CN100489037C - 低热膨胀性的热固性树脂组合物以及树脂膜 - Google Patents

低热膨胀性的热固性树脂组合物以及树脂膜 Download PDF

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Publication number
CN100489037C
CN100489037C CNB028187032A CN02818703A CN100489037C CN 100489037 C CN100489037 C CN 100489037C CN B028187032 A CNB028187032 A CN B028187032A CN 02818703 A CN02818703 A CN 02818703A CN 100489037 C CN100489037 C CN 100489037C
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China
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thermosetting
weight
resin composition
parts
thermosetting resin
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Expired - Fee Related
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CNB028187032A
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English (en)
Chinese (zh)
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CN1558931A (zh
Inventor
高桥敦之
马场日男
斑目健
中子伟夫
高野希
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Resonac Corp
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Hitachi Chemical Co Ltd
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    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L83/00—Compositions of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon only; Compositions of derivatives of such polymers
    • C08L83/10—Block- or graft-copolymers containing polysiloxane sequences
    • C08L83/12—Block- or graft-copolymers containing polysiloxane sequences containing polyether sequences
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L83/00—Compositions of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon only; Compositions of derivatives of such polymers
    • C08L83/04—Polysiloxanes
    • C08L83/06—Polysiloxanes containing silicon bound to oxygen-containing groups
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
    • C08J5/00—Manufacture of articles or shaped materials containing macromolecular substances
    • C08J5/18—Manufacture of films or sheets
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/01—Use of inorganic substances as compounding ingredients characterized by their specific function
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L83/00—Compositions of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon only; Compositions of derivatives of such polymers
    • C08L83/04—Polysiloxanes
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
    • C09D183/00—Coating compositions based on macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon, with or without sulfur, nitrogen, oxygen, or carbon only; Coating compositions based on derivatives of such polymers
    • C09D183/04—Polysiloxanes
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G77/00—Macromolecular compounds obtained by reactions forming a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon in the main chain of the macromolecule
    • C08G77/04—Polysiloxanes
    • C08G77/14—Polysiloxanes containing silicon bound to oxygen-containing groups
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G77/00—Macromolecular compounds obtained by reactions forming a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon in the main chain of the macromolecule
    • C08G77/70—Siloxanes defined by use of the MDTQ nomenclature
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
    • C08J2383/00—Characterised by the use of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon with or without sulfur, nitrogen, oxygen, or carbon only; Derivatives of such polymers
    • C08J2383/04—Polysiloxanes

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  • Chemical & Material Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Organic Chemistry (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Health & Medical Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Materials Engineering (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Wood Science & Technology (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
  • Manufacture Of Macromolecular Shaped Articles (AREA)
  • Laminated Bodies (AREA)
  • Silicon Polymers (AREA)
CNB028187032A 2001-09-25 2002-09-25 低热膨胀性的热固性树脂组合物以及树脂膜 Expired - Fee Related CN100489037C (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2001291635 2001-09-25
JP291635/2001 2001-09-25

Publications (2)

Publication Number Publication Date
CN1558931A CN1558931A (zh) 2004-12-29
CN100489037C true CN100489037C (zh) 2009-05-20

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CNB028187032A Expired - Fee Related CN100489037C (zh) 2001-09-25 2002-09-25 低热膨胀性的热固性树脂组合物以及树脂膜

Country Status (7)

Country Link
US (1) US20050065275A1 (enExample)
EP (1) EP1454962A4 (enExample)
JP (2) JP3966279B2 (enExample)
KR (1) KR100848434B1 (enExample)
CN (1) CN100489037C (enExample)
TW (1) TW593440B (enExample)
WO (1) WO2003029353A1 (enExample)

Families Citing this family (22)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
IL153812A0 (en) * 2003-01-06 2003-07-31 Bromine Compounds Ltd Improved wood-plastic composites
JP2006152261A (ja) * 2004-10-25 2006-06-15 Hitachi Chem Co Ltd 複合体、プリプレグ、金属箔張積層板、多層プリント配線板及びその製造方法
JP2006152260A (ja) * 2004-10-26 2006-06-15 Hitachi Chem Co Ltd 複合体、これを用いたプリプレグ、金属箔張積層板及び多層印刷配線板並びに多層印刷配線板の製造方法
ATE528355T1 (de) * 2005-02-16 2011-10-15 Dow Corning Verstärkte silikonharzfolie und herstellungsverfahren dafür
US8092910B2 (en) 2005-02-16 2012-01-10 Dow Corning Toray Co., Ltd. Reinforced silicone resin film and method of preparing same
ATE551398T1 (de) 2005-02-16 2012-04-15 Dow Corning Verstärkte silikonharzfolie und herstellungsverfahren dafür
WO2007018756A1 (en) 2005-08-04 2007-02-15 Dow Corning Corporation Reinforced silicone resin film and method of preparing same
ATE517947T1 (de) 2005-12-21 2011-08-15 Dow Corning Silikonharzfilm, herstellungsverfahren dafür und nanomaterialgefüllte silikonzusammensetzung
KR101426316B1 (ko) 2006-01-19 2014-08-06 다우 코닝 코포레이션 실리콘 수지 필름, 이의 제조방법, 및 나노물질로 충전된실리콘 조성물
US8084097B2 (en) 2006-02-20 2011-12-27 Dow Corning Corporation Silicone resin film, method of preparing same, and nanomaterial-filled silicone composition
WO2008103228A1 (en) 2007-02-22 2008-08-28 Dow Corning Corporation Reinforced silicone resin films
CN101627096B (zh) * 2007-02-22 2012-11-07 道康宁公司 增强硅树脂膜及其制备方法
CN101636270B (zh) 2007-02-22 2012-07-04 道康宁公司 增强硅树脂膜
KR101513005B1 (ko) * 2007-12-18 2015-04-17 다우 글로벌 테크놀로지스 엘엘씨 실리콘 폴리에테르를 포함하는 열경화성 조성물, 이들의 제조 방법 및 용도
WO2009102566A1 (en) * 2008-02-15 2009-08-20 Dow Global Technologies Inc. Thermosetting compositions comprising silicone polyethers, their manufacture, and uses
JP5343025B2 (ja) * 2010-03-18 2013-11-13 新日鉄住金化学株式会社 ガスバリア性積層体フィルム
TWI522423B (zh) 2010-08-31 2016-02-21 道康寧東麗股份有限公司 聚矽氧烷組合物及其硬化物
US10329439B2 (en) * 2012-09-24 2019-06-25 Chomarat North America Plastisol compositions including organosilicon compound(s)
JP2016180088A (ja) * 2014-07-24 2016-10-13 三菱化学株式会社 熱硬化性樹脂組成物及びその成形体
US10011720B2 (en) * 2014-07-28 2018-07-03 Sumitomo Chemical Company, Limited Silicone-based encapsulating material composition and semiconductor light-emitting device
US9617373B2 (en) * 2015-02-13 2017-04-11 LCY Chemical Corp. Curable resin composition, article, and method for fabricating the same
CN113527818B (zh) * 2021-08-12 2022-11-29 广东生益科技股份有限公司 一种树脂组合物及其应用

