JP2013062446A5 - - Google Patents

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Publication number
JP2013062446A5
JP2013062446A5 JP2011201167A JP2011201167A JP2013062446A5 JP 2013062446 A5 JP2013062446 A5 JP 2013062446A5 JP 2011201167 A JP2011201167 A JP 2011201167A JP 2011201167 A JP2011201167 A JP 2011201167A JP 2013062446 A5 JP2013062446 A5 JP 2013062446A5
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JP
Japan
Prior art keywords
adhesive layer
stress
relaxation rate
stress relaxation
elastic modulus
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JP2011201167A
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Japanese (ja)
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JP5951207B2 (en
JP2013062446A (en
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Priority to JP2011201167A priority Critical patent/JP5951207B2/en
Priority claimed from JP2011201167A external-priority patent/JP5951207B2/en
Priority to TW101126559A priority patent/TWI566282B/en
Priority to KR1020120100670A priority patent/KR102105515B1/en
Publication of JP2013062446A publication Critical patent/JP2013062446A/en
Publication of JP2013062446A5 publication Critical patent/JP2013062446A5/ja
Application granted granted Critical
Publication of JP5951207B2 publication Critical patent/JP5951207B2/en
Priority to KR1020190027593A priority patent/KR20190030667A/en
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〔応力緩和率の測定〕
硬化前の接着剤層（比較例１および２については、後述する接着剤層の収縮観察の試験と同様にして、紫外線を照射した接着剤層）の８０℃における応力緩和率は、動的粘弾性装置（レオメトリクス社製 ＲＤＡＩＩ）により、初期弾性率Ａと、捻り量２０％の応力を加え１２０秒後の応力維持後弾性率Ｂを測定し、下記の式より算出した。
応力緩和率［％］＝（Ａ−Ｂ）／Ａ×１００
[Measurement of stress relaxation rate]
The stress relaxation rate at 80 ° C. of the adhesive layer before curing (in the case of Comparative Examples 1 and 2, the adhesive layer irradiated with ultraviolet rays in the same manner as the later-described shrinkage observation test of the adhesive layer) Using an elastic device (RDAII manufactured by Rheometrics Co., Ltd.), an initial elastic modulus A and a stress with a twist amount of 20% were applied, and an elastic modulus B after stress maintenance after 120 seconds was measured and calculated from the following formula .
Stress relaxation rate [%] = (A−B) / A × 100

JP2011201167A 2011-09-14 2011-09-14 Dicing die bonding sheet Active JP5951207B2 (en)

Priority Applications (4)

Application Number Priority Date Filing Date Title
JP2011201167A JP5951207B2 (en) 2011-09-14 2011-09-14 Dicing die bonding sheet
TW101126559A TWI566282B (en) 2011-09-14 2012-07-24 Cut the adhesive sheet
KR1020120100670A KR102105515B1 (en) 2011-09-14 2012-09-11 Dicing·die bonding sheet
KR1020190027593A KR20190030667A (en) 2011-09-14 2019-03-11 Dicing·die bonding sheet

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2011201167A JP5951207B2 (en) 2011-09-14 2011-09-14 Dicing die bonding sheet

Publications (3)

Publication Number Publication Date
JP2013062446A JP2013062446A (en) 2013-04-04
JP2013062446A5 true JP2013062446A5 (en) 2014-10-30
JP5951207B2 JP5951207B2 (en) 2016-07-13

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ID=48179321

Family Applications (1)

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JP2011201167A Active JP5951207B2 (en) 2011-09-14 2011-09-14 Dicing die bonding sheet

Country Status (3)

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JP (1) JP5951207B2 (en)
KR (2) KR102105515B1 (en)
TW (1) TWI566282B (en)

Families Citing this family (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP6877982B2 (en) * 2016-12-08 2021-05-26 日東電工株式会社 Adhesive film, dicing / die bond film, semiconductor device manufacturing method and semiconductor device
CN108987294B (en) * 2018-06-21 2021-02-02 上海飞骧电子科技有限公司 Gallium arsenide glue brushing method for passive device for solving problem of glue overflow in packaging
US11639410B2 (en) 2019-12-18 2023-05-02 Shin-Etsu Chemical Co., Ltd. Heat-curable resin composition and uses thereof
JP7298468B2 (en) * 2019-12-18 2023-06-27 信越化学工業株式会社 Thermosetting resin composition and its use
CN112341975B (en) * 2020-11-25 2022-03-08 中路交科科技股份有限公司 Second-order epoxy adhesive layer oil, preparation method and application method thereof
CN116601252A (en) 2020-12-25 2023-08-15 陶氏东丽株式会社 Dicing die bonding sheet and method for manufacturing semiconductor device

Family Cites Families (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3383227B2 (en) * 1998-11-06 2003-03-04 リンテック株式会社 Semiconductor wafer backside grinding method
JP4841802B2 (en) * 2003-05-02 2011-12-21 リンテック株式会社 Adhesive sheet and method of using the same
JP4274867B2 (en) * 2003-08-06 2009-06-10 リンテック株式会社 IC tag
JP4776188B2 (en) * 2004-08-03 2011-09-21 古河電気工業株式会社 Semiconductor device manufacturing method and wafer processing tape
JP4780653B2 (en) * 2005-02-21 2011-09-28 日東電工株式会社 Manufacturing method of semiconductor device
US7768141B2 (en) * 2006-02-14 2010-08-03 Lg Innotek Co., Ltd. Dicing die attachment film and method for packaging semiconductor using same
JP5005258B2 (en) 2006-05-23 2012-08-22 リンテック株式会社 Adhesive composition, adhesive sheet and method for producing semiconductor device
JP2010171402A (en) * 2008-12-24 2010-08-05 Nitto Denko Corp Thermosetting die-bonding film
JP2010219293A (en) * 2009-03-17 2010-09-30 Furukawa Electric Co Ltd:The Tape for processing wafer

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