JP2013062446A5 - - Google Patents
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- Publication number
- JP2013062446A5 JP2013062446A5 JP2011201167A JP2011201167A JP2013062446A5 JP 2013062446 A5 JP2013062446 A5 JP 2013062446A5 JP 2011201167 A JP2011201167 A JP 2011201167A JP 2011201167 A JP2011201167 A JP 2011201167A JP 2013062446 A5 JP2013062446 A5 JP 2013062446A5
- Authority
- JP
- Japan
- Prior art keywords
- adhesive layer
- stress
- relaxation rate
- stress relaxation
- elastic modulus
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 239000012790 adhesive layer Substances 0.000 description 3
- 230000000052 comparative effect Effects 0.000 description 1
- 238000012423 maintenance Methods 0.000 description 1
- 238000005259 measurement Methods 0.000 description 1
Priority Applications (4)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2011201167A JP5951207B2 (ja) | 2011-09-14 | 2011-09-14 | ダイシング・ダイボンディングシート |
| TW101126559A TWI566282B (zh) | 2011-09-14 | 2012-07-24 | Cut the adhesive sheet |
| KR1020120100670A KR102105515B1 (ko) | 2011-09-14 | 2012-09-11 | 다이싱ㆍ다이 본딩 시트 |
| KR1020190027593A KR20190030667A (ko) | 2011-09-14 | 2019-03-11 | 다이싱ㆍ다이 본딩 시트 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2011201167A JP5951207B2 (ja) | 2011-09-14 | 2011-09-14 | ダイシング・ダイボンディングシート |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| JP2013062446A JP2013062446A (ja) | 2013-04-04 |
| JP2013062446A5 true JP2013062446A5 (enExample) | 2014-10-30 |
| JP5951207B2 JP5951207B2 (ja) | 2016-07-13 |
Family
ID=48179321
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2011201167A Active JP5951207B2 (ja) | 2011-09-14 | 2011-09-14 | ダイシング・ダイボンディングシート |
Country Status (3)
| Country | Link |
|---|---|
| JP (1) | JP5951207B2 (enExample) |
| KR (2) | KR102105515B1 (enExample) |
| TW (1) | TWI566282B (enExample) |
Families Citing this family (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP6877982B2 (ja) * | 2016-12-08 | 2021-05-26 | 日東電工株式会社 | 接着フィルム、ダイシング・ダイボンドフィルム、半導体装置の製造方法及び半導体装置 |
| CN108987294B (zh) * | 2018-06-21 | 2021-02-02 | 上海飞骧电子科技有限公司 | 解决封装溢胶问题的无源器件砷化镓刷胶方法 |
| JP2022523718A (ja) * | 2019-01-29 | 2022-04-26 | トリナミクス ゲゼルシャフト ミット ベシュレンクテル ハフツング | 光検出器 |
| JP7625784B2 (ja) * | 2019-11-15 | 2025-02-04 | 株式会社レゾナック | ダイシング・ダイボンディング一体型フィルム及びその製造方法、並びに半導体装置の製造方法 |
| JP7298468B2 (ja) * | 2019-12-18 | 2023-06-27 | 信越化学工業株式会社 | 熱硬化性樹脂組成物及びその使用 |
| US11639410B2 (en) | 2019-12-18 | 2023-05-02 | Shin-Etsu Chemical Co., Ltd. | Heat-curable resin composition and uses thereof |
| CN112341975B (zh) * | 2020-11-25 | 2022-03-08 | 中路交科科技股份有限公司 | 一种二阶环氧粘层油、制备方法及其应用方法 |
| JPWO2022138341A1 (enExample) | 2020-12-25 | 2022-06-30 |
Family Cites Families (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP3383227B2 (ja) * | 1998-11-06 | 2003-03-04 | リンテック株式会社 | 半導体ウエハの裏面研削方法 |
| JP4841802B2 (ja) * | 2003-05-02 | 2011-12-21 | リンテック株式会社 | 粘着シートおよびその使用方法 |
| JP4274867B2 (ja) * | 2003-08-06 | 2009-06-10 | リンテック株式会社 | Icタグ |
| JP4776188B2 (ja) * | 2004-08-03 | 2011-09-21 | 古河電気工業株式会社 | 半導体装置製造方法およびウエハ加工用テープ |
| JP4780653B2 (ja) * | 2005-02-21 | 2011-09-28 | 日東電工株式会社 | 半導体装置の製造方法 |
| KR100804891B1 (ko) * | 2006-02-14 | 2008-02-20 | 엘에스전선 주식회사 | 다이싱 다이 접착필름 및 이를 이용한 반도체 패키징 방법 |
| JP5005258B2 (ja) | 2006-05-23 | 2012-08-22 | リンテック株式会社 | 粘接着剤組成物、粘接着シートおよび半導体装置の製造方法 |
| JP2010171402A (ja) * | 2008-12-24 | 2010-08-05 | Nitto Denko Corp | 熱硬化型ダイボンドフィルム |
| JP2010219293A (ja) * | 2009-03-17 | 2010-09-30 | Furukawa Electric Co Ltd:The | ウエハ加工用テープ |
-
2011
- 2011-09-14 JP JP2011201167A patent/JP5951207B2/ja active Active
-
2012
- 2012-07-24 TW TW101126559A patent/TWI566282B/zh active
- 2012-09-11 KR KR1020120100670A patent/KR102105515B1/ko active Active
-
2019
- 2019-03-11 KR KR1020190027593A patent/KR20190030667A/ko not_active Withdrawn
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