JP2012514077A5 - - Google Patents
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- Publication number
- JP2012514077A5 JP2012514077A5 JP2011543525A JP2011543525A JP2012514077A5 JP 2012514077 A5 JP2012514077 A5 JP 2012514077A5 JP 2011543525 A JP2011543525 A JP 2011543525A JP 2011543525 A JP2011543525 A JP 2011543525A JP 2012514077 A5 JP2012514077 A5 JP 2012514077A5
- Authority
- JP
- Japan
- Prior art keywords
- resin
- range
- polyaminoether
- blend according
- resin blend
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 229920005989 resin Polymers 0.000 claims 16
- 239000011347 resin Substances 0.000 claims 16
- 239000000203 mixture Substances 0.000 claims 14
- IISBACLAFKSPIT-UHFFFAOYSA-N bisphenol A Chemical compound C=1C=C(O)C=CC=1C(C)(C)C1=CC=C(O)C=C1 IISBACLAFKSPIT-UHFFFAOYSA-N 0.000 claims 4
- 239000003822 epoxy resin Substances 0.000 claims 3
- 238000009472 formulation Methods 0.000 claims 3
- 229920000647 polyepoxide Polymers 0.000 claims 3
- 150000001875 compounds Chemical class 0.000 claims 2
- GYZLOYUZLJXAJU-UHFFFAOYSA-N diglycidyl ether Chemical compound C1OC1COCC1CO1 GYZLOYUZLJXAJU-UHFFFAOYSA-N 0.000 claims 2
- 125000002887 hydroxy group Chemical group [H]O* 0.000 claims 2
- YDIZFUMZDHUHSH-UHFFFAOYSA-N 1,7-bis(ethenyl)-3,8-dioxatricyclo[5.1.0.02,4]oct-5-ene Chemical group C12OC2C=CC2(C=C)C1(C=C)O2 YDIZFUMZDHUHSH-UHFFFAOYSA-N 0.000 claims 1
- 238000001802 infusion Methods 0.000 claims 1
- 238000000034 method Methods 0.000 claims 1
- 238000000465 moulding Methods 0.000 claims 1
- 239000011342 resin composition Substances 0.000 claims 1
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US14147108P | 2008-12-30 | 2008-12-30 | |
| US61/141,471 | 2008-12-30 | ||
| PCT/US2009/065437 WO2010077485A1 (en) | 2008-12-30 | 2009-11-23 | Divinylarene dioxide formulations for vacuum resin infusion molding |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| JP2012514077A JP2012514077A (ja) | 2012-06-21 |
| JP2012514077A5 true JP2012514077A5 (enExample) | 2013-01-17 |
| JP5676474B2 JP5676474B2 (ja) | 2015-02-25 |
Family
ID=41611098
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2011543525A Expired - Fee Related JP5676474B2 (ja) | 2008-12-30 | 2009-11-23 | 真空樹脂インフュージョン成形用ジビニルアレーンジオキシド配合物 |
Country Status (8)
| Country | Link |
|---|---|
| US (1) | US9085658B2 (enExample) |
| EP (1) | EP2384345B1 (enExample) |
| JP (1) | JP5676474B2 (enExample) |
| KR (1) | KR20110111278A (enExample) |
| CN (1) | CN102209741B (enExample) |
| BR (1) | BRPI0916074A8 (enExample) |
| CA (1) | CA2744063A1 (enExample) |
| WO (1) | WO2010077485A1 (enExample) |
Families Citing this family (11)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2011068858A1 (en) * | 2009-12-03 | 2011-06-09 | Dow Global Technologies Llc | Adducts based on divinylarene oxides |
| BR112012032981A2 (pt) * | 2010-06-25 | 2016-11-22 | Dow Global Technologies Llc | composição de resina epóxi curável livre de diluente para preparar um compósito, processo para preparar uma composição ou sistema de resina curável, livre de diluente, produto compósito curado e processo para preparar produto compósito curado |
| MX2013005763A (es) * | 2010-11-22 | 2013-06-18 | Dow Global Technologies Llc | Resina epoxica que comprende un aducto de dioxido de divinilbenceno como mejorador de la tenacidad. |
| WO2012082224A1 (en) * | 2010-12-17 | 2012-06-21 | Dow Global Technologies Llc | Curable compositions |
| EP2744860B1 (en) * | 2011-08-18 | 2021-02-24 | Blue Cube IP LLC | Curable resin compositions |
| JP2014528982A (ja) * | 2011-08-18 | 2014-10-30 | ダウ グローバル テクノロジーズ エルエルシー | 硬化型樹脂組成物 |
| CN103814055B (zh) * | 2011-09-21 | 2016-10-12 | 蓝立方知识产权有限责任公司 | 环氧官能树脂组合物 |
| CN104768998B (zh) * | 2012-10-01 | 2016-10-12 | 陶氏环球技术有限公司 | 可固化环氧树脂组合物 |
| WO2014062407A2 (en) | 2012-10-19 | 2014-04-24 | Dow Global Technologies Llc | Anhydride-cured epoxy resin systems containing divinylarene dioxides |
| JP6177940B2 (ja) * | 2015-01-08 | 2017-08-09 | ソマール株式会社 | 樹脂組成物、センサ用注型品及び温度センサ |
| KR20210062034A (ko) * | 2018-09-21 | 2021-05-28 | 도레이 카부시키가이샤 | 에폭시 수지 조성물, 프리프레그 및 섬유 강화 복합재료 |
Family Cites Families (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| GB854679A (en) * | 1958-10-11 | 1960-11-23 | Union Carbide Corp | Improvements in and relating to polymerisable epoxide compositions |
| JPS62153316A (ja) | 1985-12-27 | 1987-07-08 | Mitsubishi Rayon Co Ltd | エポキシ樹脂硬化物 |
| US4902215A (en) * | 1988-06-08 | 1990-02-20 | Seemann Iii William H | Plastic transfer molding techniques for the production of fiber reinforced plastic structures |
| BR0314423B1 (pt) | 2002-08-30 | 2013-04-30 | composiÇço de poliamida e processo para a preparaÇço de uma resina de epàxi curado (poli-eteralcanolamina) e de uma poliurÉia. | |
| EP1904578B1 (en) * | 2005-07-15 | 2009-12-02 | Huntsman Advanced Materials (Switzerland) GmbH | Toughened compositon |
-
2009
- 2009-11-23 KR KR1020117010370A patent/KR20110111278A/ko not_active Withdrawn
- 2009-11-23 CN CN2009801449424A patent/CN102209741B/zh not_active Expired - Fee Related
- 2009-11-23 JP JP2011543525A patent/JP5676474B2/ja not_active Expired - Fee Related
- 2009-11-23 BR BRPI0916074A patent/BRPI0916074A8/pt not_active IP Right Cessation
- 2009-11-23 EP EP09764638.4A patent/EP2384345B1/en not_active Not-in-force
- 2009-11-23 WO PCT/US2009/065437 patent/WO2010077485A1/en not_active Ceased
- 2009-11-23 CA CA2744063A patent/CA2744063A1/en not_active Abandoned
- 2009-11-23 US US13/063,281 patent/US9085658B2/en not_active Expired - Fee Related
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