在某些態樣中，該環氧樹脂為經矽氧烷改質之樹脂。
在某些態樣中，提供自本發明組合物製得之底部填充膜。
在某些態樣中，提供包括本文所述之該等底部填充膜之物件。
在某些態樣中，提供包括藉由如本文所述之調配物之固化等分試樣使第一物件永久黏附至第二物件之組件。
圖1呈現用來施覆使用本發明調配物之晶圓級底部填充(WAUF)之例示性步驟的流程圖。
圖2呈現不同調配物之熔融黏度數據。一旦掃描溫度達到主體物質之起始膠凝溫度，其熔融黏度即在5℃溫度範圍內顯著增加且該物質變成凝膠。
圖3呈現一些調配物之微差掃描熱量法(DCS)數據。所有調配物皆顯示陡峭的DSC起始，且在「DSC起始」溫度與「DSC峰」溫度之間之△T係小於15℃。
圖4呈現使用本發明調配物所製備之膜之裝配及可靠性試驗的例示性製程流程。
圖5呈現本發明調配物之施覆測試結果。底部填充膜物質顯示良好的晶粒角覆蓋(A)、良好間隙填充(B)及良好電互連接頭形成(C)，且無焊料擠壓(D)。
按照本發明，提供包含以下組分之組合物：環氧樹脂；馬來醯亞胺、納迪醯亞胺或衣康醯亞胺；
丙烯酸酯；及填充劑；其中：該環氧樹脂為可固化成三維聚合物網路之熱固性樹脂；該馬來醯亞胺、納迪醯亞胺或衣康醯亞胺為單體態或寡聚物態且可經歷自由基固化以形成聚合網路；該丙烯酸酯為單體態或寡聚物態且可經歷自由基固化以形成聚合網路；且該填充劑調節所得組合物之熱膨脹係數(CTE)；其中：當固化時，該組合物具有：100℃至205℃之DSC起始溫度；在200泊至40,000泊範圍內之熔融黏度，及130℃至180℃之膠凝溫度，如藉由Ares流變儀在10弧度(Rad)頻率下以10℃/分鐘之變溫速率使用直徑為1英寸且厚為1mm之樣品所量度。
在一些實施例中，DSC起始溫度落在120℃至205℃之範圍內；在一些實施例中，DSC起始溫度落在140℃至205℃之範圍內；在一些實施例中，DSC起始溫度落在160℃至205℃之範圍內；在一些實施例中，DSC起始溫度落在180℃至205℃之範圍內。
在一些實施例中，熔融黏度落在200泊至20,000泊之範圍內；在一些實施例中，熔融黏度落在200泊至10,000泊之範圍內；在一些實施例中，熔融黏度落在200泊至5,000泊之範圍內；在一些實施例中，熔融黏度落在200
泊至1,000泊之範圍內。
在一些實施例中，膠凝溫度落在140℃至180℃之範圍內，如藉由Ares流變儀在10弧度頻率下以10℃/分鐘之變溫速率使用直徑為1英寸且厚為1mm之樣品所量度。在一些實施例中，膠凝溫度落在140℃至170℃之範圍內，在一些實施例中，膠凝溫度落在150℃至180℃之範圍內，在一些實施例中，膠凝溫度落在150℃至170℃之範圍內。
如上所述之本發明熱固性樹脂組合物尤其包含環氧樹脂組分。本文涵蓋使用多種環氧基官能化樹脂，例如，基於雙酚A之液體型環氧樹脂、基於雙酚A之固體型環氧樹脂、基於雙酚F之液體型環氧樹脂(例如，Epiclon EXA-835LV)、基於苯酚酚醛清漆樹脂之多官能環氧樹脂、二環戊二烯型環氧樹脂(例如，Epiclon HP-7200L)、萘型環氧樹脂及其類似物以及其等之任意兩者或兩者以上之混合物。
涵蓋用於本文之例示性環氧基官能化樹脂包括環脂族醇之二環氧化物、氫化雙酚A(如市售Epalloy 5000)、六氫鄰苯二甲酸酐之雙官能環脂族縮水甘油酯(如市售Epalloy 5200)、Epiclon EXA-835LV、Epiclon HP-7200L及其類似物以及其等之任意兩者或兩者以上之混合物。
在某些實施例中，環氧樹脂組分可包括兩種或更多種不同雙酚系環氧樹脂之組合。此等雙酚系環氧樹脂可係選自雙酚A環氧樹脂、雙酚F環氧樹脂或雙酚S環氧樹脂，或其組合。此外，可使用相同類型樹脂(諸如A、F或S)中之兩種或更多種不同的雙酚環氧樹脂。
涵蓋用於本文之雙酚環氧樹脂之市售實例包括雙酚-F型環氧樹脂(諸如獲自日本Nippon Kayaku的RE-404-S及獲自Dai Nippon Ink & Chemicals,Inc.的EPICLON 830(RE1801)、830S(RE1815)、830A(RE1826)
及830W及獲自Resolution的RSL 1738及YL-983U)及雙酚-A型環氧樹脂(諸如獲自Resolution的YL-979及980)。
購自Dai Nippon且於上文所述之雙酚環氧樹脂係經改進作為液體未稀釋環氧氯丙烷-雙酚F環氧樹脂，其具有遠低於基於雙酚A環氧樹脂之習知環氧樹脂的黏度且具有與液體雙酚A環氧樹脂類似的物理性質。雙酚F環氧樹脂具有比雙酚A環氧樹脂低之黏度，兩種類型的環氧樹脂的其他所有性質皆相同，雙酚F環氧樹脂提供更低黏度且由此提供快速流動的底部填充密封劑材料。此四種雙酚F環氧樹脂之EEW係介於165與180之間。25℃黏度係介於3,000與4,500cp之間(除黏度上限為4,000cp之RE1801以外)。據報告RE1815及830W之可水解氯含量為200ppm，及RE1826之可水解氯含量為100ppm。
購自Resolution且如上文所述之雙酚環氧樹脂係經改進作為低含氯液體環氧樹脂。該等雙酚A環氧樹脂具有介於180與195之間的EEW(g/當量)及介於100與250cp之間的25℃黏度。據報告YL-979之總氯含量係介於500與700ppm之間，及YL-980之總氯含量係介於100與300ppm之間。該等雙酚F環氧樹脂具有介於165與180之間的EEW(g/當量)及介於30與60之間的25℃黏度。據報告RSL-1738之總氯含量係介於500與700ppm之間，及YL-983U之總氯含量係介於150與350ppm之間。
除該等雙酚環氧樹脂之外，涵蓋使用其他環氧化物作為本發明調配物之環氧組分。例如，可使用環脂族環氧化物，諸如3,4-環氧環己基甲基-3,4-環氧環己基碳酸酯。同樣，可使用單官能、雙官能或多官能反應性稀釋劑來調節所得樹脂材料之黏度及/或降低其Tg。例示性反應性稀釋劑包括丁基縮水甘油醚、甲苯酚基縮水甘油醚、聚乙二醇縮水甘油醚、聚丙二醇縮水