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0652256A2 (en) * 1993-11-04 1995-05-10 Dow Corning Toray Silicone Company, Limited Silicon rubber composition
GB2284214A (en) * 1993-11-30 1995-05-31 Gen Electric Silicone and fluorosilicone heat cured filled rubber compositions
US6046296A (en) * 1997-08-01 2000-04-04 Ppg Industries Ohio, Inc. Curable compositions based on functional polysiloxanes

Family Cites Families (16)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS62243649A (ja) * 1986-04-15 1987-10-24 Nippon Retsuku Kk 電気絶縁用樹脂組成物
US4966922A (en) * 1988-06-09 1990-10-30 General Electric Company Dual curable silicone compositions
JPH0670181B2 (ja) * 1989-01-19 1994-09-07 信越化学工業株式会社 熱硬化性シリコーンゴム組成物
KR950005318B1 (ko) * 1989-09-11 1995-05-23 신에쓰 가가꾸 고오교 가부시끼가이샤 열경화성 수지 조성물
CA2092457A1 (en) * 1992-05-28 1993-11-29 James E. Doin Oil resistant heat cured elastomer compositions with mixed metal oxides
US5508323A (en) * 1992-06-29 1996-04-16 Dow Corning Corporation Method for imparting fire retardancy to organic resins
JP3339910B2 (ja) * 1993-04-15 2002-10-28 東レ・ダウコーニング・シリコーン株式会社 硬化性樹脂組成物
US5952439A (en) * 1993-04-15 1999-09-14 Dow Corning Toray Silicone Co., Ltd. Epoxy group-containing silicone resin and compositions based thereon
JP3104568B2 (ja) * 1995-03-24 2000-10-30 信越化学工業株式会社 高電圧電気絶縁体用シリコーンゴム組成物
JPH08337680A (ja) * 1995-06-09 1996-12-24 Hitachi Ltd 熱硬化性樹脂およびその樹脂を用いた半導体装置
JPH11147934A (ja) * 1997-11-19 1999-06-02 Hitachi Chem Co Ltd エポキシ樹脂組成物及びそれを用いた高分子量エポキシフィルム
JPH11335565A (ja) * 1998-04-13 1999-12-07 Dow Corning Corp 熱硬化性シリコ―ンゴム組成物
DE69922577T2 (de) * 1998-05-07 2005-12-01 Shin-Etsu Chemical Co., Ltd. Epoxydharzzusammensetzungen und damit eingekapselte Halbleiteranordnungen
JP2001214075A (ja) * 2000-02-04 2001-08-07 Jsr Corp 高熱伝導性シート用組成物、高熱伝導性シート、高熱伝導性シートの製造方法および高熱伝導性シートを用いた放熱構造
JP2001139833A (ja) * 1999-11-16 2001-05-22 Jsr Corp 高熱伝導性シート用組成物、高熱伝導性シート、高熱伝導性シートの製造方法および高熱伝導性シートを用いた放熱構造
DE60140576D1 (de) * 2000-03-31 2009-12-31 Hitachi Chemical Co Ltd Hitzehärtbare Silikonzusammensetzung, Harzfilm, Metallfolie, Isolationsfilm, Metall-Leiterplatte-Laminat, Multischicht-Leiterplatte, die Zusammensetzung enthaltend und Verwendung der Zusammensetzung

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0652256A2 (en) * 1993-11-04 1995-05-10 Dow Corning Toray Silicone Company, Limited Silicon rubber composition
GB2284214A (en) * 1993-11-30 1995-05-31 Gen Electric Silicone and fluorosilicone heat cured filled rubber compositions
US6046296A (en) * 1997-08-01 2000-04-04 Ppg Industries Ohio, Inc. Curable compositions based on functional polysiloxanes

Also Published As

Publication number Publication date
KR20040039407A (ko) 2004-05-10
JP3966279B2 (ja) 2007-08-29
TW593440B (en) 2004-06-21
EP1454962A1 (en) 2004-09-08
US20050065275A1 (en) 2005-03-24
JPWO2003029353A1 (ja) 2005-01-13
CN1558931A (zh) 2004-12-29
JP5370333B2 (ja) 2013-12-18
KR100848434B1 (ko) 2008-07-28
EP1454962A4 (en) 2005-01-05
WO2003029353A1 (en) 2003-04-10
JP2011006710A (ja) 2011-01-13

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