JP2011006710A5 - - Google Patents

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Publication number
JP2011006710A5
JP2011006710A5 JP2010230488A JP2010230488A JP2011006710A5 JP 2011006710 A5 JP2011006710 A5 JP 2011006710A5 JP 2010230488 A JP2010230488 A JP 2010230488A JP 2010230488 A JP2010230488 A JP 2010230488A JP 2011006710 A5 JP2011006710 A5 JP 2011006710A5
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JP
Japan
Prior art keywords
less
elastic modulus
binder
group
mpa
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JP2010230488A
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English (en)
Japanese (ja)
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JP2011006710A (ja
JP5370333B2 (ja
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Priority to JP2010230488A priority Critical patent/JP5370333B2/ja
Priority claimed from JP2010230488A external-priority patent/JP5370333B2/ja
Publication of JP2011006710A publication Critical patent/JP2011006710A/ja
Publication of JP2011006710A5 publication Critical patent/JP2011006710A5/ja
Application granted granted Critical
Publication of JP5370333B2 publication Critical patent/JP5370333B2/ja
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

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JP2010230488A 2001-09-25 2010-10-13 低熱膨張性の熱硬化性樹脂組成物および樹脂フィルム Expired - Fee Related JP5370333B2 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2010230488A JP5370333B2 (ja) 2001-09-25 2010-10-13 低熱膨張性の熱硬化性樹脂組成物および樹脂フィルム

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2001291635 2001-09-25
JP2001291635 2001-09-25
JP2010230488A JP5370333B2 (ja) 2001-09-25 2010-10-13 低熱膨張性の熱硬化性樹脂組成物および樹脂フィルム

Related Parent Applications (1)

Application Number Title Priority Date Filing Date
JP2006347895A Division JP2007126678A (ja) 2001-09-25 2006-12-25 低熱膨張性の熱硬化性樹脂組成物および樹脂フィルム

Publications (3)

Publication Number Publication Date
JP2011006710A JP2011006710A (ja) 2011-01-13
JP2011006710A5 true JP2011006710A5 (enExample) 2011-12-01
JP5370333B2 JP5370333B2 (ja) 2013-12-18

Family

ID=19113743

Family Applications (2)

Application Number Title Priority Date Filing Date
JP2003532588A Expired - Fee Related JP3966279B2 (ja) 2001-09-25 2002-09-25 低熱膨張性の熱硬化性樹脂組成物および樹脂フィルム
JP2010230488A Expired - Fee Related JP5370333B2 (ja) 2001-09-25 2010-10-13 低熱膨張性の熱硬化性樹脂組成物および樹脂フィルム

Family Applications Before (1)

Application Number Title Priority Date Filing Date
JP2003532588A Expired - Fee Related JP3966279B2 (ja) 2001-09-25 2002-09-25 低熱膨張性の熱硬化性樹脂組成物および樹脂フィルム

Country Status (7)

Country Link
US (1) US20050065275A1 (enExample)
EP (1) EP1454962A4 (enExample)
JP (2) JP3966279B2 (enExample)
KR (1) KR100848434B1 (enExample)
CN (1) CN100489037C (enExample)
TW (1) TW593440B (enExample)
WO (1) WO2003029353A1 (enExample)