甘油醚及其類似物。
適用於本文之環氧樹脂包括酚系化合物之聚縮水甘油衍生物，諸如購自Resolution以EPON為商品名(諸如EPON 828、EPON 1001、EPON 1009及EPON 1031)之彼等；購自Dow Chemical Co.之DER 331、DER 332、DER 334及DER 542；及購自Nippon Kayaku之BREN-S。其他合適環氧樹脂包括自多元醇及其類似物製得之聚環氧化物及苯酚-甲醛酚醛清漆樹脂之聚縮水甘油衍生物，後者諸如購自Dow Chemical之DEN 431、DEN 438及DEN 439。甲酚類似物亦可以商品名ARALDITE(諸如ARALDITE ECN 1235、ARALDITE ECN 1273及ARALDITE ECN 1299)購自Ciba Specialty Chemicals Corporation。SU-8係購自Resolution的雙酚-A型環氧酚醛清漆樹脂。胺、胺基醇及多元羧酸之聚縮水甘油加合物亦適用於本發明，其市售樹脂包括購自F.I.C.Corporation之GLYAMINE 135、GLYAMINE 125及GLYAMINE 115；購自Ciba Specialty Chemicals之ARALDITE MY-720、ARALDITE 0500及ARALDITE 0510及購自the Sherwin-Williams Co.之PGA-X及PGA-C。
視情況在本文中使用之適當的單官能環氧共反應物稀釋劑包括彼等具有黏度低於該環氧樹脂組分之黏度(通常低於約250cp)者。
該等單官能環氧共反應物稀釋劑應具有含有約6個至約28個碳原子之烷基之環氧基，其實例包括C6-28烷基縮水甘油醚、C6-28脂肪酸縮水甘油酯、C6-28烷基酚縮水甘油醚及其類似物。
在包括此種單官能環氧共反應物稀釋劑的情況下，應以基於該組合物之總重量計約0.5重量%至約10重量%的量使用此種共反應物稀釋劑；在一些實施例中，應以基於該組合物之總重量計約0.25重量%至約5重量%的量
使用此種共反應物稀釋劑。
該環氧樹脂組分應以在約1重量%至約20重量%範圍內之量存在於該組合物中；在一些實施例中，本發明調配物包含約2重量%至約18重量%之環氧樹脂；在一些實施例中，本發明調配物包含約5至約15重量%之環氧樹脂。
在一些實施例中，本文所使用之環氧樹脂組分為經矽烷改質之環氧樹脂，例如，包含以下組分之物質組合物：(A)涵蓋於以下結構中之環氧樹脂組分：
其中：Y可存在或不存在，且當Y存在時，其為直接鍵、CH2、CH(CH3)2、C=O或S，此處R1為烷基、烯基、羥基、羧基及鹵素，且此處x為1至4；(B)涵蓋於以下結構中之環氧基官能化烷氧基矽烷：R1-Si(OR2)3
其中R1為含環氧乙烷之基團且R2為具有1至10個碳原子之經烷基或烷氧基取代之烷基、芳基或芳烷基；及(C)組分(A)與(B)之反應產物。
一此種經矽烷改質之環氧樹脂之一實例係作為芳族環氧樹脂(例如雙酚A、E、F或S環氧樹脂或聯苯環氧樹脂)與環氧矽烷之反應產物來形成，其中該環氧矽烷係涵蓋於以下結構中：R1-Si(OR2)3
其中R1為含環氧乙烷之基團，其實例包括2-(乙氧基甲基)環氧乙烷、2-(丙氧基甲基)環氧乙烷、2-(甲氧基甲基)環氧乙烷及2-(3-甲氧基丙基)環氧乙烷且R2為具有1至10個碳原子之經烷基或烷氧基取代之烷基、芳基或芳烷基。
在一實施例中，R1為2-(乙氧基甲基)環氧乙烷且R2係甲基。
用於製備該經矽烷改質之環氧樹脂之芳族環氧樹脂的理想化結構包括：
其中Y可存在或不存在，且當Y存在時，其為直接鍵、CH2、CH(CH3)2、C=O或S，R1為烷基、烯基、羥基、羧基或鹵素，且x為1至4。
當然，當x為2至4時，亦涵蓋該芳族環氧樹脂之鏈延伸變體涵蓋於此結構中。
例如，該芳族環氧樹脂之一鏈延伸變體可涵蓋於以下結構中：
在一些實施例中，經矽氧烷改質之環氧樹脂具有結構：-(O-Si(Me)2-O-Si(Me)(Z)-O-Si(Me)2-O-Si(Me)2)n-
其中：Z為-O-(CH2)3-O-Ph-CH2-Ph-O-(CH2-CH(OH)-CH2-O-Ph-CH2-Ph-O-)n-CH2-環氧乙烷，且n落在約1至4之範圍內。
在一些實施例中，該經矽氧烷改質之環氧樹脂係藉由使以下組分之組合在適於促進其反應之條件下接觸而製得：Me2Si(OMe)2+(MeO)3Si-(CH2)3-O-CH2-環氧乙烷+環氧乙烷-CH2-O-Ph-CH2-Ph-O-(CH2-CH(OH)-CH2-O-Ph-CH2-Ph-O-)n-CH2-環氧乙烷，其中「n」落在約1至4之範圍內。
該經矽烷改質之環氧樹脂亦可為芳族環氧樹脂、環氧矽烷及該芳族環氧樹脂與該環氧矽烷之反應產物的組合。該等反應產物可自該芳族環氧樹脂及環氧矽烷以1：100至100：1之重量比(諸如1：10至10：1的重量比)來製備。
涵蓋用於本發明組合物之環氧單體之量係足以使所得調配物包含在約1至20重量%範圍內之該環氧樹脂。在某些實施例中，所得調配物包含在
約2至18重量%範圍內之該環氧樹脂。在某些實施例中，所得調配物包含在約5至15重量%範圍內之該環氧樹脂。
視情況與環氧單體組合使用環氧樹脂固化劑。例示性環氧樹脂固化劑包括脲、脂肪族及芳族胺、胺硬化劑、聚醯胺、咪唑、二氰二胺、醯肼、脲-胺混合固化系統、自由基引發劑(例如，過氧酯、過氧碳酸酯、氫過氧化物、烷基過氧化物、芳基過氧化物、偶氮化合物及其類似物)、有機鹼、過渡金屬催化劑、酚、酸酐、路易斯酸、路易斯鹼及其類似物。
當環氧樹脂固化劑存在時，本發明組合物包含在約0.1至2重量%範圍內之環氧樹脂固化劑。在某些實施例中，本發明組合物包含在約0.5至5重量%範圍內之環氧樹脂固化劑。
涵蓋用於本文之馬來醯亞胺、納迪醯亞胺或衣康醯亞胺為各自具有以下結構之化合物：
其中：m為1至15，p為0至15，各R2獨立地選自氫或低碳數烷基(諸如C1-5)，且J為包括有機或有機矽氧烷自由基之單價或多價自由基，及其等之兩種或更多種之組合。
