JP2013062445A5 - - Google Patents
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- JP2013062445A5 JP2013062445A5 JP2011201166A JP2011201166A JP2013062445A5 JP 2013062445 A5 JP2013062445 A5 JP 2013062445A5 JP 2011201166 A JP2011201166 A JP 2011201166A JP 2011201166 A JP2011201166 A JP 2011201166A JP 2013062445 A5 JP2013062445 A5 JP 2013062445A5
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- JP
- Japan
- Prior art keywords
- adhesive layer
- stress
- relaxation rate
- stress relaxation
- elastic modulus
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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Description
〔応力緩和率の測定〕
硬化前の接着剤層(比較例1および2については、後述する接着剤層の収縮観察の試験と同様にして、紫外線を照射した接着剤層)の80℃における応力緩和率は、動的粘弾性装置(レオメトリクス社製 RDAII)により、初期弾性率Aと、捻り量20%の応力を加え120秒後の応力維持後弾性率Bを測定し、下記の式より算出した。
応力緩和率[%]=(A−B)/A×100
[Measurement of stress relaxation rate]
The stress relaxation rate at 80 ° C. of the adhesive layer before curing (in the case of Comparative Examples 1 and 2, the adhesive layer irradiated with ultraviolet rays in the same manner as the later-described shrinkage observation test of the adhesive layer) Using an elastic device (RDAII manufactured by Rheometrics Co., Ltd.), an initial elastic modulus A and a stress with a twist amount of 20% were applied, and an elastic modulus B after stress maintenance after 120 seconds was measured and calculated from the following formula .
Stress relaxation rate [%] = (A−B) / A × 100
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2011201166A JP5951206B2 (en) | 2011-09-14 | 2011-09-14 | Dicing die bonding sheet |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2011201166A JP5951206B2 (en) | 2011-09-14 | 2011-09-14 | Dicing die bonding sheet |
Publications (3)
Publication Number | Publication Date |
---|---|
JP2013062445A JP2013062445A (en) | 2013-04-04 |
JP2013062445A5 true JP2013062445A5 (en) | 2014-10-23 |
JP5951206B2 JP5951206B2 (en) | 2016-07-13 |
Family
ID=48186842
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2011201166A Active JP5951206B2 (en) | 2011-09-14 | 2011-09-14 | Dicing die bonding sheet |
Country Status (1)
Country | Link |
---|---|
JP (1) | JP5951206B2 (en) |
Family Cites Families (8)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP4841802B2 (en) * | 2003-05-02 | 2011-12-21 | リンテック株式会社 | Adhesive sheet and method of using the same |
JP4274867B2 (en) * | 2003-08-06 | 2009-06-10 | リンテック株式会社 | IC tag |
JP4776188B2 (en) * | 2004-08-03 | 2011-09-21 | 古河電気工業株式会社 | Semiconductor device manufacturing method and wafer processing tape |
JP4780653B2 (en) * | 2005-02-21 | 2011-09-28 | 日東電工株式会社 | Manufacturing method of semiconductor device |
KR100804891B1 (en) * | 2006-02-14 | 2008-02-20 | 엘에스전선 주식회사 | Dicing die attach film and semiconductor packaging method using the same |
JP4732472B2 (en) * | 2007-03-01 | 2011-07-27 | 日東電工株式会社 | Thermosetting die bond film |
JP2010189484A (en) * | 2009-02-16 | 2010-09-02 | Lintec Corp | Adhesive composition, adhesive sheet and method for manufacturing semiconductor device |
JP2010219293A (en) * | 2009-03-17 | 2010-09-30 | Furukawa Electric Co Ltd:The | Tape for processing wafer |
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2011
- 2011-09-14 JP JP2011201166A patent/JP5951206B2/en active Active
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