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IL153812A0 (en) * 2003-01-06 2003-07-31 Bromine Compounds Ltd Improved wood-plastic composites
JP2006152261A (ja) * 2004-10-25 2006-06-15 Hitachi Chem Co Ltd 複合体、プリプレグ、金属箔張積層板、多層プリント配線板及びその製造方法
JP2006152260A (ja) * 2004-10-26 2006-06-15 Hitachi Chem Co Ltd 複合体、これを用いたプリプレグ、金属箔張積層板及び多層印刷配線板並びに多層印刷配線板の製造方法
US8092910B2 (en) 2005-02-16 2012-01-10 Dow Corning Toray Co., Ltd. Reinforced silicone resin film and method of preparing same
KR101272208B1 (ko) * 2005-02-16 2013-06-07 다우 코닝 도레이 캄파니 리미티드 강화 실리콘 수지 필름 및 이의 제조방법
EP1858981B1 (en) 2005-02-16 2012-03-28 Dow Corning Corporation Reinforced silicone resin film and method of preparing same
CN101238181B (zh) 2005-08-04 2011-10-05 陶氏康宁公司 增强的有机硅树脂膜及其制备方法
WO2008045104A2 (en) 2005-12-21 2008-04-17 Dow Corning Corporation Silicone resin film, method of preparing same, and nanomaterial-filled silicone composition
WO2008051242A2 (en) 2006-01-19 2008-05-02 Dow Corning Corporation Silicone resin film, method of preparing same, and nanomaterial-filled silicone compositon
US8084097B2 (en) 2006-02-20 2011-12-27 Dow Corning Corporation Silicone resin film, method of preparing same, and nanomaterial-filled silicone composition
EP2117836B1 (en) 2007-02-22 2012-11-07 Dow Corning Corporation Reinforced silicone resin films
EP2117835A1 (en) 2007-02-22 2009-11-18 Dow Corning Corporation Reinforced silicone resin films
CN101627096B (zh) * 2007-02-22 2012-11-07 道康宁公司 增强硅树脂膜及其制备方法
JP5571568B2 (ja) * 2007-12-18 2014-08-13 ダウ グローバル テクノロジーズ エルエルシー シリコーンポリエーテルを含む熱硬化性組成物、それらの製造及び用途
CN102007167A (zh) * 2008-02-15 2011-04-06 陶氏环球技术公司 包含有机硅聚醚的热固性组合物，及其制备和用途
JP5343025B2 (ja) * 2010-03-18 2013-11-13 新日鉄住金化学株式会社 ガスバリア性積層体フィルム
TWI522423B (zh) 2010-08-31 2016-02-21 道康寧東麗股份有限公司 聚矽氧烷組合物及其硬化物
US10329439B2 (en) * 2012-09-24 2019-06-25 Chomarat North America Plastisol compositions including organosilicon compound(s)
JP2016180088A (ja) * 2014-07-24 2016-10-13 三菱化学株式会社 熱硬化性樹脂組成物及びその成形体
WO2016017592A1 (ja) * 2014-07-28 2016-02-04 住友化学株式会社 シリコーン系封止材組成物及び半導体発光装置
US9617373B2 (en) * 2015-02-13 2017-04-11 LCY Chemical Corp. Curable resin composition, article, and method for fabricating the same
CN113527818B (zh) * 2021-08-12 2022-11-29 广东生益科技股份有限公司 一种树脂组合物及其应用

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JPS62243649A (ja) * 1986-04-15 1987-10-24 Nippon Retsuku Kk 電気絶縁用樹脂組成物
US4966922A (en) * 1988-06-09 1990-10-30 General Electric Company Dual curable silicone compositions
JPH0670181B2 (ja) * 1989-01-19 1994-09-07 信越化学工業株式会社 熱硬化性シリコーンゴム組成物
JP2508390B2 (ja) * 1989-09-11 1996-06-19 信越化学工業株式会社 熱硬化性樹脂組成物
CA2092457A1 (en) * 1992-05-28 1993-11-29 James E. Doin Oil resistant heat cured elastomer compositions with mixed metal oxides
US5508323A (en) * 1992-06-29 1996-04-16 Dow Corning Corporation Method for imparting fire retardancy to organic resins
US5952439A (en) * 1993-04-15 1999-09-14 Dow Corning Toray Silicone Co., Ltd. Epoxy group-containing silicone resin and compositions based thereon
JP3339910B2 (ja) * 1993-04-15 2002-10-28 東レ・ダウコーニング・シリコーン株式会社 硬化性樹脂組成物
JP3464512B2 (ja) * 1993-11-04 2003-11-10 東レ・ダウコーニング・シリコーン株式会社 シリコーンゴム組成物
GB2284214B (en) * 1993-11-30 1998-03-04 Gen Electric Silicone and fluorosilicone heat cured filled rubber compositions
JP3104568B2 (ja) * 1995-03-24 2000-10-30 信越化学工業株式会社 高電圧電気絶縁体用シリコーンゴム組成物
JPH08337680A (ja) * 1995-06-09 1996-12-24 Hitachi Ltd 熱硬化性樹脂およびその樹脂を用いた半導体装置
US5939491A (en) * 1997-08-01 1999-08-17 Ppg Industries Ohio, Inc. Curable compositions based on functional polysiloxanes
JPH11147934A (ja) * 1997-11-19 1999-06-02 Hitachi Chem Co Ltd エポキシ樹脂組成物及びそれを用いた高分子量エポキシフィルム
JPH11335565A (ja) * 1998-04-13 1999-12-07 Dow Corning Corp 熱硬化性シリコ―ンゴム組成物
EP0955675B1 (en) * 1998-05-07 2004-12-15 Shin-Etsu Chemical Co., Ltd. Epoxy resin compositions and semiconductor devices encapsulated therewith
JP2001214075A (ja) * 2000-02-04 2001-08-07 Jsr Corp 高熱伝導性シート用組成物、高熱伝導性シート、高熱伝導性シートの製造方法および高熱伝導性シートを用いた放熱構造
JP2001139833A (ja) * 1999-11-16 2001-05-22 Jsr Corp 高熱伝導性シート用組成物、高熱伝導性シート、高熱伝導性シートの製造方法および高熱伝導性シートを用いた放熱構造
KR100840456B1 (ko) * 2000-03-31 2008-06-20 히다치 가세고교 가부시끼가이샤 열경화성 수지 조성물, 수지 필름, 절연 재료 부착 금속박,양면 금속박 부착 절연 필름, 금속장 적층판, 다층 금속장적층판 및 다층 프린트 배선판

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