在本發明之一些實施例中，J為選自以下之單價或多價自由基：
-通常具有在約6個至至多約500個範圍內之碳原子的烴基或經取代烴基種類，其中該等烴基種類係選自烷基、烯基、炔基、環烷基、環烯基、芳基、烷芳基、芳烷基、芳烯基、烯芳基、芳炔基或炔芳基；-通常具有在約6個至至多約500個範圍內之碳原子的伸烴基或經取代伸烴基種類，其中該等伸烴基種類係選自伸烷基、伸烯基、伸炔基、伸環烷基、伸環烯基、伸芳基、烷基伸芳基、芳基伸烷基、芳基伸烯基、烯基伸芳基、芳基伸炔基或炔基伸芳基，-通常具有在約6個至至多約500個範圍內之碳原子的雜環或經取代雜環種類，-聚矽氧烷，或-聚矽氧烷-聚胺基甲酸酯嵌段共聚物，以及具有選自以下之連接子之一或多個上述基團的組合：共價鍵、-O-、-S-、-NR-、-NR-C(O)-、-NR-C(O)-O-、-NR-C(O)-NR-、-S-C(O)-、-S-C(O)-O-、-S-C(O)-NR-、-O-S(O)2-、-O-S(O)2-O-、-O-S(O)2-NR-、-O-S(O)-、-O-S(O)-O-、-O-S(O)-NR-、-O-NR-C(O)-、-O-NR-C(O)-O-、-O-NR-C(O)-NR-、-NR-O-C(O)-、-NR-O-C(O)-O-、-NR-O-C(O)-NR-、-O-NR-C(S)-、-O-NR-C(S)-O-、-O-NR-C(S)-NR-、-NR-O-C(S)-、-NR-O-C(S)-O-、-NR-O-C(S)-NR-、-O-C(S)-、-O-C(S)-O-、-O-C(S)-NR-、-NR-C(S)-、-NR-C(S)-O-、-NR-C(S)-NR-、-S-S(O)2-、-S-S(O)2-O-、-S-S(O)2-NR-、-NR-O-S(O)-、-NR-O-S(O)-O-、-NR-O-S(O)-NR-、-NR-O-S(O)2-、-NR-O-S(O)2-O-、-NR-O-S(O)2-NR-、-O-NR-S(O)-、
-O-NR-S(O)-O-、-O-NR-S(O)-NR-、-O-NR-S(O)2-O-、-O-NR-S(O)2-NR-、-O-NR-S(O)2-、-O-P(O)R2-、-S-P(O)R2-或-NR-P(O)R2-；其中各R獨立地為氫、烷基或經取代烷基。
例示性組合物包括其中之J為以下基團之彼等：氧烷基、硫烷基、胺基烷基、羧基烷基、氧烯基、硫烯基、胺基烯基、羧基烯基、氧炔基、硫炔基、胺基炔基、羧基炔基、氧環烷基、硫環烷基、胺基環烷基、羧基環烷基、氧環烯基、硫環烯基、胺基環烯基、羧基環烯基、雜環、氧雜環、硫雜環、胺基雜環、羧基雜環、氧芳基、硫芳基、胺基芳基、羧基芳基、雜芳基、氧雜芳基、硫雜芳基、胺基雜芳基、羧基雜芳基、氧烷芳基、硫烷芳基、胺基烷芳基、羧基烷芳基、氧芳烷基、硫芳烷基、胺基芳烷基、羧基芳烷基、氧芳烯基、硫芳烯基、胺基芳烯基、羧基芳烯基、氧烯芳基、硫烯芳基、胺基烯芳基、羧基烯芳基、氧芳炔基、硫芳炔基、胺基芳炔基、羧基芳炔基、氧炔芳基、硫炔芳基、胺基炔芳基或羧基炔芳基、氧伸烷基、硫伸烷基、胺基伸烷基、羧基伸烷基、氧伸烯基、硫伸烯基、胺基伸烯基、羧基伸烯基、氧伸炔基、硫伸炔基、胺基伸炔基、羧基伸炔基、氧伸環烷基、硫伸環烷基、胺基伸環烷基、羧基伸環烷基、氧伸環烯基、硫伸環烯基、胺基伸環烯基、羧基伸環烯基、氧伸芳基、硫伸芳基、胺基伸芳基、羧基伸芳基、氧烷基伸芳基、硫烷基伸芳基、胺基烷基伸芳基、羧基烷基伸芳基、氧芳基伸烷基、硫芳基伸烷基、胺基芳基伸烷基、羧基芳基伸烷基、氧芳基伸烯基、硫芳基伸烯基、胺基芳基伸烯基、羧基芳基伸烯基、氧烯基伸芳基、硫烯基伸芳基、胺基烯基伸芳基、羧基烯基伸芳基、氧芳基伸炔基、硫芳基伸炔基、胺基芳基伸炔基、羧基芳基伸炔基、氧炔基伸芳基、硫炔基伸芳基、胺基炔基伸芳基、羧基炔基伸芳基、伸雜芳基、氧
伸雜芳基、硫伸雜芳基、胺基伸雜芳基、羧基伸雜芳基、含雜原子之二價或多價環基團、含氧基雜原子之二價或多價環基團、含硫基雜原子之二價或多價環基團、含胺基雜原子之二價或多價環基團或含羧基雜原子之二價或多價環基團。
涵蓋用於本發明實踐之丙烯酸酯係此項技術中所熟知。參見(例如)美國專利號5,717,034，該案之全部內容以引用的方式併入本文中。
涵蓋用於本文之例示性丙烯酸酯包括單官能(甲基)丙烯酸酯、雙官能(甲基)丙烯酸酯、三官能(甲基)丙烯酸酯、多官能(甲基)丙烯酸酯及其類似物。
例示性單官能(甲基)丙烯酸酯包括丙烯酸苯基苯酚酯、丙烯酸甲氧基聚乙烯酯(methoxypolyethylene acrylate)、琥珀酸丙烯醯氧基乙酯、丙烯酸脂肪酸酯、甲基丙烯醯氧基乙基鄰苯二甲酸、苯氧基乙二醇甲基丙烯酸酯、甲基丙烯酸脂肪酸酯、丙烯酸β-羧乙酯、丙烯酸異冰片酯、丙烯酸異丁酯、丙烯酸第三丁酯、丙烯酸羥乙酯、丙烯酸羥丙酯、丙烯酸二氫環戊二乙酯、甲基丙烯酸環己酯、甲基丙烯酸第三丁酯、甲基丙烯酸二甲基胺基乙酯、甲基丙烯酸二乙基胺基乙酯、甲基丙烯酸第三丁基胺基乙酯、丙烯酸4-羥丁酯、丙烯酸四氫糠酯、丙烯酸苄酯、丙烯酸乙基卡必醇酯、丙烯酸苯氧基乙酯、甲氧基三乙二醇丙烯酸酯、單新戊四醇丙烯酸酯、二新戊四醇丙烯酸酯、三新戊四醇丙烯酸酯、聚新戊四醇丙烯酸酯及其類似物。
例示性雙官能(甲基)丙烯酸酯包括二甲基丙烯酸己二醇酯、甲基丙烯酸羥基丙烯醯氧基丙酯、二丙烯酸己二醇酯、丙烯酸胺基甲酸酯(酯)、環氧丙烯酸酯、雙酚A型環氧丙烯酸酯、經改質之環氧丙烯酸酯、經脂肪酸改質之環氧丙烯酸酯、經胺改質之雙酚A型環氧丙烯酸酯、甲基丙烯酸烯
丙酯、二甲基丙烯酸乙二醇酯、二甲基丙烯酸二乙二醇酯、乙氧基化雙酚A二甲基丙烯酸酯、二甲基丙烯酸三環癸烷二甲醇酯、二甲基丙烯酸甘油酯、聚丙二醇二丙烯酸酯、丙氧基化乙氧基化雙酚A二丙烯酸酯、9,9-雙(4-(2-丙烯醯氧基乙氧基)苯基)茀、三環癸烷二丙烯酸酯、二丙二醇二丙烯酸酯、聚丙二醇二丙烯酸酯、經PO改質之二丙烯酸新戊二醇酯、二丙烯酸三環癸烷二甲醇酯、二甲基丙烯酸1,12-十二烷二醇酯及其類似物。
例示性三官能(甲基)丙烯酸酯包括三羥甲基丙烷三甲基丙烯酸酯、三羥甲基丙烷三丙烯酸酯、三羥甲基丙烷乙氧基三丙烯酸酯、聚醚三丙烯酸酯、甘油丙氧基三丙烯酸酯及其類似物。
例示性多官能(甲基)丙烯酸酯包括二新戊四醇多丙烯酸酯、二新戊四醇六丙烯酸酯、四丙烯酸新戊四醇酯、四丙烯酸新戊四醇乙氧基酯、二-三羥甲基丙烷四丙烯酸酯及其類似物。
涵蓋用於本發明實踐之其他例示性丙烯酸酯包括描述於美國專利號5,717,034中之彼等，該案之全部內容以引用的方式併入本文中。
視情況地，在本發明調配物中可存在一或多種額外單體或自其衍生之樹脂，諸如(例如)氰酸酯、聚矽氧、氧雜環丁烷、聚酯、聚胺基甲酸酯、聚醯亞胺、三聚氰胺、脲-甲醛、酚-甲醛及其類似物。當存在時，此等物質可以基於最終調配物之總重量計在約0.1至至多約60重量%之範圍內的量存在。
當存在時，涵蓋用於本發明實踐之氰酸酯單體包含兩個或更多個形成環之氰酸酯(-O-C≡N)基團，其在加熱時環三聚化形成經取代三嗪環。因為在該氰酸酯單體之固化期間無離去基團或揮發性副產物形成，所以該固化反應稱為加成聚合。可用於本發明實踐之合適聚氰酸酯單體包括(例如)1,1-
雙(4-氰氧苯基)甲烷、1,1-雙(4-氰氧苯基)乙烷、2,2-雙(4-氰氧苯基)丙烷、雙(4-氰氧苯基)-2,2-丁烷、1,3-雙[2-(4-氰氧苯基)丙基]苯、雙(4-氰氧苯基)醚、4,4'-二氰氧二苯基、雙(4-氰氧基-3,5-二甲基苯基)甲烷、三(4-氰氧苯基)乙烷、氰酸化清漆型酚醛樹脂、1,3-雙[4-氰氧苯基-1-(1-甲基亞乙基)]苯、氰酸化苯酚二環戊二烯加成物及其類似物。按照本發明所使用之聚氰酸酯單體可在酸受體存在下藉由使適當之二元或多元酚與鹵化氰反應來輕易地製備。
可視情況與按照本發明之聚氰酸酯單體組合之單體係選自彼等經歷加成聚合反應之單體。此等單體包括乙烯醚、二乙烯醚、二烯丙醚、二甲基丙烯酸酯、二炔丙醚、混合炔丙基烯丙基醚、單馬來醯亞胺、雙馬來醯亞胺及其類似物。此等單體之實例包括環己烷二甲醇單乙烯醚、三聚氰酸參烯丙酯、1,1-雙(4-烯丙氧基苯基)乙烷、1,1-雙(4-炔丙氧基苯基)乙烷、1,1-雙(4-烯丙氧基苯基-4'-炔丙氧基苯基)乙烷、3-(2,2-二甲基三亞甲基縮醛)-1-馬來醯亞胺基苯、2,2,4-三甲基六亞甲基-1,6-雙馬來醯亞胺、2,2-雙[4-(4-馬來醯亞胺基苯氧基)苯基]丙烷及其類似物。
涵蓋用於本發明實踐之其他氰酸酯係此項技術中所熟知。參見(例如)美國專利號5,718,941，該案之全部內容以引用的方式併入本文中。
當存在時，涵蓋用於本發明實踐之聚矽氧係此項技術中所熟知。參見(例如)美國專利號5,717,034，該案之全部內容以引用的方式併入本文中。
當存在時，氧雜環丁烷(即1,3-環氧丙烷)為具有分子式C3H6O之雜環有機化合物，其具有含三個碳原子及一個氧原子之四員環。術語氧雜環丁烷通常亦係指任何含有氧雜環丁烷環之有機化合物。參見(例如)Burkhard等人，在Angew.Chem.Int.Ed.2010,49,9052-9067中，該案之全部內
容以引用的方式併入本文中。
當存在時，涵蓋用於本發明實踐之聚酯係指藉由使多元醇(亦稱為多羥醇)與飽和或不飽和二元酸反應而形成的縮聚物。所使用之典型多元醇為諸如乙二醇之二醇類；常用酸為苯二甲酸及馬來酸。持續移除水(酯化反應之副產物)驅使反應完全。使用不飽和聚酯及諸如苯乙烯之添加劑降低樹脂之黏度。藉由交聯鏈將初始液體樹脂轉化成固態。此係藉由在不飽和鍵上產生自由基，其在連鎖反應中傳播至鄰近分子中之其他不飽和鍵，從而在製程中連接鄰近鏈來完成。
當存在時，涵蓋用於本發明實踐之聚胺基甲酸酯係指由經胺基甲酸酯(carbamate)(胺基甲酸酯(urethane))鍵結合之有機單元鏈組成之聚合物。聚胺基甲酸酯聚合物係藉由使異氰酸酯與多元醇反應而形成。用於製造聚胺基甲酸酯之異氰酸酯及多元醇皆平均每個分子含有兩個或更多個官能團。
當存在時，涵蓋用於本發明實踐之聚醯亞胺係指由經醯亞胺鍵(即-C(O)-N(R)-C(O)-)結合之有機單元鏈組成之聚合物。聚醯亞胺聚合物可藉由多種反應，即藉由使二酸酐與二胺反應、藉由二酸酐與二異氰酸酯之間之反應及其類似反應而形成。
當存在時，涵蓋用於本發明實踐之三聚氰胺係指由三聚氰胺(即1,3,5-三嗪-2,4,6-三胺)與甲醛聚合而製得之硬質熱固性塑膠材料。在其丁基化形式中，其可溶於正丁醇及/或二甲苯中。其可用於與其他樹脂(諸如醇酸樹脂、環氧樹脂、丙烯酸類樹脂及聚酯樹脂)交聯。
當存在時，涵蓋用於本發明實踐之脲-甲醛係指自在諸如氨水或吡啶之弱鹼存在下加熱脲及甲醛製得之不透明熱固性樹脂或塑膠。
當存在時，涵蓋用於本發明實踐之酚-甲醛係指藉由使酚或經取代酚
與甲醛反應而獲得之合成聚合物。
涵蓋用於本發明實踐之顆粒填充劑包括二氧化矽、矽酸鈣、氫氧化鋁、氫氧化鎂、碳酸鈣、碳酸鎂、氧化鋁(Al2O3)、氧化鋅(ZnO)、氧化鎂(MgO)、氮化鋁(AlN)、氮化硼(BN)、碳奈米管、金剛石、黏土、鋁矽酸鹽及其類似物以及其等之任意兩者或兩者以上之混合物。在一些實施例中，該顆粒填充劑為二氧化矽。
通常，用於本發明調配物之填充劑具有在約0.005μm(即5nm)至至多約20μm範圍內之粒度。在某些實施例中，本文所使用之填充劑具有在約0.1μm至至多約5μm範圍內之粒度。
本發明組合物包含在約30至75重量%範圍內之該顆粒填充劑。在一些實施例中，本發明組合物包含在約40至60重量%範圍內之該顆粒填充劑。
本發明組合物通常包含：至少1重量%之該環氧樹脂，至少6重量%之該馬來醯亞胺、納迪醯亞胺或衣康醯亞胺，至少4重量%之該丙烯酸酯，及至少30重量%之該填充劑。
在一些實施例中，本發明組合物可進一步包含下列物質中之一或多者：至少1重量%之助熔劑，至少0.1重量%之黏著促進劑；及/或至少4重量%之增韌劑。
在一些實施例中，本發明組合物可進一步包含下列物質中之一或多者：
至多約10重量%之助熔劑，至多約2重量%之黏著促進劑；及/或至多約16重量%之增韌劑。
在一些實施例中，本發明組合物包含：在約1至至多20重量%範圍內之該環氧樹脂，在約6至至多16重量%範圍內之該馬來醯亞胺、納迪醯亞胺或衣康醯亞胺，在約4至至多12重量%範圍內之該丙烯酸酯，及在約30至至多75重量%範圍內之該填充劑。
此等組合物可進一步包含以下物質中之一或多者：至少1至至多約10重量%之助熔劑，至少0.1至至多約2重量%之黏著促進劑；及/或至少4至至多約16重量%之增韌劑。
本發明組合物可視情況進一步包含在約0.2至2重量%範圍內之自由基聚合引發劑。在某些實施例中，本發明組合物可進一步包含在約0.2至1重量%範圍內之自由基聚合引發劑。
例示性自由基引發劑包括過氧酯、過氧碳酸酯、氫過氧化物、烷基過氧化物、芳基過氧化物、偶氮化合物及其類似物。
本發明組合物視情況進一步包含一或多種流動添加劑、黏著促進劑、流變調節劑、增韌劑、助熔劑、膜撓性劑(film flexibilizer)、環氧樹脂固化催化劑(例如咪唑)、固化劑(例如，諸如過氧化二異丙苯之自由基引發劑)、自由基聚合調節劑(例如8-羥基喹啉)及/或自由基穩定劑以及其等之任意兩者或兩者以上之混合物。
如本文所使用，術語「流動添加劑」係指改變其等所引入之調配物之黏性的化合物。賦予此等性質之例示性化合物包括矽聚合物、丙烯酸乙酯/丙烯酸2-乙基己酯共聚物、酮肟之磷酸酯之烷醇銨鹽、及其類似物以及其等之任意兩者或兩者以上之組合。
如本文所使用，術語「黏著促進劑」係指增強其等所引入之調配物之黏著性質的化合物。
如本文所使用，術語「流變調節劑」係指改變其等所引入之調配物之一或多種物理性質的添加劑。
如本文所使用，術語「增韌劑」係指增強其等所引入之調配物之抗衝擊性的添加劑。
如本文所使用，術語「助熔劑」係指阻止在熔融金屬之表面上形成氧化物之還原劑。如技術方案1之組合物，其中該助熔劑為羧酸，包括松脂膠、十二烷二酸(可以Corfree M2購自Aldrich)、己二酸、癸二酸、聚癸二酸聚酐、馬來酸、酒石酸、檸檬酸及其類似物。助熔劑亦可包括醇、羥基酸及羥基鹼。例示性助熔材料包括多元醇(例如乙二醇、甘油、3-[雙(縮水甘油基氧基甲基)甲氧基]-1,2-丙烷二醇、D-核糖、D-纖維二糖、纖維素、3-環己烯-1,1-二甲醇及其類似物。
如本文所使用，術語「自由基穩定劑」係指諸如下列之化合物：對苯二酚、苯醌、受阻酚、受阻胺(例如硫代羰硫基系化合物)、苯并三唑系紫外線吸收劑、三嗪系紫外線吸收劑、二苯甲酮系紫外線吸收劑、苯甲酸酯系紫外線吸收劑、受阻胺系紫外線吸收劑、氮氧化物自由基系化合物及其類似物以及其等之任意兩者或兩者以上之組合。
當存在時，本發明組合物包含在約0.1至1重量%範圍內之該自由基穩
定劑。在某些實施例中，本發明組合物包含在約0.1至0.6重量%範圍內之該自由基穩定劑。
本發明組合物亦可視情況含有一或多種稀釋劑。當稀釋劑存在時，本發明組合物包含在相對於總組合物約10至50重量%範圍內之稀釋劑。在某些實施例中，本發明組合物包含在約20至40重量%範圍內之稀釋劑。
當存在時，涵蓋用於本文之例示性稀釋劑包括芳烴(例如苯、甲苯、二甲苯及其類似物)、飽和烴(例如己烷、環己烷、庚烷、十四烷)、氯化烴(例如二氯甲烷、氯仿、四氯化碳、二氯乙烷、三氯乙烯及其類似物)、醚(例如乙醚、四氫呋喃、二噁烷、二醇醚、乙二醇之單烷基或二烷基醚及其類似物)、多元醇(例如聚乙二醇、丙二醇、聚丙二醇及其類似物)、酯(例如乙酸乙酯、乙酸丁酯、乙酸甲氧基丙酯及其類似物)、二元酯、α-萜品醇、β-萜品醇、煤油、鄰苯二甲酸二丁酯、丁基卡必醇、丁基卡必醇乙酸酯、卡必醇乙酸酯、乙基卡必醇乙酸酯、己二醇、高沸點醇及其酯、二醇醚、酮(例如丙酮、甲基乙基酮及其類似物)、醯胺(例如二甲基甲醯胺、二甲基乙醯胺及其類似物)、雜芳族化合物(例如N-甲基吡咯啶酮及其類似物)、及其類似物以及其等之任意兩者或兩者以上之混合物。
涵蓋用於本文之含羥基稀釋劑包括水及具有C1至至多約C10主鏈之含羥基化合物。例示性含羥基稀釋劑包括水、甲醇、乙醇、丙醇、乙二醇、丙二醇、甘油、萜品醇及其類似物以及其等之任意兩者或兩者以上之混合物。
涵蓋按照本發明所使用之含羥基稀釋劑的量可大幅度變化，通常落在組合物之約5至至多約80重量百分數之範圍內。在某些實施例中，含羥基稀釋劑的量落在總組合物之約10至至多60重量百分數之範圍內。在一些實施
例中，含羥基稀釋劑的量落在總組合物之約20至至多約50重量百分數之範圍內。
視情況地，本文所述組合物可包括流動添加劑及其類似物。涵蓋視情況用於本文之流動添加劑包括矽聚合物、丙烯酸乙酯/丙烯酸2-乙基己酯共聚物、酮肟之磷酸酯之烷醇銨鹽、及其類似物以及其等之任意兩者或兩者以上之組合。
按照本發明之另一實施例，提供包括本發明固化組合物之反應產物的底部填充膜。
當於85℃85%相對濕度下曝露約2天時，本發明底部填充膜通常吸收低於2重量%之水分；在一些實施例中，當於85℃85%相對濕度下曝露約2天時，本發明底部填充膜通常吸收低於1.5重量%之水分；在一些實施例中，當於85℃85%相對濕度下曝露約2天時，本發明底部填充膜通常吸收低於1.2重量%之水分；在一些實施例中，當於85℃85%相對濕度下曝露約2天時，本發明底部填充膜通常吸收低於1.0重量%之水分。
當在固化後處於B階段時，如藉由熱機械分析(TMA)所測定，本發明底部填充膜具有大於約80℃之Tg。
本發明底部填充膜可進一步表徵為具有在260℃下至少5kg/cm2之晶粒剪切(die shear)(如用SiN晶粒/PI晶粒/SiO2(大小：3.81×3.81×700mm3)所測試，其中該晶粒係以120℃/1千克力/5秒附接於BT基板上，隨後藉由歷時30分鐘將溫度從室溫升至175℃，隨後在175℃下保持5小時來固化)。
按照本發明之另一實施例，提供用於製備底部填充膜之方法，該方法包括在施覆本文所述之組合物至合適基板上之後使其固化。
按照本發明之又另一實施例，提供包括黏附至其適合基板之本文所述
之底部填充膜的物件。
涵蓋用於本文之合適基板包括聚對苯二甲酸乙二酯、聚甲基丙烯酸甲酯、聚乙烯、聚丙烯、聚碳酸酯、環氧樹脂、聚醯亞胺、聚醯胺、聚酯、玻璃、具有氮化矽鈍化層之Si晶粒、具有聚醯亞胺鈍化層之Si晶粒、BT基板、裸Si、SR4基板、SR5基板及其類似物。
本發明物件中該底部填充膜對該基板之黏著力通常為至少5kg/cm2，如用SiN晶粒/PI晶粒/SiO2(大小：3.81×3.81×700mm3)所測試，其中該晶粒係以120℃/1千克力/5秒附接於BT基板上，隨後藉由歷時30分鐘將溫度從室溫升至175℃，隨後在175℃下保持5小時來固化。
可使用本發明材料來製備多種物件，其包括(例如)覆晶封裝、堆疊晶粒、混合記憶體立方體、TSV裝置及其類似物。
藉由以下非限制性實例說明本發明之多種態樣。該等實例係用於說明目的且不限制任何本發明實踐。應瞭解，可在不脫離本發明之精神及範疇下做出變動及修改。一般孰悉技術者可容易知曉如何合成或購得本文所述之試藥及組分。
實例
按照本發明之一態樣，提供用於製備本發明組合物之方法。在本發明之一實施例中，該方法包括第一步驟：使用如三輥研磨、球研磨等之方法將填充劑分散於液體中。其目的為將所有顆粒聚結分解成個別次微米顆粒。後續步驟為添加任何其他涵蓋使用之原料並使所得組合接受充分剪切混合以製備用於塗膜之清漆。將落在本發明申請專利範圍之範疇內之例示性調配物呈現於表1中。
使上文所描述之各調配物接受性能測試(其結果闡述於下表2中)。
表2中之微差掃描熱量法(DCS)數據顯示所有調配物皆具有快速固化性質，其等之在「DSC起始」溫度與「DSC峰」溫度之間之△T係小於20℃；在一些實施例中，△T係小於15℃；且在一些實施例中，△T係小於10℃。
上文所闡述之結果證實，利用諸如本文所描述之樹脂系統之獨特混合
樹脂系統，可獲得快速固化型底部填充膜材料。
熟習以上描述之技術者當可明白除彼等本文所顯示及描述者外之本發明之各種修改。此等修改亦旨在落於隨附申請專利範圍之範疇內。
本說明書中所提及之專利案及公開案係向熟習技術者指示本發明之相關水平。此等專利案及公開案係以引用之方式併入本文，其程度如同將各個別申請案或公開案以引用方式特定地及個別地併入本文一般。
前述說明為本發明特定實施例之說明，但不意欲限制其實踐。以下申請專利範圍(包括其所有等效項)旨在界定本發明範圍。
Claims (30)
- 一種組合物，其包含：環氧樹脂；馬來醯亞胺、納迪醯亞胺或衣康醯亞胺；丙烯酸酯；及填充劑；其中：該環氧樹脂為可固化成三維聚合物網路之熱固性樹脂；該馬來醯亞胺、納迪醯亞胺或衣康醯亞胺為單體態或寡聚物態且可經歷自由基固化以形成聚合網路；該丙烯酸酯為單體態或寡聚物態且可經歷自由基固化以形成聚合網路；且該填充劑調節所得組合物之熱膨脹係數(CTE)；其中：當固化時，該組合物具有：100℃至205℃之DSC起始溫度；在200泊至40,000泊範圍內之熔融黏度，及130℃至180℃之膠凝溫度，如藉由Ares流變儀在10弧度頻率下以10℃/分鐘之變溫速率使用直徑為1英寸且厚為1mm之樣品所量度。
- 如請求項1之組合物，其中該環氧樹脂包括其上具有一或多個環氧基之聚合主鏈。
- 如請求項2之組合物，其中該環氧樹脂係選自雙酚A環氧樹脂、雙酚F環氧樹脂、萘環氧樹脂、酚醛清漆環氧樹脂、經矽氧烷改質之環氧樹脂、環脂族環氧樹脂、聯苯環氧樹脂、DCPD環氧樹脂、或經改質之環氧樹脂、以及其等之任意兩者或兩者以上之組合。
- 如請求項1之組合物，其進一步包含一或多種流動添加劑、黏著促進劑、流變調節劑、增韌劑、助熔劑、膜撓性劑、環氧樹脂固化催化劑、固化劑及/或自由基聚合調節劑以及其等之任意兩者或兩者以上之混合物。
- 如請求項4之組合物，其中該助熔劑：與金屬表面上之氧化物反應，從而促進熔融金屬之潤濕，並藉由塗覆熱表面用作氧障壁，從而防止其氧化。
- 如請求項5之組合物，其中該助熔劑為羧酸、醇、多元醇、羥基酸或羥基鹼。
- 如請求項6之組合物，其中該羧酸為松脂膠、十二烷二酸、己二酸、癸二酸、聚癸二酸聚酐、馬來酸、酒石酸或檸檬酸。
- 如請求項6之組合物，其中該助熔物質為多元醇。
- 如請求項4之組合物，其中該黏著促進劑提高該組合物對基板表面之 黏著力。
- 如請求項4之組合物，其中該增韌劑降低該組合物之材料脆性並提高其抗衝擊性。
- 如請求項3之組合物，其中該經矽氧烷改質之環氧樹脂具有以下結構：-(O-Si(Me)2-O-Si(Me)(Z)-O-Si(Me)2-O-Si(Me)2)n-其中：Z為-O-(CH2)3-O-Ph-CH2-Ph-O-(CH2-CH(OH)-CH2-O-Ph-CH2-Ph-O-)n-CH2-環氧乙烷，且n落在約1至4之範圍內。
- 如請求項11之組合物，其中該經矽氧烷改質之環氧樹脂係藉由使以下組分之組合在適於促進其反應之條件下接觸而製得：Me2Si(OMe)2+(MeO)3Si-(CH2)3-O-CH2-環氧乙烷+環氧乙烷-CH2-O-Ph-CH2-Ph-O-(CH2-CH(OH)-CH2-O-Ph-CH2-Ph-O-)n-CH2-環氧乙烷，其中「n」落在約1至4之範圍內。
- 如請求項1之組合物，其中該馬來醯亞胺、納迪醯亞胺或衣康醯亞胺各自具有以下結構：
- 如請求項13之組合物，其中J為包括有機矽氧烷自由基之單價或多價自由基。
- 如請求項13之組合物，其中J為選自以下之單價或多價自由基：通常具有在約6個至至多約500個範圍內之碳原子的烴基或經取代烴基種類，其中該等烴基種類係選自烷基、烯基、炔基、環烷基、環烯基、芳基、烷芳基、芳烷基、芳烯基、烯芳基、芳炔基或炔芳基；通常具有在約6個至至多約500個範圍內之碳原子的伸烴基或經取 代伸烴基種類，其中該等伸烴基種類係選自伸烷基、伸烯基、伸炔基、伸環烷基、伸環烯基、伸芳基、烷基伸芳基、芳基伸烷基、芳基伸烯基、烯基伸芳基、芳基伸炔基或炔基伸芳基，通常具有在約6個至至多約500個範圍內之碳原子的雜環或經取代雜環種類，聚矽氧烷，或聚矽氧烷-聚胺基甲酸酯嵌段共聚物，以及具有選自以下之連接子之一或多個上述基團的組合：共價鍵、-O-、-S-、-NR-、-NR-C(O)-、-NR-C(O)-O-、-NR-C(O)-NR-、-S-C(O)-、-S-C(O)-O-、-S-C(O)-NR-、-O-S(O)2-、-O-S(O)2-O-、-O-S(O)2-NR-、-O-S(O)-、-O-S(O)-O-、-O-S(O)-NR-、-O-NR-C(O)-、-O-NR-C(O)-O-、-O-NR-C(O)-NR-、-NR-O-C(O)-、-NR-O-C(O)-O-、-NR-O-C(O)-NR-、-O-NR-C(S)-、-O-NR-C(S)-O-、-O-NR-C(S)-NR-、-NR-O-C(S)-、-NR-O-C(S)-O-、-NR-O-C(S)-NR-、-O-C(S)-、-O-C(S)-O-、-O-C(S)-NR-、-NR-C(S)-、-NR-C(S)-O-、-NR-C(S)-NR-、-S-S(O)2-、-S-S(O)2-O-、-S-S(O)2-NR-、-NR-O-S(O)-、-NR-O-S(O)-O-、-NR-O-S(O)-NR-、-NR-O-S(O)2-、-NR-O-S(O)2-O-、-NR-O-S(O)2-NR-、-O-NR-S(O)-、-O-NR-S(O)-O-、-O-NR-S(O)-NR-、-O-NR-S(O)2-O-、-O-NR-S(O)2-NR-、-O-NR-S(O)2-、-O-P(O)R2-、-S-P(O)R2-或-NR-P(O)R2-；其中各R獨立地為氫、烷基或經取代烷基。
- 如請求項13之組合物，其中J為：氧烷基、硫烷基、胺基烷基、羧基烷基、氧烯基、硫烯基、胺基烯基、羧基烯基、氧炔基、硫炔基、胺基炔 基、羧基炔基、氧環烷基、硫環烷基、胺基環烷基、羧基環烷基、氧環烯基、硫環烯基、胺基環烯基、羧基環烯基、雜環、氧雜環、硫雜環、胺基雜環、羧基雜環、氧芳基、硫芳基、胺基芳基、羧基芳基、雜芳基、氧雜芳基、硫雜芳基、胺基雜芳基、羧基雜芳基、氧烷芳基、硫烷芳基、胺基烷芳基、羧基烷芳基、氧芳烷基、硫芳烷基、胺基芳烷基、羧基芳烷基、氧芳烯基、硫芳烯基、胺基芳烯基、羧基芳烯基、氧烯芳基、硫烯芳基、胺基烯芳基、羧基烯芳基、氧芳炔基、硫芳炔基、胺基芳炔基、羧基芳炔基、氧炔芳基、硫炔芳基、胺基炔芳基或羧基炔芳基、氧伸烷基、硫伸烷基、胺基伸烷基、羧基伸烷基、氧伸烯基、硫伸烯基、胺基伸烯基、羧基伸烯基、氧伸炔基、硫伸炔基、胺基伸炔基、羧基伸炔基、氧伸環烷基、硫伸環烷基、胺基伸環烷基、羧基伸環烷基、氧伸環烯基、硫伸環烯基、胺基伸環烯基、羧基伸環烯基、氧伸芳基、硫伸芳基、胺基伸芳基、羧基伸芳基、氧烷基伸芳基、硫烷基伸芳基、胺基烷基伸芳基、羧基烷基伸芳基、氧芳基伸烷基、硫芳基伸烷基、胺基芳基伸烷基、羧基芳基伸烷基、氧芳基伸烯基、硫芳基伸烯基、胺基芳基伸烯基、羧基芳基伸烯基、氧烯基伸芳基、硫烯基伸芳基、胺基烯基伸芳基、羧基烯基伸芳基、氧芳基伸炔基、硫芳基伸炔基、胺基芳基伸炔基、羧基芳基伸炔基、氧炔基伸芳基、硫炔基伸芳基、胺基炔基伸芳基、羧基炔基伸芳基、伸雜芳基、氧伸雜芳基、硫伸雜芳基、胺基伸雜芳基、羧基伸雜芳基、含雜原子之二價或多價環基團、含氧雜原子之二價或多價環基團、含硫雜原子之二價或多價環基團、含胺基雜原子之二價或多價環基團或含羧基雜原子之二價或多價環基團。
- 如請求項1之組合物，其進一步包含有機稀釋劑。
- 如請求項1之組合物，其中該組合物包含：至少1重量%之該環氧樹脂，至少6重量%之該馬來醯亞胺、納迪醯亞胺或衣康醯亞胺，至少4重量%之該丙烯酸酯，及至少30重量%之該填充劑。
- 如請求項18之組合物，其進一步包含以下之一或多者：至少1重量%之助熔劑，至少0.1重量%之黏著促進劑；及/或至少4重量%之增韌劑。
- 如請求項1之組合物，其中該組合物包含：在約1至至多20重量%範圍內之該環氧樹脂，在約6至至多16重量%範圍內之該馬來醯亞胺、納迪醯亞胺或衣康醯亞胺，在約4至至多12重量%範圍內之該丙烯酸酯，及在約30至至多75重量%範圍內之該填充劑。
- 如請求項20之組合物，其進一步包含以下之一或多者：至少1重量%之助熔劑，至少0.1重量%之黏著促進劑；及/或 至少4重量%之增韌劑。
- 一種底部填充膜，其包括固化如請求項1之組合物之反應產物。
- 如請求項22之底部填充膜，其中當於85℃於85%相對濕度下曝露約2天時，該膜吸收低於2重量%之水分。
- 如請求項22之底部填充膜，其中該膜為B階段膜，如藉由熱機械分析(TMA)所測定，其在固化後具有大於約80℃之Tg。
- 如請求項22之底部填充膜，其中如用SiN晶粒/PI晶粒/SiO2(大小：3.81×3.81×700mm3)所測試，該膜在260℃下之晶粒剪切為至少5kg/cm2，其中該晶粒係以120℃/1千克力/5秒附接於BT基板上，隨後藉由歷時30分鐘將溫度從室溫升至175℃，隨後在175℃下保持5小時來固化。
- 一種用於製備底部填充膜之方法，該方法包括在施覆如請求項1之組合物至合適基板後使其固化。
- 一種物件，其包括黏附至適於其之基板之如請求項22的底部填充膜。
- 如請求項27之物件，其中該合適基板為聚對苯二甲酸乙二酯、聚甲基丙烯酸甲酯、聚乙烯、聚丙烯、聚碳酸酯、環氧樹脂、聚醯亞胺、聚醯胺、聚酯、玻璃、具有氮化矽鈍化層之Si晶粒、具有聚醯亞胺鈍化層之Si晶粒、 BT基板、裸Si、SR4基板或SR5基板。
- 如請求項27之物件，其中該物件為覆晶封裝、堆疊晶粒、混合記憶體立方體或TSV裝置。
- 如請求項27之物件，其中如用SiN晶粒/PI晶粒/SiO2(大小：3.81×3.81×700mm3)所測試，該底部填充膜對該基板之黏著力為至少5kg/cm2，其中該晶粒係以120℃/1千克力/5秒附接於BT基板上，隨後藉由歷時30分鐘將溫度從室溫升至175℃，隨後在175℃下保持5小時來固化。
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| CN110146539B (zh) * | 2019-05-13 | 2021-09-10 | 南京理工大学 | 一种评估物质热分解反应最小分解起始温度的方法 |
| KR20210070639A (ko) * | 2019-12-05 | 2021-06-15 | 주식회사 두산 | 반도체 패키지용 언더필 필름 및 이를 이용하는 반도체 패키지의 제조방법 |
| KR20220160027A (ko) * | 2020-04-06 | 2022-12-05 | 쇼와덴코머티리얼즈가부시끼가이샤 | 비스말레이미드계 접착제 조성물, 경화물, 접착 시트 및 플렉시블 프린트 배선판 |
| KR102485700B1 (ko) | 2020-12-23 | 2023-01-06 | 주식회사 두산 | 반도체 패키지용 언더필 필름 및 이를 이용하는 반도체 패키지의 제조방법 |
| CN112748046B (zh) * | 2020-12-29 | 2022-05-20 | 西安交通大学 | 一种测量流体黏度和密度的装置及测量方法 |
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| US5646241A (en) | 1995-05-12 | 1997-07-08 | Quantum Materials, Inc. | Bleed resistant cyanate ester-containing compositions |
| US5717034A (en) | 1996-07-29 | 1998-02-10 | Quantum Materials, Inc. | Perfluorinated hydrocarbon polymer-filled adhesive formulations and uses therefor |
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| US20030170450A1 (en) * | 2002-03-05 | 2003-09-11 | Stewart Steven L. | Attachment of surface mount devices to printed circuit boards using a thermoplastic adhesive |
| JP4952585B2 (ja) * | 2006-01-23 | 2012-06-13 | 日立化成工業株式会社 | 接着剤組成物、フィルム状接着剤、接着シート、並びにそれを用いた半導体装置 |
| CN101595553A (zh) * | 2006-12-08 | 2009-12-02 | 汉高股份两合公司 | 涂布有凸点的半导体晶片的方法 |
| US20100007018A1 (en) * | 2006-12-08 | 2010-01-14 | Derek Wyatt | Process for coating a bumped semiconductor wafer |
| JP2008297373A (ja) * | 2007-05-29 | 2008-12-11 | Somar Corp | 液状エポキシ樹脂組成物からなるアンダーフィル材及びフリップチップ型半導体装置 |
| EP2366751A3 (en) * | 2008-08-27 | 2012-01-18 | Hitachi Chemical Co., Ltd. | Photosensitive adhesive composition, and film adhesive, adhesive sheet, adhesive pattern, semiconductor wafer with adhesive layer and semiconductor device using the photosensitive adhesive composition |
| US20120133061A1 (en) * | 2009-06-30 | 2012-05-31 | Kazuyuki Mitsukura | Photosensitive adhesive, and film adhesive, adhesive sheet, adhesive pattern, semiconductor wafer with adhesive layer, and semiconductor device, which are made using same |
| WO2011033743A1 (ja) * | 2009-09-16 | 2011-03-24 | 住友ベークライト株式会社 | 接着フィルム、多層回路基板、電子部品及び半導体装置 |
| US10428253B2 (en) * | 2013-07-16 | 2019-10-01 | Hitachi Chemical Company, Ltd | Photosensitive resin composition, film adhesive, adhesive sheet, adhesive pattern, semiconductor wafer with adhesive layer, and semiconductor device |
| WO2015127179A1 (en) * | 2014-02-24 | 2015-08-27 | Henkel IP & Holding GmbH | Thermally conductive pre-applied underfill formulations and uses thereof |
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| CN108137903B (zh) | 2020-08-21 |
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